CN1293116C - 形成消光涂膜用的光固化性·热固化性组合物 - Google Patents
形成消光涂膜用的光固化性·热固化性组合物 Download PDFInfo
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- CN1293116C CN1293116C CNB008189757A CN00818975A CN1293116C CN 1293116 C CN1293116 C CN 1293116C CN B008189757 A CNB008189757 A CN B008189757A CN 00818975 A CN00818975 A CN 00818975A CN 1293116 C CN1293116 C CN 1293116C
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/4246—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof polymers with carboxylic terminal groups
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/4292—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof together with monocarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
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- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Materials For Photolithography (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Epoxy Resins (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Polymerisation Methods In General (AREA)
- Paints Or Removers (AREA)
Abstract
Description
| 成分 | 化学名或商品名 | ||
| 主剂 | 感光性预聚体 | 合成例1所制得的a清漆 | |
| 含有羧基的共聚树脂 | 合成例2所制得的b-1清漆合成例3所制得的b-2清漆合成例4所制得的b-3清漆 | ||
| 填充物 | A | 结晶二氧化硅(平均粒径1.5μm、吸油量35~40ml/100g) | |
| B | 滑石(平均粒径1.5~1.8μm、吸油量45~50ml/100g) | ||
| C | 沉降性硫酸钡(平均粒径0.5~0.6μm、吸油量15~20ml/100g) | ||
| 光聚合引发剂 | 2-甲基-1-[4-(甲基硫)苯基]-2-吗啉-丙烷-1-酮 | ||
| 着色颜料 | 酞菁绿 | ||
| 环氧树脂固化催化剂 | 二氰基二酰胺 | ||
| 稀释剂 | 一缩二丙二醇甲醚 | ||
| 消泡剂 | 硅氧烷系消泡剂(KS-66,信越化学工业(株)制) | ||
| 添加剂 | BYK-110(Bic.Chem.Japan社制) | ||
| 固化剂 | 光聚合性单体 | 二季戊四醇六丙烯酸酯 | |
| 环氧树脂 | TEPIC(日产化学工业(股份)制) | ||
| 稀释剂 | 一缩二丙二醇单甲醚 | ||
| 成分与配合量(份) | 实施例No. | |||||||||||||
| 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | |||
| 主剂 | 清漆(固形分) | a | 60 | 60 | 60 | 60 | 90 | 75 | 50 | 30 | 60 | 60 | 60 | 60 |
| b-1 | - | 40 | - | - | - | - | - | - | - | - | - | - | ||
| b-2 | 40 | - | 40 | - | 10 | 25 | 50 | 70 | 40 | 40 | 40 | 40 | ||
| b-3 | - | - | - | 40 | - | - | - | - | - | - | - | - | ||
| 填充物 | A | - | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 50 | 200 | - | - | |
| B | - | - | - | - | - | - | - | - | - | - | 100 | - | ||
| C | - | - | - | -+ | - | - | - | - | - | - | - | 100 | ||
| 光重合引发剂 | 15 | 15 | 15 | 15 | 15 | 15 | 15 | 15 | 15 | 15 | 15 | 15 | ||
| 着色颜料 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | ||
| 环氧树脂固化催化剂 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | ||
| 稀释剂 | 10 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 30 | 20 | 20 | ||
| 消泡剂 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | ||
| 添加剂 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | ||
