CN1288171A - 复合柔性布线基板及其制造方法、电光装置、电子装置 - Google Patents
复合柔性布线基板及其制造方法、电光装置、电子装置 Download PDFInfo
- Publication number
- CN1288171A CN1288171A CN00127031A CN00127031A CN1288171A CN 1288171 A CN1288171 A CN 1288171A CN 00127031 A CN00127031 A CN 00127031A CN 00127031 A CN00127031 A CN 00127031A CN 1288171 A CN1288171 A CN 1288171A
- Authority
- CN
- China
- Prior art keywords
- flexible wiring
- circuit board
- composite
- substrate
- electro
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002131 composite material Substances 0.000 title claims abstract description 103
- 238000000034 method Methods 0.000 title claims description 19
- 239000000758 substrate Substances 0.000 claims abstract description 108
- 239000011229 interlayer Substances 0.000 claims abstract description 16
- 238000004519 manufacturing process Methods 0.000 claims abstract description 13
- 239000010410 layer Substances 0.000 claims description 84
- 239000004973 liquid crystal related substance Substances 0.000 claims description 61
- 238000005401 electroluminescence Methods 0.000 claims description 22
- 239000003990 capacitor Substances 0.000 claims description 4
- 239000010453 quartz Substances 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000000382 optic material Substances 0.000 claims 2
- 239000011521 glass Substances 0.000 description 41
- 239000011159 matrix material Substances 0.000 description 39
- 239000010408 film Substances 0.000 description 26
- 238000009434 installation Methods 0.000 description 26
- 238000009413 insulation Methods 0.000 description 20
- 230000006870 function Effects 0.000 description 16
- 230000000694 effects Effects 0.000 description 13
- 230000015572 biosynthetic process Effects 0.000 description 9
- 239000008393 encapsulating agent Substances 0.000 description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000012856 packing Methods 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 230000000712 assembly Effects 0.000 description 3
- 238000000429 assembly Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 206010070834 Sensitisation Diseases 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000008313 sensitization Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0367—Metallic bump or raised conductor not used as solder bump
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10128—Display
- H05K2201/10136—Liquid Crystal display [LCD]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Nonlinear Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Mathematical Physics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Combinations Of Printed Boards (AREA)
- Liquid Crystal (AREA)
- Structure Of Printed Boards (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
Claims (16)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26053699 | 1999-09-14 | ||
| JP260536/1999 | 1999-09-14 | ||
| JP272684/2000 | 2000-09-08 | ||
