CN2852243Y - Structure of computer heat radiator - Google Patents

Abstract

A computer heat dissipation device structure, which is a heat dissipation structure that integrates multiple heat-generating chip radiators, a base is provided on the structure, a fan is provided on one side of the base, and two outlets of the fan are provided. Or two or more heat dissipation fin groups, these heat dissipation fin groups are respectively provided with outwardly extending heat pipes, and the outwardly extending ends of these heat pipes are respectively embedded on different heat dissipation bases. change in number and location. When in use, the heat dissipated by different high-heat chips or electronic components is conducted to the heat dissipation fin groups through the heat pipes on the heat dissipation base corresponding to them, and the fan is activated to make the air flow through each heat dissipation fin group successively. The heat is blown out of the system to achieve the purpose of dissipating heat for each heating chip of the computer. The utility model reduces one cooling fan, thereby reducing comprehensive development costs and product costs.

Description

The structure of computer cooling device

【Technical field】

The utility model relates to a structure of a cooling device for a computer, in particular to a structure of a cooling device for a notebook computer or an LCD PC. The structure uses a cooling device to reduce the heat generated by most of the electronic components that generate high heat. exclude.

【Background technique】

Notebook computers and LCD PCs will be more and more widely used in people's lives because of their portability and lightness respectively. The system performance problems caused by the heat-generating chips CPU chip, north bridge chip, and VGA chip of notebook computers or LCD PCs are also more prominent when they are working. In order to ensure the normal heat dissipation of the notebook computer or LCD PC heating chip CPU, North Bridge, and VGA during work, the known technical solution heat dissipation module structure is to separately configure the respective radiators for the CPU chip, the Northbridge chip, and the VGA chip. independent of each other.

The structure of the existing CPU heat dissipation device has a CPU heat sink base, a CPU heat dissipation plane, a CPU heat pipe, a centrifugal heat dissipation fan, a cover body, a buckle, and a CPU heat dissipation fin group. In the prior art, through the orderly connection of the above components, the heat dissipated by the CPU is transferred to the CPU heat pipe through the CPU heat conduction plane, and then conducted to the CPU heat dissipation fin group by the CPU heat pipe, and finally by the centrifugal fan that produces forced convection. The purpose of the cooling fan is to forcibly dissipate the heat on the CPU cooling fin set to the outside of the system. This device uses an independent radiator centrifugal fan to dissipate heat from the CPU crystal.

The structure of the existing VGA cooling device has a VGA radiator base, a VGA cooling plane, a VGA heat pipe, a centrifugal cooling fan, a cover body, a buckle, and a VGA cooling fin group. In the prior art, through the orderly connection of the above components, the heat dissipated during VGA work can be conducted to the VGA heat pipe through the VGA heat conduction plane, and then conducted to the VGA heat dissipation fin group by the VGA heat pipe, and finally the centrifugal fan that produces forced convection The purpose of the cooling fan is to forcibly dissipate the heat of the VGA cooling fin set to the outside of the system. This device uses an independent radiator centrifugal fan to dissipate heat from the VGA chip.

For the north bridge chip, the prior art uses a large heat sink for passive heat dissipation, which is to transfer the heat generated by the north bridge chip to the large heat sink, and passively dissipate heat through the cooling of the large heat sink.

Based on the above, we can see that in the prior art, the heat sinks of the CPU chip, the north bridge chip, and the VGA chip have independent structures and are equipped with their own heat sinks. In the known technology, the heat-generating chips are individually configured with their own heat sinks, resulting in high comprehensive development costs (mold costs) and high product costs.

【Content of invention】

In order to solve the problems existing in the prior art, the utility model mainly provides a structure of a computer cooling device, which has the characteristics of low comprehensive development cost (mold cost) and product cost compared with the prior art.

The structure of the portable computer cooling device of the utility model is provided with a base, a fan is arranged on one side of the base, and a heat dissipation base is provided on the other side of the base. The air outlet of the fan is provided with two or more cooling fin groups, each of which is provided with an outwardly extending heat pipe, and the outwardly extending ends of these heat pipes are respectively embedded in different heat dissipation bases. On the seat, one of the heat pipes extends to the heat dissipation base on the above-mentioned base, and the other heat pipes respectively extend to the heat dissipation bases provided separately.

Compared with the prior art, the utility model starts a centrifugal fan to make the airflow successively flow through the cooling fins to blow the heat out of the system to dissipate heat for each heating chip of the computer, thus saving the cost of a centrifugal fan which is a key component. , so it has the characteristics of relatively low cost and energy saving.

In order to have a further understanding of the purpose, structural features and functions of the utility model, the detailed description of the accompanying drawings is as follows:

【Description of drawings】

FIG. 1A is a schematic structural diagram of a computer cooling device according to a preferred embodiment of the present invention.