| 固化剂 | 光聚合性单体 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | |
| 环氧树脂 | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 | ||
| 稀释剂 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | ||
| 成分与配合量(份) | 比较例No. | ||||
| 1 | 2 | 3 | |||
| 主剂 | 清漆(固形分) | a | 100 | 100 | - |
| b-1 | - | - | - | ||
| b-2 | - | - | 100 | ||
| b-3 | - | - | - | ||
| 填充物 | A | - | 100 | 100 | |
| B | - | - | - | ||
| C | - | - | - | ||
| 光聚合引发剂 | 15 | 15 | 15 | ||
| 着色颜料 | 1 | 1 | 1 | ||
| 环氧树脂固化催化剂 | 0.5 | 0.5 | 0.5 | ||
| 稀释剂 | 10 | 20 | 20 | ||
| 消泡剂 | 1 | 1 | 1 | ||
| 添加剂 | 0.5 | 0.5 | 0.5 | ||
| 固化剂 | 光聚合性单体 | 20 | 20 | 20 | |
| 环氧树脂 | 30 | 30 | 30 | ||
| 稀释剂 | 10 | 10 | 10 | ||
| 特性 | 实施例No. | 比较例No. | ||||||||||||||
| 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 1 | 2 | 3 | ||
| 印刷性 | 泡 | - | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | △ | ○ | - | ○ | ○ |
| 遗漏 | - | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | × | ○ | - | ○ | ○ | |
| 光泽度 | 37 | 5 | 3 | 34 | 18 | 4 | 7 | 30 | 38 | 3 | 4 | 40 | 94 | 71 | 58 | |
| 湿润指数(mN/m) | - | 54 | 54 | 45 | 50 | 54 | 53 | 47 | 44 | 54 | 53 | 43 | - | 31 | 37 | |
| 耐焊锡附着性 | - | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | - | × | × | |
| 无电解镀金耐性 | - | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | - | ○ | × | |
| 密合性 | - | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | - | ○ | ○ | |
| 耐电蚀性 | - | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | - | ○ | △ | |
Claims (15)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2000/000795 WO2001058977A1 (en) | 2000-02-14 | 2000-02-14 | Photocurable/thermosetting composition for forming matte film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1434833A CN1434833A (zh) | 2003-08-06 |
| CN1293116C true CN1293116C (zh) | 2007-01-03 |
Family
ID=11735681
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB008189757A Expired - Lifetime CN1293116C (zh) | 2000-02-14 | 2000-02-14 | 形成消光涂膜用的光固化性·热固化性组合物 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US6824858B2 (zh) |
| EP (1) | EP1266922B1 (zh) |
| JP (1) | JP4152106B2 (zh) |
| KR (1) | KR100634341B1 (zh) |
| CN (1) | CN1293116C (zh) |
| AT (1) | ATE286931T1 (zh) |
| DE (1) | DE60017470T2 (zh) |
| WO (1) | WO2001058977A1 (zh) |
Families Citing this family (49)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3964326B2 (ja) * | 2000-09-20 | 2007-08-22 | 太陽インキ製造株式会社 | カルボキシル基含有感光性樹脂、それを含有するアルカリ現像可能な光硬化性・熱硬化性組成物及びその硬化物 |
| JP2002258477A (ja) * | 2001-03-02 | 2002-09-11 | Mitsubishi Chemicals Corp | 感光性組成物 |
| CA2453237A1 (en) * | 2001-07-26 | 2003-02-06 | Ciba Specialty Chemicals Holding Inc. | Photosensitive resin composition |
