TWI240104B - Display assembly and assembling method thereof - Google Patents
Display assembly and assembling method thereof Download PDFInfo
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- TWI240104B TWI240104B TW92128769A TW92128769A TWI240104B TW I240104 B TWI240104 B TW I240104B TW 92128769 A TW92128769 A TW 92128769A TW 92128769 A TW92128769 A TW 92128769A TW I240104 B TWI240104 B TW I240104B
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- glass substrate
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- 238000000034 method Methods 0.000 title claims description 12
- 239000000758 substrate Substances 0.000 claims abstract description 48
- 239000011521 glass Substances 0.000 claims abstract description 40
- 238000012360 testing method Methods 0.000 claims abstract description 37
- 230000000903 blocking effect Effects 0.000 claims abstract description 17
- 238000009413 insulation Methods 0.000 claims description 6
- 239000004973 liquid crystal related substance Substances 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 125000006850 spacer group Chemical group 0.000 claims 2
- 239000002313 adhesive film Substances 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- 230000001681 protective effect Effects 0.000 abstract description 16
- 239000002184 metal Substances 0.000 abstract description 6
- 229910052751 metal Inorganic materials 0.000 abstract description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 4
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 238000003698 laser cutting Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000011990 functional testing Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000000344 soap Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Description
1240104 五、發明說明ο) 【發明所屬之技術領域] 本發明是有關於一種顯示器模組，且特別是有關於一 種具有一避免短路之保護絕緣層之顯示器模組。 【先前技術】 對於一般液晶顯示器（liquid crystal display, LCD )的製程，一般前製程之方式係在偏光板貼附於薄膜電晶 體（Thin Film Transistor，TFT)基板之後才對TFT基板進 行功能測試（function test)，若測試完成之TFT基板有瑕 疯時必須捨棄，往往也造成已貼附之偏光板必須捨棄，導 致偏光板之浪費。為避免原料之浪費並節省製造成本，在 TFT基板進行第一次切割後，並於貼附偏光板之前，先對 TFT基板進行2G3D或2G2D之預測試（pre-test)，以先篩選 掉不良之TFT基板。 請同時參照第1 A圖與第1 B圖。第1 A圖繪示乃一傳統應 用於一液晶顯示模組之測試線路之部分示意圖，第1 B圖繪 示乃第1A圖中沿著剖面線1 B -1 B ’方向之剖面圖。在第1B圖 中’顯不is模組100包括一 TFT基板之玻璃基板11〇與一捲 帶式載體封裝件（Tape Carrier Package，TCP)120。玻璃 基板110上具一顯示區160、多個銦錫氧化（indium Tin Oxide， I TO)引腳111，並配置有多條走線丨32以及多條導 線1 3 1。導線1 3 1係與一測試單元1 3 0電性連接，而顯示區 1 60係藉由IT0引腳111與走線132連接，走線1 32再與導線 1 31實質上垂直排列並部分連接，且藉由導線丨31與測試單1240104 V. Description of the invention [Technical field to which the invention belongs] The present invention relates to a display module, and more particularly, to a display module having a protective insulating layer to prevent short circuit. [Previous technology] For the general liquid crystal display (LCD) manufacturing process, the general pre-processing method is to perform a functional test on the TFT substrate after the polarizer is attached to a thin film transistor (TFT) substrate ( function test), if the completed TFT substrate is defective, it must be discarded, which often results in the attached polarizing plate having to be discarded, resulting in waste of the polarizing plate. In order to avoid waste of raw materials