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CN1625925B - 利用沟道/沟槽进行功率输送的功率-接地平面分割和过孔连接 - Google Patents

利用沟道/沟槽进行功率输送的功率-接地平面分割和过孔连接 Download PDF

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CN1625925B
CN1625925B CN03802980.4A CN03802980A CN1625925B CN 1625925 B CN1625925 B CN 1625925B CN 03802980 A CN03802980 A CN 03802980A CN 1625925 B CN1625925 B CN 1625925B
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groove
trench
pcb
conductive
metal
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CN1625925A (zh
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达瑞尔·萨托
加里·布里斯特
加里·朗
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Abstract

一种装置，包括多个金属化平面(202，204)、用于分隔所述多个金属化平面的一个或多个电解质层，以及用于连接到所述多个金属化平面中的至少一个金属化平面的一个或多个传导性沟槽(218、220、222)。

Description

利用沟道/沟槽进行功率输送的功率-接地平面分割和过孔连接
技术领域
本发明一般地涉及电路设计领域。更具体地说，本发明涉及创建并利用传导性沟槽来改进电路结构内部的功率输送、电磁干扰(EMI)抑制和/或热耗散。
背景技术
随着印刷电路板设计在复杂度方面已经提高，对在耦合到印刷电路板的多个组件之间的额外互连线路的需要也增加了。为了解决这一需要，制造商已供应了多层印刷电路板，其中几个导体层被多个电介质材料层分隔。印刷电路板(PCB)通常包含四个或更多导电层，其中至少一个导电层是接地平面，一个或多个导电层是功率平面和外部导电层，所述外部导电层提供用于耦合已被安装到PCB上的各种组件或插口的高密度互连。这些多层电路板制备成每个导电层都被电介质层分隔，使得除了通过过孔(via)外，向印刷电路板提供功率和接地平面的中间导体层不接触。图1图示了一个多层印刷电路板，其中位于互连层(未示出)之下的是用于提供功率的第一金属化层和用于提供接地的第二金属化层，并且这两个金属化层被电介质层(为清晰起见而被去除)分隔。围绕过孔可以提供在金属化层中的留隙空间，以避免与该层相连接。
可以使用过孔连接多层印刷电路板的多个导电层，该过孔镀有导电材料以提供镀有金属的通孔。过孔被设置成横穿印刷电路板，并且使用导电迹线将过孔连接到外部导电平面上的安装位置处。即，集成电路的安装焊盘和表面安装组件可能并不直接连接到镀有金属的通孔，而是可以使用图案化的导电迹线将所述焊盘和组件连接到镀有金属的通孔位置。随着集成电路器件密度的增加，关于电磁干扰(EMI)、功率/热耗散和功率输送的担忧也增加。
由于上文陈述的原因以及下文陈述的其它原因，所述其它原因在本领域普通技术人员阅读并理解本说明书之后将变得明显，需要现有技术中的印刷电路板能够解决上述担忧，同时保持当前电路板装配件的质量，包括焊点的质量。
附图说明
在附图中以示例而非限制的方式举例说明了本发明，附图中类似的标号指代类似的元件，其中：
图1图示了一个多层印刷电路板，其中位于互连层(未示出)之下的是用于提供功率的第一金属化层和用于提供接地的第二金属化层；
