CN1262155C - Test structure and printed circuit board with this test structure - Google Patents

Abstract

A test structure is suitable for being configured on a printed circuit board and used for detecting the pressing condition of an anisotropic conductive film pressed on the test structure, and the test structure is composed of a pad and a plurality of pins, wherein the pad is configured on one side edge of the printed circuit board, and the pins are configured on the printed circuit board on the two corresponding side edges of the pad.

Description

Test structure and printed circuit board with this test structure

technical field

The present invention relates to a test structure and a printed circuit board having the test structure, and in particular relates to a test structure which is easy to attach anisotropic conductive film (Anisotropic ConductiveFilm, ACF) and is easy to detect and has the test structure structure of printed circuit boards.

Background technique

In the manufacturing process of liquid crystal displays, one of the methods of bonding the driver chip to the liquid crystal panel is to package the driver chip on a printed circuit board, and then bond the printed circuit board to the liquid crystal panel to achieve the purpose of bonding the driver chip to the liquid crystal panel. The purpose of the panel. Among them, the method of electrically connecting the printed circuit board and the liquid crystal panel is usually by disposing the anisotropic conductive film on the contacts of the liquid crystal panel and the printed circuit board respectively, and then connecting the two flexible printed circuit boards (Flexible Printed Circuit, FPC) The pins at the end are respectively arranged on the anisotropic conductive film corresponding to the contact positions of the panel and the printed circuit board. By pressing the pins, the conductive particles in the anisotropic conductive film can electrically connect the pins and the contacts. Both, to connect the liquid crystal panel and the printed circuit board through the flexible printed circuit board.

In the above bonding method, the success of the lamination of the anisotropic conductive film will affect whether the liquid crystal panel and the printed circuit board (driver chip) are conductive, so the lamination of the anisotropic conductive film must be to test. For the lamination test of the anisotropic conductive film on the printed circuit board side, usually a test structure is arranged on both sides of the joint area, and when the anisotropic conductive film is arranged on the printed circuit board, it is also arranged on the test structure. When laminating the flexible printed circuit board and the printed circuit board, the anisotropic conductive film on the test structure is also pressed, and the test structure is detected by a sensor. When the test structure detects If the lamination of the anisotropic conductive film is good, it means that the bonding between the flexible printed circuit board and the printed circuit board is good.

Generally speaking, there are two types of test structures most commonly used today. One is that, as shown in FIG. dummylead) 104. The other is that, as shown in FIG. 2 , a whole piece of dummy pad (dummy pad) 204 with a certain area is arranged at both ends of the printed circuit board 200 .

However, when using the dummy lead 104 of FIG. 1 as the test structure for testing, because the line width and line spacing of the lead are small, and the anisotropic conductive film thereon will be The setting of the pin fluctuates, thus making it difficult for the sensor to sense. In addition, when using the dummy liner 204 of FIG. 2 as the test structure for testing, since the anisotropic conductive film is not easily attached to the dummy pad 204, it is impossible to judge the connection between the printed circuit board and the test structure through the lamination state of the test structure. Whether the flexible printed circuit board is properly pressed.

Contents of the invention

Therefore, the object of the present invention is to provide a test structure and a printed circuit board with the test structure, which can easily attach the anisotropic conductive film thereon.

Another object of the present invention is to provide a test structure and a printed circuit board with the test structure, which can make the sensor easy to detect.

The present invention proposes a test structure, which is suitable for disposing on a printed circuit board, and is used to detect the pressing condition of an anisotropic conductive film pressed on the test structure. The test structure is composed of a pad and multiple The pads are arranged on one side of the printed circuit board, and the pins are arranged on the printed circuit board on the corresponding two sides of the pad pattern.

The invention provides a printed circuit board, which is suitable for being electrically connected to a liquid crystal panel through a flexible printed circuit board. The printed circuit board is mainly composed of a substrate, at least one bonding area and two test structures. Wherein the bonding area is configured on one side of the substrate corresponding to the liquid crystal panel, and the test structure is configured on the ends of the two substrates on the above-mentioned side of the substrate, and each test structure also includes a gasket and a plurality of pins, wherein The gasket is arranged on the above-mentioned side of the substrate, and the pins are arranged on the substrate on the corresponding two sides of the gasket.

In the above test structure and printed circuit board, the pad pattern therein is a rectangle including a whole piece.

Moreover, in the above test structure and printed circuit board, the long sides of the pins are parallel to each other, and the long sides are parallel to the corresponding two sides of the pad.

Because the testing structure of the present invention is made up of pads and pins, the pins will help the laminated anisotropic conductive film to be easily attached to it and not easy to peel off. Therefore, through the anisotropic conductive After the film laminating step, the anisotropic conductive film can be well attached to the pad and the lead and is not easy to peel off.

Furthermore, since the pad is a whole piece of rectangle, it is convenient for the sensor to detect. When the anisotropic conductive film on the pad is well attached, the sensor will be able to detect the various defects on the test structure quite easily. Whether the lamination of the anisotropic conductive film is good.

Description of drawings

FIG. 1 is a top view of a known arrangement of dummy pins on a printed circuit board as a test structure.

FIG. 2 is a top view of a known dummy pad disposed on a printed circuit board as a test structure.

FIG. 3 is a top view of a printed circuit board configured with a test structure of the present invention according to a preferred embodiment of the present invention.