and save manufacturing costs, after the TFT substrate is cut for the first time and before the polarizer is attached, a 2G3D or 2G2D pre-test is performed on the TFT substrate to screen out the defects first. TFT substrate. Please refer to both Figure 1 A and Figure 1 B. FIG. 1A is a partial schematic view of a conventional test circuit applied to a liquid crystal display module, and FIG. 1B is a cross-sectional view taken along the section line 1 B -1 B ′ direction in FIG. 1A. In FIG. 1B, the 'display module 100 includes a glass substrate 11 of a TFT substrate and a roll of tape carrier package (TCP) 120. The glass substrate 110 has a display area 160, a plurality of indium tin oxide (ITO) pins 111, and is configured with a plurality of traces 32 and a plurality of traces 1 31. The lead 1 3 1 is electrically connected to a test unit 1 30, and the display area 1 60 is connected to the trace 132 through the IT0 pin 111, and the trace 1 32 is arranged substantially perpendicular to the lead 1 31 and partially connected. , And through the lead 31 and test sheet
TW1208F(友達)，ptd 第 5 頁 1240104 五、發明說明（3) 分別形成有導通孔134a與134d、134b以及134c。導線131 a 藉由絕緣層133中之導通孔134a與134d，使得導線131a與 走線132a與132d能夠電性連接。導線131b藉由絕緣層133 中之導通孔134b，使得導線13 lb與走線132b能夠電性連 接。導線1 31 c藉由絕緣層1 3 3中之導通孔1 3 4 c，使得導線 I 31 c與走線1 3 2 c能夠電性連接。 每個走線1 32係分別連接至相對應的玻璃基板丨丨〇上之 ΙΤ0引腳111，故玻璃基板11〇之顯示區16〇中每一行次畫素 將藉由玻璃基板11 0上之多個I T0引腳111與其相對應之走 線1 3 2連接。縱向排列之多條走線丨3 2再分別與三條橫向排 列之導線1 3 1 a、1 3 1 b與1 31 c電性連接，再藉由導線1 31與 測試單元1 3 0電性連接，便能夠使測試單元丨3 〇對玻璃基板 II 0之顯示區1 6 0進行測試，如第1 a圖所示。 待測試結束後’利用一雷射光束（laser beam)以平行 導線1 3 1之方向’將電性連接玻璃基板丨丨〇與測試單元丨3 〇 的走線132切斷’使導線131c與丨^引腳1U之間形成一阻 斷區域（laser cutting line) 139。此時，玻璃基板11〇 與測试皁元1 3 0之電性連接中斷。 士請^照第1C圖，第1 c圖繪示乃第1 b圖中A部分於接合 時之不意圖。依照上述之傳統作法，玻璃基板丨丨〇與捲帶 ，，體封裝件120在接合之前，需先中斷玻璃基板11()與測 |忒單7L1 30之電性連接。由於雷射切割為瞬間的高溫，在 切割走線132b的過程中，走線132b會被溶融並切割出一缺 口 ’以達到使玻璃基板丨丨〇與測試單元丨3〇電性隔離之目 〜 in-— 1240104 五、發明說明（4) 的’並形成阻斷區域丨3 9。然而，在雷射高溫熔融的過程 中，以金屬材質構成之走線132b因高溫使得走線1321)之金 屬材質熔融而向上越過阻斷區域丨3 9，溢散至絕緣層1 3 5之 表面上，形成金屬殘渣1 329。因此，當TCP引腳140與玻璃 基板110之ΙΤ0引腳ill進行接合時，於阻斷區域139處， tcp捲帶式載體封裝件引腳14〇之銅導線圖案層122便會與 溢散至絕緣層1 3 5表面上之金屬殘渣1 3 2 9接觸，造成電性 短路，損害整個顯示器模組之品質，其影響實不容小覷。 【發明内容】 、>、有鑑於此，本發明的目的就是在提供一種避免短路之 測4裝置’其形成一保護絕緣層於該測試裝置上並覆蓋該 些阻斷區之設計，能夠避免捲帶式載體封裝件（Tape Cai^ier package，Tcp)與測試裝置上殘留之金屬物質直 接接觸，以減少電性短路之現象。 、 根據本發明的目的，提出一種顯示器模組，包括一玻 璃基板，一捲帶式載體封裝件（TCP)以及一保護絕緣層。 玻璃基板上係具有一顯示區、多條走線與多條導線，導線 係與一測試單元電性連接。Tcp係與玻璃基板電性連接。 保護絕緣層，部分覆蓋於玻璃基板上。於一玻璃基板之測 試階段時，顯示區係藉由走線與導線連接，以使測試單元 對顯不區進行測試。然後，於測試階段完成後，走線上係 形成:阻斷區域，用以阻斷玻璃基板與測試單元之電性連 接。當阻斷區域形成後，才形成保護絕緣層於玻璃基板上 麵TW1208F (AUO), ptd page 5 1240104 V. Description of the invention (3) Via holes 134a and 134d, 134b, and 134c are formed, respectively. The conducting wires 131 a are electrically connected to the conducting wires 131 a and the tracks 132 a and 132 d through the through holes 134 a and 134 d in the insulating layer 133. The lead 131b is electrically connected to the trace 132b through the via 134b in the insulating layer 133. The conducting wire 1 31 c is electrically connected with the conducting wire 1 3 2 c through the through hole 1 3 4 c in the insulating layer 1 3 3. Each trace 1 32 is connected to the corresponding ITO pin 111 on the corresponding glass