图2是由传导性沟槽连接的分段功率与接地平面的一个实施例的例图；
图3A是在核心电介质材料上的图案化第一金属涂层的例图；
图3B是在图案化第一金属涂层上沉积电介质层、在第二电介质上沉积/层叠第二金属涂层、并且穿过PCB层钻孔形成过孔之后的PCB的例图；
图3C是示出了沟槽形成开始的例图；其中是通过首先创建一个凹槽(groove)穿过第二金属层和第二电介质层以暴露第一金属层的多个部分来开始形成沟槽的；
图3D是金属化工艺之后的沟槽和过孔的例图；
图4A-4D是用于制备金属化沟槽的另一个实施例的例图；
图4A是用于制备金属电路的另一个实施例的例图；
图4B是用于向PCB添加更多层的另一个实施例的例图；
图4C是用于使用模具(die)印刻PCB的另一个实施例的例图；
图4D是模具印刻到PCB上的例图；
图5是用于连接PCB上的分段金属化平面的传导性沟槽的其它实施例的例图；
图6是金属化沟槽和分段表面的3D示图的例图；
图7A图示了随着金属化沟槽的数目和用于界定沟槽的增加的表面而增加的横截面积；
图7B从侧面(与沟槽的长度方向垂直)图示了金属化沟槽；
图8A是传导性沟槽可以用于制备PCB衬底中的法拉第笼的另一个实施例的例图；
图8B是另一个实施例的例图，其示出了用于形成法拉第笼的一部分的传导性沟槽的俯视图。
具体实施方式
这里公开了一种方法与装置，用于创建并利用传导性沟槽来改进PCB衬底中的功率输送、EMI抑制和/或热耗散。该方法与装置可以对由电介质分隔的一个或多个金属化层(平面)进行分段，使得在封装互连/过孔领域中可以有效实现沟槽的使用。为了讨论本发明，应当理解本领域技术人员使用了各种术语来描述装置、技术和方法。
在下文的描述中，为了解释的目的，阐述了大量的具体细节以提供对本发明的全面理解。但是对本领域普通技术人员来说很明显，在没有这些具体细节的条件下也可以实施本发明。在一些示例中，以概括的形式而非详细地示出了公知的结构和器件，以免混淆本发明。这些实施例得到足够详细地描述，使得本领域普通技术人员可以实施本发明，并且应当理解，在不背离本发明的范围的条件下，可以使用其它实施例，并且可以作出逻辑、机械、电气以及其它改变。
本发明通过添加沟道从而增加电流方向上的表面面积，提供改进的电流输运能力，减小的电压降(voltage droop)和/或改进的热传递。沟道可以由导电材料制成，结果可能是电流方向上的横截面积的增加。例如，该导电材料可以是金属、金属化膏剂或导电聚合物。沟道可以由导热材料制成，并可引起沿着该增大的横截面积的导热性的增大。例如，该导热材料可以是金属、膏剂和经填充的聚合物复合材料。此外，沟道可以有同时导热并导电的材料制成，所述材料例如是金属、金属化聚合物、导电复合物膏剂等。
通过选择性去除置于外部金属化层之间的基础材料层的多个部分和外部金属化层的多个部分来形成沟道(沟槽)。PCB可以具有作为基础材料(即，作为一个或多个非导电层)的压板，例如以玻璃纤维加固的环氧树脂，其中一种这样的纤维玻璃类型是FR4。此外，沟槽可以足够深以同样去除置于外部金属化层之间的一个或多个内部金属化层的多个部分。可以这样形成沟槽，使得沟槽的方向(长度)沿着添加的横截面积所期望的路径(在功率输送的情况下，沟槽可以是在电流的方向上)。可以通过诸如激光烧蚀、照片显影图案化、等离子、化学或机械等技术来形成沟槽。随后可以向裸露的沟槽提供一个涂层，例如利用前述的导电和/或导热材料之一，下文称之为传导性涂层。沟槽中的该传导性涂层横截面可以提供具有改进的横截面积的传导性路径。通过增加横截面积，单位长度的电阻相应地降低，并且降低的电阻减小功率输送电路的IR(电流乘电阻)降落。用于改进路径运输电流能力的增加的横截面积还可以导热，并且传导性涂层的表面可以散热。现在具有传导性涂层的沟槽(即，传导性沟槽)可以从传导性表面辐射或对流传导热量，以从PCB的内部去除热量。这可能在下述情况下发生，即沟槽建立了在内部分层电路/平面和最外部(暴露的)电路/平面之间的传导性连接，使得内部电路/平面的热耗散得到改进。
