[go: up one dir, main page]

CN201117642Y - Storage device for storing semiconductor elements or masks - Google Patents

Storage device for storing semiconductor elements or masks Download PDF

Info

Publication number
CN201117642Y
CN201117642Y CNU2007201934930U CN200720193493U CN201117642Y CN 201117642 Y CN201117642 Y CN 201117642Y CN U2007201934930 U CNU2007201934930 U CN U2007201934930U CN 200720193493 U CN200720193493 U CN 200720193493U CN 201117642 Y CN201117642 Y CN 201117642Y
Authority
CN
China
Prior art keywords
mask
lid
semiconductor element
deposit
order
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNU2007201934930U
Other languages
Chinese (zh)
Inventor
林志铭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gudeng Precision Industrial Co Ltd
Original Assignee
Gudeng Precision Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gudeng Precision Industrial Co Ltd filed Critical Gudeng Precision Industrial Co Ltd
Priority to CNU2007201934930U priority Critical patent/CN201117642Y/en
Application granted granted Critical
Publication of CN201117642Y publication Critical patent/CN201117642Y/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Landscapes

  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

The utility model relates to a storage device is used for depositing semiconductor component or mask, and this kind of storage device is formed by first lid, second lid and the combination of flange. The first cover body is provided with a top part and a plurality of side edges arranged around the top part; the second cover body is combined with the first cover body to form an inner space capable of accommodating the mask; the flange is arranged on the first cover body and used for allowing mechanical holding and placing; the utility model is characterized in that the flange and the first cover body are in an integrated form.

Description

用以存放半导体元件或掩膜的存放装置 Storage device for storing semiconductor components or masks

技术领域 technical field

本实用新型是有关于一种存放装置用以存放半导体元件或掩膜,特别是有关于一种突缘与第一盖体一体成型的用以存放半导体元件或掩膜的存放装置。The utility model relates to a storage device for storing semiconductor elements or masks, in particular to a storage device for storing semiconductor elements or masks in which a flange and a first cover are integrally formed.

背景技术 Background technique

近代半导体科技发展迅速,其中光学光刻技术(Optical Lithography)扮演重要的角色,只要是关于图形(pattern)定义,皆需仰赖光学光刻技术。光学光刻技术在半导体的应用上,是将设计好的线路制作成具有特定形状可透光的掩膜(photo mask)。利用曝光原理,则光源通过掩膜投影至硅晶片(siliconwafer)可曝光显示特定图案。由于任何附着于掩膜上的尘埃颗粒(如微粒、粉尘或有机物)都会造成投影成像的品质劣化,用于产生图形的掩膜必须保持绝对洁净,而被投射的硅晶片或者其它半导体投射体亦必须保持绝对清静,因此在一般的晶片制程中,都提供无尘室(clean room)的环境以避免空气中的颗粒污染。然而,目前的无尘室也无法达到绝对无尘状态。The rapid development of modern semiconductor technology, in which optical lithography (Optical Lithography) plays an important role, as long as it is about the definition of patterns, it needs to rely on optical lithography. In the application of optical lithography technology to semiconductors, the designed circuit is made into a light-transmitting mask (photo mask) with a specific shape. Using the principle of exposure, the light source is projected onto the silicon wafer (silicon wafer) through a mask to expose and display a specific pattern. Since any dust particles (such as particles, dust or organic matter) attached to the mask will cause the quality of projection imaging to deteriorate, the mask used to generate graphics must be kept absolutely clean, and the projected silicon wafer or other semiconductor projection body must also be kept clean. It must be kept absolutely quiet, so in general wafer processing, a clean room (clean room) environment is provided to avoid particle contamination in the air. However, the current clean room cannot achieve an absolutely dust-free state.

