[go: up one dir, main page]

CN111601455A - Flexible circuit board, display module, terminal, binding system and binding method - Google Patents

Flexible circuit board, display module, terminal, binding system and binding method Download PDF

Info

Publication number
CN111601455A
CN111601455A CN202010580672.XA CN202010580672A CN111601455A CN 111601455 A CN111601455 A CN 111601455A CN 202010580672 A CN202010580672 A CN 202010580672A CN 111601455 A CN111601455 A CN 111601455A
Authority
CN
China
Prior art keywords
circuit board
film transistor
transistor layer
binding
display module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010580672.XA
Other languages
Chinese (zh)
Inventor
周俊阳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Chuanggong Telecom Technology Co Ltd
Original Assignee
Shanghai Chuanggong Telecom Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Chuanggong Telecom Technology Co Ltd filed Critical Shanghai Chuanggong Telecom Technology Co Ltd
Priority to CN202010580672.XA priority Critical patent/CN111601455A/en
Publication of CN111601455A publication Critical patent/CN111601455A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136254—Checking; Testing

Landscapes

  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mathematical Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

The invention discloses a flexible circuit board, a display module, a terminal, a binding system and a binding method. The flexible circuit board comprises a main body part, a bending part and a plurality of connecting parts; wherein: one side of the main body part is provided with the bending part, and the other side of the main body part is provided with a plurality of connecting parts; gaps are arranged among the connecting parts, and the connecting parts are respectively used for being electrically connected with an external circuit. The part of the flexible circuit board electrically connected with the external circuit board is not a whole surface any more, but a plurality of adjacent subsections with intervals are arranged, so that the binding mode of the flexible circuit board and the external circuit board is not whole surface binding but subsection binding, which is beneficial to dispersing the bending force applied to the external circuit board when the flexible circuit board is bound with the external circuit board, and further beneficial to avoiding the peeling phenomenon of the external circuit board and other plate-shaped structures arranged on the external circuit board caused by the binding of the flexible circuit board.

