CN111826100A - Die-bond film - Google Patents

Abstract

Provided is a dicing die-bonding film which is less likely to float between an adhesive layer and an adhesive layer during cold expansion and normal temperature expansion, and thereafter. A dicing die-bonding film comprising: a dicing tape having a laminated structure including a substrate and an adhesive layer; and an adhesive layer that is releasably adhered to the adhesive layer in the dicing tape, wherein the adhesive layer has a water contact angle of a surface on the adhesive layer adhesion side of 110 DEG or less and an arithmetic average surface roughness Ra of 1.0 [ mu ] m or less.

Description

Die-bond film

technical field

The present invention relates to dicing die-bonding films. More specifically, the present invention relates to a dicing die-bonding film that can be used in a manufacturing process of a semiconductor device.

Background technique

In the manufacturing process of a semiconductor device, a dicing die-bonding film is sometimes used in the process of obtaining a semiconductor chip having an adhesive film for die-bonding having a size equivalent to the die, that is, a semiconductor chip with an adhesive layer for die-bonding. The dicing die-bonding film has a size corresponding to the semiconductor wafer to be processed, and includes, for example, a dicing tape composed of a base material and an adhesive layer, and a die-bonding film ( adhesive layer).

As one of the methods of obtaining a semiconductor chip with an adhesive bond layer by using a dicing die-bonding film, there is known a method of going through a step of extending a dicing tape in the dicing die-bonding film to cut the die-bonding film. In this method, a semiconductor wafer is first attached to the die-bonding film from which the die-bonding film is cut. This semiconductor wafer is processed so that it can be cut|disconnected together with a die-bonding film later, and it can be divided into several semiconductor chips, for example.

Then, in order to cut the die-bonding film on the dicing tape, the dicing tape for dicing the die-bonding film is stretched in a two-dimensional direction including the radial and circumferential directions of the semiconductor wafer using an expansion device. In this expansion step, the semiconductor wafer located on the die-bonding film is also cut at a position corresponding to the cutting position in the die-bonding film, and the semiconductor wafer is singulated on the dicing die-bonding film or the dicing tape. Multiple semiconductor chips.

Then, for the plurality of semiconductor chips with the die-bonding film that have been cut on the dicing tape, the expansion process is performed again in order to increase the spacing distance. Then, after a cleaning step, for example, each semiconductor chip and a die-bonding film having a size corresponding to the chip adhered thereto are lifted up from the lower side of the dicing tape by the needle-shaped member of the pickup mechanism, and picked up from the dicing tape. Thereby, the semiconductor chip with the adhesive bond layer which is a die-bonding film is obtained. The adhesive layer-attached semiconductor chip is fixed to an adherend such as a mounting substrate by die bonding via the adhesive layer.

The technique concerning the dicing die-bonding film used as mentioned above is described in the following patent documents 1-3, for example.

prior art literature

Patent Literature

Patent Document 1: Japanese Patent Laid-Open No. 2007-2173

Patent Document 2: Japanese Patent Laid-Open No. 2010-177401

Patent Document 3: Japanese Patent Laid-Open No. 2016-115804

SUMMARY OF THE INVENTION

Invention to solve problem

In recent years, in order to increase the capacity of semiconductors, multilayering of circuit layers and thinning of silicon layers are progressing. However, by multilayering the circuit layers, the thickness (total thickness) of the circuit layers increases, and the ratio of the resin contained in the circuit layers tends to increase. As a result, the multilayered circuit layers and the thinned circuit layers tend to increase. The difference between the linear expansion coefficients of the silicon layers becomes significant, and thus the semiconductor chip becomes easily warped. Therefore, in the case of using the conventional dicing die-bonding film, in particular, a semiconductor chip in which the circuit layer with the die-bonding film obtained after dicing is multi-layered has the following problem: in the expansion process (cold expansion to be described later) and room temperature expansion) and thereafter (for example, a cleaning process, a period until picking up, etc.), peeling (floating) is likely to occur at the interface between the pressure-sensitive adhesive layer of the dicing tape and the die-bonding film. When the floating occurs, the semiconductor chip is likely to slip off after the expansion process (cleaning process, processing, etc.).

The present invention has been made in view of the above-mentioned problems, and an object thereof is to provide a dicing die-bonding film that does not easily float between the adhesive layer and the adhesive layer during cold expansion, during normal temperature expansion, and thereafter.

solution to the problem

The inventors of the present invention have conducted intensive studies in order to achieve the above-mentioned object, and as a result, they have found that when a dicing die-bonding film is used as described below, floating is less likely to occur between the adhesive bond layer and the adhesive bond layer during cold expansion, during normal temperature expansion, and thereafter. , the dicing die-bonding film includes: a dicing tape having a laminated structure including a base material and an adhesive layer; and an adhesive layer that is releasably adhered to the above-mentioned adhesive in the above-mentioned dicing tape layer, wherein the adhesive layer has a water contact angle of 110° or less and an arithmetic mean surface roughness Ra of 1.0 μm or less on the surface of the adhesive layer on the adhesive side. The present invention has been completed based on the above findings.

That is, the present invention provides a dicing die-bonding film comprising: a dicing tape having a laminated structure including a base material and an adhesive layer; and an adhesive layer releasably adhering to the dicing tape In the said pressure-sensitive adhesive layer, in the said pressure-sensitive adhesive layer, the water contact angle of the surface of the said pressure-sensitive adhesive layer adhering side is 110 degrees or less, and the arithmetic mean surface roughness Ra is 1.0 micrometer or less.

The dicing die-bonding film of the present invention includes a dicing tape and an adhesive layer. The dicing tape has a laminated structure including a base material and an adhesive layer. The adhesive layer is releasably adhered to the adhesive layer in the dicing tape. The dicing die-bonding film of such a configuration can be used to obtain a semiconductor chip with an adhesive layer in the manufacturing process of a semiconductor device.

In the manufacturing process of a semiconductor device, as described above, in order to obtain a semiconductor chip with an adhesive layer, an expansion process using a dicing die-bonding film, that is, an expansion process for severing may be performed. In this expansion step, it is necessary to appropriately act the cutting force on the adhesive layer on the dicing tape in the dicing die-bonding film. The pressure-sensitive adhesive layer of the dicing tape in the dicing die-bonding film of the present invention has a water contact angle of 110° or less and an arithmetic mean surface roughness Ra of 1.0 μm or less on the surface on the side where the pressure-sensitive adhesive layer is in close contact. According to the dicing die-bonding film of the present invention having such a configuration, the adhesiveness between the adhesive layer and the adhesive layer is moderately excellent, and the occurrence of peeling between the adhesive layer and the adhesive layer in the expansion step and subsequent steps can be suppressed (floating).

In the dicing die-bonding film of the present invention, it is preferable that the contact angle with water and the contact angle of diiodomethane on the surface of the pressure-sensitive adhesive layer (the surface on the side where the pressure-sensitive adhesive layer is in close contact) are determined by the Kaelble Uy equation. The value of the polar component of the obtained surface free energy is 0.10 or more. With the dicing die-bonding film of the present invention having such a configuration, the difference in polar components with the surface of the adhesive layer is reduced, and the affinity between the surface of the adhesive layer and the surface of the adhesive layer is improved, so that the adhesive The adhesiveness between the layer and the adhesive layer becomes more appropriate, and the occurrence of peeling (floating) between the adhesive layer and the adhesive layer in the expansion step and subsequent steps can be further suppressed.

Moreover, in the dicing die-bonding film of the present invention, the pressure-sensitive adhesive layer preferably contains an acrylic polymer containing a hydrocarbon group-containing (meth)acrylate and a hydroxyl group-containing monomer optionally having an alkoxy group as a monomer component. With the dicing die-bonding film of the present invention having such a configuration, an adhesive layer having a surface with a water contact angle of 110° or less and an arithmetic mean surface roughness Ra of 1.0 μm or less can be easily designed.

It is preferable that the said adhesive layer contains a polyisocyanate compound as a crosslinking agent. With the dicing die-bonding film of the present invention having such a configuration, an adhesive layer having a surface with a water contact angle of 110° or less and an arithmetic mean surface roughness Ra of 1.0 μm or less can be easily designed and easily designed A radiation-curable adhesive layer in a state in which the adhesive layer exhibits relatively high adhesive force and a state in which it exhibits relatively low adhesive force can be distinguished.

effect of invention

The dicing die-bonding film of the present invention is less likely to float between the adhesive layer and the pressure-sensitive adhesive layer in the expansion step of using the dicing die-bonding film to obtain a semiconductor chip with an adhesive layer. In particular, even in the case of using a semiconductor chip in which the circuit layers are multi-layered, floating is less likely to occur.

Description of drawings

FIG. 1 is a schematic cross-sectional view showing one embodiment of the dicing die-bonding film of the present invention.

FIG. 2 shows a part of steps in a method of manufacturing a semiconductor device using the dicing die-bonding film shown in FIG. 1 .

FIG. 3 shows a subsequent process to the process shown in FIG. 2 .

FIG. 4 shows a subsequent process to the process shown in FIG. 3 .

FIG. 5 shows a subsequent process to the process shown in FIG. 4 .

FIG. 6 shows a subsequent process to the process shown in FIG. 5 .

FIG. 7 shows a subsequent process to the process shown in FIG. 6 .

FIG. 8 shows some steps in a modification of the method for manufacturing a semiconductor device using the dicing die-bonding film shown in FIG. 1 .

FIG. 9 shows some steps in a modification of the method for manufacturing a semiconductor device using the dicing die-bonding film shown in FIG. 1 .

FIG. 10 shows some steps in a modification of the method for manufacturing a semiconductor device using the dicing die-bonding film shown in FIG. 1 .

FIG. 11 shows some steps in a modification of the method for manufacturing a semiconductor device using the dicing die-bonding film shown in FIG. 1 .

Description of reference numerals

1 Cut the die-bonding film

10 cutting tape

11 Substrate

12 Adhesive Layer

20, 21 Adhesive layer

W, 30A, 30C semiconductor wafers

30B Semiconductor Wafer Divider

30a Split slot

30b Modified region

31 Semiconductor chips

Detailed ways

[Dicing Die Bonding Film]

The dicing die-bonding film of the present invention includes: a dicing tape having a laminated structure including a base material and an adhesive layer; and an adhesive layer that is releasably adhered to the above-mentioned adhesive in the above-mentioned dicing tape Floor. Hereinafter, one Embodiment of the dicing die-bonding film of this invention is demonstrated.

FIG. 1 is a schematic cross-sectional view showing one embodiment of the dicing die-bonding film of the present invention. As shown in FIG. 1 , the dicing die-bonding film 1 includes: a dicing tape 10; An expansion process in the process of a semiconductor chip with an adhesive layer.

The dicing die-bonding film 1 has a disc shape whose size corresponds to a semiconductor wafer to be processed in a manufacturing process of a semiconductor device. The diameter of the dicing die-bonding film 1 is, for example, in the range of 345 to 380 mm (for 12-inch wafers), in the range of 245 to 280 mm (for 8-inch wafers), and in the range of 195 to 230 mm (for 6-inch wafers). compatible type), or within the range of 495 to 530 mm (18-inch wafer compatible type).

The dicing tape 10 in the dicing die-bonding film 1 has a laminated structure including a base material 11 and an adhesive layer 12 . The surface 12a of the adhesive layer 12 in the dicing die-bonding film 1 on the side to which the adhesive layer 20 is in close contact has a water contact angle of 110° or less and an arithmetic mean surface roughness Ra of 1.0 μm or less.

(substrate)

The base material in the dicing tape is an element that functions as a support in the dicing tape and the dicing die-bonding film. As a base material, a plastic base material (especially a plastic film) is mentioned, for example. The above-mentioned base material may be a single layer, or may be a laminate of the same kind or different kinds of base materials.

Examples of the resin constituting the plastic base material include low density polyethylene, linear low density polyethylene, medium density polyethylene, high density polyethylene, ultra-low density polyethylene, random copolymer polypropylene, block Copolymer polypropylene, homopolypropylene, polybutene, polymethylpentene, ethylene-vinyl acetate copolymer (EVA), ionomer, ethylene-(meth)acrylic acid copolymer, ethylene-(meth) Acrylate (random, alternating) copolymer, ethylene-butene copolymer, ethylene-hexene copolymer and other polyolefin resins; polyurethane; polyethylene terephthalate (PET), polyethylene naphthalene Polyester such as diethanol dicarboxylate and polybutylene terephthalate (PBT); polycarbonate; polyimide; polyether ether ketone; polyether imide; aramid, wholly aromatic Polyamide such as polyamide; polyphenylene sulfide; fluororesin; polyvinyl chloride; polyvinylidene chloride; cellulose resin; silicone resin, etc. The substrate preferably contains ethylene-vinyl acetate copolymer as a main component from the viewpoints of ensuring good heat shrinkability of the substrate and making it easy to maintain the distance between chips by the local thermal shrinkage of the dicing tape or the substrate in the room temperature expansion process described later. Element.