因此,现代的半导体制程皆利用抗污染的存放装置进行掩膜的保存与运输,以使掩膜保持洁净;也利用抗污染的半导体元件存放装置进行半导体元件的保存与运输,以使半导体元件保持洁净。存放装置是在半导体制程中用于存放掩膜,以利掩膜在机台之间的搬运与传送,并隔绝掩膜与大气的接触,避免掩膜被杂质污染而产生变化;而半导体元件存放装置是在半导体制程中用于存放半导体元件,以利半导体元件在机台之间的搬运与传送,并隔绝半导体元件与大气的接触,避免半导体元件被杂质污染而产生变化。因此,掩膜或是半导体元件均需置放于存放装置中,以达到洁净与避免污染的效果。Therefore, modern semiconductor manufacturing processes use anti-pollution storage devices for mask storage and transportation to keep masks clean; anti-pollution semiconductor component storage devices are also used for storage and transportation of semiconductor components to keep semiconductor components clean. clean. The storage device is used to store the mask in the semiconductor manufacturing process, so as to facilitate the handling and transmission of the mask between machines, and to isolate the mask from the atmosphere, so as to prevent the mask from being polluted by impurities and causing changes; while semiconductor components are stored The device is used to store semiconductor components in the semiconductor manufacturing process, to facilitate the handling and transmission of semiconductor components between machines, and to isolate the semiconductor components from contact with the atmosphere, so as to prevent the semiconductor components from being polluted by impurities and changing. Therefore, the mask or the semiconductor element must be placed in the storage device to achieve the effect of cleaning and avoiding pollution.

传统的用以存放半导体元件或掩膜的存放装置均具有相当多的结构,凡是需要有两盖体组合,而为了达到机械运送的功能,在其中一盖体的顶部尚须在设置突缘或突缘承座以供机器人或机械手持取移动,需设置把手以供人力取放,另还需设置板件等供贴放标记(Label),尚须在设置其它装置以放至其它元件。The traditional storage devices for storing semiconductor elements or masks have quite a lot of structures. Usually, two covers are required to be combined. In order to achieve the function of mechanical transportation, a flange or a flange must be set on the top of one of the covers. The flange seat is used for robot or manipulator to take and move. It needs to be equipped with a handle for manpower to pick and place. In addition, it needs to set up a plate for labeling (Label), and it needs to set up other devices to place on other components.

如此一来,此种用以存放半导体元件或掩膜的存放装置上,因增加了突缘、突缘承座、把手、板件等元件,除了增加用以存放半导体元件或掩膜的存放装置本身的重量、增加组装置工时外,连接此等元件莫不使用接合零件,纵使作工精密,难保零件不疏松,当零件疏松时,接合的各元件将有脱离的危险,轻则仅造成板件脱落或者辨识机能丧失,重则突缘、突缘承座甚或是把手脱落,造成用以存放半导体元件或掩膜的存放装置在运输过程中的危险,增加掩膜或半导体元件毁损的可能。In this way, on this kind of storage device for storing semiconductor elements or masks, due to the addition of flanges, flange holders, handles, boards and other components, in addition to increasing the storage device for storing semiconductor elements or masks In addition to the weight of itself and the increased man-hours of the assembly, joint parts are used to connect these components. Even if the workmanship is precise, it is difficult to ensure that the parts are not loose. When the parts are loose, the joint components will be in danger of detachment. Falling off or loss of identification function, and more severe, flanges, flange holders or even handles falling off, causing danger during transportation of storage devices used to store semiconductor components or masks, and increasing the possibility of damage to masks or semiconductor components.

有鉴于此,本实用新型所提供的具有过滤件的用以存放半导体元件或掩膜的存放装置,乃针对先前技术加以改良。In view of this, the storage device provided by the utility model for storing semiconductor elements or masks provided with a filter is improved on the prior art.

实用新型内容Utility model content

因此,本实用新型的主要目的在于提供一种突缘与第一盖体一体成型的存放装置与半导体元件存放装置,其组装简便,可节省工作时间。Therefore, the main purpose of the present invention is to provide a storage device and a semiconductor device storage device in which the flange and the first cover are integrally formed, which is easy to assemble and can save working time.

