CN1302315C

CN1302315C - Liquid crystal display assembly

Info

Publication number: CN1302315C
Application number: CNB2003101142374A
Authority: CN
Inventors: 陈慧昌; 杨金城
Original assignee: AU Optronics Corp
Current assignee: Huaxing Optoelectronic International Hong Kong Co ltd
Priority date: 2003-11-05
Filing date: 2003-11-05
Publication date: 2007-02-28
Anticipated expiration: 2023-11-05
Also published as: CN1542507A

Abstract

A liquid crystal display component includes a glass substrate and a tape-and-reel carrier package, wherein the glass substrate is provided with a plurality of indium tin oxide pins, a test circuit and a plurality of routing lines, and the tape-and-reel carrier package further includes a plurality of tape-and-reel carrier package pins. The test circuit and the indium tin oxide pins are electrically connected by a plurality of corresponding routing lines. The method for preventing the test circuit from short-circuiting is to change the configuration of the routing lines so that the cutting point of each routing line is located between every two adjacent tape-and-reel carrier package pins.

Description

LCD assembly

(1) technical field

The relevant a kind of LCD assembly of the present invention, and particularly relevant a kind of LCD assembly that prevents the measurement circuit short circuit.

(2) background technology

For existing LCD (Liquid Crystal Monitor, LCD) manufacturing, in order to reduce the scrappage of Polarizer, change original LCD process sequence, functional test time-histories is originally moved forward, (Thin Film Transistor, TFT) substrate carries out Pretesting (pre-test) and falls defective TFT substrate with prior screening, avoids waste and improves process rate to thin film transistor (TFT) and adopted before sticking Polarizer promptly.

Please refer to Fig. 1, it is the synoptic diagram of part block of the line configuring of known measurement circuit.A plurality of tin indium oxide pins (Indium Tin Oxide Lead, ITO Lead) 106a, 106b, 106c, and 106d be a side on the glass substrate (not being illustrated among Fig. 1) that is disposed at the TFT substrate equidistantly.Measurement circuit 102 is made up of

many metal line

102a, 102b and 102c.Measurement circuit 102 also is arranged on the glass substrate of TFT substrate, and the top covers first protective seam (Passivation) 308, with isolated and protection test circuit 102.

Cabling

104a, 104b, 104c, and 104d be electrically connected to

corresponding ITO pin

106a, 106b, 106c, and 106d, and the top covers second protective seam 110.Wherein, be with the means of contact hole (Contact Hole) 112 between cabling 104 and the measurement circuit 102, and cabling 104 is linear fashion electric connection measurement circuit 102 and corresponding ITO pin 106 with bee-line as electric connection.

When carrying out Pretesting (pre-test), the TFT glass substrate electrically connects by a measurement circuit 102 and a test cell 114 earlier, and then test cell 114 is responsible for the TFT glass substrate is tested.

Please be simultaneously with reference to Fig. 2 and Fig. 3 A, Fig. 2 is the synoptic diagram of the part block that is connected with the tin indium oxide pin of known coil type carrier package part pin, Fig. 3 A is the profile line 3A-3A ' sectional view along Fig. 2.After current test is finished, utilize laser beam that cabling 104 is blown separation forming an electrical isolation district, and this electrical isolation district extend to form a cut path 108.Then, with hot pressing legal (Heat Seal) TCP pin (Tape Carrier package Lead, TCP Lead) 202 is configured in the ITO pin 106 of the correspondence on the glass substrate 302.

Please refer to Fig. 3 A, the processing procedure that now TCP is engaged in glass substrate is described below: at first, (Anisotropic Conductive Film, ACF) 306 on ITO pin 106b to be coated with an aeolotropic conductive film.Then, TCP pin 202b and ITO pin 106b contraposition and pressing downwards make TCP pin 202b to combine with ITO pin 106b and to electrically connect by aeolotropic conductive film 306, and TCP and glass substrate 302 are also interconnected.

Please refer to Fig. 3 A, TCP (the IC chip is not illustrated among Fig. 3 A) includes three layers, and ground floor is with polyimide (Polyimide, PI) be the soft winding layer 310 of base material, the second layer is that 312, the three layers of copper foil layers are anti-welding barrier layer (Solder Resist, SR) 314.And TCP pin 202b is formed in the copper foil layer 312, to electrically connect with ITO pin 106b.