| JP2000272684A JP3952125B2 (ja) | 1999-09-14 | 2000-09-08 | 複合フレキシブル配線基板、電気光学装置、電子機器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1288171A true CN1288171A (zh) | 2001-03-21 |
| CN1132054C CN1132054C (zh) | 2003-12-24 |
Family
ID=26544649
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN00127031A Expired - Lifetime CN1132054C (zh) | 1999-09-14 | 2000-09-13 | 复合柔性布线基板及其制造方法、电光装置、电子装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US6972966B1 (zh) |
| EP (1) | EP1085788A3 (zh) |
| JP (1) | JP3952125B2 (zh) |
| KR (1) | KR100402507B1 (zh) |
| CN (1) | CN1132054C (zh) |
| TW (1) | TW548455B (zh) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1310320C (zh) * | 2002-05-31 | 2007-04-11 | 富士通株式会社 | 柔性互连装置、指纹传感装置、及其制造方法 |
| CN100368875C (zh) * | 2005-03-30 | 2008-02-13 | 爱普生映像元器件有限公司 | 电光装置、布线基板的安装方法及电子设备 |
| CN100378791C (zh) * | 2003-06-02 | 2008-04-02 | 精工爱普生株式会社 | 电光学模块、电源基板、配线基板和电子机器 |
| CN107170774A (zh) * | 2016-03-07 | 2017-09-15 | 株式会社日本显示器 | 显示装置 |
Families Citing this family (51)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7339317B2 (en) | 2000-06-05 | 2008-03-04 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device having triplet and singlet compound in light-emitting layers |
| KR100451775B1 (ko) * | 2002-12-31 | 2004-10-08 | 엘지.필립스 엘시디 주식회사 | 터치 패널 |
| KR100908231B1 (ko) * | 2003-04-15 | 2009-07-20 | 삼성모바일디스플레이주식회사 | 평판표시소자 |
| JP4543772B2 (ja) | 2003-09-19 | 2010-09-15 | セイコーエプソン株式会社 | 電気光学装置および電子機器 |
| JP3976019B2 (ja) * | 2004-02-10 | 2007-09-12 | セイコーエプソン株式会社 | 実装構造体、電気光学装置、および電子機器 |
| JP4651318B2 (ja) * | 2004-06-25 | 2011-03-16 | シャープ株式会社 | 液晶表示装置 |
| EP1776002B1 (en) * | 2004-07-30 | 2011-11-23 | Murata Manufacturing Co., Ltd. | Composite electronic component and method for manufacturing the same |
| US7515240B2 (en) * | 2004-10-05 | 2009-04-07 | Au Optronics Corporation | Flat display panel and assembly process or driver components in flat display panel |
| JP2006189806A (ja) * | 2004-12-06 | 2006-07-20 | Semiconductor Energy Lab Co Ltd | 表示装置及びその駆動方法 |
| JP4628154B2 (ja) * | 2005-03-22 | 2011-02-09 | 三井金属鉱業株式会社 | フレキシブルプリント配線基板、および半導体装置 |
| JP2006269496A (ja) * | 2005-03-22 | 2006-10-05 | Mitsui Mining & Smelting Co Ltd | フレキシブルプリント配線基板、および半導体装置 |
| KR20060104088A (ko) | 2005-03-29 | 2006-10-09 | 삼성전자주식회사 | 표시 장치의 회로 기판 및 이를 포함하는 표시 장치 |
| JP2007025200A (ja) * | 2005-07-15 | 2007-02-01 | Toshiba Matsushita Display Technology Co Ltd | 液晶表示素子及びその製造方法 |
| JP2007036001A (ja) * | 2005-07-28 | 2007-02-08 | Cmk Corp | リジッドフレックス多層プリント配線板 |
| JP2007067244A (ja) * | 2005-08-31 | 2007-03-15 | Sony Corp | 回路基板 |
| JP4955970B2 (ja) * | 2005-09-20 | 2012-06-20 | 住友電気工業株式会社 | フレキシブルプリント配線板およびその製造方法 |
| JP2007201237A (ja) * | 2006-01-27 | 2007-08-09 | Seiko Epson Corp | 半導体装置および半導体装置の製造方法 |
| KR100761853B1 (ko) * | 2006-07-18 | 2007-09-28 | 삼성전자주식회사 | 리페어 및 크기 조절이 가능한 필터, 필터가 내장된 테이프배선기판 및 필터가 내장된 테이프 배선기판을 구비한디스플레이 패널 어셈블리 |
