CN1472032A - Layout liner - Google Patents
Layout liner Download PDFInfo
- Publication number
- CN1472032A CN1472032A CNA031459129A CN03145912A CN1472032A CN 1472032 A CN1472032 A CN 1472032A CN A031459129 A CNA031459129 A CN A031459129A CN 03145912 A CN03145912 A CN 03145912A CN 1472032 A CN1472032 A CN 1472032A
- Authority
- CN
- China
- Prior art keywords
- base plate
- mentioned
- material base
- fragile material
- line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims abstract description 101
- 230000007246 mechanism Effects 0.000 claims abstract description 68
- 238000001816 cooling Methods 0.000 claims abstract description 44
- 230000003287 optical effect Effects 0.000 claims abstract description 40
- 238000010438 heat treatment Methods 0.000 claims abstract description 34
- 238000005520 cutting process Methods 0.000 claims description 29
- 238000007493 shaping process Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 20
- 230000015572 biosynthetic process Effects 0.000 abstract description 15
- 239000000758 substrate Substances 0.000 abstract 4
- 239000007921 spray Substances 0.000 description 22
- 239000007858 starting material Substances 0.000 description 17
- 239000011521 glass Substances 0.000 description 15
- 239000002826 coolant Substances 0.000 description 12
- 238000012545 processing Methods 0.000 description 11
- 238000002347 injection Methods 0.000 description 7
- 239000007924 injection Substances 0.000 description 7
- 239000003507 refrigerant Substances 0.000 description 5
- 230000006835 compression Effects 0.000 description 4
- 238000007906 compression Methods 0.000 description 4
- 239000000498 cooling water Substances 0.000 description 3
- 239000003550 marker Substances 0.000 description 3
- 230000010355 oscillation Effects 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 2
- 239000006063 cullet Substances 0.000 description 2
- 230000011514 reflex Effects 0.000 description 2
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Thermal Sciences (AREA)
- Toxicology (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Laser Beam Processing (AREA)
- Liquid Crystal (AREA)
Abstract
Provided is a scribing apparatus suitable for scribing a brittle material substrate of a large plate. Whole formation necessary for forming a scribe line on the brittle material substrate of a laser beam oscillator 3, an optical unit 4, a bend mirror 5, a cooling jet 6, and a trigger mechanism 7 is fitted integrally to a support 2. In this way, in the scribing apparatus 1, even when each formation necessary for forming the scribe line is moved in relation to the surface of the brittle material substrate S, the occurrence of variation in the forming positions of a heating area and a cooling area is prevented. Accordingly, the formation of a stable scribe line can be maintained, and the stable quality of the disruption surface of the brittle material substrate S disrupted through a break process implemented after the scribe line is formed can be secured.
Description
Technical field
The present invention relates to a kind of being used at the big chalker that forms the line profile on the fragile material base plate of opening.
Background technology
In order to block with glass film plates etc. is the fragile material base plate of representative, the general method that adopts is to carry out crossed process as described below and disconnect operation, promptly, above-mentioned crossed process is to form along desirable direction to make surface from the fragile material base plate be formed up to the continuous line profile of vertical fracture of prescribed depth; And above-mentioned disconnection operation is after this crossed process, by the fragile material base plate is exerted pressure, along the line profile that forms at crossed process the fragile material base plate is blocked.
In the crossed process that is carried out under the occasion of blocking the fragile material base plate, used known method is with the superhard alloy manufacturing or forms the method for line profile with the colyliform icking tool that sintered diamond is made.But state in the use in the method for colyliform icking tool, the cullet that when forming the line profile, produced can surface attached to the fragile material base plate on, the fragile material base plate is being used under the occasion such as display unit, will become the reason of display defect.And when the disconnection operation of carrying out the fragile material base plate is blocked, also can partly produce at the section of fragile material base plate etc. undesirable damaged, the therefore problem that reduces with regard to the quality that the fragile material base plate that makes after blocking is arranged.
At this situation, in recent years, the method for using the laser line to form the line profile has been practical.The method that this use laser line forms the line profile as shown in Figure 6, it is that the laser line LB of laser oscillation apparatus 61 outputs is shone on the fragile material base plate S that constitutes the object of ruling.Laser line LB by laser oscillation apparatus 61 irradiations forms laser spot LS along line with predetermined profile on fragile material base plate S.Set for along line the laser line LB of laser oscillation apparatus 61 irradiations relatively mobile on fragile material base plate S with predetermined profile SL.