substrate. Therefore, each row of pixels in the display area 16 of the glass substrate 110 will pass through the glass substrate 110. Multiple I T0 pins 111 are connected to their corresponding tracks 1 3 2. Multiple wires arranged vertically 丨 3 2 are respectively electrically connected to three horizontally arranged wires 1 3 1 a, 1 3 1 b, and 1 31 c, and then electrically connected to the test unit 1 3 0 through wires 1 31 , So that the test unit 丨 30 can test the display area 160 of the glass substrate II 0, as shown in Fig. 1a. After the test is over, 'use a laser beam to parallelize the direction of the wires 1 3 1' to electrically cut the wiring 132 of the glass substrate 丨 丨 〇 and the testing unit 丨 3〇 to make the wires 131c and 丨^ A laser cutting line 139 is formed between the pins 1U. At this time, the electrical connection between the glass substrate 11 and the test soap element 130 is interrupted. Please refer to Figure 1C, Figure 1c shows the intention of Part A in Figure 1b when joining. According to the above-mentioned traditional method, the glass substrate 11 and the tape and the body package 120 need to be interrupted before the electrical connection between the glass substrate 11 () and the test sheet 7L1 30. Because the laser cutting is an instant high temperature, during the cutting of the wiring 132b, the wiring 132b will be melted and cut a gap 'to achieve the purpose of electrically isolating the glass substrate 丨 丨 〇 from the test unit 丨 30 ~ in--1240104 V. Description of the invention (4) and forming a blocking region 3-9. However, in the process of laser high temperature melting, the wiring 132b made of a metal material passes through the blocking area upwards due to the melting of the metal material of the wiring 1321) due to the high temperature, and overflows to the surface of the insulating layer 1 3 5 On the formation of metal residues 1 329. Therefore, when the TCP pin 140 and the ITO pin ill of the glass substrate 110 are bonded, at the blocking area 139, the copper wire pattern layer 122 of the tcp tape carrier package pin 14 will be scattered with The metal residue 1 3 2 9 on the surface of the insulating layer 1 3 5 is in contact with each other, which causes an electrical short circuit and damages the quality of the entire display module. The influence cannot be ignored. [Summary of the invention], > In view of this, the object of the present invention is to provide a test device that avoids short circuits, which forms a protective insulation layer on the test device and covers the blocking areas. The tape carrier package (Tape Cai ^ ier package, Tcp) is in direct contact with the remaining metal material on the test device to reduce the phenomenon of electrical short circuit. According to the purpose of the present invention, a display module is provided, which includes a glass substrate, a roll carrier package (TCP), and a protective insulating layer. The glass substrate has a display area, a plurality of traces and a plurality of wires, and the wires are electrically connected to a test unit. Tcp is electrically connected to the glass substrate. The protective insulating layer is partially covered on the glass substrate. During the test phase of a glass substrate, the display area is connected by wires and wires to enable the test unit to test the display area. Then, after the test phase is completed, the traces form a blocking area to block the electrical connection between the glass substrate and the test unit. After the blocking area is formed, a protective insulating layer is formed on the glass substrate
