CN201097407Y - 电连接器组件 - Google Patents
电连接器组件 Download PDFInfo
- Publication number
- CN201097407Y CN201097407Y CNU2007201747281U2007201747281U CN200720174728U CN201097407Y CN 201097407 Y CN201097407 Y CN 201097407Y CN U2007201747281U2007201747281 U CNU2007201747281U2007201747281 U CN U2007201747281U2007201747281U CN 200720174728 U CN200720174728 U CN 200720174728U CN 201097407 Y CN201097407 Y CN 201097407Y
- Authority
- CN
- China
- Prior art keywords
- circuit board
- conductive
- connector assembly
- conductive terminal
- insulating body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/0969—Apertured conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10628—Leaded surface mounted device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10795—Details of lead tips, e.g. pointed
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
Landscapes
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
Abstract
本实用新型公开了一种电连接器组件,用以电性连接电子元件至电路板,其包括绝缘本体、容设于绝缘本体中的若干导电端子,以及置于绝缘本体下端的电路板,导电端子设有与电路板电性连接的尾部,其中,导电端子尾部大致呈碟状,电路板相应设有收容该碟状尾部的收容槽以使导电端子有至少一个部位与电路板电性连接。这种形状的导电端子尾部能方便地插入或脱离电路板,而且至少有一个部位与电路板连接以实现电子元件与电路板稳固地电性连接。
Description
【技术领域】
本实用新型关于一种电连接器组件,尤指一种电性连接电子元件至电路板的电连接器组件。
【背景技术】
与本实用新型相关的电连接器组件一般通过表面安装技术(SMT)和穿孔式连接技术(Through hole)来实现电子元件与电路板的电性连接,该电连接器组件一般包括绝缘本体及容置于绝缘本体中的若干导电端子。表面安装技术一般于导电端子末端设置有锡球,将锡球置于电路板表面后,再通过标准回流焊接方法来实现导电端子与电路板的电性连接。穿孔式连接技术一般是直接将导电端子插入电路板中以实现导电端子与电路板的电性连接,再将电子元件置于绝缘本体表面从而实现电子元件与电路板之间的电性导通。
然而,采用表面焊接技术和穿孔式技术的电连接器组件,分别存在以下缺点:对于表面焊接技术,随着导电端子数量的增加,对应导电端子的锡球数量也相应增加,在电路板加温或者降温的过程中,锡球容易破裂,从而影响电子元件与电路板之间的电性连接。另外,由于绝缘本体通过锡球焊接在电路板上,当电子元件与电路板不导通时,对电连接器组件进行重工也是相当不易。对于穿孔式连接技术,由于导电端子是插入电路板中的,在导电端子发生偏移时,导电端子可能会在电路板中松动,从而造成电子元件与电路板连接的不紧密。
鉴于此,实有必要提供一种改进的电连接器组件,以克服上述电连接器组件的缺陷。
【实用新型内容】
本实用新型要解决的技术问题是提供一种电连接器组件,尤指一种便于插入或脱离电路板且有多个部位与电路板电性连接的电连接器组件。
为此,本实用新型提供了一种连接电子元件至印刷电路板的电连接器组件,其包括:绝缘本体、容设于绝缘本体中的若干导电端子,以及置于绝缘本体下端的电路板,导电端子设有与电路板电性连接的尾部,其中,导电端子尾部大致呈碟状,电路板相应设有收容该碟状尾部的收容槽以使导电端子有至少一个部位与电路板电性连接。
相对于与本实用新型相关的技术,本实用新型电连接器组件具有以下优点:导电端子尾部设置为碟状,其收容于电路板上的收容槽中,由此导电端子设有至少一个部位与电路板电性连接,由此可以增强电子元件与电路板电性连接的稳定性。而且,由于该碟状尾部是固持于电路板上的收容槽中的,其可以方便地插入或脱离电路板,这样在电连接器组件出现问题时,也便于对其进行检查或重工。
【附图说明】
图1为本实用新型电连接器组件中导电端子尾部置于电路板中的立体示意图。
图2为图1中电连接器组件沿II-II方向的剖视图。
【具体实施方式】
请参阅图1和图2所示,本实用新型电连接器组件(未标示),用以电性连接电子元件至电路板1,其包括绝缘本体(未图示)、容置于绝缘本体中的若干导电端子20,以及置于绝缘本体下端与导电端子20电性连接的电路板1。
电路板1上表面设有与导电端子20电性导通的导电垫片12,导电垫片12上设有收容槽10以接纳导电端子20。收容槽10可为未贯穿导电垫片12的凹槽,也可为贯穿导电垫片12的通槽,且该收容槽10设置有导电层13,导电层13表面涂有金属材料,如金等,从而实现电路板1与导电端子20的电性连接。收容槽10于其上表面设有斜面101以承接导电端子20从而扩大导电端子20与电路板1的导接区域。
导电端子20容置于绝缘本体中,其于与电路板1接触处设有尾部22。尾部22大致呈碟状,其外表面220朝向收容槽10凸出且大致呈半球形。依实际需要,尾部22外表面220也可设置为其他规则或者不规则的形状,比如椭圆形。由于导电端子20尾部22的外表面220大致为半球形,故导电垫片12上的收容槽10存在至少一个部位与导电端子20电性连接,且外表面220设置为光滑面,导电端子20不会损坏导电层13从而该电连接器组件能实现电子元件与电路板1稳固的电性连接。另外,由于导电端子20是置于收容槽10中来实现电连接器组件与电路板1的电形连接的,故导电端子20能方便地插入或脱离电路板1上的收容槽10,这样,在电连接器组件出现问题时,也便于对其进行检查或重工。
以上所述仅为本实用新型的优选实施方案,其它在本实施方案基础上进行的任何改进变换也应当不脱离本实用新型的技术方案。
Claims (4)