Also spray cooling agents such as cooling water, make near the line profile that forms of laser line LB irradiation area on fragile material base plate S surface from cooling jet 62.The surface of the fragile material base plate S of illuminated laser line LB produces compression stress through laser line LB heating, the injection by cooling agent produces tensile stress.Like this, because the zone that is close with the zone that produces compression stress has produced tensile stress, thereby between two zones, produced stress gradient based on each stress, generate a vertical fracture (blind crack) on fragile material base plate S, it is from the end of fragile material base plate S, with preformed joint-cutting TR of instrument such as colyliform icking tools, forms continuously with predetermined profile along line.
Owing to the method for using aforesaid laser line to form the line profile seldom produces cullet, in the forming process of line profile, utilized thermal strain stress, thereby when disconnecting operation, on the end face of fragile material end, be not easy to take place damaged.
Though it mainly is to be applicable to the occasion that the used small-sized glass film plates of liquid crystal indicator etc. is rule that above-mentioned stitch marker profile with the irradiation of laser line becomes method, also can rule with same principle under the occasion that the large glass base plate is rule.
Be designed to such to the rule laser scribe apparatus of usefulness of the big glass film plates of opening, promptly, laser oscillator that the laser beam stream of provision wavelengths is vibrated is set at and big the opening on the position that glass film plates leaves that constitutes the line object, by transfer systems such as speculums the energy of line is sent to be arranged on the big stitch marker profile of opening glass film plates and to become optical system lens portion on the face.The cooling jet of ejected coolant is being set near position this optical system lens portion.And, adopt this chalker to open under the occasion that forms the line profile on the glass film plates big, optical system lens portion and cooling jet scan with respect to the big glass film plates of opening that is fixed along the direction of desirable line with predetermined profile, by shine heating that forms and the formed cooling of cooling agent that sprays by cooling jet by the laser line, make vertical fracture (blind crack) begin development, to form desirable line profile from the joint-cutting that forms in the end in advance.
But, in this apparatus structure, in order to form the line profile on the glass film plates big opening, optical system lens portion and cooling jet are moved big opening on the glass film plates, therefore along with moving of this optical system lens portion and cooling jet will make the light path change of laser line with respect to the glass film plates face, thereby make the beam configuration change that forms on the glass film plates face, also can make the eject position change of cooling jet ejection cooling agent.Therefore, because these changes have taken place, thereby just be difficult to the formation of the stable line profile of maintenance, like this, exist after the line profile disconnects glass film plates, be difficult to guarantee the problem of stable glass film plates truncation surface quality.
In addition, because with above-mentioned chalker, a plurality of optical system lens portion is set on same big glass film plates face, this structurally also is difficult, thereby also has the problem that is difficult to process the processing time (productive temp) shortening.
The present invention makes for the problem that overcomes above-mentioned prior art existence, its objective is provides can be applicable to the chalker that a big fragile material base plate is rule, using the irradiation of laser line and cooling off by cooling agent and form under the occasion of line profile, can eliminate the light path change that becomes face with respect to the stitch marker profile of fragile material base plate, and because a plurality of optical system lens portion can be set, thereby can shorten in the processing processing time.
Summary of the invention
In order to achieve the above object, chalker of the present invention comprises, the joint-cutting that forms the cooling body of cooled region at the heating arrangements that forms heating region on the fragile material base plate, near the position of this heating region and form as the joint-cutting of line profile starting point forms mechanism, form from the continuous line profile of vertical fracture of above-mentioned joint-cutting progress by the stress gradient that takes place between heating region and the cooled region, it is characterized in that, be provided with above-mentioned heating arrangements, cooling body and joint-cutting are formed fixedly all-in-one-piece fixed mechanism of mechanism; It is mutual with the relative velocity stipulated, relatively keep certain position relation and mobile forming mechanism and above-mentioned fragile material base plate by said fixing mechanism fixing heating arrangements, cooling body and joint-cutting.
In the chalker of the invention described above, preferably above-mentioned heating arrangements has: shine optical module on the above-mentioned fragile material base plate after the laser shaping established practice setting shape that the laser oscillator of the laser line of vibration takes place, above-mentioned laser oscillator is taken place, be configured between above-mentioned laser oscillator and the optical module and the laser beam of above-mentioned laser oscillator irradiation spread and deliver to connecting gear on the above-mentioned module of optical system; By said fixing mechanism above-mentioned laser oscillator, module of optical system and connecting gear are fixed into one.