In addition, the main component of a base material is a component which occupies the largest mass ratio among structural components. Only one kind of the above-mentioned resins may be used, or two or more kinds thereof may be used. When the pressure-sensitive adhesive layer is a radiation-curable pressure-sensitive adhesive layer as described later, the base material preferably has radiation permeability.

When the base material is a plastic film, the plastic film may not be oriented or may be oriented in at least one direction (uniaxial direction, biaxial direction, etc.). When oriented in at least one direction, the plastic film is capable of heat shrinking in the at least one direction. When it has thermal shrinkage, the outer peripheral portion of the semiconductor wafer of the dicing tape can be thermally shrunk, and thus the singulated semiconductor chips with the adhesive layer can be fixed in a state where the gap between the semiconductor chips with the adhesive layer after being separated into pieces is widened. Pickup of semiconductor chips can be easily performed. In order to impart isotropic heat shrinkability to the base material and the dicing tape, the base material is preferably a biaxially oriented film. It should be noted that the plastic film oriented in at least one direction can be obtained by stretching (uniaxial stretching, biaxial stretching, etc.) of an unstretched plastic film in the at least one direction.

The thermal shrinkage ratio of the base material and the dicing tape in the heat treatment test performed under the conditions of a heating temperature of 100° C. and a heating time of 60 seconds is preferably 1 to 30%, more preferably 2 to 25%, and still more preferably 3 to 20%. %, particularly preferably 5 to 20%. It is preferable that the said thermal shrinkage rate is the thermal shrinkage rate of at least one of the MD direction and the TD direction.

The adhesive layer side surface of the base material may be subjected to, for example, corona discharge treatment, plasma treatment, sanding treatment, or ozone exposure treatment for the purpose of improving adhesion to the adhesive layer, retention, etc. , flame exposure treatment, high voltage electric shock exposure treatment, ionizing radiation treatment and other physical treatments; chromic acid treatment and other chemical treatments; coating agent (primer) based easy bonding treatment and other surface treatments. In addition, in order to impart antistatic capability, a conductive vapor deposition layer containing metals, alloys, oxides thereof, and the like may be provided on the surface of the substrate. It is preferable that the surface treatment for improving adhesiveness is given to the whole surface of the adhesive layer side of a base material.

From the viewpoint of securing the strength of the base material to function as a support for the dicing tape and the dicing die-bonding film, the thickness of the base material is preferably 40 μm or more, more preferably 50 μm or more, still more preferably 55 μm or more, and particularly preferably 60 μm or more. In addition, from the viewpoint of realizing moderate flexibility of the dicing tape and the dicing die-bonding film, the thickness of the base material is preferably 200 μm or less, more preferably 180 μm or less, and further preferably 150 μm or less.

(adhesive layer)

The pressure-sensitive adhesive layer in the dicing die-bonding film of the present invention has a water contact angle of 110° or less and an arithmetic mean surface roughness Ra of 1.0 μm or less on the surface on the side of the pressure-sensitive adhesive layer in close contact as described above. Since the dicing die-bonding film of the present invention has such a configuration, the adhesiveness between the adhesive layer and the adhesive layer is moderately excellent, and the occurrence of peeling between the adhesive layer and the adhesive layer in the expansion step and subsequent steps can be suppressed (floating).

The arithmetic mean surface roughness (Ra) of the surface (surface 12a) of the adhesive layer on the adhesive layer adhesion side is 1.0 μm or less, preferably 0.5 μm or less, and more preferably 0.3 μm or less. The said Ra can be obtained by measuring the adhesive layer surface of the part in which the adhesive bond layer was not laminated|stacked in the dicing die-bonding film of this invention. The above-mentioned arithmetic mean surface roughness can be measured based on JIS B 0601.

The water contact angle of the surface (surface 12a) of the adhesive layer on the adhesive layer adhesion side is 110° or less, preferably 108° or less, and more preferably 105° or less. The said water contact angle can be obtained by measuring the adhesive layer surface of the part in which the adhesive bond layer was not laminated|stacked in the dicing die-bonding film of this invention.

Moreover, the said water contact angle is 80 degrees or more, for example, Preferably it is 84 degrees or more, More preferably, it is 88 degrees or more. When the said water contact is 80 degrees or more, fusion of an adhesive bond layer and an adhesive bond layer can be suppressed, and when an adhesive bond layer and an adhesive bond layer are peeled intentionally, the inconvenience of not peeling becomes less likely to occur.

The value of the polar component of the surface free energy obtained by the Kaelble Uy equation for the contact angle with water and the contact angle of diiodomethane on the surface (surface 12a) of the adhesive layer on the adhesion side of the adhesive layer is preferably: 0.10 or more, more preferably 0.20 or more, still more preferably 0.40 or more. When the value of the above-mentioned polar component is 0.10 or more, the difference between the polar component and the surface of the adhesive layer becomes small, and the affinity between the surface of the adhesive layer and the surface of the adhesive layer is improved, so that the The adhesiveness of the adhesive bond layer becomes more appropriate, and the occurrence of peeling (floating) between the adhesive bond layer and the adhesive bond layer in the expansion step and subsequent steps can be further suppressed. The value of the above-mentioned polar component can be obtained by using the following formula (2) and the following formula (3) as γs ^p in the following formula (1) used to obtain the surface free energy.

γs=γs ^d +γs ^p (1)

γw(1+cosθw)=2(γs ^d γw ^d ) ^1/2 +2(γs ^p γw ^p ) ^1/2 (2)

γi(1+cosθi)=2(γs ^d γi ^d ) ^1/2 +2(γs ^p γi ^p ) ^1/2 (3)

In the above formulae (1) to (3), γs represents the surface free energy of the adhesive layer, γs ^d represents the dispersion component of the surface free energy of the adhesive layer, and γs ^p represents the polar of the surface free energy of the adhesive layer. Sex components, γw represents 72.8mJ/m ² , γw ^d represents 21.8mJ/m ² , γw ^p represents 51.0mJ/m ² , γi represents 50.8mJ/m ² , γi ^d represents 48.5mJ/m ² , and ^γip represents 2.3 mJ/m ² , θw represents the water contact angle of the adhesive layer surface, and θi represents the diiodomethane contact angle of the adhesive layer surface. γw, γw ^d , γw ^p , γi, ^γid , and ^γip are known literature values.

The pressure-sensitive adhesive layer of the dicing tape is preferably a pressure-sensitive adhesive layer (acrylic pressure-sensitive adhesive layer) containing an acrylic polymer as a base polymer. The said acrylic polymer is a polymer which contains the structural unit derived from an acrylic monomer (monomer component which has a (meth)acryloyl group in a molecule|numerator) as a structural unit of a polymer.

It is preferable that the said acrylic polymer is a polymer which has the largest content of the structural unit derived from a (meth)acrylate by mass ratio. In addition, only 1 type of acrylic polymer may be used, and 2 or more types may be used for it. In addition, in this specification, "(meth)acrylic acid" means "acrylic acid" and/or "methacrylic acid" (either or both of "acrylic acid" and "methacrylic acid"), and the same applies to others.

As said (meth)acrylate, the hydrocarbon group containing (meth)acrylate which may have an alkoxy group is mentioned, for example. Examples of the hydrocarbon group-containing (meth)acrylate include alkyl (meth)acrylate, cycloalkyl (meth)acrylate, aryl (meth)acrylate, and the like.

Examples of the above-mentioned alkyl (meth)acrylate include methyl, ethyl, propyl, isopropyl, butyl, isobutyl, sec-butyl, tert-butyl, pentyl (meth)acrylic acid esters, isoamyl esters, hexyl esters, heptyl esters, octyl esters, 2-ethylhexyl esters, isooctyl esters, nonyl esters, decyl esters, isodecyl esters, undecyl esters, dodecyl esters (lauryl esters ), tridecyl ester, tetradecyl ester, hexadecyl ester, octadecyl ester, eicosyl ester, etc.

As said (meth)acrylic-acid cycloalkyl ester, the cyclopentyl ester of (meth)acrylic acid, a cyclohexyl ester, etc. are mentioned, for example. As said (meth)acrylic-acid aryl ester, the phenyl ester and benzyl ester of (meth)acrylic acid are mentioned, for example.

Examples of the hydrocarbon group-containing (meth)acrylate having an alkoxy group include those obtained by substituting one or more hydrogen atoms in the hydrocarbon group in the above-mentioned hydrocarbon group-containing (meth)acrylate with an alkoxy group, and examples thereof include 2-methoxymethyl ester, 2-methoxyethyl ester, 2-methoxybutyl ester of (meth)acrylic acid, etc.

Only one type of hydrocarbon group-containing (meth)acrylate which may have an alkoxy group may be used, or two or more types may be used.

Regarding the above-mentioned hydrocarbon group-containing (meth)acrylate optionally having an alkoxy group, in one embodiment, the total number of carbon atoms in the ester moiety (in the case of having an alkoxy group, the total number of carbon atoms in the alkoxy group is included) The total number) is preferably 6-10. Particularly preferred is a hydrocarbon group-containing (meth)acrylate in which the total number of carbon atoms in the hydrocarbon group is 6 to 10. In this case, it is possible to more easily achieve both the suppression of floating between the pressure-sensitive adhesive layer and the pressure-sensitive adhesive layer after the expansion process and the good pick-up property in the pickup process.

In addition, about the above-mentioned hydrocarbon group-containing (meth)acrylate which may have an alkoxy group, in yet another embodiment, the total number of carbon atoms in the ester moiety (in the case of having an alkoxy group, an alkoxy group is included) The total number of carbon numbers in the oxy group) is preferably 2-4. Particularly preferred is a hydrocarbon group-containing (meth)acrylate in which the total number of carbon atoms in the hydrocarbon group is 2 to 4. In this case, since the above-mentioned hydrocarbon group-containing (meth)acrylate which may have an alkoxy group has a relatively high polarity, even if the ratio of the polar group-containing monomer is relatively small, the pressure-sensitive adhesive layer can be easily formed. The water contact angle of the surface is 110° or less.

In order for the pressure-sensitive adhesive layer to appropriately exhibit basic properties such as adhesiveness based on the hydrocarbon group-containing (meth)acrylate which optionally has an alkoxy group, optional among all monomer components for forming the acrylic polymer is required. The ratio of the hydrocarbon group-containing (meth)acrylate having an alkoxy group is preferably 20 mol % or more, and more preferably 30 mol % or more. More preferably, it is 40 mol% or more.

In addition, in this specification, the said monomer component does not contain the compound which has a radiation polymerizable group in the stage of incorporating into the polymer before irradiating radiation to the pressure-sensitive adhesive layer (for example, the following-mentioned compound with a second functional group and a radiation polymerizable carbon-carbon double bond).

The above-mentioned acrylic polymer may contain, for the purpose of modification of cohesion, heat resistance, etc., a monomer component derived from other monomer components that can be copolymerized with the above-mentioned hydrocarbon group-containing (meth)acrylate which optionally has an alkoxy group. constituent unit. Examples of the above-mentioned other monomer components include carboxyl group-containing monomers, acid anhydride-containing monomers, hydroxyl group-containing monomers, glycidyl group-containing monomers, sulfonic acid group-containing monomers, phosphoric acid group-containing monomers, nitrogen atom-containing monomers such as monomers containing polar groups, etc.

Examples of the carboxyl group-containing monomer include acrylic acid, methacrylic acid, carboxyethyl (meth)acrylate, carboxypentyl (meth)acrylate, itaconic acid, maleic acid, fumaric acid, crotonic acid, and the like. .

As said acid anhydride monomer, maleic anhydride, itaconic anhydride, etc. are mentioned, for example. Examples of the above-mentioned hydroxyl group-containing monomer include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, and 6 (meth)acrylate. -Hydroxyhexyl, 8-hydroxyoctyl (meth)acrylate, 10-hydroxydecyl (meth)acrylate, 12-hydroxylauryl (meth)acrylate, (4-hydroxymethyl) (meth)acrylate Hexyl) methyl ester, etc.

As said glycidyl group-containing monomer, glycidyl (meth)acrylate, methyl glycidyl (meth)acrylate, etc. are mentioned, for example.

Examples of the sulfonic acid group-containing monomer include styrenesulfonic acid, allylsulfonic acid, 2-(meth)acrylamide-2-methylpropanesulfonic acid, and (meth)acrylamidepropanesulfonic acid , (meth) sulfopropyl acrylate, (meth) acryloyloxynaphthalene sulfonic acid, etc.