Please refer to Fig. 3 B, it is the enlarged drawing of regional A among Fig. 3 A.In above-mentioned conventional practice,, therefore understand fusion and cut off cabling 104, and form a cut path 108, to reach the purpose that metal wire 102b and ITO pin 106b are electrically separated because cut is moment cabling 104 to be carried out pyroprocessing.Yet in the process of high-temperature fusion, cabling 104b tends to upwards send forth to second protective seam, 110 end faces and forms metal residue 316.Therefore, when TCP pin 202b engaged with ITO pin 106b, TCP pin 202b will contact with the metal residue 316 at cabling 104b breakpoint place, and produces the phenomenon of electrical short circuit.Like this, will make the TFT substrate produce misoperation, and increase the scrappage of TFT substrate.

(3) summary of the invention

In view of this, the object of the present invention is to provide a kind of LCD assembly, can prevent the measurement circuit short circuit, to reduce the scrappage of TFT substrate.

According to LCD assembly of the present invention, comprise a glass substrate and a TCP.Have a measurement circuit, many cablings and a plurality of ITO pin on this glass substrate.This measurement circuit is made up of many metal line, and described metal wire is in order to electrically connect with a test cell, to make that test cell must be in order to test LCD assembly.This measurement circuit is adjacent to the ITO pin and is positioned at the outside of ITO pin, and is to electrically connect with many cablings between measurement circuit and the ITO pin.Side on the TCP has a plurality of TCP pins, and each TCP pin engages and electrically connects with corresponding ITO pin.After test cell is finished test to LCD assembly, utilize a laser beam to cut along a cut path, cut off cabling to reach the purpose that makes electrical isolation between measurement circuit and the ITO pin.And the part section of each cabling is to be disposed between per two adjacent TCP pins, and the intersection point in described cabling and cut path is a cabling breakpoint, and described cabling breakpoint is between per two adjacent TCP pins.

For further specifying above-mentioned purpose of the present invention, design feature and effect, the present invention is described in detail below with reference to accompanying drawing.

(4) description of drawings

Fig. 1 is the synoptic diagram of part block of the line configuring of known measurement circuit.

Fig. 2 is the synoptic diagram of the part block that is connected with the tin indium oxide pin of known coil type carrier package part pin.

Fig. 3 A is the profile line 3A-3A ' sectional view along Fig. 2.

Fig. 3 B is the enlarged drawing of regional A among Fig. 3 A.

Fig. 4 is the synoptic diagram according to the part block of the TFT substrate of a preferred embodiment of LCD assembly of the present invention.

Fig. 5 is the synoptic diagram of the part block of of the present invention LCD assembly of TCP pin when engaging with the ITO pin.

Fig. 6 A is the sectional view along the profile line 6A-6A ' of Fig. 5.

Fig. 6 B is the sectional view along the profile line 6B-6B ' of Fig. 5.

(5) embodiment

Please refer to Fig. 4 and Fig. 5, it is the synoptic diagram according to the part block of the TFT substrate of a preferred embodiment of LCD assembly of the present invention, and Fig. 5 is the synoptic diagram of the part block of of the present invention LCD assembly of TCP pin when engaging with the ITO pin.One measurement circuit is made up of

metal wire

402a and 402b, and wherein, this two

metal line

402a and 402b are the horizontal direction configuration and the outside that is positioned at described tin indium oxide pin.Be to electrically connect between

metal wire

402a and 402b and the ITO pin 406 with many corresponding cablings 404.In addition,

metal wire

402a and 402b electrically connect an outside test cell 414, make that test cell 414 must be in order to test LCD assembly.Also promptly, after the signal that carries out Pretesting is sent by test cell 414, be passed to cabling 404a, 404b, 404c and 404d, then be passed on corresponding ITO

406a, 406b, 406c and the 406d by described cabling 404 again via

metal wire

402a and 402b.

Cabling 404 covers with one second protective seam 410, and each cabling 404 can electrically connect via a plurality of through holes 608 of correspondence corresponding with each respectively metal wire 402a and 402b.After 414 pairs of LCD assemblies of test cell are finished test, cut along a cut path 408 with a laser beam, then, engage with after each TCP pin 502 and corresponding each ITO pin 406 contrapositions again.Wherein,

cabling

404a, 404b, 404c and 404d form corresponding cabling breakpoint 504a, 504b, 504c and 504d in the confluce mutually with cut path 408.By described cabling breakpoint 504, reach the purpose of electrical isolation between metal wire 402 and the ITO pin 406.

As shown in Figure 4, the part section of cabling 404 of the present invention is to dispose in approximate L shaped mode, wherein, and L shaped section tool one straight-line segment and dispose along vertical direction.Because the part section of cabling 404 is to dispose in approximate L shaped mode, make each cabling breakpoints 504 of the straight-line segment of this L shaped section and 408 intersections, cut path all between per two adjacent TCP pins 502.For example, cabling breakpoint 504a is between TCP pin 502a and 502b.Wherein, cabling breakpoint 504 can be positioned at the right side of corresponding coil type carrier package part pin 502, and as shown in Figure 5, and cabling breakpoint 504 also can be positioned at the left side of corresponding coil type carrier package part pin 502.