In the chalker of the invention described above, preferably above-mentioned cooling body and joint-cutting form mechanism and are separately positioned on the both sides of the moving direction of above-mentioned fragile material base plate across above-mentioned heating arrangements, said fixing mechanism with respect to above-mentioned fragile material base plate, no matter move and can both rule towards any one direction that moves forward and backward.
In the chalker of the invention described above, preferably be provided with a plurality of said fixing mechanism, side by side form the line profile at a plurality of positions of above-mentioned fragile material base plate.
The chalker of the invention described above, it is characterized in that, be provided with fixed mechanism, it is to form mechanism and be fixed into one forming the cooling body of cooled region at a heating arrangements that forms heating region on the fragile material base plate, near the position of this heating region and forming joint-cutting as the joint-cutting of line profile starting point, when above-mentioned heating arrangements, cooling body and joint-cutting mechanism being held in certain position relation with respect to the fragile material base plate, they are moved by said fixing mechanism.Use chalker of the present invention,, also can prevent the formation position change of heating region and cooled region even necessary each member of formation line profile is moved with respect to the fragile material base plate.Therefore the formation of stable line profile can be kept, the disconnection operation of after forming the line profile, being implemented can be guaranteed and the quality of the stable truncation surface of the fragile material base plate S that blocks.
Another chalker of the present invention is that cooling body and joint-cutting form mechanism is separately positioned on the direct of travel of above-mentioned fragile material base plate across above-mentioned heating arrangements both sides, even said fixing mechanism with respect to this fragile material base plate, move towards any one direction of direction or direction of retreat of advancing, can both rule on the fragile material base plate.Therefore can shorten the line formation of processing the processing time, can be suitable for opening greatly the fragile material base plate.
Another chalker of the present invention is to be provided with a plurality of fixed mechanisms that heating arrangements, cooling body and joint-cutting mechanism are fixed into one, be provided with and make each fixed mechanism to travel mechanism that same direction moves, mobile each fixed mechanism that makes by this travel mechanism moves to same direction, just can the while form the line profile simultaneously on a plurality of positions on the surface of fragile material base plate.Thus, with respect to a fragile material base plate, just can form a plurality of line profiles with 1 line, can shorten and process the processing time, can be suitable for opening greatly the line formation of fragile material base plate.
Description of drawings
Fig. 1 represents the schematic configuration of the chalker of embodiment of the present invention 1, (a) is that side view, (b) are that vertical view, (c) are front views.
Fig. 2 is the side view of the chalker of expression embodiment of the present invention 2.
Fig. 3 is the side view of the chalker of expression embodiment of the present invention 3.
Fig. 4 is the vertical view of the chalker of expression embodiment of the present invention 3.
Fig. 5 is the front view of the chalker of expression embodiment of the present invention 3.
Fig. 6 is the ideograph that is used to illustrate with the fragile material base plate method for cutting of laser line irradiation.
The specific embodiment
Below, explain chalker of the present invention.
(embodiment 1)
Fig. 1 represents the schematic configuration of the chalker of embodiment of the present invention 1, and Fig. 1 (a) is that side view, Fig. 1 (b) are that vertical view, Fig. 1 (c) are front views.Below, with reference to Fig. 1 (a)～(c), the chalker 1 of present embodiment 1 is described.
This chalker 1 has the flat support platform 2 of formation.On support platform 2, with respect to supporting that platform 2 is installed with laser oscillator 3 with being integral, be used to produce the laser line of the vibration of regulation irradiation energy.Supporting on the platform 2, forming peristome 2a at the laser line emitting side of laser oscillator 3, below peristome 2a, with respect to supporting that platform 2 is installed with module of optical system 4 with being integral, it is penetrated the laser beam inflow of laser oscillator 3 irradiations and be shaped to after the shape of regulation, incides on the surface of the fragile material base plate S that constitutes the line object.In the peristome 2a top position of supporting platform 2, also with respect to supporting that platform 2 is being provided with 2 curved reflectors 5 with being integral, it reflexes to the laser line of laser oscillator 3 irradiations the direction that is arranged on the module of optical system 4 below the peristome 2a.
Below supporting platform 2, near the position module of optical system 4, with respect to supporting that platform 2 is being provided with cooling spray 6 with being integral, it with refrigerant injection to the surface of fragile material base plate S.At the opposition side of cooling spray 6, module of optical system 4 is being provided with starter mechanism 7 with being clipped in the middle, be used for forming joint-cutting as the starting point (starting) of line profile at the positions such as end of fragile material base plate S.