Ml TW1208F(友達 第8頁 1240104 五、發明說明（5) 並覆蓋阻斷區域。最後 體封裝件才與玻璃基板 根據本發明的再一 方法。組裝方法包括： 有一顯示區、多條走線 電性連接，而顯示區係 70對顯示區進行測試。 斷區域，用以阻斷顯示 成一保護絕緣層於玻璃 提供一捲帶式載體封裝 為讓本發明之上述 懂’下文特舉一較佳實 明如下： ’當保護絕緣層形成後，捲帶式載 電性連接。 目的’提出一種顯示器模組之組裝 提供一玻璃基板，玻璃基板上係具 與多條導線。導線係與一測試單元 藉由走線與導線連接，以使測試單 待測試完成後，於走線上形成一阻 區與導線之電性連接。之後，再形 基板上，並覆蓋阻斷區域。最後， 件（TCP) ’與玻璃基板電性連接。 目的、特徵、和優點能更明顯易 施例，並配合所附圖式，作詳細說 【實施方式】 請參照第2圖，其繪示乃依照本發明較佳實施例之— 顯不模組之剖面圖。在第2圖中，顯示器模組2 〇 〇包括一破 璃基板210、一捲帶式載體封裝件（TCp)22〇以及一保護絕 緣層29 0。顯示器模組2〇〇例如是一液晶顯示器模組，而坡 璃基板210例如是一TFT基板之玻璃基板。 玻璃基板210上具一顯示區260、多個銦錫氧化 (Indium Tin Oxide， ITO)引腳211，並配置有多條導線 (shorting bar)，例如是導線231a、231b與231c以及多條 走線，於第2圖中僅以走線232b做說明。 ' m TW1208F(友達).ptd 第9頁 1240104 五、發明說明（7)Ml TW1208F (AUO page 8 1240104 V. Description of the invention (5) and covering the blocking area. The final body package and the glass substrate are in accordance with yet another method of the present invention. The assembly method includes: a display area, multiple wiring lines The display area is tested by the display area 70. The broken area is used to block the display into a protective insulating layer. The glass is provided with a tape carrier package to allow the above understanding of the present invention. The explanation is as follows: 'When the protective insulating layer is formed, a tape-and-relay electrical connection is made. Purpose' Propose a display module assembly to provide a glass substrate with a plurality of wires on the glass substrate. The wires are borrowed from a test unit. The traces are connected to the wires, so that after the test order is completed, a resistance area is electrically connected to the wires on the traces. Then, the substrate is reshaped and covered with the blocking area. Finally, the TCP (TCP) ' It is electrically connected to the glass substrate. The purpose, characteristics, and advantages can be more obvious and easy to implement, and will be described in detail in accordance with the attached drawings. [Embodiment] Please refer to FIG. According to the preferred embodiment of the present invention—a cross-sectional view of a display module. In the second figure, the display module 2000 includes a broken glass substrate 210, a tape carrier package (TCp) 22, and a The protective insulating layer 290. The display module 200 is, for example, a liquid crystal display module, and the sloped glass substrate 210 is, for example, a glass substrate of a TFT substrate. The glass substrate 210 has a display area 260 and a plurality of indium tin oxide ( Indium Tin Oxide (ITO) pin 211 is configured with multiple shorting bars, such as the wires 231a, 231b, and 231c, and multiple traces. In the second figure, only the trace 232b is used for illustration. TW1208F (友 达) .ptd Page 9 1240104 V. Description of Invention (7)