As said phosphoric acid group containing monomer, 2-hydroxyethyl acryloyl phosphate etc. are mentioned, for example.

Examples of the nitrogen atom-containing monomers include morpholine group-containing monomers such as (meth)acryloyl morpholine, cyano group-containing monomers such as (meth)acrylonitrile, and amides such as (meth)acrylamide. base monomers, etc.

Among these other monomer components, hydroxyl group-containing monomers and nitrogen atom-containing monomers (especially morpholine group-containing monomers) are preferred, and 2-hydroxyethyl (meth)acrylate ((meth)acrylic acid) is more preferred 2-hydroxyethyl ester), (meth)acryloyl morpholine. That is, it is preferable that the said acrylic polymer contains the structural unit derived from 2-hydroxyethyl (meth)acrylate and/or the structural unit derived from (meth)acryloyl morpholine.

Only one type of the above-mentioned other monomer components may be used, or two or more types may be used.

In order for the pressure-sensitive adhesive layer to appropriately exhibit basic properties such as adhesiveness based on the hydrocarbon group-containing (meth)acrylate which optionally has an alkoxy group, the above-mentioned containing among all the monomer components used to form the acrylic polymer The total ratio of the polar group monomers is preferably 60 mol % or less, and more preferably 50 mol % or less. In addition, from the viewpoint that the water contact angle of the pressure-sensitive adhesive layer surface can be easily designed to be 110° or less, the total ratio of the polar group-containing monomers is preferably 10 mol % or more, and more preferably 15 mol % or more. .

In order for the pressure-sensitive adhesive layer to appropriately exhibit basic properties such as adhesiveness based on the hydrocarbon group-containing (meth)acrylate optionally having an alkoxy group, among all the monomer components used to form the acrylic polymer, the The ratio of the structural unit of the hydroxyl group-containing monomer is preferably 5 mol % or more, and more preferably 10 mol % or more. Moreover, the said ratio is 80 mol% or less, for example, 70 mol% or less, 60 mol% or less may be sufficient as it.

When the above-mentioned nitrogen atom-containing monomer is used as a monomer component for forming an acrylic polymer, it is used for forming an acrylic polymer from the viewpoint that the water contact angle of the pressure-sensitive adhesive layer surface can be easily designed to be 110° or less The proportion of the structural unit derived from the nitrogen atom-containing monomer in the total monomer components of the product is preferably 3 mol % or more, and more preferably 5 mol % or more. Moreover, the said ratio is 50 mol% or less, for example, 30 mol% or less, 20 mol% or less may be sufficient as it.

The said acrylic polymer may contain the structural unit derived from the polyfunctional monomer which can be copolymerized with the monomer component which forms an acrylic polymer in order to form a crosslinked structure in the polymer backbone. As said polyfunctional monomer, for example, hexanediol di(meth)acrylate, (poly)ethylene glycol di(meth)acrylate, (poly)propylene glycol di(meth)acrylate, new Pentylene glycol di(meth)acrylate, pentaerythritol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate Esters, epoxy (meth)acrylates (eg polyglycidyl(meth)acrylate), polyester (meth)acrylates, urethane (meth)acrylates, etc. have (methyl) in the molecule ) monomers of acryloyl and other reactive functional groups, etc.

Only one type of the above-mentioned polyfunctional monomer may be used, or two or more types may be used. In order for the pressure-sensitive adhesive layer to appropriately exhibit basic properties such as adhesiveness based on the hydrocarbon group-containing (meth)acrylate optionally having an alkoxy group, many of the above-mentioned monomer components used for forming the acrylic polymer are required. The ratio of the functional monomer is preferably 40 mol % or less, and more preferably 30 mol % or less.

The acrylic polymer preferably contains a structural unit derived from a monomer having a first functional group (for example, the above-mentioned polar group-containing monomer), as well as a second functional group having a reactable with the first functional group and The structural part of the compound of the radiation polymerizable functional group. When an acrylic polymer has such a structure, the design of the radiation curable adhesive mentioned later becomes easy.

Examples of combinations of the first functional group and the second functional group include a carboxyl group and an epoxy group, an epoxy group and a carboxyl group, a carboxyl group and an aziridine group, an aziridine group and a carboxyl group, a hydroxyl group and an isocyanate group, and an isocyanate group. with hydroxyl, etc. Among these, the combination of a hydroxyl group and an isocyanate group, and the combination of an isocyanate group and a hydroxyl group are preferable from a viewpoint of the easiness of tracing a reaction. Among them, it is technically difficult to prepare a polymer having a highly reactive isocyanate group, but from the viewpoint of ease of preparation and availability of an acrylic polymer having a hydroxyl group, the first functional group is preferably a hydroxyl group and the second functional group is preferably a hydroxyl group. It is a combination of isocyanate groups.

In particular, the acrylic polymer preferably contains a compound derived from a radiation polymerizable carbon-carbon double bond (especially a (meth)acryloyl group) and an isocyanate group in addition to a structural unit derived from a hydroxyl group-containing monomer the structural department.

Examples of compounds having radiation polymerizable carbon-carbon double bonds and isocyanate groups include methacryloyl isocyanate, 2-acryloyloxyethyl isocyanate, 2-methacryloyloxyethyl isocyanate, meta- Isopropenyl-α,α-dimethylbenzyl isocyanate, etc. Among them, 2-acryloyloxyethyl isocyanate and 2-methacryloyloxyethyl isocyanate are preferable. In addition, examples of the acrylic polymer having a hydroxyl group include those derived from the above-mentioned hydroxyl group-containing monomer, 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, and diethylene glycol monovinyl ether. An acrylic polymer that is a constituent unit of an ether-based compound.

The molar ratio [the former/the latter] of the structural unit derived from the monomer having the first functional group and the compound having the second functional group and the radiation polymerizable functional group is preferably 0.95 or more, more preferably 1.00 or more, still more preferably 1.05 or more, particularly preferably 1.10 or more. When the molar ratio is 0.95 or more, the bonding between the first functional group (for example, hydroxyl group) and the second functional group (for example, isocyanate group) can be sufficiently promoted, but the unreacted first functional group in the acrylic polymer in the pressure-sensitive adhesive layer is presumed to be unreacted. The functional group remains to a certain extent, the peeling force between the adhesive layer and the substrate is further improved, and the adhesive layer is less likely to be broken during expansion. The above-mentioned molar ratio is, for example, 10.00 or less, and may be 5.00 or less, 3.00 or less, 2.00 or less, 1.50 or less, or 1.30 or less.

In particular, the molar ratio of the hydroxyl group-containing monomer to 2-methacryloyloxyethyl isocyanate [hydroxyl group-containing monomer/2-methacryloyloxyethyl isocyanate] is preferably within the above range.

The acrylic polymer can be obtained by subjecting one or more monomer components including an acrylic monomer to polymerization. As a polymerization method, solution polymerization, emulsion polymerization, bulk polymerization, suspension polymerization, etc. are mentioned.

The adhesive layer or the adhesive forming the adhesive layer may contain a crosslinking agent. For example, when an acrylic polymer is used as a base polymer, the acrylic polymer can be crosslinked, and the low molecular weight substances in the adhesive layer can be further reduced. In addition, the number average molecular weight of the acrylic polymer can be increased.

As said crosslinking agent, a polyisocyanate compound, an epoxy compound, a polyol compound (polyphenol type compound etc.), an aziridine compound, a melamine compound etc. are mentioned, for example. Among them, polyisocyanate compounds are preferred. In this case, a pressure-sensitive adhesive layer having a surface with a water contact angle of 110° or less and an arithmetic mean surface roughness Ra of 1.0 μm or less can be easily designed, and it is possible to easily design a pressure-sensitive adhesive layer capable of distinguishing the use of the pressure-sensitive adhesive layer to exhibit relatively high The state of the adhesive force of the radiation-curable adhesive layer and the state of showing a relatively low adhesive force. When a crosslinking agent is used, the amount thereof is preferably about 5 parts by mass or less with respect to 100 parts by mass of the base polymer, and more preferably 0.1 to 5 parts by mass.

The mass average molecular weight of the acrylic polymer (after crosslinking when a crosslinking agent is used) is preferably 300,000 or more (for example, 300,000 to 1.4 million), and more preferably 350,000 or more. When the mass average molecular weight is 300,000 or more, there is a tendency that there are few low-molecular-weight substances in the adhesive layer, and contamination to the adhesive layer, the semiconductor wafer, and the like can be further suppressed.

The adhesive layer may be an adhesive layer (adhesive force-reducing type adhesive layer) that can intentionally reduce the adhesive force by an action from the outside during the use of the dicing die-bonding film, or it may be an adhesive layer during the dicing of the die-bonding film. An adhesive layer (adhesive force non-decreasing type adhesive layer) in which the adhesive force is hardly or not reduced by external action during the use of the die-bonding film can be singulated by using the dicing die-bonding film. The method and conditions of the singulation of the semiconductor wafer are appropriately selected.

When the pressure-sensitive adhesive layer is a pressure-reducing type pressure-sensitive adhesive layer, it is possible to distinguish between a state in which the pressure-sensitive adhesive layer exhibits relatively high adhesion during the manufacturing process and use of the dicing die-bonding film. A state of relatively low adhesion. For example, in the production process of the dicing die-bonding film, when the adhesive layer is attached to the adhesive layer of the dicing tape, when the dicing die-bonding film is used in the dicing process, the adhesive layer exhibits relatively high adhesion The state of the force can suppress and prevent the adherend such as the adhesive layer from rising from the adhesive layer. On the other hand, the semiconductor with the adhesive layer is picked up from the dicing tape for dicing the die-bonding film. In the pick-up process of a chip, it can pick up easily by reducing the adhesive force of an adhesive layer.

As an adhesive which forms such an adhesive force-decreasing-type adhesive layer, a radiation curable adhesive, a heating foaming adhesive, etc. are mentioned, for example. As the pressure-sensitive adhesive for forming the pressure-sensitive adhesive layer, only one type of pressure-sensitive adhesive may be used, or two or more types of pressure-sensitive adhesives may be used.

As the above-mentioned radiation-curable adhesive, for example, a type of adhesive that can be cured by irradiation with electron beams, ultraviolet rays, alpha rays, beta rays, gamma rays, or X rays can be used, and it is particularly preferable to use ultraviolet rays. Cured type of adhesive (UV-curable adhesive).

Examples of the radiation-curable adhesive include an additive-type radiation-curable adhesive containing a base polymer such as the above-mentioned acrylic polymer and a carbon-carbon double bond having radiation polymerizability. Radiation polymerizable monomer components and oligomer components with equal functional groups.

Examples of the radiation polymerizable monomer component include urethane (meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetrakis (meth)acrylate, dipentaerythritol monohydroxypenta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, 1,4-butanediol di(meth)acrylate, and the like.

Examples of the radiation polymerizable oligomer component include various oligomers such as urethane-based, polyether-based, polyester-based, polycarbonate-based, and polybutadiene-based oligomers, and the molecular weight is preferred. It is about 100 to 30,000.

The content of the radiation-curable monomer component and oligomer component in the radiation-curable pressure-sensitive adhesive forming the pressure-sensitive adhesive layer is, for example, 5 to 500 parts by mass, preferably 5 to 500 parts by mass relative to 100 parts by mass of the base polymer. About 40 to 150 parts by mass.

In addition, as an additive type radiation-curable adhesive, for example, those disclosed in Japanese Unexamined Patent Publication No. Sho 60-196956 can be used.

Examples of the above radiation-curable adhesive include intrinsically-type radiation-curable adhesives containing a radiation-polymerizable adhesive in the side chain of the polymer, in the main chain of the polymer, and at the end of the main chain of the polymer. Base polymer for functional groups such as carbon-carbon double bonds. Use of such an intrinsic radiation-curable adhesive tends to suppress undesired changes in adhesive properties over time due to migration of low-molecular-weight components in the formed adhesive layer.

As the base polymer contained in the above-mentioned intrinsic radiation-curable adhesive, an acrylic polymer is preferable. As a method for introducing a radiation polymerizable carbon-carbon double bond into an acrylic polymer, for example, a method in which acrylic acid is obtained by polymerizing (copolymerizing) a raw material monomer containing the monomer component having the first functional group described above may be mentioned. After the polymer, a compound having the above-mentioned second functional group and a radiation polymerizable carbon-carbon double bond is subjected to a condensation reaction or addition to the acrylic polymer while maintaining the radiation polymerizability of the carbon-carbon double bond reaction.