Description

Flexible circuit board, display module, terminal, binding system and binding method
Technical Field
The invention relates to the technical field of hardware, in particular to a flexible circuit board, a display module, a terminal, a binding system and a binding method.
Background
The existing Flexible Printed Circuit board (FPC) mostly adopts a T-shaped structure as shown in fig. 1, see fig. 2 and fig. 3, when the Flexible Printed Circuit board is bound (bonded) with an external Circuit board, the Flexible Printed Circuit board mostly adopts a whole-surface binding mode, and a bending force downward, uniformly and intensively is applied to the external Circuit board bound by the Flexible Printed Circuit board in a bending operation, so that the external Circuit board is easily peeled (peeled) from other plate-shaped structures arranged thereon.
Disclosure of Invention
The invention provides a flexible circuit board, a display module, a terminal, a binding system and a binding method, aiming at overcoming the defect that the bound external circuit board is easy to be stripped from other plate-shaped structures arranged on the external circuit board when the flexible circuit board is bound in a whole surface mode in the prior art.
The invention solves the technical problems through the following technical scheme:
a flexible wiring board comprising: the connecting device comprises a main body part, a bending part and a plurality of connecting parts; wherein:
one side of the main body part is provided with the bending part, and the other side of the main body part is provided with a plurality of connecting parts;
gaps are arranged among the connecting parts, and the connecting parts are respectively used for being electrically connected with an external circuit.
Optionally, the main body portion, the bending portion, and the plurality of connecting portions are integrally formed.
A display module, comprising: a Thin Film Transistor (TFT) layer and any of the above flexible wiring boards; wherein:
at least one of the plurality of connections is for electrically connecting to the thin-film-transistor layer.
Optionally, the thin-film transistor layer comprises a test signal line;
at least one of the connection portions electrically connected to the thin-film transistor layer is used for electrically connecting to the test signal line.
Optionally, the display module further includes an Integrated Circuit (IC);
at least one of the other connection portions of the plurality of connection portions except the connection portion electrically connected to the thin-film transistor layer is used for electrically connecting to the integrated circuit.
Optionally, the integrated circuit comprises a power line and a signal line;
at least one of the connection portions electrically connected to the integrated circuit is for electrical connection to the power supply line;
at least one of the other connecting portions electrically connected to the integrated circuit, except for the connecting portion electrically connected to the power supply line, is used for electrical connection to the signal line.
Optionally, the display module further includes a Backlight (BL) layer and a Color Filter (CF) layer; wherein:
the backlight layer is arranged below the thin film transistor layer;
the integrated circuit and the color filter layer are arranged above the thin film transistor layer.
A terminal comprises any one of the display modules.
A binding system comprises a multi-pressure head device, a thin film transistor layer and any one of the flexible circuit boards; wherein:
the multi-pressure head equipment is used for adsorbing a plurality of connecting parts, aligning the connecting parts with pins of the thin film transistor layer, and simultaneously binding the adsorbed pins of the connecting parts to the pins of the thin film transistor layer.
A binding method is realized by the binding system, and the binding method comprises the following steps:
the multi-pressure head equipment adsorbs a plurality of connecting parts;
the multi-pressure head equipment is aligned with the plurality of connecting parts and the pins of the thin film transistor layer;
and the multi-pressure head equipment simultaneously binds the adsorbed pins of the plurality of connecting parts to the pins of the thin film transistor layer.
The positive progress effects of the invention are as follows: the part of the flexible circuit board electrically connected with the external circuit board is not a whole surface any more, but a plurality of adjacent subsections with intervals are arranged, so that the binding mode of the flexible circuit board and the external circuit board is not whole surface binding but subsection binding, which is beneficial to dispersing the bending force applied to the external circuit board when the flexible circuit board is bound with the external circuit board, and further beneficial to avoiding the peeling phenomenon of the external circuit board and other plate-shaped structures arranged on the external circuit board caused by the binding of the flexible circuit board.
Drawings
Fig. 1 is a schematic structural diagram of a flexible printed circuit in the prior art.
Fig. 2 is a schematic diagram illustrating a flexible printed circuit board and an external circuit board in the prior art.
Fig. 3 is a schematic diagram illustrating a peeling phenomenon caused by the binding of a flexible printed circuit board in the prior art.
Fig. 4 is a schematic structural view of a flexible wiring board according to embodiment 1 of the present invention.
Fig. 5 is a schematic structural diagram of a display module according to embodiment 2 of the invention.
Fig. 6 is a schematic circuit diagram of a flexible printed circuit board in a display module according to embodiment 2 of the invention.
Fig. 7 is a flowchart of a binding method according to embodiment 5 of the present invention.
Detailed Description
The invention is further illustrated by the following examples, which are not intended to limit the scope of the invention.
Example 1
Referring to fig. 4, the flexible printed circuit includes a main body 11, a bending portion 12, and a plurality of connecting portions 13, specifically, the main body 11 is provided with the bending portion 12 on one side and the connecting portions 13 on the other side, wherein gaps are provided between the connecting portions 13, and the connecting portions 13 are respectively used for electrically connecting with an external circuit.
In the present embodiment, the main body 11, the bent portion 12, and the plurality of connecting portions 13 are preferably integrally molded. In addition, in the present embodiment, the widths of the plurality of connecting portions 13 may be the same, and the size of the gap between two adjacent connecting portions may be the same.