| KR20090003932A (ko) * | 2007-07-05 | 2009-01-12 | 삼성전자주식회사 | 연성 인쇄 회로 기판과 이를 이용한 액정 표시 장치 |
| JP5375198B2 (ja) * | 2008-03-07 | 2013-12-25 | セイコーエプソン株式会社 | ヘッド基板およびサーマルヘッド基板 |
| TWI380072B (en) * | 2008-05-09 | 2012-12-21 | Au Optronics Corp | Touch panel |
| TW200948233A (en) * | 2008-05-09 | 2009-11-16 | Wintek Corp | Flexible printed circuit board with anti-solder-crack structure |
| US20090277670A1 (en) * | 2008-05-10 | 2009-11-12 | Booth Jr Roger A | High Density Printed Circuit Board Interconnect and Method of Assembly |
| JP4711149B2 (ja) * | 2008-06-18 | 2011-06-29 | ソニー株式会社 | フレキシブルプリント配線板、タッチパネル、表示パネルおよび表示装置 |
| KR101065931B1 (ko) | 2009-07-30 | 2011-09-19 | 삼성에스디아이 주식회사 | 플라즈마 표시 장치 |
| JP2011049375A (ja) * | 2009-08-27 | 2011-03-10 | Panasonic Corp | 基板接続構造および電子機器 |
| JP2011107389A (ja) * | 2009-11-17 | 2011-06-02 | Hitachi Displays Ltd | 表示装置 |
| TWM388046U (en) * | 2010-04-21 | 2010-09-01 | Minlead Ltd | Touch control panel |
| JP5509480B2 (ja) * | 2010-05-26 | 2014-06-04 | 住友電工プリントサーキット株式会社 | フレキシブルプリント配線板の接続構造、その製造方法、および電子機器 |
| JP5223913B2 (ja) * | 2010-12-20 | 2013-06-26 | 株式会社デンソー | チップ型電子部品の実装構造 |
| JP5853421B2 (ja) * | 2011-05-26 | 2016-02-09 | 住友化学株式会社 | 表示装置およびその製造方法 |
| KR101244318B1 (ko) * | 2011-12-06 | 2013-03-15 | 삼성디스플레이 주식회사 | 표시장치용 회로기판 및 이를 포함하는 표시장치 |
| GB2494223B (en) * | 2012-03-02 | 2014-03-12 | Novalia Ltd | Circuit board assembly |
| CN103296489B (zh) | 2012-04-13 | 2015-08-26 | 上海天马微电子有限公司 | 连接装置、平板装置、图像传感器、显示器及触摸设备 |
| JP6055275B2 (ja) * | 2012-11-05 | 2016-12-27 | ローム株式会社 | 半導体集積回路装置および電子機器 |
| JP6202368B2 (ja) * | 2013-05-14 | 2017-09-27 | パナソニックIpマネジメント株式会社 | 基板モジュール |
| KR20160102968A (ko) * | 2013-12-26 | 2016-08-31 | 인텔 코포레이션 | 플렉서블 전자 통신 디바이스를 위한 방법 및 장치 |
| JP6184372B2 (ja) * | 2014-05-30 | 2017-08-23 | 株式会社沖データ | 露光装置及び画像形成装置 |
| US9538655B2 (en) * | 2014-08-15 | 2017-01-03 | Htc Corporation | Electronic assembly |
| US10440824B2 (en) | 2014-12-31 | 2019-10-08 | Shenzhen Royole Technologies Co., Ltd. | Flexible display device and electronic apparatus |
| WO2017164267A1 (ja) * | 2016-03-25 | 2017-09-28 | 株式会社村田製作所 | 部品実装基板 |
| CN108091255A (zh) * | 2016-11-21 | 2018-05-29 | 群创光电股份有限公司 | 显示装置及其制造方法 |
| JP2018128489A (ja) * | 2017-02-06 | 2018-08-16 | セイコーエプソン株式会社 | 電気光学装置および電子機器 |
| CN108931862A (zh) * | 2017-05-22 | 2018-12-04 | 南昌欧菲显示科技有限公司 | 液晶显示组件和液晶显示设备 |
| DE102018104250A1 (de) * | 2018-02-26 | 2019-08-29 | Enmech GmbH | Anordnung mit einer flexiblen Leiterplatte |
| WO2020105206A1 (ja) * | 2018-11-22 | 2020-05-28 | 株式会社村田製作所 | 伸縮性配線基板及び伸縮性配線基板の製造方法 |
| US11500489B2 (en) * | 2019-01-30 | 2022-11-15 | Chengdu Boe Optoelectronics Technology Co., Ltd. | Flexible circuit board and manufacturing method, display device, circuit board structure and display panel thereof |
| KR102803326B1 (ko) * | 2019-03-26 | 2025-05-08 | 삼성디스플레이 주식회사 | 회로 기판 조립체를 포함한 전자 패널 조립체 및 이의 제조 방법 |