本实用新型的再一目的在于提供一种突缘与第一盖体一体成型的用以存放半导体元件或掩膜的存放装置,其接合不需零件,减低因零件耗损所可能导致对象毁损的风险。Another object of the present utility model is to provide a storage device for storing semiconductor elements or masks in which the flange and the first cover are integrally formed. The joint does not require parts, which reduces the risk of damage to the object due to wear and tear of the parts. .

本实用新型的再一目的在于提供一种突缘与第一盖体一体成型的用以存放半导体元件或掩膜的存放装置,其接合不需零件,可减少组装的工作时程。Another object of the present invention is to provide a storage device for storing semiconductor elements or masks in which the flange and the first cover are integrally formed. The joint does not require parts, which can reduce the working time of assembly.

本实用新型的再一目的在于提供一种突缘与第一盖体一体成型的用以存放半导体元件或掩膜的存放装置,其接合不需零件,可减低整体存放装置或半导体元件存放装置的重量。Another object of the present utility model is to provide a storage device for storing semiconductor elements or masks in which the flange and the first cover are integrally formed. The joint does not require parts, which can reduce the overall storage device or the semiconductor element storage device. weight.

为解决先前技术的问题,本实用新型提供一种用以存放半导体元件或掩膜的存放装置,用以存放半导体元件或掩膜,其特征在于,包含有:In order to solve the problems of the prior art, the utility model provides a storage device for storing semiconductor elements or masks, which is characterized in that it includes:

一第一盖体,具有一顶部,以及多数个侧边设于该顶部的周围;A first cover body has a top, and a plurality of sides are arranged around the top;

一第二盖体,与该第一盖体组合,形成一可容纳半导体元件或掩膜的内部空间;以及A second cover, combined with the first cover, forms an inner space capable of accommodating semiconductor elements or masks; and

至少一容许一机械持置的突缘,设于该第一盖体;At least one flange allowing a mechanical holding is provided on the first cover;

其中,该突缘与该第一盖体是一体成型。Wherein, the flange and the first cover are integrally formed.

其中该突缘突出于该第一盖体的侧边。Wherein the flange protrudes from the side of the first cover.

其中该突缘突出于该第一盖体的顶部。Wherein the flange protrudes from the top of the first cover.

其中该突缘另包含有一突缘承座,与该第一盖体连接。Wherein the flange further includes a flange seat connected with the first cover.

其中该突缘承座垂直设置于该第一盖体的顶部。Wherein the flange seat is vertically arranged on the top of the first cover.

其中该突缘承座与该第一盖体的顶部的夹角大于或小于九十度。Wherein the angle between the flange seat and the top of the first cover is larger or smaller than 90 degrees.

其中该突缘承座垂直设置于该第一盖体的侧边。Wherein the flange seat is vertically arranged on the side of the first cover.

其中该突缘承座与该第一盖体的侧边的夹角大于或小于九十度。Wherein the angle between the flange seat and the side of the first cover is greater than or less than 90 degrees.

其中另包含有一把手设于该第一盖体上。It also includes a handle disposed on the first cover.

其中该把手与该第一盖体为一体成型。Wherein the handle and the first cover are integrally formed.

其中另包含有一板件设于该第一盖体上。It also includes a plate set on the first cover.

其中该板件与该第一盖体为一体成型。Wherein the board and the first cover are integrally formed.

其中另包含有一标记设于该板件上。It also includes a mark on the board.

其中另包含有一警示器设于该第一盖体上。It also includes a warning device arranged on the first cover.

其中另包含有一感应器设于该第一盖体上。It also includes a sensor disposed on the first cover.

其中另包含有一辨识装置设于该第一盖体上。It also includes an identification device arranged on the first cover.

其中该辨识装置为一无线射频辨识装置。Wherein the identification device is a radio frequency identification device.

本实用新型的有益效果是:The beneficial effects of the utility model are:

本实用新型的用以存放半导体元件或掩膜的存放装置,其是突缘与第一盖体一体成型,其组装简便,可节省工作时间。The storage device for storing semiconductor elements or masks of the utility model is formed integrally with the flange and the first cover, which is easy to assemble and can save working time.