Like this, though after the laser pyroprocessing, metal residue still can be sprayed onto on second protective seam 410, yet in the process that the TCP pin engages, metal residue no longer includes chance and contacts with TCP pin 502.Therefore, by the configuration that changes cabling, the generation of electrical short circuit in the time of can effectively avoiding engaging.

Please refer to Fig. 6 A and Fig. 6 B, Fig. 6 A is the sectional view along the profile line 6A-6A ' of Fig. 5, and Fig. 6 B is the sectional view along the profile line 6B-6B ' of Fig. 5.Two

metal line

402a and 402b are set in parallel on the glass substrate 602, and cover first protective seam 606 on it, with isolated and protect this measurement circuit.Wherein, have a plurality of through holes 608 on first protective seam 606, make each cabling 404 to electrically connect via the through hole 608 of correspondence corresponding with each respectively metal wire 402a and 402b.For example, cabling 404c electrically connects with metal wire 402a by through hole 608.TCP includes three layers, is made up of polyimide 610, copper 612 and anti-welding barrier layer 614 respectively.Utilize aeolotropic conductive film 604 as adhesive agent and conductive media, test signal can be passed to ITO pin 406c by copper foil layer 612.

On the confluce in Fig. 6 A section line 6A-6A ' and cut path 408, there is no cabling 404c and pass through, have only the existence of second protective seam 410.Therefore, as TCP pin 502c when down the hot pressing program is carried out in pressing, between TCP pin 502c and the cut path 408, there is no any metal residue and exist.Therefore, the copper foil layer 612 of the 2nd layer of pin 502c can not have an opportunity to contact with the metal residue at cabling breakpoint 504c place and cause electrical short circuit.

Please refer to Fig. 6 B and Fig. 5, is between TCP pin 502c and 502d along the cabling breakpoint 504c of profile line 6B-6B ' section, makes the metal residue of the 504c of breakpoint place can not contact with TCP502c and 502d, and then removes the possibility of short circuit fully.

The disclosed structure-improved of measurement circuit short circuit that prevents of the above embodiment of the present invention has following advantage: outside carrying out in the pin engaging process, can avoid between cabling breakpoint after the cut and the TCP pin electrical short circuit taking place.

Though the present invention describes with reference to current specific embodiment, but those of ordinary skill in the art will be appreciated that, above embodiment is used for illustrating the present invention, under the situation that does not break away from spirit of the present invention, also can make the variation and the modification of various equivalences, therefore, as long as variation, the modification to the foregoing description all will drop in the scope of claims of the present invention in connotation scope of the present invention.

Claims

1. A liquid crystal display assembly, the assembly comprising:

A glass substrate, the glass substrate is provided with a test line, a plurality of wiring lines and a plurality of indium tin oxide pins, the indium tin oxide pins are located on one side of the glass substrate, and the test line is adjacent to the The indium tin oxide pin is located outside the indium tin oxide pin, and the test line is electrically connected to the indium tin oxide pin by the trace; and

A tape and reel carrier package having a plurality of tape and reel carrier package pins, wherein each tape and reel carrier package pin is vertically bonded and electrically connected to a corresponding indium tin oxide pin;

Wherein, after the liquid crystal display component is tested by using the test line, a laser beam is cut along a laser cutting path to cut off the wiring, and cut off between the test line and the ITO pin and the intersection point of each of the traces and the laser cutting path is a trace breakpoint, and the trace breakpoint is located between every two adjacent pins of the tape and reel carrier package.

2. The liquid crystal display assembly as claimed in claim 1, wherein a partial section of each of the traces is disposed between every two adjacent tape and reel carrier package pins, and the traces of the traces Part of the segment is intersected with the laser cutting path.

3. The liquid crystal display assembly as claimed in claim 1, wherein the break point of the wiring is located on the right side of the corresponding lead of the tape and reel carrier package.

4. The liquid crystal display assembly as claimed in claim 1, wherein the breakpoint of the wiring is located on the left side of the corresponding pin of the tape and reel carrier package.

5. The liquid crystal display assembly as claimed in claim 1, wherein the test circuit has more than one metal line arranged along the horizontal direction, and a part of the line is arranged in a straight line along the vertical direction, so The metal wires are covered by a first protection layer, and the traces are covered by a second protection layer, and each trace is electrically connected to the corresponding metal wire through a through hole.