| US11419213B2 (en) * | 2019-03-26 | 2022-08-16 | Western Digital Technologies, Inc. | Multilayer flex circuit with non-plated outer metal layer |
| CN211090137U (zh) * | 2020-02-24 | 2020-07-24 | 京东方科技集团股份有限公司 | 显示装置 |
| DE102022204643A1 (de) * | 2022-05-12 | 2023-11-16 | Carl Zeiss Smt Gmbh | Optisches system, lithographieanlage mit einem optischen system und verfahren zum herstellen eines optischen systems |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02253591A (ja) * | 1989-03-27 | 1990-10-12 | Hitachi Maxell Ltd | フレキシブルプリント基板を取り付けた分散型el素子 |
| JPH0411797A (ja) * | 1990-04-28 | 1992-01-16 | Sharp Corp | 回路基板の接続構造 |
| JP2523657Y2 (ja) * | 1991-04-09 | 1997-01-29 | 日本サーボ株式会社 | 電子回路組立体 |
| JPH081499B2 (ja) * | 1993-01-05 | 1996-01-10 | 日本電気株式会社 | 液晶表示装置 |
| US5727310A (en) * | 1993-01-08 | 1998-03-17 | Sheldahl, Inc. | Method of manufacturing a multilayer electronic circuit |
| JP3227681B2 (ja) * | 1993-03-12 | 2001-11-12 | ソニーケミカル株式会社 | 複合可撓性プリント基板 |
| JPH075486A (ja) * | 1993-06-15 | 1995-01-10 | Sanyo Electric Co Ltd | 液晶表示装置 |
| JP3184674B2 (ja) * | 1993-09-22 | 2001-07-09 | シャープ株式会社 | 表示装置の実装構造 |
| JPH07199219A (ja) * | 1993-12-28 | 1995-08-04 | Mitsui Eng & Shipbuild Co Ltd | 液晶表示装置検査用プローブカード |
| JPH07270814A (ja) * | 1994-03-25 | 1995-10-20 | Casio Comput Co Ltd | 液晶表示装置 |
| JP3186925B2 (ja) * | 1994-08-04 | 2001-07-11 | シャープ株式会社 | パネルの実装構造並びに集積回路搭載テープおよびその製造方法 |
| US5719749A (en) * | 1994-09-26 | 1998-02-17 | Sheldahl, Inc. | Printed circuit assembly with fine pitch flexible printed circuit overlay mounted to printed circuit board |
| JPH08248432A (ja) * | 1995-03-07 | 1996-09-27 | Casio Comput Co Ltd | 表示パネルの実装構造 |
| JP3559115B2 (ja) * | 1995-09-14 | 2004-08-25 | 株式会社半導体エネルギー研究所 | 表示装置 |
| JP3498448B2 (ja) * | 1995-11-06 | 2004-02-16 | 富士通株式会社 | 液晶表示装置 |
| DE19605966A1 (de) * | 1996-02-17 | 1997-08-21 | Bosch Gmbh Robert | Vorrichtung, insbesondere zur Verwendung in einem elektronischen Steuergerät |
| JPH09232377A (ja) * | 1996-02-27 | 1997-09-05 | Toshiba Corp | 実装構造体およびその製造方法 |
| JPH09318965A (ja) * | 1996-05-30 | 1997-12-12 | Nippon Seiki Co Ltd | 液晶表示装置 |
| JPH09331143A (ja) * | 1996-06-13 | 1997-12-22 | Matsushita Electric Ind Co Ltd | フレキシブル配線基板への電子部品装着方法 |
| JPH10268333A (ja) * | 1997-03-27 | 1998-10-09 | Alps Electric Co Ltd | 液晶表示装置 |
| JP3175673B2 (ja) * | 1997-11-27 | 2001-06-11 | 日本電気株式会社 | 半導体素子を実装したフレキシブル回路基板ユニットの製造方法 |
| DE60027342T2 (de) * | 1999-03-26 | 2007-01-04 | Seiko Epson Corp. | Flexible gedruckte Leiterplatte, elektrooptische Vorrichtung, und elektronisches Gerät |
-
2000
- 2000-09-08 JP JP2000272684A patent/JP3952125B2/ja not_active Expired - Lifetime
- 2000-09-08 EP EP00307782A patent/EP1085788A3/en not_active Withdrawn
- 2000-09-09 KR KR10-2000-0053742A patent/KR100402507B1/ko not_active Expired - Lifetime
- 2000-09-13 CN CN00127031A patent/CN1132054C/zh not_active Expired - Lifetime