Members such as cooling spray 6, module of optical system 4, starter mechanism 7 are to be adapted to respectively along line with on the same straight line of predetermined profile according to this order.For the heating region that makes the cooled region that is formed by refrigerant injection on the fragile material base plate S and formed by the irradiation of laser line constitutes approaching mutually position relation, with cooling spray 6 and module of optical system 4 closely configuration mutually.As long as and that starter mechanism 7 is adapted to the joint-cutting that can form as line profile starting point is just passable, can approaching, also can leave with respect to the heating region that forms by the laser line irradiation of laser system assembly 4, therefore it can be arranged on the optional position.
The support platform 2 that laser oscillator 3, curved reflectors 5, module of optical system 4, cooling spray 6 are installed with being integral is by the drive mechanism that does not have expression among the figure, can move with predetermined profile along line, when forming the line profile, support that platform 2 is that the direction of front moves with respect to fragile material base plate S, with starter mechanism 7 sides.And will support the translational speed of platform 2 to be adjusted to be applicable to preferably to form the line profile by this travel mechanism.
Make the melt surface of fragile material base plate S for the heating-up temperature of the heating region that prevents from fragile material base plate S, to form by the oscillating laser line that laser oscillator 3 produces, use the sort of also lower than fragile material base plate S melt temperature, promptly, laser oscillator structure that energy is also lower than the softening point of fragile material base plate S.At this moment, because it is also different to constitute difference, the softening point of the fragile material base plate S kind of line object, thereby preferably sets for and can change according to the kind of fragile material base plate S by the irradiation energy of the oscillating laser line of laser oscillator 3 outputs.
To penetrate by laser oscillator 3 with module of optical system 4, by 2 curved reflectors 5 and the laser beam flow shaping of incident becomes to be suitable for forming the desired shape of line profile, for example be shaped to the elliptical shape of using the length of predetermined profile direction along line.
As the cooling agent from cooling spray 6 ejections, for the ease of using, representative is water, but also can be altered to the CO of cooling usefulness
2Gas, N
2The liquid cooling agents such as organic solvent of gas shape cooling agent such as gas, He gas or cooling usefulness.
Starter mechanism 7 is the mechanical type mechanisms that are provided with colyliform icking tool etc., for example by the colyliform icking tool being pressed on the surface of fragile material base plate S, in the desirable position of fragile material base plate S, for example form joint-cutting as the starting point of line profile near the end on the surface of fragile material base plate S.This mechanical type mechanism must not push the fragile material base plate S beyond the desired position on the fragile material base plate S, and the reciprocating mechanism (not expression among the figure) that this mechanical type mechanism is moved up and down is being set on starter mechanism 7.Mechanism as form joint-cutting on fragile material base plate S surface except adopting mechanical mechanism, can also adopt the mechanism of optical profile types such as YAG laser.At this moment, because the mechanism of this optical profile type is discontiguous with respect to the surface of fragile material base plate S, thereby just reciprocating mechanism needn't be set.
Below, the scribble method of the chalker that uses said structure is described.
To be placed on the workbench of lower position of the module of optical system 4, cooling spray 6 and the starting structure 7 that are in chalker 1 as the fragile material base plate S of line object earlier.When placing, S carries out position alignment to the fragile material base plate, makes the line on fragile material base plate S surface consistent with the line direction of chalker 1 with the direction of predetermined profile.
Then, by the driving of travel mechanism, the support platform 2 that module of optical system 4, cooling spray 6 and starter mechanism 7 are installed with being integral is moved with respect to fragile material base plate S.When support platform 2 was moved, starter mechanism 7 reached the end of fragile material base plate S earlier.At this end position, make the mechanical type mechanisms such as colyliform icking tool that are installed on starter mechanism 7 front ends by the surface that is pressed in fragile material base plate S on, on this position, form joint-cutting thus, with starting point as the line profile.
On the surface of fragile material base plate S, form after the joint-cutting, the mechanical type mechanism of starter mechanism 7 front ends is in contactless state with respect to fragile material base plate S surface, under situations such as the surface that makes fragile material base plate S does not take place to damage unintentionally, continue again to make and support that platform 2 moves.And when module of optical system 4, cooling spray 6 below supporting platform 2 reach the joint-cutting position on fragile material base plate S surface, begin laser oscillator 3 is driven, also begin from cooling agents such as cooling spray 6 injection cooling waters.