本实用新型的用以存放半导体元件或掩膜的存放装置,其接合不需零件,减低因零件耗损所可能导致对象毁损的风险。The storage device for storing semiconductor elements or masks of the utility model does not need parts for bonding, which reduces the risk of object damage caused by parts wear and tear.

本实用新型的用以存放半导体元件或掩膜的存放装置,其接合不需零件,可减少组装的工作时程。The storage device for storing semiconductor elements or masks of the utility model does not need parts for bonding, which can reduce the working time of assembly.

本实用新型的用以存放半导体元件或掩膜的存放装置,其接合不需零件,可减低整体存放装置或半导体元件存放装置的重量。The storage device for storing semiconductor elements or masks of the utility model does not need parts for bonding, which can reduce the weight of the whole storage device or the semiconductor element storage device.

附图说明 Description of drawings

为使审查员方便简捷了解本实用新型的其它特征内容与优点及其所达成的功效能够更为显现,以下结合实施例及附图详细说明如后,其中:In order for the examiner to easily understand the other features and advantages of the utility model and the effects achieved by it can be more apparent, the following detailed description is as follows in conjunction with the embodiments and accompanying drawings, in which:

图1是本实用新型用以存放半导体元件或掩膜的存放装置的示意图。FIG. 1 is a schematic diagram of a storage device for storing semiconductor elements or masks of the present invention.

图2A与图2B是本实用新型用以存放半导体元件或掩膜的存放装置的示意图。2A and 2B are schematic diagrams of a storage device for storing semiconductor elements or masks of the present invention.

图3A至图3K是本实用新型用以存放半导体元件或掩膜的存放装置中,关于突缘、突缘承座与第一盖体的顶部的位置关是示意图。FIGS. 3A to 3K are schematic diagrams of positions of the flange, the flange seat, and the top of the first cover in the storage device for storing semiconductor elements or masks of the present invention.

图4A至图4F是本实用新型用以存放半导体元件或掩膜的存放装置中,关于突缘、突缘承座与第一盖体的侧边的位置关是示意图。FIGS. 4A to 4F are schematic diagrams of the position of the flange, the flange seat, and the side of the first cover in the storage device for storing semiconductor elements or masks of the present invention.

图5是本实用新型用以存放半导体元件或掩膜的存放装置增设把手的示意图。FIG. 5 is a schematic diagram of a handle added to the storage device of the present invention for storing semiconductor components or masks.

图6A与图6B是本实用新型用以存放半导体元件或掩膜的存放装置增设板件的示意图。6A and 6B are schematic diagrams of additional boards of the storage device for storing semiconductor elements or masks of the present invention.

图7A至图7C是本实用新型用以存放半导体元件或掩膜的存放装置增设警示器、感应器或辨识装置的示意图。7A to 7C are schematic diagrams of adding alarms, sensors or identification devices to the storage device for storing semiconductor components or masks of the present invention.

具体实施方式 Detailed ways

由于本实用新型是揭露一种具有过滤件的存放装置用以存放半导体元件或掩膜的结构,其中所利用到的一些掩膜或半导体或存放装置的详细制造或处理过程,是利用现有技术来达成,故在下述说明中,并不作完整描述。而且下述内文中的附图,亦并未依据实际的相关尺寸完整绘制,其作用仅在表达与本实用新型特征有关的示意图。Since the utility model discloses a storage device with a filter for storing semiconductor elements or masks, the detailed manufacturing or processing process of some masks or semiconductors or storage devices used is based on the prior art To achieve, so in the following description, not a complete description. Moreover, the drawings in the following texts are not completely drawn according to the actual relevant dimensions, and their function is only to express the schematic diagrams related to the features of the present utility model.

