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CN200986989Y - 电连接器端子 - Google Patents

电连接器端子 Download PDF

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Publication number
CN200986989Y
CN200986989Y CNU2006200744296U CN200620074429U CN200986989Y CN 200986989 Y CN200986989 Y CN 200986989Y CN U2006200744296 U CNU2006200744296 U CN U2006200744296U CN 200620074429 U CN200620074429 U CN 200620074429U CN 200986989 Y CN200986989 Y CN 200986989Y
Authority
CN
China
Prior art keywords
electrical connector
solder
connector terminal
groove
recessed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNU2006200744296U
Other languages
English (en)
Inventor
谢福斌
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Foxconn Kunshan Computer Connector Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Foxconn Kunshan Computer Connector Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Kunshan Computer Connector Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Foxconn Kunshan Computer Connector Co Ltd
Priority to CNU2006200744296U priority Critical patent/CN200986989Y/zh
Priority to US11/821,236 priority patent/US7503815B2/en
Application granted granted Critical
Publication of CN200986989Y publication Critical patent/CN200986989Y/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/02Arrangements of circuit components or wiring on supporting structure
    • H05K7/10Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • H05K7/1069Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting with spring contact pieces
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50Fixed connections
    • H01R12/51Fixed connections for rigid printed circuits or like structures
    • H01R12/55Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multi-Conductor Connections (AREA)
  • Manufacturing Of Electrical Connectors (AREA)

Abstract

本实用新型公开了一种电连接器端子,可固持于绝缘本体中,用以电性连接芯片模组与电路板,其包括接触部、焊接部和连接接触部和焊接部的主体部,其中焊接部的下表面设有向内凹陷的凹陷部和至少一个可连通外界和凹陷部的沟槽。该沟槽使积聚在凹陷部中的焊料,可借由沟槽通道挥发至外界,不会被锡球包覆,锡球内也就不会存在凝结的焊料。

Description

电连接器端子
【技术领域】
本实用新型是关于一种电连接器端子,尤指一种供一焊料进行植接的电连接器端子。
【背景技术】
目前如中央处理器(CPU)等集成电路芯片的处理速度及功能日益强大,因此芯片对外进行讯号输入(I/O)的电性连接点将越来越多,然而其封装后的体积却要求轻薄短小,故如中央处理器等高度密集化设计的集成电路芯片之封装皆己采用PGA(Pin Grid Array)、BGA(Ball Grid Array)、甚至LGA(Land Grid Array)等封装方式,但无论集成电路芯片采用何种封装方式,皆必须利用一电连接器与一电路板电性连接,因此,为了使电连接器配合集成电路芯片的封装方式,以及考虑电连接器与电路板间相互电性连接的稳固性及制程效率,故一般在电连接器内各电连接器端子之一端连接一对应的锡球,再利用表面粘着法(SMT)将电连接器焊固于电路板上的做法,乃为现今电连接器与电路板间产生电性连接经常使用的方法。
承前所述,为了使电连接器端子与电路板间可利用表面粘着法相连,电连接器端子必须先连接一锡球。如图4所示,一种电连接器端子1’,其包括接触部10’,焊接部11’和连接接触部10’和焊接部11’的主体部12’。其中焊接部11’的下表面110’设有向内呈球弧形凹陷状的凹陷部111’,借由凹陷部111’以定位锡球(未图示),而锡球亦可与电连接器端子1’的焊接部11’接触,之后进行回焊,锡球熔化而得以植接在对应的电连接器端子1’上,并可供后续电连接器(未图示)与电路板(未图示)的表面粘着制程。
然而,为了使锡球植接在电连接器端子1’上,必须经过锡炉以进行回焊的作业,回焊时首先将电连接器端子1’焊接部11’朝上,然后将其下表面110’涂一层焊料,由于焊接部11’下表面110’上凹陷部111’的存在,部分焊料将会聚集在此凹陷部111’内,这样,锡球在回焊的过程中受热熔化,将会包覆整个电连接器端子1’焊接部11’的下表面110’,同时部分塌陷于下表面110’的凹陷部111’内。这样积聚在凹陷部111’内的焊料会被锡球完全覆盖,导致气态的焊料挥发到锡球内,并最后凝结在锡球中。
【实用新型内容】
本实用新型的目的是提供一种能够防止气态焊料于回焊的过程中,进入锡球内的电连接器端子。
本实用新型的目的是这样实现的:一种电连接器端子,可固持于绝缘本体中,用以电性连接芯片模组与电路板,其包括接触部、焊接部和连接接触部和焊接部间的主体部,其中焊接部的下表面设有向内凹陷的凹陷部和至少一个可连通外界和该凹陷部的沟槽,且该沟槽贯穿焊接部下表面未设凹陷部之区域。
与现有技术相比,本实用新型的优点为:通过焊接部的下表面设置可连通外界和凹陷部的沟槽,使积聚在凹陷部中的焊料,可借由沟槽通道挥发至外界,不会被锡球包覆,锡球内也就不会存在凝结的焊料。
【附图说明】
图1是本实用新型电连接器端子的立体图。
图2是图1所示电连接器端子另一视角的立体图。
图3是图1所示电连接器端子的主视图。
图4是先前技术中电连接器端子的立体图。
【具体实施方式】
请参阅图1-图3所示,本实用新型电连接器端子1,可固持于绝缘本体(未图示)中,并通过锡球(未图示)与电路板(未图示)相连,其包括接触部10、焊接部11和连接接触部10和焊接部11的主体部12。
主体部12的两侧面120设有若干倒刺121,以将电连接器端子1固持于绝缘本体中。
请参阅图2所示,焊接部11于主体部12的一端垂直延伸而出,以焊接至电路板上,其下表面110设有向内凹陷的凹陷部111,该下表面110上还设有至少一个可连通外界和凹陷部的沟槽112,且该沟槽112贯穿焊接部下表面未设凹陷部之区域。
接触部10于主体部12的侧面120延伸出,包括弯折部101及于该弯折部101上末端延伸出的弯曲部102。
通过在焊接部11的下表面110设置可连通外界和凹陷部111的沟槽112,使积聚在凹陷部111中的焊料,可借由沟槽112通道挥发至外界,不会被锡球包覆,锡球内也就不会存在凝结的焊料。
需要指出的是,本实用新型的电连接器端子不仅局限于以上所述的具体结构,只要焊接部下表面有凹陷部,并在其下表面设有至少一个沟槽可连通该凹陷部和外界,且该沟槽贯穿焊接部下表面未设凹陷部之区域,均可解决本实用新型的技术问题。