In this embodiment, the portion of the flexible printed circuit board electrically connected to the external circuit board is not a whole surface, but a plurality of adjacent segments are provided with intervals, so that the flexible printed circuit board and the external circuit board are bound in a manner that the flexible printed circuit board and the external circuit board are not bound in a whole surface but in segments, which is beneficial to dispersing the bending force applied to the external circuit board when the flexible printed circuit board and the external circuit board are bound, and further beneficial to avoiding the peeling phenomenon of the external circuit board and other plate-shaped structures arranged thereon, which is caused by the binding of the flexible printed circuit board.
Example 2
Referring to fig. 5, the display module of this embodiment sequentially includes, from top to bottom, a color filter layer 2, a thin film transistor layer 3, and a backlight layer 4, where the thin film transistor layer 3 is electrically connected to an integrated circuit 5 and the flexible circuit board 1 provided in embodiment 1, and the flexible circuit board 1 is bent and attached to the backlight layer 4. In this embodiment, the Display Module may be a Liquid Crystal Display Module (LCM).
Specifically, referring to fig. 6, in this embodiment, at least one of the connection portions 13 included in the flexible wiring board 1 is used to be electrically connected to the thin-film transistor layer 3, and further, at least one of the connection portions 13 electrically connected to the thin-film transistor layer 3 is used to be electrically connected to the test signal line 31 included in the thin-film transistor layer 3. Therefore, the flexible circuit board 1 leads out a test signal of the thin film transistor layer 3, and the test on the thin film transistor layer 3 is facilitated.
In the present embodiment, at least one of the connection portions 13 other than the connection portion 13 electrically connected to the thin-film transistor layer 3 among the plurality of connection portions 13 is used to be electrically connected to the integrated circuit 5, further, at least one of the connection portions 13 electrically connected to the integrated circuit 5 is used to be electrically connected to a power supply line 51 included in the integrated circuit 5, and at least one of the connection portions 13 other than the connection portion 13 electrically connected to the power supply line 51 among the connection portions 13 electrically connected to the integrated circuit 5 is used to be electrically connected to a signal line 52 included in the integrated circuit 5. Therefore, the flexible circuit board 1 also leads out the power supply signal, the image signal and the like of the integrated circuit 5, and the power supply signal and the image signal are led out in a segmented manner, so that the interference between the power supply signal and the image signal can be effectively avoided.
In this embodiment, the sectional binding of the flexible printed circuit board and the thin film transistor layer is beneficial to dispersing the bending force applied by the flexible printed circuit board to the thin film transistor layer, thereby being beneficial to avoiding the peeling phenomenon caused by the binding of the flexible printed circuit board.
In addition, in this embodiment, preferably improve the width D of flexible line way board, for example, width D's value can be close to the width on thin film transistor layer, in order to avoid because the flexible line way board that the existence in clearance between a plurality of connecting portion caused walks the defect that the line area is not enough, and simultaneously, can also further make the flexible line way board act on the power of buckling on thin film transistor layer more even, be favorable to avoiding because the binding of flexible line way board causes the peeling off of thin film transistor layer and color filter layer, the reliability of display module assembly has been improved.
Example 3
This embodiment provides a terminal including the display module provided in embodiment 2, for example, the terminal may be a mobile phone, a tablet computer, or the like. In this embodiment, the flexible circuit board is bound with the thin film transistor layer in a segmented manner, so that the reliability of the display module is improved, and further, the reliability of the terminal of this embodiment is improved.
Example 4
This embodiment provides a bonding system that includes a multi-head device, a thin-film transistor layer, and the flexible wiring board provided in embodiment 1.
Specifically, in this embodiment, the multi-head pressing device is configured to adsorb the plurality of connection portions, precisely align the plurality of connection portions and the pins of the thin film transistor layer included in the flexible printed circuit board, and simultaneously bind the pins of the adsorbed plurality of connection portions to the pins of the thin film transistor layer.
In this embodiment, the synchronous binding of each connecting portion of the flexible printed circuit board is realized based on the multi-pressure head device, specifically, each connecting portion of the flexible printed circuit board is bound with the thin Film transistor layer at the same time, so that the binding of each connecting portion of the flexible printed circuit board is completed under the same conditions, for example, under the conditions of the same temperature, humidity, ACF (anisotropic conductive Film), glue and the like, and the binding effect of the wiring pins of each connecting portion of the flexible printed circuit board is ensured to be consistent.
Example 5
The present embodiment provides a binding method, specifically, the binding method of the present embodiment is implemented by using the binding system provided in embodiment 4, and referring to fig. 7, the binding method of the present embodiment includes:
s501, adsorbing a plurality of connecting parts by a multi-pressure head device;
s502, aligning the plurality of connecting parts and pins of the thin film transistor layer by the multi-pressure head equipment;
and S503, the multi-pressure head equipment simultaneously binds the pins of the plurality of adsorbed connecting parts to the pins of the thin film transistor layer.
In this embodiment, the synchronous binding of each connecting portion of the flexible printed circuit board is realized based on the multi-pressure head device, specifically, each connecting portion of the flexible printed circuit board is bound with the thin Film transistor layer at the same time, so that the binding of each connecting portion of the flexible printed circuit board is completed under the same conditions, for example, under the conditions of the same temperature, humidity, ACF (anisotropic conductive Film), glue and the like, and the binding effect of the wiring pins of each connecting portion of the flexible printed circuit board is ensured to be consistent.
While specific embodiments of the invention have been described above, it will be appreciated by those skilled in the art that this is by way of example only, and that the scope of the invention is defined by the appended claims. Various changes and modifications to these embodiments may be made by those skilled in the art without departing from the spirit and scope of the invention, and these changes and modifications are within the scope of the invention.