请参阅图1,是本实用新型的用以存放半导体元件或掩膜的存放装置的示意图,本实用新型的用以存放半导体元件或掩膜的存放装置包含有第一盖体1、第二盖体2与突缘3设置而成。第一盖体1具有一顶部11,以及多数个侧边12设于该顶部11的周围;而第二盖体2,是用以与该第一盖体1组合,形成一内部空间可容纳掩膜或是半导体元件;突缘3设于第一盖体1上,可以是一个或一个以上,当欲移动本实用新型的用以存放半导体元件或掩膜的存放装置时,可直接将机械人或机械手置于突缘3下,将突缘3抬升,以升抬本实用新型的用以存放半导体元件或掩膜的存放装置,得以进行运送、移动或置放本实用新型的用以存放半导体元件或掩膜的存放装置的工作;而本实用新型的特征是在于突缘3与第一盖体1是一体成型。其中,突缘3可自第一盖体1的侧边12突出,如图2A所示;或自第一盖体1的顶部11突出,如图2B所示。Please refer to Fig. 1, which is a schematic diagram of a storage device for storing semiconductor elements or masks of the present utility model. The storage device for storing semiconductor elements or masks of the present utility model includes a first cover 1, a second cover The body 2 and the flange 3 are arranged. The first cover 1 has a top 11, and a plurality of sides 12 are arranged around the top 11; and the second cover 2 is used to be combined with the first cover 1 to form an inner space that can accommodate a cover. film or semiconductor element; flange 3 is located on the first cover body 1, can be one or more than one, when wanting to move the storage device for storing semiconductor element or mask of the present utility model, can directly put robot Or the manipulator is placed under the flange 3, and the flange 3 is lifted to lift the storage device for storing semiconductor elements or masks of the present utility model, so as to transport, move or place the storage device for storing semiconductor components of the present utility model. The work of the storage device for components or masks; and the utility model is characterized in that the flange 3 and the first cover 1 are integrally formed. Wherein, the flange 3 can protrude from the side 12 of the first cover 1 , as shown in FIG. 2A ; or protrude from the top 11 of the first cover 1 , as shown in FIG. 2B .

接着请再参阅图3,在本实用新型的用以存放半导体元件或掩膜的存放装置中,突缘3可再增设突缘承座31,与第一盖体1连接,用以支撑突缘3,使机器人或机械手持置本实用新型的用以存放半导体元件或掩膜的存放装置时有更好的支撑力,突缘承座31的设置方式有许多,如图3A至图3K所示,突缘承座31可垂直设置于该第一盖体1的顶部11;或突缘承座31与第一盖体的顶部11的夹角设置成不等于九十度,均得视使用的需要而加以改变设计。Then please refer to FIG. 3 again. In the storage device for storing semiconductor elements or masks of the present invention, the flange 3 can be further provided with a flange holder 31, which is connected with the first cover 1 to support the flange. 3. When the robot or manipulator holds the storage device for storing semiconductor elements or masks of the present utility model, it has better supporting force. There are many ways to set up the flange holder 31, as shown in Fig. 3A to Fig. 3K , the flange seat 31 can be vertically arranged on the top 11 of the first cover 1; or the angle between the flange seat 31 and the top 11 of the first cover is set to be not equal to 90 degrees, depending on the use Change the design as needed.

又,请参阅图4,是本实用新型的用以存放半导体元件或掩膜的存放装置中,突缘承座31的他种实施方式,突缘承座31得设置于第一盖体的侧边12,突缘承座31与第一盖体的侧边12的角度可以是九十度或不等于九十度,其实施方式如图4A至图4F所示,端视使用的需要而得加以改变。Also, please refer to FIG. 4 , which is another embodiment of the flange holder 31 in the storage device for storing semiconductor elements or masks of the present invention. The flange holder 31 must be arranged on the side of the first cover. The angle between the side 12, the flange seat 31 and the side 12 of the first cover can be 90 degrees or not equal to 90 degrees, and its implementation is shown in Figure 4A to Figure 4F, depending on the needs of use. be changed.

接着,请参阅图5,本实用新型的用以存放半导体元件或掩膜的存放装置得再设置把手41于第一盖体1上,以供人力提取、移动本实用新型的用以存放半导体元件或掩膜的存放装置,该把手41的设置,得另外架设或是将该把手41与第一盖体1设置为一体成型的型态。Next, please refer to Fig. 5, the storage device for storing semiconductor elements or masks of the present utility model must be provided with a handle 41 on the first cover 1 for manpower to extract and move the storage device for storing semiconductor elements of the present utility model Or the storage device for the mask, the setting of the handle 41 has to be erected separately or the handle 41 and the first cover 1 are set to be integrally formed.