图2是由沟槽和过孔连接的分段功率与接地平面的一个实施例的例图。如图2所示，上部金属化平面202(平面)和下部金属化平面204可以由印刷电路板(PCB)200上的电介质(为清楚起见而被去除)分隔。利用虚线，上部和下部金属化平面202和204被示为广义的平面，即没有特定的边界。上部和下部金属化平面202和204可以被分段，其中通过传导性沟槽218、220和222可以将分隔开的上部分段206、208和210连接到分隔开的下部分段212、214和216。上部206、208、210和下部212、214、216分段可以层叠在一起，使得等电位分段(即，具有相等或近似相等面积)在垂直轴224方向上对准，用于通过相应的传导性沟槽218、220和222连接。
通过图案刻蚀金属化平面202和204并且随后通过去除用于分隔平面202和204的电介质材料，形成沟槽。随后每个沟槽218、220和222都被涂覆传导性材料以在上部分段206、208与210和下部分段212、214和216之间提供电和/或热连接。可以这样制备传导性沟槽的涂层厚度，使之提供比在金属化层202和204中的每个都没有沟槽的情况下所获得的横截面积更大的横截面。分段210和208可以被图案化为分别围绕并电连接一个或多个过孔226和229，并且分别电连接到沟槽222和220。或者作为另一种选择，分段210和208可以被图案化为分别围绕过孔227和228并与过孔保持间隔(即，未连接)。
图3A-3D图示了用于制备由PCB上的传导性沟槽和过孔连接的分段金属化平面的制备方法的一个实施例。图3A是在核心基础材料上的图案化的第一金属化层的例图。第一金属化涂层302可以是铜，其是通过几种方法覆层沉积而成的，所述方法例如是CVD或层叠(lamination)。在沉积金属层302之后的图案化可以包括在置于金属层上的光致抗蚀剂涂层中显影图像。刻蚀工艺随后可以对铜层302进行分段，以暴露出下面的基础材料304。
图3B是在第一金属化层之上沉积的电介质层和第二金属化层的例图。第二电介质层306被沉积在图案化的第一金属化涂层302上。然后，在第二电介质306上沉积或层叠第二金属化涂层308，并且可以穿过PCB层钻出过孔310。第二金属化涂层308可以是铜，第二电介质306可以是环氧树脂。
图3C是沟槽形成开始的例图。可以刻蚀或烧蚀穿过第二金属层308和第二电介质306层到暴露第一金属层302中的电路迹线的深度来形成凹槽312和314。在电介质306中刻蚀/烧蚀凹槽312和314可以通过多种工艺来完成，所述工艺例如是机械印刻、化学刻蚀、机械挖空或激光烧蚀。对于机械印刻，一种方法可以使用具有将要被放置到衬底中的沟槽的凸出式图案的金属模具(未示出)。将模具机械按压到衬底上可以使材料移位并形成沟槽。用于从金属层308中的沟槽区域312和314去除金属的工艺可能不同于用于从相同沟槽区域去除电介质材料306的工艺。
图3D是涂层工艺之后的传导性沟槽316与318和有涂层的过孔320的例图。所述涂层工艺例如是CVD、溅射、无电镀、电解镀或者这些工艺的组合。涂层可以覆盖沟槽312与314(上面的图3C)的表面以创建增大的传导性横截面积，其中通过控制所沉积的传导性材料(例如，金属沉积物、聚合物或膏剂)的量，可以在尺寸上调节该面积。
图4A-4D图示了用于制备由PCB上的传导性沟槽和过孔连接的分段的金属化平面的方法的另一个实施例的例图。图4A是在作为电介质的核心基础材料上的图案化的第一金属化层的例图。诸如铜的第一金属化涂层402可以由几种方法覆层沉积而成，所述方法例如是CVD或层叠。在沉积金属化层402之后的图案化可以包括在置于金属层上的光致抗蚀剂涂层中显影图像。刻蚀工艺随后可以对金属化层402进行分段，以暴露出下面的基础材料404。