Claims (10)

1. A flexible wiring board, comprising: the connecting device comprises a main body part, a bending part and a plurality of connecting parts; wherein:
one side of the main body part is provided with the bending part, and the other side of the main body part is provided with a plurality of connecting parts;
gaps are arranged among the connecting parts, and the connecting parts are respectively used for being electrically connected with an external circuit.
2. The flexible wiring board of claim 1, wherein the main body portion, the bending portion, and the plurality of connecting portions are integrally formed.
3. A display module, comprising: a thin-film transistor layer and the flexible wiring board of claim 1 or 2; wherein:
at least one of the plurality of connections is for electrically connecting to the thin-film-transistor layer.
4. The display module of claim 3, wherein the thin-film transistor layer comprises a test signal line;
at least one of the connection portions electrically connected to the thin-film transistor layer is used for electrically connecting to the test signal line.
5. The display module of claim 3, wherein the display module further comprises an integrated circuit;
at least one of the other connection portions of the plurality of connection portions except the connection portion electrically connected to the thin-film transistor layer is used for electrically connecting to the integrated circuit.
6. The display module of claim 5, wherein the integrated circuit comprises a power line and a signal line;
at least one of the connection portions electrically connected to the integrated circuit is for electrical connection to the power supply line;
at least one of the other connecting portions electrically connected to the integrated circuit, except for the connecting portion electrically connected to the power supply line, is used for electrical connection to the signal line.
7. The display module of claim 5, wherein the display module further comprises a backlight layer and a color filter layer; wherein:
the backlight layer is arranged below the thin film transistor layer;
the integrated circuit and the color filter layer are arranged above the thin film transistor layer.
8. A terminal, characterized in that the terminal comprises a display module according to any one of claims 3-7.
9. A binding system comprising a multi-head device, a thin-film transistor layer, and the flexible wiring board of claim 1 or 2; wherein:
the multi-pressure head equipment is used for adsorbing a plurality of connecting parts, aligning the connecting parts with pins of the thin film transistor layer, and simultaneously binding the adsorbed pins of the connecting parts to the pins of the thin film transistor layer.
10. A binding method implemented by the binding system of claim 9, the binding method comprising:
the multi-pressure head equipment adsorbs a plurality of connecting parts;
the multi-pressure head equipment is aligned with the plurality of connecting parts and the pins of the thin film transistor layer;
and the multi-pressure head equipment simultaneously binds the adsorbed pins of the plurality of connecting parts to the pins of the thin film transistor layer.
CN202010580672.XA 2020-06-23 2020-06-23 Flexible circuit board, display module, terminal, binding system and binding method Pending CN111601455A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010580672.XA CN111601455A (en) 2020-06-23 2020-06-23 Flexible circuit board, display module, terminal, binding system and binding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010580672.XA CN111601455A (en) 2020-06-23 2020-06-23 Flexible circuit board, display module, terminal, binding system and binding method