又,如图6所示,本实用新型的用以存放半导体元件或掩膜的存放装置得再设置板件42于第一盖体1上,板件42得以额外加装的方式或者与第一盖体为一体成型的型态,板件42得用以设置标记43于上,达到辨识本实用新型的用以存放半导体元件或掩膜的存放装置本身或其内容物的资料。Also, as shown in Figure 6, the storage device for storing semiconductor elements or masks of the present utility model must be provided with a plate 42 on the first cover 1, and the plate 42 can be additionally installed or combined with the first cover 1. The cover body is integrally formed, and the plate 42 can be used to set the mark 43 on it, so as to identify the information of the storage device itself or its contents for storing semiconductor elements or masks of the present invention.

又如图7A至图7C所示,本实用新型的用以存放半导体元件或掩膜的存放装置得再设置警示器44当本实用新型的用以存放半导体元件或掩膜的存放装置受到预先设定的威胁时,该警示器44将产生警示的功效。或是可再增设感应器45,由感应器45可直接感应相关信息。或是可再增设辨识装置46,用以达到辨识的功能,该辨识装置46可以是无线射频辨识装置(RFID)。As shown in Figures 7A to 7C, the storage device for storing semiconductor elements or masks of the present utility model must be provided with a warning device 44 when the storage device for storing semiconductor elements or masks of the present utility model is preset. When there is a certain threat, this warning device 44 will produce the effect of warning. Alternatively, a sensor 45 can be added, and the sensor 45 can directly sense relevant information. Alternatively, an identification device 46 can be added to achieve the identification function. The identification device 46 can be a radio frequency identification device (RFID).

以上所述仅为本实用新型的较佳实施例而已,并非用以限定本实用新型的申请专利权利;同时以上的描述,对于熟知本技术领域的专门人士应可明了及实施,因此其它未脱离本发明所揭示的精神下所完成的等效改变或修饰,均应包含在本实用新型的权利要求范围中。The above description is only a preferred embodiment of the present utility model, and is not intended to limit the application for patent rights of the present utility model; simultaneously, the above description should be clear and implementable for those who are familiar with the technical field, so others do not depart from it. Equivalent changes or modifications accomplished under the spirit disclosed in the present invention shall be included in the scope of the claims of the present invention.

Claims (17)

