CN1324321C - Method for testing flexible circuit board bonding yield and flexible circuit board with test pad - Google Patents

Abstract

A flexible circuit board with test pads is provided with a plurality of connecting points and a plurality of test pads, wherein each test pad is arranged corresponding to each connecting point, and the test pads are electrically isolated from the connecting points. After the connection points of the flexible circuit board are connected with the connection pins of the display, the test pad is electrically connected with the connection points of the flexible circuit board through the connection pins of the display, so that the connection qualification rate between the flexible circuit board and the display can be judged by electrically measuring the test pad.

Description

Method for testing flexible circuit board bonding yield and flexible circuit board with test pad

technical field

The present invention relates to a method for testing the joint pass rate of a flexible circuit board and the structure of the flexible circuit board, in particular to a method for testing the joint pass rate between a flexible circuit board and a display and a flexible circuit with a test pad plate.

Background technique

Usually, after the flat panel display is fabricated, the flat panel display is connected to an external system to supply power or drive the display of the flat panel display. The general method for connecting the flat panel display to the external system is to press the flexible circuit board on the edge of the flat display panel so that the circuits of the flat panel display and the flexible circuit board are connected to each other. Since the other end of the flexible circuit board is connected to the external system, the flat panel display can be connected to the external system through the connection of the flexible circuit board. However, because the flexible circuit board is extremely fragile, it is easy to cause insufficient reliability between the flexible circuit board and the flat-panel display due to external force. Therefore, after the flexible circuit board and the flat-panel display are bonded, the joint pass rate test will be carried out.

The existing test method for the joint pass rate of the flexible circuit board and the flat panel display is to use an optical microscope to check the pressing condition of the flexible circuit board, or to test the strength of the flexible circuit board after pressing by means of a tensile test . However, the existing measurement methods cannot electrically measure whether the flat panel display can be driven normally.

In the existing method, if it is necessary to measure whether the flat panel display can be driven normally, the general practice is to light on the light (Light On) after the flat panel display is bonded to the flexible circuit board to confirm the flexible circuit Whether the connection between the board and the flat panel display is successful. However, using the above method to confirm whether the connection between the flexible circuit board and the flat-panel display is successful, there is a problem, that is, if there is an abnormality in the picture of the flat-panel display, it is impossible to confirm whether it is between the flexible circuit board and the flat-panel display. There is a problem with the joint of the flat panel display, or a problem with the components in the flat panel display. Therefore, to actually find out the cause of the abnormality, it will be quite complicated and difficult to find the real reason.

Contents of the invention

Therefore, the purpose of the present invention is to provide a method for testing the bonding yield of a flexible circuit board and a flexible circuit board with test pads, so as to solve the problem that the existing measurement methods cannot electrically measure whether the flat panel display can be driven normally.

Another object of the present invention is to provide a method for testing the bonding yield of flexible printed circuit boards and flexible printed circuit boards with test pads, so as to solve the problem that when the display screen is abnormal in the existing measurement methods, it is impossible to confirm whether it is There is a problem with the bonding of the flexible circuit board, or there is a problem with the components in the flat panel display.

The object of the present invention is achieved by proposing a method for testing the bonding yield of a flexible circuit board. The method firstly provides a flexible circuit board, wherein the flexible circuit board has several contacts. Next, several test pads are set on the flexible circuit board, wherein each test pad corresponds to each contact configuration, and the test pads and the contacts are electrically isolated from each other. In the present invention, the method of disposing the test pads on the flexible circuit board is, for example, forming several conductive blocks on the flexible circuit board, and the material of these conductive blocks is copper, for example. Alternatively, several openings are formed on the flexible circuit board, and the formed openings will expose the pins of the device to be bonded after the subsequent bonding process of the flexible circuit board. At the same time, a device to be joined is provided, such as a display, wherein the device has several pins. Afterwards, a bonding process is performed to electrically connect the contacts of the flexible circuit board and the test pads to the pins of the device. Subsequently, a test signal is input into the flexible circuit board, and then an output signal is measured from the test pad to judge the joint qualification rate between the flexible circuit board and the device. If the output signal measured from the test pad is abnormal, it means that the connection between the flexible circuit board and the device is not good.

The present invention proposes a flexible circuit board with test pads, the flexible circuit board has several contacts and several test pads, wherein each test pad corresponds to each contact configuration, and each test pad is connected to each contact are electrically isolated from each other. In the present invention, the test pads on the flexible circuit board are, for example, several conductive blocks, and the material of these conductive blocks is, for example, copper. In addition, these test pads can also be several openings.

The test method of the invention can know the bonding effect of the flexible circuit board in real time, thus improving the qualified rate of the product and reducing the manufacturing process time of the product.