It is preferable that the said radiation curable adhesive contains a photoinitiator. Examples of the above-mentioned photopolymerization initiator include α-ketoalcohol-based compounds, acetophenone-based compounds, benzoin ether-based compounds, ketal-based compounds, aromatic sulfonyl chloride-based compounds, photoactive oxime-based compounds, Benzophenone compounds, thioxanthone compounds, camphorquinone, halogenated ketones, acyl phosphine oxides, acyl phosphonates, etc.

Examples of the above-mentioned α-ketoalcohol compounds include 4-(2-hydroxyethoxy)phenyl(2-hydroxy-2-propyl)ketone, α-hydroxy-α,α'-dimethylbenzene Ethanone, 2-methyl-2-hydroxypropiophenone, 1-hydroxycyclohexyl phenyl ketone, etc.

As said acetophenone compound, methoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxyacetophenone, 2- Methyl-1-[4-(methylthio)-phenyl]-2-morpholinopropan-1-one, etc.

As said benzoin ether type compound, benzoin ethyl ether, benzoin isopropyl ether, anisin methyl ether, etc. are mentioned, for example. As said ketal type compound, benzil dimethyl ketal etc. are mentioned, for example.

As said aromatic sulfonyl chloride type compound, 2-naphthalenesulfonyl chloride etc. are mentioned, for example. As said photoactive oxime type compound, 1-phenyl-1, 2- propanedione-2-(O-ethoxycarbonyl) oxime etc. are mentioned, for example.

As said benzophenone type compound, benzophenone, benzoylbenzoic acid, 3,3'-dimethyl-4-methoxybenzophenone etc. are mentioned, for example.

As said thioxanthone compound, for example: thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, 2,4-dimethylthioxanthone, isopropylthioxanthone, 2 , 4-dichlorothioxanthone, 2,4-diethylthioxanthone, 2,4-diisopropylthioxanthone, etc.

The content of the photopolymerization initiator in the radiation-curable adhesive is, for example, 0.05 to 20 parts by mass with respect to 100 parts by mass of the base polymer.

The above-mentioned heating-foaming-type adhesive is an adhesive containing a component (foaming agent, heat-expandable microspheres, etc.) that foams and expands by heating.

As said foaming agent, various inorganic foaming agents and organic foaming agents are mentioned. As said inorganic foaming agent, ammonium carbonate, ammonium hydrogencarbonate, sodium hydrogencarbonate, ammonium nitrite, sodium borohydride, azides, etc. are mentioned, for example. Examples of the organic foaming agent include: chlorofluoroalkanes such as trichloromonofluoromethane and dichloromonofluoromethane; Compounds; hydrazine compounds such as p-toluenesulfonyl hydrazide, diphenylsulfone-3,3'-disulfonylhydrazide, 4,4'-oxobisbenzenesulfonylhydrazide, allylbissulfonylhydrazide; p- Semicarbazide compounds such as tosyl semicarbazide and 4,4'-oxobis(benzenesulfonyl semicarbazide); triazole compounds such as 5-morpholino-1,2,3,4-thitriazole; N-nitroso compounds such as N,N'-dinitrosopentamethylenetetramine, N,N'-dimethyl-N,N'-dinitrosoterephthalamide, etc.

As said heat-expandable microsphere, the microsphere comprised in the shell which encloses the substance which is easy to vaporize and expand|swell by heating is mentioned, for example. Examples of the above-mentioned substances that are easily vaporized and expanded by heating include isobutane, propane, and pentane. Heat-expandable microspheres can be produced by enclosing a substance that is easily vaporized and expanded by heating in a shell-forming substance by a coacervation method, an interfacial polymerization method, or the like. As the above-mentioned shell-forming substance, a substance that exhibits thermal fusion properties and a substance that can be ruptured by thermal expansion of an encapsulated substance can be used. As such a substance, a vinylidene chloride-acrylonitrile copolymer, polyvinyl alcohol, polyvinyl butyral, polymethyl methacrylate, polyacrylonitrile, polyvinylidene chloride, polysulfone, etc. are mentioned, for example.

As said adhesive force non-decreasing-type adhesive layer, a pressure-sensitive adhesive layer is mentioned, for example. In addition, the pressure-sensitive pressure-sensitive adhesive layer includes a pressure-sensitive adhesive layer of a form formed of the radiation-curable pressure-sensitive adhesive described in the adhesive force-reducing type pressure-sensitive adhesive layer by irradiating radiation in advance. The adhesive layer cured but still had some adhesion. As an adhesive for forming the adhesive force non-decreasing type adhesive layer, one type of adhesive may be used, or two or more types of adhesive may be used.

In addition, the whole adhesive layer may be an adhesive force non-decreasing type adhesive layer, or a part may be an adhesive force non-adhesive force non-decreasing type adhesive layer. For example, when the pressure-sensitive adhesive layer has a single-layer structure, the entire pressure-sensitive adhesive layer may be the pressure-sensitive adhesive layer without reducing the adhesive force, or a predetermined portion (eg, a ring frame) in the pressure-sensitive adhesive layer may be used. The area on the outside of the central area of the pasting target area) is the non-adhesion-reducing type adhesive layer, and other parts (for example, the central area of the pasting target area of the semiconductor wafer) are the adhesive force-reducing type adhesive layer. agent layer.

When the pressure-sensitive adhesive layer has a laminated structure, all of the pressure-sensitive adhesive layers in the laminated structure may be non-adhesive pressure-sensitive adhesive layers, or a part of the pressure-sensitive adhesive layers in the laminated structure may be the pressure-sensitive adhesive layer. Non-reduced adhesive layer.

A pressure-sensitive adhesive layer in a form in which a radiation-curable pressure-sensitive adhesive layer (a radiation-irradiated radiation-curable pressure-sensitive adhesive layer) is previously cured by irradiation with radiation (radiation-irradiated Curable pressure-sensitive adhesive layer) Although the adhesive force is reduced by irradiation with radiation, the adhesiveness due to the contained polymer component is exhibited, and the pressure-sensitive adhesive layer of the dicing tape can be exerted in the dicing process and the like. Minimal adhesion.

In the case of using a radiation-curable adhesive layer irradiated with radiation, the entire adhesive layer may be a radiation-curable adhesive layer irradiated with radiation in the surface expansion direction of the adhesive layer, A part of the pressure-sensitive adhesive layer may be a radiation-curable pressure-sensitive adhesive layer to which radiation has been irradiated, and the other part may be a radiation-curable pressure-sensitive adhesive layer not irradiated with radiation.

In addition, in this specification, "radiation-curable adhesive layer" refers to an adhesive layer formed of a radiation-curable adhesive, including radiation-curable radiation-irradiated non-radiation-curable adhesives Both the adhesive layer and the radiation-curable adhesive layer after the adhesive layer is cured by radiation irradiation.

As the pressure-sensitive pressure-sensitive pressure-sensitive pressure-sensitive pressure-sensitive pressure-sensitive pressure-sensitive pressure-sensitive adhesive layer, known or conventional pressure-sensitive pressure-sensitive pressure-sensitive pressure-sensitive pressure-sensitive adhesive can be used, acrylic pressure-sensitive adhesives based on acrylic polymers, rubber-based adhesives can be preferably used adhesive. When the adhesive layer contains an acrylic polymer as a pressure-sensitive adhesive, the acrylic polymer is preferably a polymer containing a constitutional unit derived from a (meth)acrylate as the constitutional unit having the largest mass ratio. As said acrylic polymer, the acrylic polymer demonstrated as an acrylic polymer which can be contained in the said adhesive layer, for example can be employ|adopted.

The pressure-sensitive adhesive layer or the pressure-sensitive adhesive forming the pressure-sensitive adhesive layer may be compounded, in addition to the above components, known or conventionally used for adhesion, such as crosslinking accelerators, tackifiers, antioxidants, colorants (pigments, dyes, etc.). Additives for the mixture layer.

As said coloring agent, the compound which produces coloration by irradiation with radiation is mentioned, for example. When a compound that is colored by irradiation with radiation is contained, only the portion irradiated with radiation can be colored. The compound which is colored by irradiation with radiation is colorless or light-colored before irradiation with radiation, and becomes colored by irradiation with radiation, and examples thereof include leuco dyes and the like. The usage-amount of the said compound which produces coloring by irradiation with radiation is not specifically limited, It can select suitably.

The thickness of the adhesive layer is not particularly limited, and when the adhesive layer is an adhesive layer formed of a radiation-curable adhesive, the adhesive layer is obtained from the adhesive layer before and after radiation curing. From the viewpoint of the balance of the adhesive force, the thickness is preferably about 1 to 50 μm, more preferably 2 to 30 μm, and even more preferably 5 to 25 μm.

(adhesive layer)

The adhesive layer functions as a thermosetting adhesive for die bonding, and also functions as an adhesive for holding workpieces such as semiconductor wafers and frame members such as ring frames as necessary. An adhesive bond layer can be cut|disconnected by applying a tensile stress, and it can be used by cutting|disconnecting it by applying a tensile stress.

The adhesive layer and the adhesive constituting the adhesive layer may contain a thermosetting resin and, for example, a thermoplastic resin as a binder component, or may contain a thermoplastic resin having a thermosetting functional group capable of Bonding occurs by reaction with the curing agent. When the adhesive constituting the adhesive layer contains a thermoplastic resin having a thermosetting functional group, the adhesive does not necessarily contain a thermosetting resin (epoxy resin or the like). The adhesive bond layer may have a single-layer structure or a multilayer structure.

As said thermoplastic resin, natural rubber, butyl rubber, isoprene rubber, chloroprene rubber, ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer, ethylene-acrylic acid ester copolymer, polybutadiene can be mentioned, for example. Vinyl resin, polycarbonate resin, thermoplastic polyimide resin, polyamide resin such as 6-nylon and 6,6-nylon, phenoxy resin, acrylic resin, saturated polyester resin such as PET, PBT, polyamide amide imine resin, fluororesin, etc. Only one kind of the above-mentioned thermoplastic resins may be used, or two or more kinds thereof may be used. As the thermoplastic resin, an acrylic resin is preferable because there are few ionic impurities and high heat resistance, and it is easy to secure the bonding reliability by the adhesive bond layer.

It is preferable that the said acrylic resin contains the structural unit derived from a hydrocarbon group-containing (meth)acrylate as a structural unit with the largest mass ratio. As the hydrocarbon group-containing (meth)acrylate, for example, the hydrocarbon group-containing (meth)acrylic acid exemplified as the hydrocarbon group-containing (meth)acrylate of the acrylic polymer that can be contained in the pressure-sensitive adhesive layer may be mentioned. ester.

The said acrylic resin may contain the structural unit derived from the other monomer component which can be copolymerized with the hydrocarbon group-containing (meth)acrylate. Examples of the above-mentioned other monomer components include: carboxyl group-containing monomer; acid anhydride monomer; hydroxyl group-containing monomer; glycidyl group-containing monomer; sulfonic acid group-containing monomer; phosphoric acid group-containing monomer; acrylamide, acrylonitrile Functional group-containing monomers, etc.; various polyfunctional monomers, etc. Specifically, the monomer components exemplified as other monomer components constituting the acrylic polymer that can be contained in the pressure-sensitive adhesive layer can be used.

When the adhesive layer contains a thermoplastic resin and a thermosetting resin, examples of the thermosetting resin include epoxy resins, phenol resins, amino resins, unsaturated polyester resins, polyurethane resins, organic resins Silicone resin, thermosetting polyimide resin, etc. As for the said thermosetting resin, only 1 type may be used and 2 or more types may be used. The above-mentioned thermosetting resin is preferably an epoxy resin because there is a tendency that the content of ionic impurities, etc., which may cause corrosion of a semiconductor chip, which is an object of die bonding, is small. Moreover, as a hardening|curing agent of an epoxy resin, a phenol resin is preferable.

As said epoxy resin, for example, bisphenol A type, bisphenol F type, bisphenol S type, brominated bisphenol A type, hydrogenated bisphenol A type, bisphenol AF type, biphenyl type, naphthalene type, Fluorene type, phenol novolak type, o-cresol novolac type, trishydroxyphenylmethane type, tetraphenylolethane type, hydantoin type, triglycidyl isocyanurate type , Glycidylamine type epoxy resin, etc. Among them, novolak-type epoxy resins, biphenyl-type epoxy resins, trishydroxyphenylmethane-type epoxy resins, tetrakis(phenylhydroxy)ethyl Alkyl epoxy resin.

As a phenolic resin which can function as a hardening|curing agent of an epoxy resin, a novolac-type phenolic resin, a resol-type phenolic resin, polyoxystyrene, such as polyparaoxystyrene, etc. are mentioned, for example. As a novolak-type phenolic resin, a phenol novolak resin, a phenol aralkyl resin, a cresol novolak resin, a t-butylphenol novolak resin, a nonylphenol novolak resin, etc. are mentioned, for example. As for the said phenol resin, only 1 type may be used and 2 or more types may be used. Among them, phenol novolac resins and phenol aralkyl resins are preferred from the viewpoint of the tendency to improve the connection reliability of the adhesive when used as a curing agent for an epoxy resin as an adhesive for die bonding.