1, a kind ofly in order to deposit semiconductor element or mask, it is characterized in that, include in order to deposit the storing unit of semiconductor element or mask:
One first lid has a top, and most sides be located at this top around;
One second lid, with this first lid combination, but the inner space of formation one holding semiconductor element or mask; And
At least onely allow that a machinery holds the bead of putting, be located at this first lid;
Wherein, this bead and this first lid are one-body molded.
2, as claimed in claim 1ly it is characterized in that in order to deposit the storing unit of semiconductor element or mask wherein this bead protrudes in the side of this first lid.
3, as claimed in claim 1ly it is characterized in that in order to deposit the storing unit of semiconductor element or mask wherein this bead protrudes in the top of this first lid.
4, as claimed in claim 1ly it is characterized in that in order to deposit the storing unit of semiconductor element or mask wherein this bead includes a bead bearing in addition, be connected with this first lid.
5, as claimed in claim 4ly it is characterized in that in order to deposit the storing unit of semiconductor element or mask wherein this bead bearing is vertically installed in the top of this first lid.
6, as claimed in claim 4ly it is characterized in that in order to deposit the storing unit of semiconductor element or mask wherein the angle at the top of this bead bearing and this first lid is greater than or less than 90 degree.
7, as claimed in claim 4ly it is characterized in that in order to deposit the storing unit of semiconductor element or mask wherein this bead bearing is vertically installed in the side of this first lid.
8, as claimed in claim 4ly it is characterized in that in order to deposit the storing unit of semiconductor element or mask wherein the angle of the side of this bead bearing and this first lid is greater than or less than 90 degree.
9, as claimed in claim 1ly it is characterized in that, wherein include the leader in addition and be located on this first lid in order to deposit the storing unit of semiconductor element or mask.
10, as claimed in claim 9ly it is characterized in that in order to deposit the storing unit of semiconductor element or mask wherein this handle and this first lid are formed in one.
11, as claimed in claim 1ly it is characterized in that, wherein include a plate in addition and be located on this first lid in order to deposit the storing unit of semiconductor element or mask.
12, as claimed in claim 11ly it is characterized in that in order to deposit the storing unit of semiconductor element or mask wherein this plate and this first lid are formed in one.
13, as claimed in claim 11ly it is characterized in that, wherein include a mark in addition and be located on this plate in order to deposit the storing unit of semiconductor element or mask.
14, as claimed in claim 1ly it is characterized in that, wherein include an attention device in addition and be located on this first lid in order to deposit the storing unit of semiconductor element or mask.
15, as claimed in claim 1ly it is characterized in that, wherein include an inductor in addition and be located on this first lid in order to deposit the storing unit of semiconductor element or mask.
16, as claimed in claim 1ly it is characterized in that, wherein include a device for identifying in addition and be located on this first lid in order to deposit the storing unit of semiconductor element or mask.
17, as claimed in claim 16ly it is characterized in that in order to deposit the storing unit of semiconductor element or mask wherein this device for identifying is a RFID devices.
CNU2007201934930U 2007-11-22 2007-11-22 Storage device for storing semiconductor elements or masks Expired - Lifetime CN201117642Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU2007201934930U CN201117642Y (en) 2007-11-22 2007-11-22 Storage device for storing semiconductor elements or masks

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2007201934930U CN201117642Y (en) 2007-11-22 2007-11-22 Storage device for storing semiconductor elements or masks

Publications (1)

Publication Number Publication Date
CN201117642Y true CN201117642Y (en) 2008-09-17

Family

ID=39992224

Family Applications (1)

Application Number Title Priority Date Filing Date
CNU2007201934930U Expired - Lifetime CN201117642Y (en) 2007-11-22 2007-11-22 Storage device for storing semiconductor elements or masks

Country Status (1)

Country Link
CN (1) CN201117642Y (en)

Similar Documents

Publication Publication Date Title
JP5268142B2 (en) Mask blank storage case, mask blank storage method, and mask blank storage body
CN1781826B (en) Stencil delivery container
JP5854511B2 (en) Pellicle and pellicle attaching method
US20100294688A1 (en) Photomask case structure
CN101546115A (en) Photomask storage device
JP4857239B2 (en) Wafer holding device
CN201117642Y (en) Storage device for storing semiconductor elements or masks
TWI377162B (en) Reticle pod
TWM330970U (en) Semiconductor elements storage apparatus and reticle storage apparatus
JPWO2007074757A1 (en) Reticle transfer apparatus, exposure apparatus, reticle transfer method, reticle processing method, device manufacturing method, and reticle cover management method
CN201156159Y (en) Photomask box and positioning piece thereof
CN101750872A (en) mask box
CN201107546Y (en) Metal light shield box and filter device thereof
TWM336941U (en) Storage apparatus for storing semiconductor element or reticle
TW200808622A (en) Metal photomask box
JP2006124034A (en) Member for supporting thin-film coated board, container for storing the thin-film coated board, mask blank storing body, transfer mask storing body and method for transporting the thin-film coated board
CN201214503Y (en) Photomask box and support piece thereof
JP2005326634A (en) Method for housing pellicle
JP2013041947A (en) Lithographic device and article manufacturing method
JP2014190998A (en) Substrate housing case
CN100344210C (en) Anti-static device for photomask transfer box
JP4356443B2 (en) Substrate transfer device
CN101673046A (en) Photomask storage device and method for keeping photomask clean and dry
WO2007147120A2 (en) Reticle pod with visually differentiable orientation indicator
CN208127167U (en) Spring buckle type box opening equipment

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CX01 Expiry of patent term

Granted publication date: 20080917