When laser oscillator 3 is driven, send the laser line of vibration with predetermined energy.By 2 curved reflectors 5 the laser line of vibration is reflexed to and to be formed on the direction of supporting the peristome 2a on the platform 2, the laser beam by peristome 2a flows into and is mapped to module of optical system 4.By incident the module of optical system 4 of above-mentioned laser line the laser line is formed after the desirable shapes such as elliptical shape, to the surface irradiation of fragile material base plate S.Form heating region on the surface of fragile material base plate S, this heating region is corresponding with the laser point of irradiated laser line.
From cooling spray 6 with refrigerant injections such as cooling waters to the surface of fragile material base plate S, forming cooled region on the position near the heating region that forms by the irradiation of laser line.
The heating region that forms on the surface of fragile material base plate S produces compression stress, in the cooled region generation tensile stress of refrigerant injection.Make on the fragile material base plate S line with form on the predetermined profile compression stress that forms by the irradiation of laser line and form at its rear side, by the tensile stress of the cooled region of cooling agent generation, ruling with moving successively on the predetermined profile by making these heating regions and cooled region, just can be from the formed joint-cutting in end of fragile material base plate S, generate the vertical fracture (blind crack) of vertical direction continuously, form desirable line profile.
In the chalker 1 of present embodiment 1, the necessary entire infrastructures of formation line profile such as laser oscillator 3, curved reflectors 5, module of optical system 4, cooling spray 6 and starter mechanism 7 are all with respect to supporting platform 2 to install with being integral.Therefore, even make each structure with respect to the surface of fragile material base plate S and move, also can prevent of the light path change of laser line, can eliminate the beam configuration change that shines the lip-deep laser line of fragile material base plate S with respect to fragile material base plate S surface.Can also eliminate the cooling agent that sprays from cooling spray 6 the eject position change, can make it keep certain.Like this, just can keep the formation of stable line profile, can guarantee through forming the line profile stable cross section quality of the fragile material base plate S that blocked of the disconnection operation of enforcement afterwards.
(embodiment 2)
Fig. 2 is the side view of the chalker 10 of expression embodiment of the present invention 2.
This chalker 10 has the structure roughly the same with the chalker 1 of above-mentioned embodiment 1 shown in Figure 1, on the basis of the structure of the chalker 1 of above-mentioned embodiment 1, starter mechanism 7 and cooling spray 6 all are being set respectively, and will be used to make the travel mechanism that supports platform 2 to move to make the structure that both direction forwards, backwards moves in both sides, front and back with respect to optical system 4.In this chalker 10, those structures identical with above-mentioned chalker 1 are all used identical reference marks.
On the chalker 10 of present embodiment 2, as mentioned above, owing to starter mechanism 7 and cooling spray 6 all are being set respectively in the both sides, front and back of module of optical system 4, thereby after fragile material base plate S being carried out 1 line end, move, make support platform 2 to move by the position that makes fragile material base plate S, just can continue to form the line profile towards rightabout with the 1st line.
Like this, not only can obtain 1 getable effect of chalker with the chalker 10 of present embodiment 2 by embodiment 1, and can back and forth cut off, the processing processing time is shortened, can be applicable to the formation of the line profile of the big fragile material base plate of opening.
(embodiment 3)
Fig. 3～Fig. 5 has represented the schematic configuration of the chalker 20 of embodiment 3, and Fig. 3 is that side view, Fig. 4 are that vertical view, Fig. 5 are front views.The chalker 20 of present embodiment 3 is described below with reference to Fig. 3～Fig. 5.
This chalker 20 has the flat support platform 21 of formation.At this above support platform 21,, be used to produce the laser line of the vibration of regulation irradiation energy with respect to supporting platform 21 that laser oscillator 22 is installed with being integral.On this supports platform 21, form peristome 21a at the laser line emitting side of laser oscillator 22, below this peristome 21a, with respect to supporting that platform 21 is installed with module of optical system 23 with being integral, it is penetrated the laser beam inflow of laser oscillator 22 irradiations and be shaped to after the shape of regulation, incides on the surface of the fragile material base plate S that constitutes the line object.In the peristome 21a top position of supporting platform 21, also with respect to supporting that platform 21 is being provided with 2 curved reflectors 24 with being integral, it reflexes to the laser line of laser oscillator 22 irradiations the direction that is arranged on the module of optical system 23 below the peristome 21a.
Below supporting platform 21, near the position module of optical system 23, with respect to supporting that platform 21 is being provided with cooling spray 25 with being integral, it with refrigerant injection to the surface of fragile material base plate S.Opposition side at cooling spray 25 is being provided with starter mechanism 26, and module of optical system 23 is clipped in their centre, and above-mentioned starter mechanism 26 is the joint-cuttings that are used for forming at the positions such as end of fragile material base plate S as the starting point (starting) of line profile.