In addition, since the present invention can instantly know whether the bonding of the flexible circuit board is successful, when it is found that the bonding of the flexible circuit board fails, the rework step of the bonding of the flexible circuit board can be performed immediately, thereby improving the yield of the product.

Furthermore, since the measurement method of the present invention can be used to determine whether the abnormality of the display screen is caused by a poor connection of the flexible circuit board, the present invention can reduce the time to find out the cause of the abnormality when the product is abnormal.

Description of drawings

Fig. 1 is the top view of the flexible printed circuit board of a preferred embodiment of the present invention;

Fig. 2 is a schematic diagram of the joint pass rate of the test flexible circuit board according to a preferred embodiment of the present invention;

FIG. 3 is a schematic diagram of the joint pass rate of the flexible circuit board for testing according to another preferred embodiment of the present invention.

Detailed ways

As shown in Figure 1, what it depicts is a schematic top view of a flexible circuit board according to a preferred embodiment of the present invention; as shown in Figure 2, what it depicts is a test flexible circuit board according to a preferred embodiment of the present invention Schematic diagram of board bonding yield.

Please refer to FIG. 1 and FIG. 2 , the method for testing the bonding yield of the flexible circuit board of the present invention is to firstly provide a flexible circuit board 100 , wherein the flexible circuit board 100 has several contacts 102 . Next, several test pads 104 are provided on the flexible circuit board 100 , wherein each test pad 104 is configured corresponding to each contact 102 , and the test pads 104 and the contacts 102 are electrically isolated from each other.

In a preferred embodiment, the method of disposing the test pad 104 on the flexible circuit board 100 is, for example, forming several conductive blocks 104 on the flexible circuit board 100, and its cross-sectional view (A-A' cross-sectional view) is shown in In FIG. 2 , the material of these conductive blocks 104 is copper, for example.

Please refer to FIG. 2 , at the same time, a device 200 is provided. The device 200 is, for example, a display, wherein the display 200 has several pins 202 . Afterwards, a bonding process is performed to electrically connect the contacts 102 and the test pads 104 of the flexible circuit board 100 to the pins 202 of the display 200 . In a preferred embodiment, the bonding process is, for example, placing a layer of anisotropic conductive adhesive 210 between the flexible circuit board 100 and the display 200, and then performing a pressing step to make the anisotropic conductive adhesive The conductive particles in 210 are in contact with each other, so that the contacts 102 of the flexible circuit board 100 and the test pads 104 are electrically connected with the pins 202 of the display 200 .

Subsequently, a test signal is input into the flexible circuit board 100, and the test signal will pass through the contact 102 and the anisotropic conductive glue 210 to the pin 202 of the display 200, and then pass through the pin 202 and the anisotropic conductive The glue 210 is then transferred to the test pad 104 . Therefore, if the bonding result of the flexible printed circuit is good, a normal output signal can be measured from the test pad 104 . In other words, the present invention uses a test signal to be input into the flexible circuit board 100 , and then the output signal is measured by the test pad 104 to determine the joint pass rate between the flexible circuit board and the display. If the output signal measured from the test pad 104 is abnormal, it indicates that the connection between the flexible circuit board 100 and the display 200 is not good.

The method for testing the bonding yield of the flexible circuit board of the present invention can also form several openings 104 a in the flexible circuit board 100 as test pads, as shown in FIG. 3 . After using an anisotropic conductive adhesive 210 to bond the flexible circuit board 100 to the display 200, the contacts 102 of the flexible circuit board 100 will be electrically connected to the pins 202 of the display 200, and the openings on the flexible circuit board 100 104 a exposes the anisotropic conductive adhesive 210 corresponding to the pin 202 .

Then, a test signal is input into the flexible circuit board 100 , and the test signal will be transmitted to the pin 202 of the display 200 through the contact 102 and the anisotropic conductive glue 210 . If the bonding of the flexible printed circuit is good, a normal output signal can be measured from the exposed anisotropic conductive adhesive 210 corresponding to the pin 202 through the opening 104 a. In other words, the present invention utilizes inputting a test signal into the flexible circuit board 100, and then measuring the output signal from the anisotropic conductive glue 210 exposed by the opening 104a and corresponding to the pin 202 to judge the relationship between the flexible circuit board and the display. The joint pass rate. If the measured output signal is abnormal, it means that the connection between the flexible circuit board 100 and the display 200 is not good.