FIG. 1B is a schematic view of the reverse side of FIG. 1A .

Fig. 2 is an exploded schematic diagram of Fig. 1A.

【Detailed ways】

Please refer to FIG. 1A , FIG. 1B and FIG. 2 , which are front and back schematic diagrams and assembly and disassembly schematic diagrams of a preferred embodiment of the present invention.

The device is provided with a base 100. The base 100 includes a fan base 100a at one end and a heat dissipation base 100b at the other end. The fan base 100a and the heat dissipation base 100b are integrally formed. The periphery of the cooling base 100b is respectively provided with screw holes 100c, the base 100 can be locked on the motherboard of the computer through the screws 110 of the screw holes 100c, so that the cooling base 100b is fixed on a designated position, and the cooling base 100b also includes There is a heat pipe groove 100d.

A centrifugal fan 200 is disposed inside the fan base 100 a at one end of the base 100 , and a fan cover 210 is disposed on the centrifugal fan 200 . The fan cover 210 is locked on the fan base 100 a by locking screws 220 . The fan cover 210 and the fan base 100a jointly fix the centrifugal fan inside the two, and the combination of the two forms an air outlet 130, and the air outlet 130 is provided with a combination 300 of heat dissipation fins, the heat dissipation fins The combination of groups 300 includes two hollow heat dissipation fin groups 300a and 300b groups of heat dissipation fins combined with each other. Wherein the cooling fin set 300a is closer to the air outlet 130 than the cooling fin set 300b. In addition, the cooling fin set 300 a is internally provided with an outwardly extending heat pipe 310 , and the cooling fin set 300 b is internally provided with an outwardly extending heat pipe 320 . The other end of the heat pipe 310 rests in the heat pipe groove 100 d of the heat dissipation base 100 b , and the other end of the heat pipe 320 rests in the heat pipe groove 400 a of another heat dissipation module base 400 .

A copper block 510 and a copper block 520 are provided on the back of the heat dissipation base 100b. The two copper blocks are not connected, and the two copper blocks are welded on the heat pipe 310, and the copper block 510 is farther away from the heat dissipation fin 300a than the copper block 520. The copper block 510 is fixed on the heat dissipation base 100b by screws 510a. The heat dissipation base 400 is provided with a fastener 410, the fastener 410 and the heat pipe groove 400a clamp the heat pipe 320 on the heat dissipation base 400, and the fastener 410 is surrounded by screws 420 to fix it on the heat dissipation base 400 superior. A RAM cooling fin set 430 is connected to the back of the cooling base 400 .

When the device is installed on the computer motherboard to work, first the heat generated by the CPU chip and the north bridge chip is conducted to the heat pipe 310 through the copper block 510 and the copper block 520 respectively, and the heat pipe 310 transfers the heat of the north bridge chip and the CPU chip to the heat pipe 310. The cooling fin group 300a. The centrifugal cooling fan 200 fixed on the fan base 100a by the fan cover 210 and the cover locking screws 220 generates forced convection to forcibly dissipate the heat on the cooling fins 300a to the outside of the system. The heat of the VGA chip and the RAM heat dissipation fin set 430 is conducted to the heat pipe 320 through the heat dissipation base 400 , and the heat pipe 320 conducts the heat to the heat dissipation fin set 300 b. The heat on the heat dissipation fin set 300b is forcibly dissipated to the outside of the system by the centrifugal heat dissipation fan 200 generating forced convection.

The above is a preferred embodiment of the utility model. In actual operation, it is not limited to soldering the CPU chip heat dissipation plane, the North Bridge chip heat dissipation plane and the VGA heat dissipation base on the two heat conduction pipes respectively, and it is also possible to connect other heat dissipation elements on the two heat conduction pipes. The heat dissipation plane of the heat dissipation chip.

Claims (5)

1. the structure of a computer radiating apparatus, this structure comprises: a pedestal; One radiator fan is positioned at pedestal one side; One cooling base is positioned at the pedestal opposite side; It is characterized in that, two or more radiating fin group is located at the air outlet of radiator fan, and these radiating fin groups are provided with a heat pipe respectively, wherein a heat pipe extends on the above-mentioned cooling base, and all the other heat pipes then extend to respectively on each cooling base of establishing in addition.

2. the structure of computer radiating apparatus according to claim 1 is characterized in that, this radiator fan is a centrifugal fan, and its air intake direction and air-out direction angle are 90 degree.

3. the structure of computer radiating apparatus according to claim 1 is characterized in that, one of them cooling base is provided with the housing that radiator fan is installed.

4. the structure of computer radiating apparatus according to claim 1 is characterized in that, all can attach the heat conduction plane of an electronic component on each heat pipe.

5. the structure of computer radiating apparatus according to claim 1 is characterized in that, all can attach the heat conduction plane of an above electronic component on each heat pipe.

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