Promptly, in the chalker 20 of present embodiment 3, a plurality of support platforms 21 are being set in a travel mechanism 27.Travel mechanism 27 has the travelling carriage portion 28 that each supports platform 21 that is being provided with.And on this chalker 20, form the pair of guide rails 29 that parallels with predetermined profile with line in the both sides of the travelling carriage portion 28 of travel mechanism 27, travelling carriage portion 28 rides on this guide rail 29, and can be mobile on predetermined profile in line.This travelling carriage portion 28 moves along guide rail 29 by the driving mechanism that does not have expression among the figure.
Can be provided with each travelling carriage portion that supports platform 21 28 fixing, fragile material base plate S moved and rule by the travel mechanism that not have among the figure to represent.
Being arranged in the travelling carriage portion 28 each supports platform 21 shown in the dotted line of Fig. 4, can can on the lip-deep desired position of fragile material base plate S, form the line profile along using the perpendicular direction of predetermined profile in the 28 enterprising line position adjustment of travelling carriage portion with line.
Because the detailed structure of laser oscillator 22 members such as grade is identical with laser oscillator 1 member such as grade of embodiment 1, thereby the explanation of the detailed structure of these members omitted.
Because the scribble method with this chalker 20 also is identical with the scribble method of the chalker 1 of using embodiment 1, thereby detailed explanation has also been omitted.But, because present embodiment 3 has a plurality of support platforms 21, these support platforms that formation such as the laser oscillator 22 necessary member of profile of ruling is provided with as 1 assembly, thereby with respect to a fragile material base plate S, just can form a plurality of line profiles simultaneously with 1 line.
Like this,, carry out 1 line and just can form a plurality of line profiles simultaneously, thereby compare, can further shorten the time that processing is handled with the chalker 1 of embodiment 1 owing to use the chalker 20 of present embodiment 3.
Because the chalker 20 of present embodiment 3 is provided with a plurality of support platforms 21, and these support that platforms are members such as the necessary laser oscillator 22 of line to be made 1 assembly and one is simplified with constituting, thereby with respect to a fragile material base plate S, can form a plurality of line profiles simultaneously, can be applicable at the big fragile material base plate of opening to form a plurality of line profiles.
Each supports that the platform 21 and the support platform 2 of the chalker of embodiment 1 are same structures in the present embodiment 3, can only be to a direction line, but also can make with the support platform 2 of embodiment 2 said chalkers 10 similarly, starter mechanism 7 and cooling spray 6 all are set respectively in both sides with respect to module of optical system 4, and make support platform forwards, backwards both direction constitute movably.If adopt such structure, then can in two directions rule, the processing processing time is further shortened.
Claims (4)
1. chalker, comprise: form the cooling body of cooled region at the heating arrangements that forms heating region on the fragile material base plate, on and the joint-cutting that forms as the joint-cutting of line profile starting point forms mechanism near the position of this heating region, form from the continuous line profile of vertical fracture of above-mentioned joint-cutting progress by the stress gradient that takes place between this heating region and the cooled region, it is characterized in that
Be provided with above-mentioned heating arrangements, cooling body and joint-cutting are formed fixedly all-in-one-piece fixed mechanism of mechanism; It is mutual with the relative velocity stipulated, relatively keep certain position relation and mobile forming mechanism and above-mentioned fragile material base plate by said fixing mechanism fixing heating arrangements, cooling body and joint-cutting.
2. chalker as claimed in claim 1, it is characterized in that above-mentioned heating arrangements has: shine optical module on the above-mentioned fragile material base plate after the laser shaping established practice setting shape that the laser oscillator of the laser line of vibration takes place, above-mentioned laser oscillator is taken place, be configured between above-mentioned laser oscillator and the optical module and the laser beam of above-mentioned laser oscillator irradiation spread and deliver to connecting gear on the above-mentioned optical module; By said fixing mechanism above-mentioned laser oscillator, optical module and connecting gear are fixed into one.
3. chalker as claimed in claim 1 or 2, it is characterized in that, above-mentioned cooling body and joint-cutting form mechanism and are separately positioned on the both sides of the moving direction of above-mentioned fragile material base plate across above-mentioned heating arrangements, and no matter said fixing mechanism moves and can both rule towards any one direction that moves forward and backward with respect to above-mentioned fragile material base plate.