| EP1296188A3 (en) * | 2001-09-21 | 2003-04-23 | Tamura Kaken Corporation | Photosensitive resin composition and printed wiring board |
| TWI228132B (en) * | 2001-09-26 | 2005-02-21 | Nof Corp | Soldering flux composition and solder paste |
| TW200417294A (en) * | 2002-11-28 | 2004-09-01 | Taiyo Ink Mfg Co Ltd | Photo- and thermo-setting resin composition and printed wiring boards made by using the same |
| US20050215656A1 (en) | 2002-11-28 | 2005-09-29 | Taiyo Ink Manufacturing Co., Ltd. | Photocurable and thermosetting resin composition and printed circuit boards made by using the same |
| KR100600639B1 (ko) * | 2004-02-23 | 2006-07-14 | 동우 화인켐 주식회사 | 포지티브 타입 포토레지스트 조성물 |
| JPWO2005081026A1 (ja) * | 2004-02-25 | 2008-03-06 | 関西ペイント株式会社 | 光導波路形成用光硬化性樹脂組成物、光導波路形成用光硬化性ドライフィルム及び光導波路 |
| JP4328645B2 (ja) * | 2004-02-26 | 2009-09-09 | 太陽インキ製造株式会社 | 光硬化性・熱硬化性樹脂組成物及びそれを用いたプリント配線板 |
| KR101049316B1 (ko) * | 2004-03-31 | 2011-07-13 | 다이요 홀딩스 가부시키가이샤 | 활성 에너지선 경화성 수지, 그것을 함유하는 광경화성ㆍ열 경화성 수지 조성물 및 그의 경화물 |
| WO2006004158A1 (ja) * | 2004-07-07 | 2006-01-12 | Taiyo Ink Mfg. Co., Ltd. | 光硬化性・熱硬化性樹脂組成物とそれを用いたドライフィルム、及びその硬化物 |
| JP4368266B2 (ja) * | 2004-07-30 | 2009-11-18 | 東京応化工業株式会社 | レジスト保護膜形成用材料、およびこれを用いたレジストパターン形成方法 |
| JP4368267B2 (ja) * | 2004-07-30 | 2009-11-18 | 東京応化工業株式会社 | レジスト保護膜形成用材料、およびこれを用いたレジストパターン形成方法 |
| KR101317223B1 (ko) * | 2005-06-20 | 2013-10-15 | 가부시키가이샤 아데카 | 착색 알칼리 현상형 감광성 수지 조성물, 및 상기 착색 알칼리 현상형 감광성 수지 조성물을 이용한 컬러필터 |
| JP4504275B2 (ja) * | 2005-07-06 | 2010-07-14 | 株式会社有沢製作所 | 感光性熱硬化型樹脂組成物、並びに該組成物を用いた感光性カバーレイ、及びフレキシブルプリント配線板 |
| CN101278236B (zh) * | 2005-10-07 | 2013-11-27 | 日立化成株式会社 | 感光性树脂组成物及使用其的感光性元件 |
| JP5311721B2 (ja) * | 2006-04-18 | 2013-10-09 | 関西ペイント株式会社 | カチオン電着塗料組成物 |
| JP4340272B2 (ja) * | 2006-05-30 | 2009-10-07 | 太陽インキ製造株式会社 | 光硬化性・熱硬化性ソルダーレジスト組成物およびそれを用いたプリント配線板 |
| KR101612569B1 (ko) | 2008-03-28 | 2016-04-14 | 다이요 홀딩스 가부시키가이샤 | 경화성 수지 조성물과 그의 경화물, 및 인쇄 배선판 |
| CN101591423B (zh) * | 2008-05-29 | 2012-09-05 | 新日铁化学株式会社 | 碱可溶性树脂及其制造方法以及使用了碱可溶性树脂的感光性树脂组合物、固化物和滤色器 |
| ATE545671T1 (de) * | 2008-06-09 | 2012-03-15 | Goo Chemical Co Ltd | Carboxylgruppenhaltiges harz, carboxylgruppenhaltiges harz enthaltende härtbare zusammensetzung und gehärtetes produkt der zusammensetzung |
| JP5632146B2 (ja) * | 2009-09-02 | 2014-11-26 | 太陽ホールディングス株式会社 | 硬化性樹脂組成物 |
| CN102081301B (zh) * | 2009-11-26 | 2014-10-22 | 京东方科技集团股份有限公司 | 感光树脂组合物及其制备方法 |
| KR101908363B1 (ko) * | 2010-09-22 | 2018-10-16 | 가부시키가이샤 아데카 | 염료 및 착색 감광성 조성물 |
| JP5416725B2 (ja) * | 2010-09-24 | 2014-02-12 | 積水化学工業株式会社 | インクジェット用硬化性組成物及びプリント配線板の製造方法 |