In the adhesive bond layer, from the viewpoint of sufficiently advancing the curing reaction of the epoxy resin and the phenolic resin, the hydroxyl group in the phenolic resin is preferably 0.5 to 2.0 equivalents relative to 1 equivalent of the epoxy group in the epoxy resin component. , More preferably, the phenolic resin is contained in an amount of 0.7 to 1.5 equivalents.

When the adhesive layer contains a thermosetting resin, the content ratio of the above-mentioned thermosetting resin is relative to the adhesive from the viewpoint of appropriately exhibiting the function as a thermosetting adhesive in the adhesive layer. The total mass of the layers is preferably 5 to 60 mass %, more preferably 10 to 50 mass %.

When the adhesive bond layer contains a thermoplastic resin having a thermosetting functional group, as the thermoplastic resin, for example, a thermosetting functional group-containing acrylic resin can be used. The acrylic resin in the thermosetting functional group-containing acrylic resin preferably contains a structural unit derived from a hydrocarbon group-containing (meth)acrylate as the structural unit having the largest mass ratio. As the hydrocarbon group-containing (meth)acrylate, for example, the hydrocarbon group-containing (meth)acrylate exemplified as the hydrocarbon group-containing (meth)acrylate that forms the acrylic polymer that can be contained in the pressure-sensitive adhesive layer may be mentioned. .

On the other hand, as a thermosetting functional group in a thermosetting functional group containing acrylic resin, a glycidyl group, a carboxyl group, a hydroxyl group, an isocyanate group etc. are mentioned, for example. Among them, a glycidyl group and a carboxyl group are preferable. That is, as the thermosetting functional group-containing acrylic resin, a glycidyl group-containing acrylic resin and a carboxyl group-containing acrylic resin are particularly preferable. In addition, it is preferable to contain a curing agent together with the thermosetting functional group-containing acrylic resin, and examples of the curing agent include a crosslinking agent that can be contained in the radiation-curable adhesive for forming the adhesive layer described above, for example. and the exemplified crosslinking agent. When the thermosetting functional group in the thermosetting functional group-containing acrylic resin is a glycidyl group, a polyphenol-based compound is preferably used as a curing agent, and for example, the various phenol resins described above can be used.

Regarding the adhesive layer before curing for die bonding, in order to achieve a certain degree of crosslinking, it is preferable to preliminarily mix, for example, the above-mentioned resin composition for adhesive layer formation that can be contained in the adhesive layer. The polyfunctional compound which reacts and couple|bonds the functional group etc. of the molecular chain terminal of resin as a crosslinking component. Such a configuration is preferable from the viewpoint of improving the adhesive properties of the adhesive bond layer at high temperatures and from the viewpoint of achieving improvement in heat resistance.

As said crosslinking component, a polyisocyanate compound is mentioned, for example. As a polyisocyanate compound, the adduct of toluene diisocyanate, diphenylmethane diisocyanate, p-phenylene diisocyanate, 1, 5- naphthalene diisocyanate, polyol, and diisocyanate, etc. are mentioned, for example. Moreover, as the said crosslinking component, other polyfunctional compounds, such as an epoxy resin, can be used in combination with a polyisocyanate compound.

The content of the cross-linking component in the resin composition for forming an adhesive layer is improved from the cohesive force of the formed adhesive layer with respect to 100 parts by mass of the resin having the above-mentioned functional group capable of reacting and bonding with the cross-linking component. From the viewpoint of this, it is preferably 0.05 parts by mass or more, and from the viewpoint of improving the adhesive strength of the adhesive layer to be formed, it is preferably 7 parts by mass or less.

The adhesive bond layer preferably contains a filler. Physical properties such as electrical conductivity, thermal conductivity, and elastic modulus of the adhesive bond layer can be adjusted by blending the filler with the adhesive bond layer. Examples of the filler include inorganic fillers and organic fillers, and inorganic fillers are particularly preferred.

Examples of inorganic fillers include aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, aluminum oxide, aluminum nitride, and aluminum borate whiskers. , boron nitride, crystalline silica, amorphous silica; and metal elements and alloys such as aluminum, gold, silver, copper, nickel, etc.; amorphous carbon black, graphite, etc. The filler may have various shapes such as spherical shape, needle shape, and flake shape. As said filler, only 1 type may be used and 2 or more types may be used.

The average particle diameter of the above-mentioned filler is preferably 0.005 to 10 μm, and more preferably 0.005 to 1 μm. When the said average particle diameter is 0.005 micrometer or more, the wettability and adhesiveness with respect to to-be-adhered bodies, such as a semiconductor wafer, are further improved. When the said average particle diameter is 10 micrometers or less, the effect of the filler added in order to provide each characteristic mentioned above can be fully exhibited, and heat resistance can be ensured. In addition, the average particle diameter of a filler can be calculated|required using, for example, a photometric particle size distribution meter (for example, brand name "LA-910", the product made by Horiba Co., Ltd.).

The adhesive bond layer may contain other components as needed. As said other components, a hardening catalyst, a flame retardant, a silane coupling agent, an ion trapping agent, a dye etc. are mentioned, for example. Only one type of the above-mentioned other additives may be used, or two or more types may be used.

As said flame retardant, an antimony trioxide, an antimony pentoxide, a brominated epoxy resin etc. are mentioned, for example.

As said silane coupling agent, for example, β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxy propylpropylmethyldiethoxysilane, etc.

Examples of the ion trapping agent include hydrotalcites, bismuth hydroxide, hydrated antimony oxide (for example, "IXE-300" manufactured by Toagosei Co., Ltd.), and zirconium phosphate with a specific structure (for example, "Toagosei Co., Ltd." IXE-100"), magnesium silicate (for example, "Kyoward 600" produced by Kyowa Chemical Industry Co., Ltd.), aluminum silicate (for example, "Kyoward 700" produced by Kyowa Chemical Industry Co., Ltd.), and the like.

Compounds capable of forming complexes with metal ions can also be used as ion traps. As such a compound, a triazole type compound, a tetrazole type compound, and a bipyridine type compound are mentioned, for example. Among these, from the viewpoint of the stability of the complex formed with the metal ion, triazole-based compounds are preferred.

As said triazole type compound, 1,2,3- benzotriazole, 1-{N,N-bis(2-ethylhexyl)aminomethyl}benzotriazole, carboxybenzotriazole, for example azole, 2-(2-hydroxy-5-methylphenyl)benzotriazole, 2-(2-hydroxy-3,5-di-tert-butylphenyl)-5-chlorobenzotriazole, 2- (2-Hydroxy-3-tert-butyl-5-methylphenyl)-5-chlorobenzotriazole, 2-(2-hydroxy-3,5-di-tert-amylphenyl)benzotriazole, 2-(2-Hydroxy-5-tert-octylphenyl)benzotriazole, 6-(2-benzotriazolyl)-4-tert-octyl-6'-tert-butyl-4'-methyl -2,2'-methylenebisphenol, 1-(2',3'-hydroxypropyl)benzotriazole, 1-(1,2-dicarboxydiethyl)benzotriazole, 1- (2-Ethylhexylaminomethyl)benzotriazole, 2,4-di-tert-amyl-6-{(H-benzotriazol-1-yl)methyl}phenol, 2-(2-hydroxyl) -5-tert-butylphenyl)-2H-benzotriazole, 3-(2H-benzotriazol-2-yl)-5-(1,1-dimethylethyl)-4-hydroxy, Octyl 3-[3-tert-butyl-4-hydroxy-5-(5-chloro-2H-benzotriazol-2-yl)phenyl]propanoate, 3-[3-tert-butyl-4-hydroxy -5-(5-Chloro-2H-benzotriazol-2-yl)phenyl]propionic acid 2-ethylhexyl ester, 2-(2H-benzotriazol-2-yl)-6-(1 -Methyl-1-phenethyl)-4-(1,1,3,3-tetramethylbutyl)phenol, 2-(2H-benzotriazol-2-yl)-4-tert-butyl Phenol, 2-(2-hydroxy-5-methylphenyl)benzotriazole, 2-(2-hydroxy-5-tert-octylphenyl)-benzotriazole, 2-(3-tert-butyl -2-Hydroxy-5-methylphenyl)-5-chlorobenzotriazole, 2-(2-hydroxy-3,5-di-tert-amylphenyl)benzotriazole, 2-(2-hydroxyl -3,5-Di-tert-butylphenyl)-5-chloro-benzotriazole, 2-[2-hydroxy-3,5-bis(1,1-dimethylbenzyl)phenyl]-2H - Benzotriazole, 2,2'-methylenebis[6-(2H-benzotriazol-2-yl)-4-(1,1,3,3-tetramethylbutyl)phenol] , 2-[2-hydroxy-3,5-bis(α,α-dimethylbenzyl)phenyl]-2H-benzotriazole, 3-[3-(2H-benzotriazole-2- yl)-5-tert-butyl-4-hydroxyphenyl]propionic acid methyl ester and the like.

In addition, a predetermined hydroxyl group-containing compound such as a hydroquinone compound, a hydroxyanthraquinone compound, and a polyphenol compound can also be used as the ion trapping agent. Specific examples of such a hydroxyl group-containing compound include 1,2-benzenediol, alizarin, 1,5-dihydroxyanthraquinone, tannic acid, gallic acid, methyl gallate, pyrogallol, and the like. .

The thickness of the adhesive bond layer (the total thickness in the case of a laminate) is not particularly limited, but is, for example, 1 to 200 μm. The upper limit is preferably 100 μm, and more preferably 80 μm. The lower limit is preferably 3 μm, and more preferably 5 μm.

In the dicing die-bonding film of the present invention, the peel force between the pressure-sensitive adhesive layer and the pressure-sensitive adhesive layer is preferably 0.3 N in a T-type peel test under the conditions of a temperature of 23° C. and a peeling speed of 300 mm/min. /20mm or more, more preferably 0.5N/20mm or more, still more preferably 0.7N/20mm or more. When the peeling force is 0.3 N/20 mm or more, the adhesiveness between the pressure-sensitive adhesive layer and the pressure-sensitive adhesive layer can be moderately adjusted, and when the expansion process is carried out without radiation curing, the expansion process and later can be easily suppressed. The occurrence of peeling (floating) between the adhesive layer and the adhesive layer.

In addition, the higher the peeling force, the more preferable, and the upper limit may be, for example, 10 N/20 mm, 5.0 N/20 mm, or 3.0 N/20 mm. In addition, with respect to the dicing die-bonding film using the radiation-curable adhesive in the adhesive layer, the above-mentioned peel force of the adhesive layer before radiation curing (in the T-peel test before ultraviolet curing) peel force) is preferably the above-mentioned value.

In the dicing die-bonding film of the present invention, in the T-peel test under the conditions of a temperature of 23° C. and a peeling speed of 300 mm/min, the peeling between the adhesive layer after radiation curing and the adhesive layer The force is preferably 0.3 N/20 mm or less, and more preferably 0.2 N/20 mm or less. When the said peeling force is 0.3 N/20mm or less, it becomes easy to implement favorable pick-up in the pick-up process performed after radiation hardening.

The dicing die-bonding film may have a separator. Specifically, a sheet-like form having a separator for each dicing die-bonding film may be used, or the separator may be an elongated shape, a plurality of dicing die-bonding films may be arranged thereon, and the separator may be wound. In roll form.

The separator is an element for covering and protecting the surface of the adhesive layer of the dicing die-bonding film, and is peeled from the dicing die-bonding film when the dicing die-bonding film is used. As the separator, for example, polyethylene terephthalate (PET) film, polyethylene film, polypropylene film, a release agent such as a fluorine-based release agent or a long-chain alkyl acrylate-type release agent can be used. Surface-coated plastic film or paper, etc. The thickness of the separator is, for example, 5 to 200 μm.

The dicing die-bonding film 1 as one embodiment of the dicing die-bonding film of the present invention can be produced, for example, as follows.

First, the base material 11 can be obtained by forming a film by a known or conventional film forming method. Examples of the above-mentioned film forming method include a calendering film forming method, a casting method in an organic solvent, a blow extrusion method in a closed system, a T-die extrusion method, a co-extrusion method, and a dry lamination method.