4. as any described chalker in the claim 1～3, it is characterized in that, be provided with a plurality of said fixing mechanism, side by side form the line profile at a plurality of positions of above-mentioned fragile material base plate.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP202578/2002 | 2002-07-11 | ||
| JP2002202578A JP2004042423A (en) | 2002-07-11 | 2002-07-11 | Scribing apparatus |
| JP202578/02 | 2002-07-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1472032A true CN1472032A (en) | 2004-02-04 |
| CN1328194C CN1328194C (en) | 2007-07-25 |
Family
ID=30437330
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB031459129A Expired - Fee Related CN1328194C (en) | 2002-07-11 | 2003-07-11 | Layout liner |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2004042423A (en) |
| KR (1) | KR20040007251A (en) |
| CN (1) | CN1328194C (en) |
| TW (1) | TW200400863A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102089115A (en) * | 2008-05-30 | 2011-06-08 | 三星钻石工业股份有限公司 | Laser working apparatus, and laser working method |
| CN101439928B (en) * | 2007-11-23 | 2012-02-29 | 三星康宁精密素材株式会社 | Glass substrate laser cutting device |
| CN102555095A (en) * | 2008-06-30 | 2012-07-11 | 三星钻石工业股份有限公司 | Pin for holding scribing wheel |
| CN101003416B (en) * | 2006-01-20 | 2012-07-11 | 株式会社东芝 | Laser cutting apparatus and method |
| CN105835243A (en) * | 2015-02-02 | 2016-08-10 | 三星钻石工业股份有限公司 | Holder, holder unit and scribe apparatus |
| CN107378908A (en) * | 2017-09-08 | 2017-11-24 | 广州市盛吉成智能科技有限公司 | A kind of high-end shear line dispenser |
| CN111055256A (en) * | 2019-12-30 | 2020-04-24 | 湖南三一快而居住宅工业有限公司 | Double-end marking device and double-end marking system |
| CN113246089A (en) * | 2021-06-11 | 2021-08-13 | 中庆建设有限责任公司 | Measuring and marking device |
| CN114734153A (en) * | 2022-03-31 | 2022-07-12 | 武汉华日精密激光股份有限公司 | Splitting method and system for processing brittle material by laser |
| CN116352293A (en) * | 2023-06-02 | 2023-06-30 | 沧州领创激光科技有限公司 | A new type of laser cutting machine |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100573259B1 (en) * | 2004-06-28 | 2006-04-24 | 주식회사에스엘디 | Laser cutting device using heat induced crack propagation |
| TWI380868B (en) * | 2005-02-02 | 2013-01-01 | Mitsuboshi Diamond Ind Co Ltdl | Fine processing method of sintered diamond using laser, cutter wheel for brittle material substrate, and method of manufacturing the same |
| EP1900492B1 (en) * | 2005-07-06 | 2013-05-22 | Mitsuboshi Diamond Industrial Co., Ltd. | Brittle material scribing wheel, method for manufacturing such brittle material scribing wheel, and scribing method, scribing apparatus and scribing tool using such brittle material scribing wheel |
| CN101108446A (en) * | 2006-07-21 | 2008-01-23 | 富士迈半导体精密工业（上海）有限公司 | Laser cutting device and method |
| JP2009242184A (en) * | 2008-03-31 | 2009-10-22 | Nippon Electric Glass Co Ltd | Cutting method and cutting device for brittle platy object |
| KR100958745B1 (en) * | 2009-11-30 | 2010-05-19 | 방형배 | Laser scribing apparatus, method, and laser scribing head |
| TWI543834B (en) * | 2015-04-24 | 2016-08-01 | 納諾股份有限公司 | Brittle object cutting apparatus and cutting method thereof |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2024441C1 (en) * | 1992-04-02 | 1994-12-15 | Владимир Степанович Кондратенко | Process of cutting of nonmetal materials |
| MY120533A (en) * | 1997-04-14 | 2005-11-30 | Schott Ag | Method and apparatus for cutting through a flat workpiece made of brittle material, especially glass. |
| DE19952331C1 (en) * | 1999-10-29 | 2001-08-30 | Schott Spezialglas Gmbh | Method and device for quickly cutting a workpiece from brittle material using laser beams |
-
2002
- 2002-07-11 JP JP2002202578A patent/JP2004042423A/en active Pending
-
2003
- 2003-06-02 TW TW092114861A patent/TW200400863A/en not_active IP Right Cessation
- 2003-06-11 KR KR1020030037330A patent/KR20040007251A/en not_active Ceased
- 2003-07-11 CN CNB031459129A patent/CN1328194C/en not_active Expired - Fee Related