Claims (2)

1.一种电连接器端子,其包括焊接部和连接焊接部的主体部,其中焊接部的下表面设有向内凹陷的凹陷部,其特征在于:焊接部的下表面设有至少一个可连通外界和凹陷部的沟槽,且该沟槽贯穿焊接部下表面未设凹陷部之区域。
2.如权利要求1所述的电连接器端子,其特征在于:所述电连接器端子还包括自主体部延伸的接触部。
CNU2006200744296U 2006-06-23 2006-06-23 电连接器端子 Expired - Lifetime CN200986989Y (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CNU2006200744296U CN200986989Y (zh) 2006-06-23 2006-06-23 电连接器端子
US11/821,236 US7503815B2 (en) 2006-06-23 2007-06-22 IC socket with terminal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2006200744296U CN200986989Y (zh) 2006-06-23 2006-06-23 电连接器端子

Publications (1)

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CN200986989Y true CN200986989Y (zh) 2007-12-05

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US (1) US7503815B2 (zh)
CN (1) CN200986989Y (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101752705B (zh) * 2008-11-28 2012-11-28 富士康(昆山)电脑接插件有限公司 电连接器
CN109449632A (zh) * 2018-12-14 2019-03-08 深圳市远爱电子科技有限公司 焊接端子、焊接式端子及数据连接器
CN114628347A (zh) * 2022-05-16 2022-06-14 山东中清智能科技股份有限公司 一种半导体封装结构及其制备方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI583068B (zh) * 2012-08-02 2017-05-11 鴻海精密工業股份有限公司 電連接器

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11250966A (ja) * 1997-12-22 1999-09-17 Whitaker Corp:The コネクタ
JP2004158430A (ja) * 2002-09-12 2004-06-03 Tyco Electronics Amp Kk Lgaソケット用コンタクト
US6905377B2 (en) * 2002-09-17 2005-06-14 Tyco Electronics Corporation Contact for land grid array socket
US6955572B1 (en) * 2004-07-22 2005-10-18 Hon Hai Precision Ind. Co., Ltd LGA contact with extended arm for IC connector
US7247062B1 (en) * 2006-08-28 2007-07-24 Hon Hai Precision Ind. Co., Ltd. Electrical contact used in an electrical socket

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101752705B (zh) * 2008-11-28 2012-11-28 富士康(昆山)电脑接插件有限公司 电连接器
CN109449632A (zh) * 2018-12-14 2019-03-08 深圳市远爱电子科技有限公司 焊接端子、焊接式端子及数据连接器
CN114628347A (zh) * 2022-05-16 2022-06-14 山东中清智能科技股份有限公司 一种半导体封装结构及其制备方法
CN114628347B (zh) * 2022-05-16 2022-07-22 山东中清智能科技股份有限公司 一种半导体封装结构及其制备方法

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US20080007923A1 (en) 2008-01-10
US7503815B2 (en) 2009-03-17

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GR01 Patent grant
CX01 Expiry of patent term

Granted publication date: 20071205

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