- 2000-09-13 US US09/661,187 patent/US6972966B1/en not_active Expired - Lifetime
- 2000-09-13 TW TW089118743A patent/TW548455B/zh not_active IP Right Cessation
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1310320C (zh) * | 2002-05-31 | 2007-04-11 | 富士通株式会社 | 柔性互连装置、指纹传感装置、及其制造方法 |
| US9451703B2 (en) | 2003-06-02 | 2016-09-20 | Seiko Epson Corporation | Electro-optical module, power supply substrate, wiring substrate, and electronic apparatus |
| CN100378791C (zh) * | 2003-06-02 | 2008-04-02 | 精工爱普生株式会社 | 电光学模块、电源基板、配线基板和电子机器 |
| US7460112B2 (en) | 2003-06-02 | 2008-12-02 | Seiko Epson Corporation | Electro-optical module, power supply substrate, wiring substrate, and electronic apparatus |
| US8860698B2 (en) | 2003-06-02 | 2014-10-14 | Seiko Epson Corporation | Electro-optical module, power supply substrate, wiring substrate, and electronic apparatus |
| US9144154B2 (en) | 2003-06-02 | 2015-09-22 | Seiko Epson Corporation | Electro-optical module, power supply substrate, wiring substrate, and electronic apparatus |
| US9947261B2 (en) | 2003-06-02 | 2018-04-17 | Seiko Epson Corporation | Electro-optical module, power supply substrate, wiring substrate, and electronic apparatus |
| US10769981B2 (en) | 2003-06-02 | 2020-09-08 | 138 East Lcd Advancements Limited | Electro-optical module, power supply substrate, wiring substrate, and electronic apparatus |
| US11170697B2 (en) | 2003-06-02 | 2021-11-09 | 138 East Lcd Advancements Limited | Electro-optical module, power supply substrate, wiring substrate, and electronic apparatus |
| US11587495B2 (en) | 2003-06-02 | 2023-02-21 | 138 East Lcd Advancements Limited | Electro-optical module, power supply substrate, wiring substrate, and electronic apparatus |
| CN100368875C (zh) * | 2005-03-30 | 2008-02-13 | 爱普生映像元器件有限公司 | 电光装置、布线基板的安装方法及电子设备 |
| CN107170774A (zh) * | 2016-03-07 | 2017-09-15 | 株式会社日本显示器 | 显示装置 |
| CN107170774B (zh) * | 2016-03-07 | 2020-10-27 | 株式会社日本显示器 | 显示装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3952125B2 (ja) | 2007-08-01 |
| TW548455B (en) | 2003-08-21 |
| EP1085788A3 (en) | 2003-01-02 |
| KR100402507B1 (ko) | 2003-10-22 |
| KR20010039881A (ko) | 2001-05-15 |
| EP1085788A2 (en) | 2001-03-21 |
| JP2001156418A (ja) | 2001-06-08 |
| US6972966B1 (en) | 2005-12-06 |
| CN1132054C (zh) | 2003-12-24 |
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Effective date of registration: 20160601 Address after: 100015 Jiuxianqiao Road, Beijing, No. 10, No. Patentee after: BOE TECHNOLOGY GROUP Co.,Ltd. Address before: Hongkong, China Patentee before: BOE Technology (Hongkong) Co.,Ltd. Effective date of registration: 20160601 Address after: Hongkong, China Patentee after: BOE Technology (Hongkong) Co.,Ltd. Address before: Tokyo, Japan Patentee before: Seiko Epson Corp. |
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