Publications (1)

Publication Number Publication Date
CN111601455A true CN111601455A (en) 2020-08-28

Family

ID=72184897

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010580672.XA Pending CN111601455A (en) 2020-06-23 2020-06-23 Flexible circuit board, display module, terminal, binding system and binding method

Country Status (1)

Country Link
CN (1) CN111601455A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112331093A (en) * 2020-11-03 2021-02-05 Tcl华星光电技术有限公司 Display panel and display device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030086049A1 (en) * 2001-11-08 2003-05-08 Hitachi, Ltd. Liquid crystal display device
CN1607895A (en) * 2003-10-14 2005-04-20 三星电子株式会社 Flexible printed circuit board and liquid crystal display having the same
CN1680846A (en) * 2004-10-05 2005-10-12 友达光电股份有限公司 Flat display panel and assembly method thereof
CN1834732A (en) * 1998-12-08 2006-09-20 夏普株式会社 Matrix display device and method for manufacturing the same, and heat pressing connection head
CN110196520A (en) * 2018-02-27 2019-09-03 华为终端有限公司 LCD display part and electronic equipment

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1834732A (en) * 1998-12-08 2006-09-20 夏普株式会社 Matrix display device and method for manufacturing the same, and heat pressing connection head
US20030086049A1 (en) * 2001-11-08 2003-05-08 Hitachi, Ltd. Liquid crystal display device
CN1607895A (en) * 2003-10-14 2005-04-20 三星电子株式会社 Flexible printed circuit board and liquid crystal display having the same
CN1680846A (en) * 2004-10-05 2005-10-12 友达光电股份有限公司 Flat display panel and assembly method thereof
CN110196520A (en) * 2018-02-27 2019-09-03 华为终端有限公司 LCD display part and electronic equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112331093A (en) * 2020-11-03 2021-02-05 Tcl华星光电技术有限公司 Display panel and display device

Similar Documents

Publication Publication Date Title
CN111919164B (en) Display panel and electronic device with narrow bottom frame
US8174662B2 (en) Display circuits
US9230467B2 (en) Display module and assembly method thereof
US20120262886A1 (en) Display Device
US7489382B2 (en) Liquid crystal display module
US20150085210A1 (en) In-Cell Touch Liquid Crystal Display Module and Manufacturing Method For The Same
CN108663863B (en) Array substrate
CN1188730C (en) Probe, device and method for testing liquid crystal display panel
US20080179085A1 (en) Printed circuit board and display panel assembly having the same
CN102914890A (en) Flexible circuit board
KR100447233B1 (en) A Liquid Crystal Display Device
CN111601455A (en) Flexible circuit board, display module, terminal, binding system and binding method
US7791701B2 (en) Circuit film comprising a film substrate connected to the control board, wire board, and display panel
US20170347452A1 (en) Display, multi-circuit board and manufacturing method thereof
CN102446926B (en) Flexible display panel and assembling method thereof
CN112631028A (en) Display panel, manufacturing method thereof and display device
CN202514165U (en) Flexible printed circuit board
CN113973505B (en) Display device
KR102247998B1 (en) Display device having flexible printed circuit
CN100480786C (en) Composite crystal structure of glass, and LCD of using the composite crystal structure of glass
CN108364996A (en) O L ED display device
CN101206369A (en) Pixel array module and flat display device
CN100363790C (en) Liquid crystal display and its soft circuit board
CN1746732A (en) Display panels and circuit substrate manufacturing method thereof
KR101034683B1 (en) LCD Display

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20200828