1.一种电连接器组件,用以电性连接电子元件至电路板,其包括绝缘本体、容设于绝缘本体中的若干导电端子,以及置于绝缘本体下端的电路板,导电端子设有与电路板电性连接的尾部,电路板上表面设有与导电端子电性导通的导电垫片,其特征在于:导电端子尾部大致呈碟状,电路板导电垫片相应设有收容该碟状尾部的收容槽以使导电端子有至少一个部位与电路板电性连接。
2.如权利要求1所述的电连接器组件,其特征在于:所述收容槽为未贯穿电路板导电垫片的凹槽。
3.如权利要求1所述的电连接器组件,其特征在于:所述收容槽为贯穿电路板导电垫片的通槽。
4.如权利要求1所述的电连接器组件,其特征在于:所述碟状尾部外表面大致呈半球形。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/509535 | 2006-08-24 | ||
| US11/509,535 US7267558B1 (en) | 2006-08-24 | 2006-08-24 | Electrical connector with contact |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201097407Y true CN201097407Y (zh) | 2008-08-06 |
Family
ID=38473187
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007201747281U2007201747281U Expired - Fee Related CN201097407Y (zh) | 2006-08-24 | 2007-08-21 | 电连接器组件 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US7267558B1 (zh) |
| CN (1) | CN201097407Y (zh) |
| TW (1) | TWM330644U (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107482332A (zh) * | 2017-07-13 | 2017-12-15 | 广东欧珀移动通信有限公司 | 电连接器组件及移动终端 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011029111A (ja) * | 2009-07-29 | 2011-02-10 | Molex Inc | コネクタ |
| CN118659187B (zh) * | 2024-08-20 | 2024-10-22 | 安徽天科泰新能源有限公司 | 一种导电连接件组装接合装置 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4940181A (en) * | 1989-04-06 | 1990-07-10 | Motorola, Inc. | Pad grid array for receiving a solder bumped chip carrier |
| US5459287A (en) * | 1994-05-18 | 1995-10-17 | Dell Usa, L.P. | Socketed printed circuit board BGA connection apparatus and associated methods |
| US5746608A (en) * | 1995-11-30 | 1998-05-05 | Taylor; Attalee S. | Surface mount socket for an electronic package, and contact for use therewith |
| US6037667A (en) * | 1998-08-24 | 2000-03-14 | Micron Technology, Inc. | Socket assembly for use with solder ball |
| US6099326A (en) * | 1998-09-18 | 2000-08-08 | Hon Hai Precision Ind. Co., Ltd. | Contact for use with matrix type connector |
| US6214716B1 (en) * | 1998-09-30 | 2001-04-10 | Micron Technology, Inc. | Semiconductor substrate-based BGA interconnection and methods of farication same |
| US7049693B2 (en) * | 2001-08-29 | 2006-05-23 | Micron Technology, Inc. | Electrical contact array for substrate assemblies |
| TW582642U (en) * | 2002-10-08 | 2004-04-01 | Via Tech Inc | Contact device for electric communication connection |
-
2006
- 2006-08-24 US US11/509,535 patent/US7267558B1/en not_active Expired - Fee Related
-
2007
- 2007-08-21 CN CNU2007201747281U2007201747281U patent/CN201097407Y/zh not_active Expired - Fee Related
- 2007-08-24 TW TW096214108U patent/TWM330644U/zh unknown
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107482332A (zh) * | 2017-07-13 | 2017-12-15 | 广东欧珀移动通信有限公司 | 电连接器组件及移动终端 |
| CN107482332B (zh) * | 2017-07-13 | 2019-12-27 | Oppo广东移动通信有限公司 | 电连接器组件及移动终端 |
Also Published As
| Publication number | Publication date |
|---|---|
| US7267558B1 (en) | 2007-09-11 |
| TWM330644U (en) | 2008-04-11 |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080806 Termination date: 20090921 |