图4B是在第一金属化层之上沉积的电介质层和第二金属化层的例图。可以在图案化的第一金属化涂层402上沉积第二电介质层406。然后，可以在第二电介质406上沉积或层叠第二金属化涂层408，随后可以穿过PCB层钻出过孔410。第二金属化涂层408可以是铜，第二电介质406可以是环氧树脂。
图4C是创建引起传导性沟槽形成的印刻的例图。例如通过使用具有凸出式图案414(即，将要被制造的沟槽的镜像图像)的金属模具412，机械印刻可以被按压416到衬底400的第二或顶部金属化层408上。
图4D是被按压到衬底的金属模具创建传导性沟槽的例图。将金属模具412机械按压到衬底400上可以同时移位金属化层408和电介质材料406两者，以形成传导性沟槽418和419。
用于去除或移位电介质材料以创建沟槽的工艺可以不同于用于移位或去除金属化层的工艺。
图5是用于连接PCB上的分段的金属化平面的传导性沟槽的其它实施例的例图。使用与上述工艺(图3A-3D)相同的工艺，金属化沟槽502和510可以被制备得更深，并且可以连接多于两个的金属化层512、514和508。图5图示了第一金属化沟槽502，其是例如通过刻蚀穿过两个电介质层504和506以暴露出PCB底部上的第三金属层508而形成的。第二金属化沟槽510还被图示为其被设置为穿过两个电介质层504和506，以连接在三个金属层508、512和514上的迹线。第三沟槽516可以将第二金属化层514连接到第三金属化层508。
对于其它的替代实施例，可以有多种组合，例如沟槽可以是只连接一个金属层的较深的沟槽，以只增加第一金属层的表面积，进而改进热传导和/或改进电导率。
图6是用于定义单个平面对602和604即第一金属层602和第二金属层604的分段的图案的一个实施例，其中两个金属层602和604的将要由沟槽605连接的分段可以彼此相对地放置。在本实施例中，上部掩模图像602稍后可以连接到(+)电位，而下部掩模图像604可以连接到(-)电位。上部掩模图像602中的较大表面积606可以连接到下部掩模图像604的一系列较小表面积分段或指状物609和609′。反过来，下部掩模图像604中的较大表面积608可以连接到上部掩模图像602中的一系列较小表面积分段或指状物607和607′。图6是允许在通过沟槽传导相连的两个或多个表面中实现多个电位或热位的一个实施例，以考虑将用于连接的两个或更多表面分段成电子封装件中使用的典型的交替的功率接地域。
图7A和7B是金属化沟槽的横截面的例图。如在图7A中所示的，横截面积随着金属化沟槽702和702′的数目增加，并且随着用于界定沟槽的增加的表面而增加。在矩形沟槽的情况下，表面积的增加对于每个金属化沟槽702和702′来说与沟槽侧壁的长度a和侧壁宽度b有关系。如图7B所示，当从侧面(与沟槽的长度方向垂直)看金属化沟槽702和702′时，对于每个横越过的沟槽702和702′来说，横截面积未变但传导性路径704长了2a。在功率传输的情况下，通过封装件的空隙式网格(未示出)，可以置于封装件引脚之间的金属化沟槽的数目是金属化方法的金属化沟槽宽度(a)和纵横比能力的函数。传导性涂覆之后的横截面积和沟槽的表面积可以通过修整沟槽表面的边缘和轮廓来控制或增大。
图8A和8B图示了可以用于制备PCB衬底中的法拉第笼的传导性沟槽的另一个实施例。本发明可以是用于将单个电路相对于传导性和/或辐射的能量进行屏蔽的新的器件结构。所述能量例如是从印刷电路板的外面或PCB上的邻近器件产生的辐射而引起的电磁干扰(EMI)。在另一个实施例中，法拉第笼被构建在PCB衬底之上和/或内部，以将PCB电路围在金属结构中。
法拉第笼通常是完整的导电壳，其收集杂散的电荷，并且由于同种电荷排斥，法拉第笼将它们存储在外表面(在那里与在内部相比，电荷可以离得更远)。这些电荷产生的电场之后在笼的内部相互抵消。法拉第笼通常被用于保护敏感的无线电设备。