| KR20160003294A (ko) * | 2010-12-28 | 2016-01-08 | 다이요 잉키 세이조 가부시키가이샤 | 광 경화성 수지 조성물, 그의 드라이 필름 및 경화물, 및 이들을 이용한 인쇄 배선판 |
| WO2012111356A1 (ja) * | 2011-02-14 | 2012-08-23 | 積水化学工業株式会社 | 2液混合型の第1,第2の液及びプリント配線板の製造方法 |
| CN102298262B (zh) * | 2011-06-16 | 2012-12-05 | 胡海波 | 一种热固化感光树脂组合物 |
| JP5875821B2 (ja) * | 2011-09-30 | 2016-03-02 | 太陽インキ製造株式会社 | 感光性樹脂組成物、その硬化皮膜およびプリント配線板 |
| TWI547759B (zh) * | 2011-09-30 | 2016-09-01 | 太陽油墨製造股份有限公司 | A photosensitive resin composition, a hardened film thereof, and a printed wiring board |
| TW201435495A (zh) * | 2011-09-30 | 2014-09-16 | Taiyo Ink Mfg Co Ltd | 感光性樹脂組成物、其之硬化皮膜及印刷配線板 |
| JP6240399B2 (ja) * | 2012-05-29 | 2017-11-29 | 太陽インキ製造株式会社 | 感光性組成物及びその硬化層を有するプリント配線板 |
| JP6163876B2 (ja) * | 2013-05-24 | 2017-07-19 | 株式会社村田製作所 | 感光性ペースト |
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| JPWO2022210415A1 (zh) * | 2021-03-31 | 2022-10-06 | ||
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| CN118259548A (zh) * | 2022-12-28 | 2024-06-28 | 太阳油墨(苏州)有限公司 | 感光热固化显影性树脂组合物、其干膜及其固化物以及使用其而形成的印刷电路板 |
| JP2025083793A (ja) * | 2023-11-21 | 2025-06-02 | 株式会社タムラ製作所 | 感光性樹脂組成物およびプリント配線基板 |
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- 2000-02-14 WO PCT/JP2000/000795 patent/WO2001058977A1/ja not_active Ceased
- 2000-02-14 DE DE60017470T patent/DE60017470T2/de not_active Expired - Lifetime
- 2000-02-14 EP EP00902949A patent/EP1266922B1/en not_active Expired - Lifetime
- 2000-02-14 CN CNB008189757A patent/CN1293116C/zh not_active Expired - Lifetime
- 2000-02-14 AT AT00902949T patent/ATE286931T1/de active
- 2000-02-14 JP JP2001558122A patent/JP4152106B2/ja not_active Expired - Lifetime
- 2000-02-14 KR KR1020027010511A patent/KR100634341B1/ko not_active Expired - Lifetime
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2002
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| US5753722A (en) * | 1995-12-13 | 1998-05-19 | Taiyo Ink Manufacturing Co., Ltd. | Photocurable and thermosetting matte liquid resist composition |
| JPH09185167A (ja) * | 1995-12-28 | 1997-07-15 | Taiyo Ink Mfg Ltd | 光硬化性・熱硬化性ソルダーレジストインキ組成物 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2001058977A1 (en) | 2001-08-16 |
| EP1266922B1 (en) | 2005-01-12 |
| CN1434833A (zh) | 2003-08-06 |
| JP4152106B2 (ja) | 2008-09-17 |
| DE60017470D1 (de) | 2005-02-17 |
| KR20020075418A (ko) | 2002-10-04 |
| ATE286931T1 (de) | 2005-01-15 |
| DE60017470T2 (de) | 2005-12-29 |
| EP1266922A1 (en) | 2002-12-18 |
| US6824858B2 (en) | 2004-11-30 |
| EP1266922A4 (en) | 2004-04-21 |
| KR100634341B1 (ko) | 2006-10-16 |
| US20030082355A1 (en) | 2003-05-01 |
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