Adhesive, NCA)。 當形成保護絕緣層2 9 0以覆蓋阻斷區2 3 9後，再將捲帶 式載體封裝件220利用熱壓合製程將捲帶式載體封裝件22〇 之捲帶式載體封裝件引腳（TCP lead) 240與ΙΤ0引腳211上 下壓合連接，並在連接處塗附一異方性導電膜（ACF) 250使 電性能在垂直方向上下導通。TCP引腳240包括一軟板 221、一銅導線圖案層222與一絕緣層223。軟板2 21之材質 例如是聚醯亞胺（p〇 1 y i m i de，p I )，其上有一層銅導線 圖案層222形成。絕緣層223例如是一防銲阻絕層（s〇lder resist，SR )，配附於銅導線圖案層222上之部分區域。 當TCP引腳240利用熱壓合製程與ιτο引腳211上下壓合時， 保護絕緣層290亦同時被加溫，故當保護絕緣層290冷卻硬 化後便可與捲帶式載體封裝件2 2 〇貼合。 對於習知於熱壓合的過程中，金屬材質之導線2 3 2b因 高溫炼融’在阻斷區239附近且位於絕緣層235表面上所形 成之金屬殘渣（未顯示於第2圖中），在此，因保護絕緣層 290覆蓋於阻斷區239上，阻隔了原金屬殘渣與捲帶式載體 封裝件220之銅導線圖案層222的直接接觸，便可有效避免 電性短路的發生，降低損害顯示器品質之可能性。 本發明上述實施例所揭露之顯示器模組，不僅增加產 出效能’更減少測試機台之購買與使用並節省成本。最重 要的是’捲帶式載體封裝件（Tcp)未坡覆絕緣層（SR)而裸 露出之銅導線圖案層，受到本發明之保護絕緣層的保護， 可以避免鋼導線圖案層在以雷射切割形成之阻斷區域上受Adhesive, NCA). After the protective insulating layer 2 900 is formed to cover the blocking area 2 3 9, the tape-and-reel carrier package 220 is then subjected to a thermocompression process to roll the tape-and-reel carrier package 22 to the tape-and-reel carrier package pin. (TCP lead) 240 and ITO pin 211 are pressed and connected up and down, and an anisotropic conductive film (ACF) 250 is coated at the connection to make the electrical performance conduct vertically in the vertical direction. The TCP pin 240 includes a flexible board 221, a copper wire pattern layer 222, and an insulating layer 223. The material of the flexible board 2 21 is, for example, polyimide (p0 1 y i m i de, p I), and a copper wire pattern layer 222 is formed thereon. The insulating layer 223 is, for example, a solder resist (SR), and is disposed on a portion of the copper wire pattern layer 222. When the TCP pin 240 is pressed up and down with the ιτο pin 211 by a thermocompression process, the protective insulating layer 290 is also heated at the same time, so when the protective insulating layer 290 is cooled and hardened, it can be used with the tape carrier package 2 2 〇Mating. The metal residue formed on the surface of the insulating layer 235 near the blocking area 239 due to high temperature melting during the process of thermocompression (not shown in Figure 2) Here, because the protective insulating layer 290 covers the blocking area 239 and blocks the direct contact between the original metal residue and the copper wire pattern layer 222 of the tape carrier package 220, an electrical short circuit can be effectively avoided. Reduce the possibility of damaging the quality of the display. The display module disclosed in the above embodiments of the present invention not only increases the production efficiency, but also reduces the purchase and use of test equipment and saves costs. The most important thing is that the copper wire pattern layer exposed by the tape carrier package (Tcp) without slope insulation layer (SR) is protected by the protective insulating layer of the present invention, which can prevent the steel wire pattern layer from being exposed to lightning. On the blocking area