Then, a composition for forming the pressure-sensitive adhesive layer 12 (adhesive composition) including a pressure-sensitive adhesive for forming the pressure-sensitive adhesive layer 12, a solvent, and the like is applied on the substrate 11 to form a coating film, and then, if necessary, a coating film is formed. The adhesive layer 12 can be formed by curing the coating film by solvent removal, curing, or the like. As a method of said coating, well-known and conventional coating methods, such as roll coating, screen coating, and gravure coating, are mentioned, for example. Moreover, as desolvation conditions, for example, it performs in the range of temperature 80-150 degreeC, and time 0.5-5 minutes.

In addition, the adhesive layer 12 may be formed by coating the adhesive composition on the separator to form a coating film, and then curing the coating film under the above-mentioned desolvation conditions. Then, the pressure-sensitive adhesive layer 12 is attached to the base material 11 together with the separator. By doing as above, the dicing tape 10 can be produced. In addition, in the case where the method of transferring the pressure-sensitive adhesive layer 12 formed on the separator to the base material 11 is employed, in order to set the Ra of the surface 12 a of the pressure-sensitive adhesive layer 12 to 1.0 μm or less, it is preferable to A separator with a smaller Ra of the release-treated surface (adhesive composition-coated surface) was used.

For the adhesive layer 20, first, a composition (adhesive composition) for forming the adhesive layer 20 containing a resin, a filler, a curing catalyst, a solvent, and the like is prepared. Then, after applying the adhesive composition on the separator to form a coating film, if necessary, the coating film is cured by solvent removal, curing, or the like to form the adhesive layer 20 . Although it does not specifically limit as a coating method, For example, well-known and conventional coating methods, such as roll coating, screen coating, and gravure coating, are mentioned. Moreover, as a desolvation condition, for example, it performs in the range of temperature 70-160 degreeC, and time 1-5 minutes.

Next, the separator is peeled off from the dicing tape 10 and the adhesive layer 20 , respectively, and the adhesive layer 20 and the adhesive layer 12 are bonded together so that the adhesive layer 20 and the adhesive layer 12 become bonding surfaces. Bonding can be performed, for example, by crimping. In this case, the lamination temperature is not particularly limited, but for example, it is preferably 30 to 50°C, and more preferably 35 to 45°C. Moreover, although the linear pressure is not specifically limited, For example, 0.1-20 kgf/cm is preferable, and 1-10 kgf/cm is more preferable.

As described above, when the adhesive layer 12 is a radiation-curable adhesive layer, when the adhesive layer 12 is irradiated with radiation such as ultraviolet rays after the adhesive layer 20 is bonded, the adhesive layer 12 is irradiated with radiation such as ultraviolet rays. The adhesive layer 12 is irradiated with radiation, and the irradiation amount is, for example, 50 to 500 mJ, or preferably 100 to 300 mJ.

In the dicing die-bonding film 1 , the area (irradiated area R) where irradiation as a measure for reducing the adhesive force of the adhesive layer 12 is performed is usually the area except the edge of the adhesive layer 20 in the adhesive layer 12 in the bonding area. areas outside the Department. When the irradiation region R is partially provided, it can be performed through a photomask in which a pattern corresponding to regions other than the irradiation region R is formed. In addition, a method of forming the irradiation region R by irradiating the radiation in a spot shape can also be mentioned.

As described above, for example, the dicing die-bonding film 1 shown in FIG. 1 can be produced.

[Manufacturing method of semiconductor device]

A semiconductor device can be manufactured using the dicing die-bonding film of the present invention. Specifically, a semiconductor device can be manufactured by a manufacturing method including a step of sticking a divided body of a semiconductor wafer including a plurality of semiconductor chips on the adhesive layer side of the dicing die-bonding film of the present invention, or capable of A step of singulating a semiconductor wafer into a plurality of semiconductor chips (sometimes referred to as "step A"); expanding the dicing tape in the dicing die-bonding film of the present invention at a relatively low temperature to cut at least the above-mentioned adhesive layer , the process of obtaining a semiconductor chip with an adhesive layer (sometimes referred to as "process B"); the process of expanding the above-mentioned dicing tape under relatively high temperature conditions to widen the distance between the above-mentioned semiconductor chips with an adhesive layer. (sometimes referred to as "step C"); and a step of picking up the above-mentioned semiconductor chip with an adhesive bond layer (sometimes referred to as "step D").

The divided body of the semiconductor wafer including the plurality of semiconductor chips used in the step A, or the semiconductor wafer that can be singulated into a plurality of semiconductor chips can be obtained as follows. First, as shown in FIGS. 2( a ) and 2 ( b ), dividing grooves 30 a are formed on the semiconductor wafer W (division groove forming step). The semiconductor wafer W has a first surface Wa and a second surface Wb. Various semiconductor elements (not shown) are already mounted on the first surface Wa side of the semiconductor wafer W, and wiring structures and the like (not shown) required for the semiconductor elements are already formed on the first surface Wa.

Then, after bonding the tape T1 for wafer processing having the adhesive surface T1a to the second surface Wb side of the semiconductor wafer W, a dicing device is used in a state where the semiconductor wafer W is held on the tape T1 for wafer processing. The iso-rotary cutter forms dividing grooves 30 a of predetermined depths on the first surface Wa side of the semiconductor wafer W. As shown in FIG. The dividing grooves 30 a are gaps for separating the semiconductor wafer W into semiconductor chip units (the dividing grooves 30 a are schematically shown by thick lines in FIGS. 2 to 4 ).

Then, as shown in FIG. 2( c ), the wafer processing tape T2 having the adhesive surface T2 a is bonded to the first surface Wa side of the semiconductor wafer W, and the wafer processing is performed to separate the wafer from the semiconductor wafer W Use tape T1.

Then, as shown in FIG. 2( d ), in a state where the semiconductor wafer W is held on the tape T2 for wafer processing, the semiconductor wafer W is thinned to a predetermined thickness by grinding from the second surface Wb Thickness (wafer thinning process). The grinding process can be performed using a grinding process apparatus having a grinding stone. Through this wafer thinning step, in this embodiment, a semiconductor wafer 30A that can be singulated into a plurality of semiconductor chips 31 can be formed.

Specifically, the semiconductor wafer 30A has a portion (connection portion) in the wafer that connects portions to be singulated into a plurality of semiconductor chips 31 on the second surface Wb side. The thickness of the connection portion in the semiconductor wafer 30A, that is, the distance between the second surface Wb of the semiconductor wafer 30A and the tip of the second surface Wb side of the dividing groove 30a is, for example, 1 to 30 μm, or preferably 3 to 20 μm.

(Process A)

In step A, a split body of a semiconductor wafer including a plurality of semiconductor chips, or a semiconductor wafer that can be singulated into a plurality of semiconductor chips is attached to the adhesive layer 20 side in the dicing die-bonding film 1 .

In one embodiment of step A, as shown in FIG. 3( a ), the semiconductor wafer 30A held by the tape T2 for wafer processing is bonded to the adhesive layer 20 of the dicing die-bonding film 1 . Then, as shown in FIG. 3( b ), the tape T2 for wafer processing is peeled off from the semiconductor wafer 30A.

In addition, after bonding the semiconductor wafer 30A to the adhesive bond layer 20, radiation, such as an ultraviolet-ray, is irradiated to the adhesive bond layer 12 from the base material 11 side. The irradiation amount is, for example, 50 to 500 mJ/cm ² , preferably 100 to 300 mJ/cm ² . In the dicing die-bonding film 1, an area to be irradiated as a measure for reducing the adhesive force of the adhesive layer 12 (irradiated area R shown in FIG. 1 ) is, for example, the adhesive layer 20 in the adhesive layer 12 is attached. Areas other than the edges of the area.

(Process B)

In step B, the dicing tape 10 in the die-bonding film 1 is spread under relatively low temperature conditions, at least the adhesive layer 20 is cut, and a semiconductor chip with an adhesive layer is obtained.

In one embodiment of the process B, first, the ring frame 41 is attached to the adhesive layer 12 of the dicing tape 10 in the dicing die-bonding film 1, and then, as shown in FIG. The dicing die-bonding film 1 of the circle 30A is fixed to the holder 42 of the expansion device.

Then, as shown in FIG. 4( b ), a first expansion step (cold expansion step) under relatively low temperature conditions is performed, the semiconductor wafer 30A is singulated into a plurality of semiconductor chips 31 , and the die-bonding film 1 is diced. The adhesive layer 20 is cut into small pieces of the adhesive layer 21 to obtain a semiconductor chip 31 with an adhesive layer.

In the cold expansion step, the hollow cylindrical lift-up member 43 included in the expansion device is brought into contact with the dicing tape 10 on the lower side of the drawing in which the die-bonding film 1 is diced and raised so as to follow the diameter including the semiconductor wafer 30A. The dicing tape 10 on which the dicing die-bonding film 1 of the semiconductor wafer 30A is bonded is extended in a two-dimensional direction with respect to the circumferential direction.

This expansion is performed under the conditions that a tensile stress in the range of 15 to 32 MPa, preferably 20 to 32 MPa, is generated in the dicing tape 10 . The temperature conditions in the cold expansion step are, for example, 0°C or lower, preferably -20 to -5°C, more preferably -15 to -5°C, and more preferably -15°C. The expansion speed in the cold expansion step (the speed at which the lifting member 43 is raised) is preferably 0.1 to 100 mm/sec. In addition, the expansion amount in the cold expansion step is preferably 3 to 16 mm.

When the semiconductor wafer 30A that can be singulated into a plurality of semiconductor chips is used in the step B, the semiconductor wafer 30A is singulated into the semiconductor chips 31 by cutting at a thin portion of the semiconductor wafer 30A where cracks are likely to occur. At the same time, in the step B, the adhesive layer 20 that is in close contact with the adhesive layer 12 of the expanded dicing tape 10 is restrained from being deformed in each region where the semiconductor chips 31 are in close contact. Such deformation suppression does not occur at positions located in the direction perpendicular to the dividing grooves between the semiconductor chips 31 in the figure, and tensile stress generated in the dicing tape 10 acts in this state. As a result, the adhesive layer 20 is cut at a position in a direction perpendicular to the dividing groove between the semiconductor chips 31 . After being cut by expansion, as shown in FIG. 4( c ), the push-up member 43 is lowered to release the expanded state of the dicing tape 10 .

(Process C)

In step C, the dicing tape 10 is expanded under relatively high temperature conditions to widen the distance between the semiconductor chips with the adhesive layer.

In one embodiment of the process C, first, as shown in FIG. 5( a ), a second expansion process (a normal temperature expansion process) under relatively high temperature conditions is performed, and the distance between the semiconductor chips 31 with the adhesive layer is adjusted to (separation distance) widened.

In the process C, the hollow-cylindrical-shaped push-up member 43 with which the expansion device is provided is raised again to expand the dicing tape 10 for dicing the die-bonding film 1 . The temperature conditions in the second expansion step are, for example, 10°C or higher, preferably 15 to 30°C. The expansion speed in the second expansion step (the speed at which the push-up member 43 is raised) is, for example, 0.1 to 10 mm/sec, or preferably 0.3 to 1 mm/sec. In step C, the distance between the adhesive layer-attached semiconductor chips 31 is widened to such an extent that the adhesive layer-attached semiconductor chips 31 can be appropriately picked up from the dicing tape 10 in a pickup step to be described later. After the spacing distance is widened by the expansion, the push-up member 43 is lowered as shown in FIG. 5( b ), and the expanded state of the dicing tape 10 is released.

From the viewpoint of suppressing the narrowing of the distance between the semiconductor chips 31 with the adhesive layer on the dicing tape 10 after the expanded state is released, it is preferable to hold the outer portion of the region where the semiconductor chips 31 in the dicing tape 10 are held before releasing the expanded state. Heat it to shrink it.

After step C, if necessary, there may be a cleaning step of cleaning the semiconductor chip 31 side of the dicing tape 10 having the semiconductor chip 31 with the adhesive layer using a cleaning liquid such as water.

(Process D)

In step D (pickup step), the singulated semiconductor chips with the adhesive layer are picked up. In one embodiment of the process D, after passing through the above-mentioned cleaning process as needed, the semiconductor chip 31 with the adhesive layer is picked up from the dicing tape 10 as shown in FIG. 6 . For example, for the semiconductor chip 31 with the adhesive layer to be picked up, the needle-shaped member 44 of the pick-up mechanism is raised from the lower side of the dicing tape 10 in the figure to push up through the dicing tape 10 , and then the suction jig 45 is used. Adsorb it. In the pick-up process, the push-up speed of the needle-shaped member 44 is, for example, 1 to 100 mm/sec, and the push-up amount of the needle-shaped member 44 is, for example, 50 to 3000 μm.

The above-described method of manufacturing a semiconductor device may further include other steps than steps A to D. For example, in one embodiment, as shown in FIG. 7( a ), the picked-up semiconductor chip 31 with an adhesive layer is temporarily fixed to the adherend 51 via the adhesive layer 21 (temporary fixing step) .