Explanation of reference signs

100, 200, 300: printed circuit board

102, 202, 304: junction area

104: quasi-pin

204: quasi-liner

302: Substrate

306: Test Structure

A: Zoom in

Detailed ways

In order to make the above and other purposes, features, and advantages of the present invention more comprehensible, a preferred embodiment is specifically cited below, and in conjunction with the accompanying drawings, the detailed description is as follows:

FIG. 3 is a top view of a test structure and a printed circuit board configured with the test structure according to a preferred embodiment of the present invention. Referring to FIG. 3 , the printed circuit board 300 of the present invention is mainly composed of a substrate 302 , at least one bonding area 304 and a test structure 306 .

Each bonding area 304 is formed by a plurality of contacts, and these bonding areas 304 are disposed on one side of the substrate 302 corresponding to the bonding area (not shown) of the liquid crystal panel.

The test structure 306 is also arranged on the above-mentioned side of the substrate 302 corresponding to the bonding area of the liquid crystal panel, and the test structure 306 is individually arranged at both ends of the substrate 302 (only one end is shown in FIG. 3 ), The test structure 306 is made of the same material and the same manufacturing process as the contact of the bonding area 304 , for example.

Please continue to refer to FIG. 3 , as shown by the enlarged part A in FIG. 3 , each test structure 306 of the present invention is composed of a pad 308 and a plurality of pins 310 . Wherein, the liner 308 is, for example, a whole piece of rectangle, and the pins 310 are arranged on the corresponding two sides of the liner 308, and the pins 310 arranged on the corresponding two sides of the liner 308 are based on The long sides are parallel to each other, and the long sides are parallel to the corresponding two sides of the liner 308 .

Also, on the substrate 302 there are also a plurality of drive chip configuration areas (such as chip holders, not shown) and wirings (not shown) electrically connecting the drive chip configuration areas to the bonding area 304. First, the drive chips ( (not shown) are disposed thereon, and then the driver chip is electrically connected to the wiring on the substrate 302 , so that the driver chip can be electrically connected to the contact of the bonding area 304 through the wiring.

When using the printed circuit board configured with the test structure of the present invention in FIG. 3 to connect to the liquid crystal panel, first anisotropic conductive film (Anisotropic conductive film, ACF) is configured on the bonding area of the liquid crystal panel, and the substrate 302 is configured. On the bonding area 304 and the test structure 306, then the pins at both ends of the flexible printed circuit board (FPC) are respectively arranged on the anisotropic conductive film above the bonding area of the panel and the bonding area 304 of the substrate 302. Then, the flexible printed circuit boards at both ends are laminated, and when the printed circuit board 300 side is laminated, the anisotropic conductive film lamination step is also laminated to the anisotropic conductive film on the test structure 306 . Afterwards, a sensor is used to detect the pressing result of the anisotropic conductive film on the test structure 306 to detect whether the printed circuit board 300 and the flexible printed circuit board are correctly pressed.

In the above-mentioned printed circuit board 300 after lamination of anisotropic conductive film, since the test structure 306 is composed of pads 308 and pins 310, the pins 310 will contribute to the anisotropy after lamination. The conductive film is easy to attach and not easy to peel off. Therefore, after the pressing step, the anisotropic conductive film can be well attached to the pad 308 and the lead 310 and is not easy to peel off.

Furthermore, since the liner 308 is a whole piece of rectangle, it is beneficial for the sensor to detect. When the anisotropic conductive film on the liner 308 is well attached, the sensor will be able to detect the test structure 306 quite easily. Whether the lamination of the anisotropic conductive film on the surface is good.

Although the present invention has been disclosed above with preferred embodiments, it is not intended to limit the present invention. Anyone skilled in the art can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the present invention The scope of protection should be defined by the appended claims.

Claims (8)

1. a test structure is disposed on the printed circuit board (PCB), is pressed on a anisotropic conducting film on this test structure in order to detection, and this test structure comprises:

One liner is disposed on the side of this printed circuit board (PCB); And

A plurality of pins are disposed at the relative dual-side of this liner, and are positioned on this printed circuit board (PCB).

2. test structure as claimed in claim 1 is characterized in that: this liner comprises the rectangle of whole piece.

3. test structure as claimed in claim 1 is characterized in that: those pins are parallel to each other with its long limit, and are parallel to the corresponding dual-side of this liner with its long limit.

4. a printed circuit board (PCB) is electrically connected to a liquid crystal panel by a flexible printed wiring board, and this printed circuit board (PCB) comprises:

One substrate;

At least one engaging zones is disposed at this substrate to a side that should liquid crystal panel; And

Two test structures are disposed on the two substrates end of this side of this substrate, and wherein respectively this test structure comprises:

One liner is disposed on the side of this substrate; And

A plurality of pins are disposed at the relative dual-side of this liner, and are positioned on this substrate.

5. printed circuit board (PCB) as claimed in claim 4 is characterized in that: this liner comprises the rectangle of whole piece.

6. printed circuit board (PCB) as claimed in claim 4 is characterized in that: those pins are parallel to each other with its long limit, and are parallel to the corresponding dual-side of this liner with its long limit.

7. printed circuit board (PCB) as claimed in claim 4 is characterized in that: also have a plurality of contacts, be disposed on this substrate of this engaging zones.

8. printed circuit board (PCB) as claimed in claim 4 is characterized in that: also comprise a plurality of chip for driving configuring areas on this substrate, and those chip for driving configuring areas are to be electrically connected to this engaging zones.

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