TW1208R 友達).ptd 第11頁 1240104 £、發明說明（幻 到外來異物制m 屬殘渣產場，如灰塵、水氣等，或是與熔融之溢散金 電性短路（s h 〇 r t )之現象。 、麵上戶斤、+、 然其並卩連’雖然本發明已以一較佳實施例揭露如上’ Ϊ發二t限定本發明，任何熟習此技藝者，在不脫離 本發明之=1°範圍内，當可作各種之更動與潤飾，因此 準。 、邊槐圍當視後附之申請專利範圍所界定者為TW1208R AUO) .ptd Page 11 1240104 £, description of the invention (from magic to foreign objects m is a residue production site, such as dust, water vapor, etc., or an electrical short circuit (sh 〇rt) with molten spilled gold ，, 户, +, +, but they do not connect 'Although the present invention has been disclosed as above with a preferred embodiment, the second invention is limited to anyone who is familiar with this art, without departing from the invention = 1 Within the range, it can be used for various changes and retouching. Therefore, Bianhuaiwei shall regard the following as defined by the scope of patent application attached:
TW1208F(友達).ptd 第12頁 1240104 圖式簡單說明 【圖式簡單說明】 第1 A圖繪示乃一傳統液晶顯示模組之部分示意圖。 第1B圖繪示乃第1A圖中沿著剖面線IB-1B’方向之剖面 圖。 第1C圖繪示乃第1B圖中A部分於接合時之示意圖。 第2圖繪示乃依照本發明較佳實施例之一顯示模組之 剖面圖。 圖式標號說明 I 0 0、2 0 0 :顯示器模組 II 0、2 1 0 :玻璃基板 III 、 211 : ΙΤ0 引腳 120、 220 :捲帶式載體封裝件 121、 221 :軟板 122、 222 :銅導線圖案層 123、 223 :絕緣層（SR) 1 3 0 :測試單元 131a、131b、131c、231a、231b、231c :導線 132a、132b、132c、132d、23 2b ··走線 1 329 :金屬殘渣 133、135、233、235 :絕緣層（PL) 13 4a、134b、134c、134d、23 4b ··導通孔 1 3 9、2 3 9 ··阻斷區域 140 、 240 : TCP 引腳TW1208F (AUO) .ptd Page 12 1240104 Simple illustration of the drawing [Simplified illustration of the drawing] Figure 1A is a partial schematic diagram of a traditional LCD module. FIG. 1B is a cross-sectional view taken along the section line IB-1B 'in FIG. 1A. Figure 1C is a schematic diagram of the part A in Figure 1B when it is joined. FIG. 2 is a cross-sectional view of a display module according to a preferred embodiment of the present invention. Description of drawing symbols I 0 0, 2 0 0: Display module II 0, 2 1 0: Glass substrate III, 211: ITO 0 pins 120, 220: Tape and reel carrier packages 121, 221: Soft boards 122, 222 : Copper wire pattern layers 123, 223: Insulation layer (SR) 1 3 0: Test cells 131a, 131b, 131c, 231a, 231b, 231c: Wires 132a, 132b, 132c, 132d, 23 2b · Trace 1 329: Metal residues 133, 135, 233, 235: Insulation layer (PL) 13 4a, 134b, 134c, 134d, 23 4b ·· Through hole 1 3 9, 2 3 9 ·· Block area 140, 240: TCP pin
TW1208F(友達).ptd 第13頁 1240104 圖式簡單說明 150、250 :異方性導電膜（ACF) 1 6 0、2 6 0 :顯示區 2 9 0 :保護絕緣層TW1208F (AUO) .ptd Page 13 1240104 Simple illustration of drawings 150, 250: Anisotropic conductive film (ACF) 1 6 0, 2 6 0: Display area 2 9 0: Protective insulation layer
1W1208F(友達).ptd 第14頁1W1208F (友 达) .ptd Page 14
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW92128769A TWI240104B (en) | 2003-10-16 | 2003-10-16 | Display assembly and assembling method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW92128769A TWI240104B (en) | 2003-10-16 | 2003-10-16 | Display assembly and assembling method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200515034A TW200515034A (en) | 2005-05-01 |
| TWI240104B true TWI240104B (en) | 2005-09-21 |
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| TW92128769A TWI240104B (en) | 2003-10-16 | 2003-10-16 | Display assembly and assembling method thereof |
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| TW (1) | TWI240104B (en) |
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2003
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| TW200515034A (en) | 2005-05-01 |
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