Examples of the adherend 51 include a lead frame, a TAB (Tape Automated Bonding) film, a wiring board, a separately produced semiconductor chip, and the like. The shear adhesive force at 25° C. of the adhesive layer 21 when temporarily fixed is preferably 0.2 MPa or more with respect to the adherend 51 , and more preferably 0.2 to 10 MPa. The configuration in which the shear adhesive force of the adhesive layer 21 is 0.2 MPa or more can suppress the adhesion between the adhesive layer 21 and the semiconductor chip 31 or the adherend 51 due to ultrasonic vibration and heating in the wire bonding process described later. Shear deformation occurs on the bonding surface, and wire bonding can be performed appropriately. Moreover, when the adhesive bond layer 21 is temporarily fixed, it is preferable that it is 0.01 MPa or more with respect to the to-be-adhered body 51, and, as for the shear adhesive force at 175 degreeC, it is more preferable that it is 0.01-5 MPa.

Then, as shown in FIG. 7( b ), the electrode pads (not shown) of the semiconductor chip 31 and the terminal portion (not shown) of the adherend 51 are electrically connected by bonding wires 52 (wire bonding). process).

The electrode pads of the semiconductor chip 31 , the terminals of the adherend 51 and the bonding wires 52 can be connected by ultrasonic welding with heating, and the adhesive layer 21 can be not thermally cured. As the bonding wire 52, for example, a gold wire, an aluminum wire, a copper wire, or the like can be used. The wire heating temperature in wire bonding is, for example, 80 to 250°C, or preferably 80 to 220°C. In addition, the heating time is several seconds to several minutes.

Then, as shown in FIG. 7( c ), the semiconductor chip 31 is sealed with a sealing resin 53 for protecting the semiconductor chip 31 on the adherend 51 and the bonding wire 52 (sealing step).

In the sealing step, the adhesive layer 21 is thermally cured. In the sealing process, the sealing resin 53 is formed by, for example, a transfer molding technique using a mold. As a constituent material of the sealing resin 53, for example, an epoxy resin can be used. In the sealing step, the heating temperature for forming the sealing resin 53 is, for example, 165 to 185° C., and the heating time is, for example, 60 seconds to several minutes.

When the sealing resin 53 is not sufficiently cured in the sealing process, a post-curing process for completely curing the sealing resin 53 is performed after the sealing process. Even when the adhesive layer 21 is not completely thermally cured in the sealing step, the adhesive layer 21 may be completely thermally cured together with the sealing resin 53 in the post-curing step. In the post-curing step, the heating temperature is, for example, 165 to 185° C., and the heating time is, for example, 0.5 to 8 hours.

In the above-described embodiment, as described above, after the semiconductor chip 31 with the adhesive layer is temporarily fixed to the adherend 51 , the wire bonding step is performed without completely thermosetting the adhesive layer 21 . Instead of this configuration, in the above-described method of manufacturing a semiconductor device, the adhesive layer 21 may be thermally cured after the semiconductor chip 31 with the adhesive layer is temporarily fixed to the adherend 51, and then the wire bonding step may be performed. .

In the above-described method of manufacturing a semiconductor device, as another embodiment, the wafer thinning process shown in FIG. 8 may be performed instead of the above-described wafer thinning process with reference to FIG. 2( d ). After the above-described process with reference to FIG. 2( c ), in the wafer thinning step shown in FIG. 8 , the semiconductor wafer W is passed from the second surface Wb in a state where the semiconductor wafer W is held on the tape T2 for wafer processing. The wafer is thinned to a predetermined thickness by a grinding process, and a semiconductor wafer divided body 30B including a plurality of semiconductor chips 31 and held by the tape T2 for wafer processing is formed.

In the wafer thinning step described above, a method of grinding the wafer until the dividing grooves 30a are exposed on the second surface Wb side (first method), or a method of starting from the second surface Wb side may be used. The wafer is ground until it reaches the dividing groove 30a, and then cracks are formed between the dividing groove 30a and the second surface Wb by the pressing force of the rotating grindstone on the wafer, thereby forming the semiconductor wafer dividing body 30B (the second method). ). The depth from the first surface Wa of the dividing groove 30a formed as described above with reference to FIGS. 2(a) and 2(b) is appropriately determined according to the method to be used.

In FIG. 8 , the divided grooves 30 a formed by the first method or the divided grooves 30 a formed by the second method and the cracks connected thereto are schematically shown by thick lines. In the above-described method of manufacturing a semiconductor device, in step A, the semiconductor wafer divided body 30B thus produced may be used as the semiconductor wafer divided body instead of the semiconductor wafer 30A, and the above-described steps with reference to FIGS. 3 to 7 may be performed. .

FIGS. 9( a ) and 9 ( b ) show the process B of this embodiment, that is, the first expansion process (cold expansion process) performed after the semiconductor wafer divided body 30B is bonded to the dicing die-bonding film 1 . ).

In step B of this embodiment, the hollow cylindrical lift-up member 43 included in the expansion device is brought into contact with the dicing tape 10 on the lower side in the drawing of the dicing die-bonding film 1 and raised so as to extend along the semiconductor wafer including the semiconductor wafer. The two-dimensional directions of the radial direction and the circumferential direction of the divided body 30B are expanded so that the dicing tape 10 of the dicing die-bonding film 1 to which the semiconductor wafer divided body 30B is bonded is stretched.

This expansion is performed under conditions such that a tensile stress in the range of, for example, 5 to 28 MPa, preferably 8 to 25 MPa, is generated in the dicing tape 10 . The temperature conditions in the cold expansion step are, for example, 0°C or lower, preferably -20 to -5°C, more preferably -15 to -5°C, and more preferably -15°C. The expansion speed in the cold expansion step (the speed at which the lifting member 43 is raised) is preferably 1 to 400 mm/sec. In addition, the expansion amount in the cold expansion step is preferably 50 to 200 mm.

By such a cold expansion process, the adhesive bond layer 20 of the dicing die-bonding film 1 is cut|disconnected into the adhesive bond layer 21 of small pieces, and the semiconductor chip 31 with an adhesive bond layer is obtained. Specifically, in the cold expansion step, in the adhesive layer 20 that is in close contact with the adhesive layer 12 of the dicing tape 10 to be expanded, each semiconductor chip 31 of the semiconductor wafer divided body 30B is in close contact with each other. Deformation is suppressed in each region. On the other hand, such a deformation suppressing effect does not occur at positions located in the direction perpendicular to the dividing grooves 30a between the semiconductor chips 31 in the figure. Tensile stress comes into play. As a result, the adhesive layer 20 is cut at a position in the direction perpendicular to the dividing groove 30a between the semiconductor chips 31 in the figure.

In the above-described method of manufacturing a semiconductor device, as yet another embodiment, the semiconductor wafer 30C produced as follows may be used instead of the semiconductor wafer 30A or the semiconductor wafer divided body 30B used in the process A.

In this embodiment mode, as shown in FIGS. 10( a ) and 10 ( b ), the modified region 30 b is formed in the semiconductor wafer W first. The semiconductor wafer W has a first surface Wa and a second surface Wb. Various semiconductor elements (not shown) are already mounted on the first surface Wa side of the semiconductor wafer W, and wiring structures and the like (not shown) required for the semiconductor elements are already formed on the first surface Wa.

Then, after the tape T3 for wafer processing having the adhesive surface T3a is attached to the first surface Wa side of the semiconductor wafer W, the semiconductor wafer W is held on the tape T3 for wafer processing, from the On the opposite side of the tape T3 for wafer processing, the semiconductor wafer W is irradiated with laser light whose condensing point is located inside the wafer along the pre-partition line, and a modified region 30b is formed in the semiconductor wafer W by ablation caused by multiphoton absorption. . The modified region 30b is a weakened region for separating the semiconductor wafer W into semiconductor chip units.

The method of forming the modified region 30b on the pre-division line in the semiconductor wafer by laser irradiation is described in detail in, for example, Japanese Patent Application Laid-Open No. 2002-192370, and the laser irradiation conditions in this embodiment may be, for example, the following conditions suitable adjustment within the range.

<Laser irradiation conditions>

(A) Laser

(B) Condensing lens

Magnification 100 times or less

NA 0.55

Transmittance to laser wavelength 100% or less

(C) Movement speed of the stage on which the semiconductor substrate is placed is 280 mm/sec or less

Then, as shown in FIG. 10( c ), in a state where the semiconductor wafer W is held on the tape T3 for wafer processing, the semiconductor wafer W is thinned to a predetermined thickness by grinding from the second surface Wb Thus, a semiconductor wafer 30C that can be separated into a plurality of semiconductor chips 31 is formed (wafer thinning step).

In the above-described method of manufacturing a semiconductor device, in step A, the semiconductor wafer 30C thus produced may be used as a singulated semiconductor wafer instead of the semiconductor wafer 30A, and each of the above-described processes with reference to FIGS. 3 to 7 may be performed. process.

FIGS. 11( a ) and 11 ( b ) show the process B in this embodiment, that is, the first expansion process (cold expansion process) performed after the semiconductor wafer 30C is bonded to the dicing die-bonding film 1 . .

In the cold expansion process, the hollow cylindrical-shaped lifting member 43 included in the expansion device is brought into contact with the dicing tape 10 on the lower side in the drawing of the dicing die-bonding film 1 and raised so as to follow the diameter including the semiconductor wafer 30C. The dicing tape 10 on which the dicing die-bonding film 1 of the semiconductor wafer 30C is bonded is extended in a two-dimensional direction with respect to the circumferential direction.

This expansion is performed under conditions such that a tensile stress in the range of, for example, 5 to 28 MPa, preferably 8 to 25 MPa, is generated in the dicing tape 10 . The temperature conditions in the cold expansion step are, for example, 0°C or lower, preferably -20 to -5°C, more preferably -15 to -5°C, and more preferably -15°C. The expansion speed in the cold expansion step (the speed at which the lifting member 43 is raised) is preferably 1 to 400 mm/sec. In addition, the expansion amount in the cold expansion step is preferably 50 to 200 mm.

By such a cold expansion process, the adhesive bond layer 20 of the dicing die-bonding film 1 is cut|disconnected into the adhesive bond layer 21 of small pieces, and the semiconductor chip 31 with an adhesive bond layer is obtained. Specifically, in the cold expansion step, cracks are formed in the fragile reformed region 30 b in the semiconductor wafer 30C, and the semiconductor chips 31 are separated into pieces. At the same time, in the cold expansion process, each area of the adhesive layer 20 that is in close contact with the adhesive layer 12 of the dicing tape 10 to be expanded is in close contact with each semiconductor chip 31 of the semiconductor wafer 30C. On the other hand, at a position located in the direction perpendicular to the crack formation position of the wafer in the figure, such a deformation suppressing effect does not occur, and the tensile stress generated in the dicing tape 10 is exerted in this state. effect. As a result, the adhesive layer 20 is cut at a position in the direction perpendicular to the crack formation position between the semiconductor chips 31 in the figure.

Moreover, in the manufacturing method of the above-mentioned semiconductor device, the dicing die-bonding film 1 can be used for the purpose of obtaining a semiconductor chip with an adhesive bond layer as described above, or it can also be used for obtaining a plurality of semiconductor chips which are stacked in layers. It is used for the application of a semiconductor chip with an adhesive bond layer during three-dimensional mounting. A spacer may or may not be interposed between the three-dimensionally mounted semiconductor chips 31 together with the adhesive layer 21 .

[Example]

Hereinafter, the present invention will be described in more detail by way of Examples, but the present invention is not limited by these Examples at all. _In addition, the composition of each monomer component which comprises the acrylic polymer P2 of the adhesive layer in an Example and a comparative example is shown in a table|surface. Among them, in the table, for the unit of each numerical value representing the composition of the composition, the numerical value related to the monomer component is the relative "mol" in the composition, and the numerical value related to each component other than the monomer component is "Parts by mass" relative to 100 parts by mass of the acrylic polymer P ₂ .

Example 1

(cutting tape)

In a reaction vessel equipped with a condenser tube, a nitrogen introduction tube, a thermometer, and a stirring device, 100 mol of 2-ethylhexyl acrylate (2EHA), 30 mol of 2-hydroxyethyl acrylate (HEA), and acryloyl morpholine were prepared. (AM) 30 mol, 0.2 mass part with respect to 100 mass parts of these monomer components, the mixture of benzoyl peroxide as a polymerization initiator, and toluene as a polymerization solvent was carried out at 61 degreeC under nitrogen atmosphere. hours of stirring (polymerization). Thus, _a polymer solution containing the acrylic polymer P1 was obtained.