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101003416B (en) * | 2006-01-20 | 2012-07-11 | 株式会社东芝 | Laser cutting apparatus and method |
| CN101439928B (en) * | 2007-11-23 | 2012-02-29 | 三星康宁精密素材株式会社 | Glass substrate laser cutting device |
| CN102089115A (en) * | 2008-05-30 | 2011-06-08 | 三星钻石工业股份有限公司 | Laser working apparatus, and laser working method |
| CN102555095A (en) * | 2008-06-30 | 2012-07-11 | 三星钻石工业股份有限公司 | Pin for holding scribing wheel |
| CN102555095B (en) * | 2008-06-30 | 2015-09-16 | 三星钻石工业股份有限公司 | Keep the columned pin of stitch marker |
| CN105835243B (en) * | 2015-02-02 | 2020-06-05 | 三星钻石工业股份有限公司 | Holder, holder unit, and scribing device |
| CN105835243A (en) * | 2015-02-02 | 2016-08-10 | 三星钻石工业股份有限公司 | Holder, holder unit and scribe apparatus |
| CN107378908A (en) * | 2017-09-08 | 2017-11-24 | 广州市盛吉成智能科技有限公司 | A kind of high-end shear line dispenser |
| CN111055256A (en) * | 2019-12-30 | 2020-04-24 | 湖南三一快而居住宅工业有限公司 | Double-end marking device and double-end marking system |
| CN113246089A (en) * | 2021-06-11 | 2021-08-13 | 中庆建设有限责任公司 | Measuring and marking device |
| CN114734153A (en) * | 2022-03-31 | 2022-07-12 | 武汉华日精密激光股份有限公司 | Splitting method and system for processing brittle material by laser |
| CN114734153B (en) * | 2022-03-31 | 2023-02-14 | 武汉华日精密激光股份有限公司 | Splitting method and system for processing brittle material by laser |
| CN116352293A (en) * | 2023-06-02 | 2023-06-30 | 沧州领创激光科技有限公司 | A new type of laser cutting machine |
| CN116352293B (en) * | 2023-06-02 | 2023-08-25 | 沧州领创激光科技有限公司 | Laser cutting machine |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1328194C (en) | 2007-07-25 |
| JP2004042423A (en) | 2004-02-12 |
| TWI292352B (en) | 2008-01-11 |
| KR20040007251A (en) | 2004-01-24 |
| TW200400863A (en) | 2004-01-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1472032A (en) | Layout liner | |
| CN101386467B (en) | Method and device for dividing brittle substrate | |
| CN1203013C (en) | Method and device for cutting breakable plane workpiece, particularly, plate glass product | |
| KR101223470B1 (en) | Method of machining vulnerable material substrate | |
| KR101949777B1 (en) | Glass plate cutting method and glass plate cutting device | |
| KR101190173B1 (en) | Method for cutting a fragile material substrate | |
| KR101165982B1 (en) | Method for processing fragile material substrate | |
| EP1428640A1 (en) | Method for scribing substrate of brittle material and scriber | |
| CN1414893A (en) | Method and device for rapid cutting of workpiece from brittle material | |
| US20150209911A1 (en) | Cutting device | |
| KR101440481B1 (en) | Method for scribing brittle material substrate and device for scribing brittle material substrate | |
| CN1733415A (en) | Laser processing method | |
| CN101046571A (en) | Method for cutting substrate and substrate cutting apparatus using the same | |
| CN1264768C (en) | Device and method for scribing fragile material substrate | |
| KR20100087371A (en) | Method for chamfering/machining brittle material substrate and chamfering/machining apparatus | |
| EP2428494A2 (en) | Laser dividing apparatus | |
| TW201334904A (en) | Method for breaking workpiece and method for breaking substrate with optical element pattern | |
| CN1298523C (en) | Method and device for scribing fragile material substrate | |
| KR100647454B1 (en) | Scribing apparatus and scribing method of brittle material substrate | |
| CN1242458C (en) | Method and device for scribing brittle material substrate | |
| KR20100107253A (en) | Substrate cutting appartus and method for cutting substrate using the same | |
| CN103028841B (en) | Laser processing device | |
| CN1284737C (en) | Glass cutting method and apparatus | |
| KR20000054977A (en) | Apparatus for cutting a glass | |
| CN1704213A (en) | Fragile work piece cutting equipment with double nozzle |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070725 Termination date: 20130711 |