图8A示出了具有由法拉第笼围绕的单个电路的PCB的横截面。图8B是形成法拉第笼的一部分的传导性沟槽的俯视图。可以通过上述方法制备多个传导性沟槽804。在一个实施例中，电路801和801′可以被形成在PCB 800内部的层上。沟槽可以被形成在PCB的侧面802和804两者之中。顶部表面802和底部表面806可以具有沉积的金属化层。沟槽804和804′可以形成为封闭的或近似封闭的环，即，例如这里示出的正方形。结果，所选择的电路可以被封闭在沟槽-底部/顶部表面中，从而使用法拉第笼屏蔽所选择的电路。其它电路801′和过孔808可以置于法拉第笼的外面。或者，在虑及法拉第笼的效率的些许降级的情况下，过孔(未示出)可以被设置为穿过法拉第笼结构。
如此，已经描述了使用一系列金属化沟槽连接两个或多个金属化平面的方法与装置，其中金属化沟槽具有可以增加从一个或多个金属化平面的导热和/或导电路径的横截面积。并且，一系列金属化平面和传导性沟槽可以被定位来创建用于保护其中的电路和/或电器件的法拉第笼。尽管已经参考具体示例性实施例描述了本发明，但是很明显，在不偏离如权利要求所阐述的本发明的较宽精神和范围的条件下，可以对这些实施例作出各种修改和改变。因此，说明书和附图应当被认为是示例性的而不具有限制意义。

Claims (10)

1.一种装置，包括：
多个金属化平面；
一个或多个电介质层，用于分隔所述多个金属化平面；以及
一个或多个传导性沟槽，用于连接所述多个金属化平面中的多于两个金属化平面。
2.如权利要求1所述的装置，其中所述多个金属化平面的一个或多个具有多个独立的分段。
3.如权利要求2所述的装置，其中所述传导性沟槽的至少一个连接到所述独立的分段的至少一个。
4.如权利要求3所述的装置，其中所述独立的分段的至少一个连接到电源。
5.如权利要求3所述的装置，其中所述所述独立的分段的至少一个连接到接地。
6.如权利要求1所述的装置，其中所述多个金属化平面的至少一个连接到电源。
7.如权利要求1所述的装置，其中所述多个金属化平面的至少一个连接到接地。
8.如权利要求1所述的装置，其中所述装置包括多个所述传导性沟槽，所述传导性沟槽的至少一个连接到所述金属化平面的至少两个，并且在所述所连接的金属化平面之间的一个或多个金属化平面与所述用于连接的传导性沟槽隔离。
9.如权利要求1所述的装置，其中一个或多个传导性沟槽的至少一个是导热的。
10.如权利要求1所述的装置，其中所述一个或多个传导性沟槽的至少一个是导电的。
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EP1472914B1 (en) 2008-04-09
US20100038127A1 (en) 2010-02-18
US7269899B2 (en) 2007-09-18
DE60320219T2 (de) 2009-05-14
AU2003207694A1 (en) 2003-09-02
US20030146020A1 (en) 2003-08-07
DE60320219D1 (de) 2008-05-21
US8056221B2 (en) 2011-11-15
US20030205407A1 (en) 2003-11-06
WO2003067943A2 (en) 2003-08-14
US6747216B2 (en) 2004-06-08
US7797826B2 (en) 2010-09-21
CN1625925A (zh) 2005-06-08
AU2003207694A8 (en) 2003-09-02
US8299369B2 (en) 2012-10-30
WO2003067943A3 (en) 2003-11-06
US20080029295A1 (en) 2008-02-07
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US20080029296A1 (en) 2008-02-07
ATE392126T1 (de) 2008-04-15

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