Therefore, the flexible circuit board 100 with test pads 104 proposed by the present invention includes several contacts 102 and several test pads 104, wherein each test pad 104 is corresponding to each contact 102, and each test pad 104 is connected to each test pad 104. The contacts 102 are electrically isolated from each other. In the present invention, the test pads 104 on the flexible circuit board 100 are, for example, several conductive blocks (as shown in FIG. 2 ), and the material of these conductive blocks 104 is, for example, copper. In addition, these test pads 104 can also be several openings (as shown in FIG. 3 ), and these openings 104 a will expose the pins of the display after the subsequent bonding process.

The method for testing the joint pass rate of the flexible circuit board of the present invention can know the effect of the joint of the flexible circuit board in real time, so the product pass rate can be improved and the production process time schedule of the product can be reduced.

In addition, since the present invention can instantly know whether the bonding of the flexible circuit board is successful, when it is found that the bonding of the flexible circuit board fails, the rework step of the bonding of the flexible circuit board can be performed immediately, thereby improving the yield of the product.

Furthermore, since the measurement method of the present invention can be used to determine whether the abnormality of the display screen is caused by a poor connection of the flexible circuit board, the present invention can reduce the time to find out the cause of the abnormality when the product is abnormal.

Although the present invention has been disclosed in conjunction with the above preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the present invention The scope of protection should be defined by the claims.

Claims (12)

1. test the method that flexible circuit board engages qualification rate for one kind, comprising:

One flexible circuit board is provided, and this flexible circuit board has a plurality of contacts;

A plurality of testing cushion are set, wherein corresponding each this each joint configuration of each this each testing cushion, and electric completely cutting off between this each testing cushion and this each contact on this flexible circuit board;

One device is provided, and it has a plurality of pins;

Carry out one and engage manufacture craft, so that each contact of this of this flexible circuit board and this each testing cushion are electrically connected with this each pin of this device respectively;

Import a test signal to this flexible circuit board, this test signal reaches this each pin of this device by this each contact of this flexible circuit board, and then reaches on this each testing cushion by this each pin; And

Measure an output signal from this each testing cushion, to judge the qualification rate that engages between this flexible circuit board and this device.

2. test flexible circuit board as claimed in claim 1 engages the method for qualification rate, and wherein the method that this each testing cushion is set on this flexible circuit board is for forming a plurality of conducting blocks on this flexible circuit board.

3. test flexible circuit board as claimed in claim 2 engages the method for qualification rate, and wherein the material of this each conducting block comprises copper.

4. test flexible circuit board as claimed in claim 1 engages the method for qualification rate, and wherein this joint manufacture craft comprises:

Between this flexible circuit board and this device, place an anisotropic conductive; And

Carry out a pressing step, so that each contact of this of this flexible circuit board and this each testing cushion are electrically connected with this each pin of this device.

5. test flexible circuit board as claimed in claim 1 engages the method for qualification rate, and wherein this device is a display.

6. test the method that flexible circuit board engages qualification rate for one kind, comprising:

One flexible circuit board is provided, and this flexible circuit board has a plurality of contacts;

On this flexible circuit board, form a plurality of openings with as a plurality of testing cushion, corresponding each this each joint configuration of each this each opening wherein, and do not link together between this each opening and this each contact;

One device is provided, and it has a plurality of pins;

Carry out one and engage manufacture craft, so that each contact of this of this flexible circuit board and be electrically connected with those pins of this device, wherein each opening of this of this flexible circuit board exposes this each pin of this device;

Import a test signal to this flexible circuit board, this test signal reaches this each pin of this device by this each contact of this flexible circuit board, and then reaches this each opening part by this each pin; And

Measure an output signal from this each opening part, to judge the qualification rate that engages between this flexible circuit board and this device.

7. test flexible circuit board as claimed in claim 1 engages the method for qualification rate, and wherein this joint manufacture craft also comprises:

Between this flexible circuit board and this device, place an anisotropic conductive; And

Carry out a pressing step, so that each contact of this of this flexible circuit board is electrically connected with this each pin of this device.

8. test flexible circuit board as claimed in claim 1 engages the method for qualification rate, and wherein this device is a display.

9. flexible circuit board with testing cushion comprises:

One flexible circuit board has a plurality of contacts on this flexible circuit board; And

A plurality of testing cushion are positioned on this flexible circuit board, corresponding each this each joint configuration of each this each testing cushion, and electricity is isolated each other between each this each testing cushion and this each contact.

10. the flexible circuit board with testing cushion as claimed in claim 9, wherein this each testing cushion is a plurality of conducting blocks on this flexible circuit board.

11. the flexible circuit board with testing cushion as claimed in claim 10, wherein the material of this each conducting block comprises copper.

12. the flexible circuit board with testing cushion as claimed in claim 9, wherein this each testing cushion is a plurality of openings on this flexible circuit board.

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