Then, a mixture containing the polymer solution containing the acrylic polymer P1, ₂ -methacryloyloxyethyl isocyanate (MOI), and dibutyltin dilaurate as an addition reaction catalyst was heated at 50°C and stirring for 48 hours in an air atmosphere (addition reaction). In this reaction solution, the compounding amount of MOI was 25 mol. Moreover, in this reaction solution, the compounding quantity of dibutyltin dilaurate was 0.01 mass part with respect to ₁₀₀ mass parts of acryl-type polymer P1. By this addition reaction, the polymer solution containing the acrylic polymer P2 ₍ acrylic polymer containing the structural unit derived from the unsaturated functional group containing isocyanate compound) which has a methacrylate group in a side chain is obtained.

Then, 1 part by mass of a polyisocyanate compound (trade name "CORONATE L", manufactured by Tosoh Corporation) and 2 parts by mass of a photopolymerization agent were added to the polymer solution with respect to 100 parts by mass of the acrylic polymer P ₂ . An initiator (trade name "Irgacure 127", manufactured by BASF Corporation) was mixed, and toluene was added and diluted to obtain an adhesive composition.

Then, the pressure-sensitive adhesive composition was applied on the silicone release-treated surface of the PET separator (thickness 50 μm) having the silicone release-treated surface using an applicator to form a pressure-sensitive adhesive composition layer. Then, the composition layer was subjected to desolvation by heating at 120° C. for 2 minutes to form an adhesive layer with a thickness of 10 μm on the PET separator.

Then, using a laminator, an EVA film (thickness: 125 μm) as a base material was bonded to the exposed surface of the pressure-sensitive adhesive layer at room temperature. Then, the bonded body was stored at 50°C for 24 hours. As described above, the dicing tape of Example 1 was produced.

(adhesive layer)

Acrylic polymer A1 (copolymer _of ethyl acrylate, butyl acrylate, acrylonitrile and glycidyl methacrylate, mass average molecular weight is 1.2 million, glass transition temperature is 0°C, and epoxy value is 0.4eq /kg) 54 parts by mass, solid phenolic resin (trade name "MEHC-7851SS", solid at 23°C, manufactured by Meiwa Chemical Co., Ltd.) 3 mass parts, liquid phenol resin (trade name "MEH-8000H", 23°C In a liquid state, 3 parts by mass of Meiwa Chemical Co., Ltd., and 40 parts by mass of a silica filler (trade name "SO-C2", average particle diameter of 0.5 μm, manufactured by ADMATECHS CO., LTD.) were added to methyl ethyl ketone and Mixing was carried out, and the density|concentration was adjusted so that the viscosity at room temperature might become 700 mPa*s, and the adhesive composition was obtained.

Then, using an applicator, the adhesive composition was applied to the silicone release-treated surface of the PET separator (thickness 38 μm) having the silicone release-treated surface to form a coating film, and the coating film was placed at 130 Å. The desolvation was carried out at °C for 2 minutes. As described above, the adhesive layer having a thickness of 10 μm in Example 1 was produced on the PET separator.

(Production of dicing die-bonding film)

The PET separator was peeled off from the dicing tape of Example 1, and the adhesive layer of Example 1 was bonded to the exposed adhesive layer. Use a hand roller for lamination. Then, 300 mJ of ultraviolet rays were irradiated from the dicing tape side, and the dicing die-bonding film of Example 1 was produced.

Example 2

The compounding amount of acryloyl morpholine (AM) constituting the acrylic polymer P ₂ (acrylic polymer including a structural unit derived from an unsaturated functional group-containing isocyanate compound) of the pressure-sensitive adhesive layer was changed to 10 mol, Except for this, it carried out similarly to Example 1, and produced the dicing tape and the dicing die-bonding film of Example 2.

Example 3

Except not irradiating an ultraviolet-ray to an adhesive layer, it carried out similarly to Example 1, and produced the dicing tape and the dicing die-bonding film of Example 3.

Example 4

In the preparation of the pressure-sensitive adhesive layer, the preparation was carried out in the same manner as in Example 3, except that the compounding amount of the polyisocyanate compound (trade name "CORONATE L", manufactured by Tosoh Corporation) was 2 parts by mass. The dicing tape and the dicing die-bonding film of Example 4.

Example 5

Except not irradiating an ultraviolet-ray to an adhesive layer, it carried out similarly to Example 2, and produced the dicing tape and the dicing die-bonding film of Example 5.

Example 6

In the preparation of the pressure-sensitive adhesive layer, the preparation was carried out in the same manner as in Example 5, except that the compounding amount of the polyisocyanate compound (trade name "CORONATE L", manufactured by Tosoh Corporation) was 2 parts by mass The dicing tape and the dicing die-bonding film of Example 6.

Example 7

(cutting tape)

In a reaction vessel equipped with a condenser tube, a nitrogen introduction tube, a thermometer, and a stirring device, 50 mol of ethyl acrylate (EA), 50 mol of butyl acrylate (BA), and 20 mol of 2-hydroxyethyl acrylate (HEA) were contained , A mixture of 0.2 parts by mass of benzoyl peroxide as a polymerization initiator and toluene as a polymerization solvent with respect to 100 parts by mass of these monomer components was stirred at 61° C. for 6 hours under a nitrogen atmosphere (polymerization reaction) . Thus, _a polymer solution containing the acrylic polymer P1 was obtained.

Then, a mixture containing the polymer solution containing the acrylic polymer P1, ₂ -methacryloyloxyethyl isocyanate (MOI), and dibutyltin dilaurate as an addition reaction catalyst was heated at 50°C Stirring (addition reaction) was carried out under air atmosphere for 48 hours. In this reaction solution, the compounding amount of MOI was 18 moles. Moreover, in this reaction solution, the compounding quantity of dibutyltin dilaurate was 0.01 mass part with respect to ₁₀₀ mass parts of acryl-type polymer P1. Through this addition reaction, a polymer solution containing an acrylic polymer P ₂ having a methacrylate group in a side chain (acrylic polymer containing a structural unit derived from an unsaturated functional group-containing isocyanate compound) is obtained.

Then, 1 part by mass of a polyisocyanate compound (trade name "CORONATE L", manufactured by Tosoh Corporation) and 2 parts by mass of a photopolymerization agent were added to the polymer solution with respect to 100 parts by mass of the acrylic polymer P ₂ . An initiator (trade name "Irgacure 127", manufactured by BASF Corporation) was mixed, and toluene was added and diluted to obtain an adhesive composition.

Then, the pressure-sensitive adhesive composition was applied on the silicone release-treated surface of the PET separator (thickness 50 μm) having the silicone release-treated surface using an applicator to form a pressure-sensitive adhesive composition layer. Then, the composition layer was subjected to desolvation by heating at 120° C. for 2 minutes to form an adhesive layer with a thickness of 10 μm on the PET separator.

Then, using a laminator, an EVA film (thickness: 125 μm) as a base material was bonded to the exposed surface of the pressure-sensitive adhesive layer at room temperature. Then, the bonded body was stored at 50°C for 24 hours. As described above, the dicing tape of Example 7 was produced.

(Production of dicing die-bonding film)

The PET separator was peeled off from the dicing tape of Example 7, and the adhesive layer of Example 1 was bonded to the exposed adhesive layer. Use a hand roller for lamination. In this way, the dicing die-bonding film of Example 7 was produced.

Example 8

In the preparation of the pressure-sensitive adhesive layer, the preparation was carried out in the same manner as in Example 7, except that the compounding amount of the polyisocyanate compound (trade name "CORONATE L", manufactured by Tosoh Corporation) was set to 2 parts by mass The dicing tape and the dicing die-bonding film of Example 8.

Comparative Example 1

(cutting tape)

In a reaction vessel equipped with a condenser tube, a nitrogen gas introduction tube, a thermometer, and a stirring device, 100 mols of 2-ethylhexyl acrylate (2EHA) and 20 mols of 2-hydroxyethyl acrylate (HEA) were prepared relative to these monomers. A mixture of 0.2 parts by mass of benzoyl peroxide as a polymerization initiator and toluene as a polymerization solvent was stirred at 61° C. for 6 hours under a nitrogen atmosphere (polymerization reaction) for 100 parts by mass of the body. Thus, _a polymer solution containing the acrylic polymer P1 was obtained.

Then, a mixture containing the polymer solution containing the acrylic polymer P1, ₂ -methacryloyloxyethyl isocyanate (MOI), and dibutyltin dilaurate as an addition reaction catalyst was heated at 50°C Stirring (addition reaction) was carried out under air atmosphere for 48 hours. In this reaction solution, the compounding amount of MOI was 18 moles. Moreover, in this reaction solution, the compounding quantity of dibutyltin dilaurate was 0.01 mass part with respect to ₁₀₀ mass parts of acryl-type polymer P1. Through this addition reaction, a polymer solution containing an acrylic polymer P ₂ having a methacrylate group in a side chain (acrylic polymer containing a structural unit derived from an unsaturated functional group-containing isocyanate compound) is obtained.

Then, 0.5 parts by mass of a polyisocyanate compound (trade name "CORONATE L", manufactured by Tosoh Corporation) and 2 parts by mass of a photopolymerization agent were added to the polymer solution with respect to 100 parts by mass of the acrylic polymer P ₂ . An initiator (trade name "Irgacure 127", manufactured by BASF Corporation) was mixed, and toluene was added and diluted to obtain an adhesive composition.

Then, the pressure-sensitive adhesive composition was applied on the silicone release-treated surface of the PET separator (thickness 50 μm) having the silicone release-treated surface using an applicator to form a pressure-sensitive adhesive composition layer. Then, the composition layer was subjected to desolvation by heating at 120° C. for 2 minutes to form an adhesive layer with a thickness of 10 μm on the PET separator.

Then, using a laminator, an EVA film (thickness: 125 μm) as a base material was bonded to the exposed surface of the pressure-sensitive adhesive layer at room temperature. Then, the bonded body was stored at 50°C for 24 hours. As described above, the dicing tape of Comparative Example 1 was produced.

(Production of dicing die-bonding film)

The PET separator was peeled off from the dicing tape of Comparative Example 1, and the adhesive layer of Example 1 was bonded to the exposed adhesive layer. Use a hand roller for lamination. In this way, the dicing die-bonding film of Comparative Example 1 was produced.

Comparative Example 2

In the preparation of the pressure-sensitive adhesive layer, except that the compounding amount of the polyisocyanate compound (trade name "CORONATE L", manufactured by Tosoh Corporation) was set to 1 part by mass, it was carried out in the same manner as in Comparative Example 1 to prepare a comparison. The dicing tape and the dicing die-bonding film of Example 2.

Comparative Example 3

In the preparation of the pressure-sensitive adhesive layer, a comparison was made in the same manner as in Comparative Example 1, except that the compounding amount of the polyisocyanate compound (trade name "CORONATE L", manufactured by Tosoh Corporation) was set to 2 parts by mass The dicing tape and the dicing die-bonding film of Example 3.

Comparative Example 4

(cutting tape)

In a reaction vessel equipped with a condenser tube, a nitrogen gas introduction tube, a thermometer, and a stirring device, 100 mols of lauryl methacrylate (LMA) and 20 mols of 2-hydroxyethyl methacrylate (HEMA) were prepared. A mixture of 0.2 parts by mass of benzoyl peroxide as a polymerization initiator and toluene as a polymerization solvent was stirred at 61° C. for 6 hours under a nitrogen atmosphere (polymerization reaction) for 100 parts by mass of the body. Thus, _a polymer solution containing the acrylic polymer P1 was obtained.

Then, a mixture containing the polymer solution containing the acrylic polymer P1, ₂ -methacryloyloxyethyl isocyanate (MOI), and dibutyltin dilaurate as an addition reaction catalyst was heated at 50°C Stirring (addition reaction) was carried out under air atmosphere for 48 hours. In this reaction solution, the compounding amount of MOI was 18 moles. Moreover, in this reaction solution, the compounding quantity of dibutyltin dilaurate was 0.01 mass part with respect to ₁₀₀ mass parts of acryl-type polymer P1. Through this addition reaction, a polymer solution containing an acrylic polymer P ₂ having a methacrylate group in a side chain (acrylic polymer containing a structural unit derived from an unsaturated functional group-containing isocyanate compound) is obtained.

Then, 0.5 parts by mass of a polyisocyanate compound (trade name "CORONATE L", manufactured by Tosoh Corporation) and 2 parts by mass of a photopolymerization agent were added to the polymer solution with respect to 100 parts by mass of the acrylic polymer P ₂ . An initiator (trade name "Irgacure 127", manufactured by BASF Corporation) was mixed, and toluene was added and diluted to obtain an adhesive composition.

Then, the pressure-sensitive adhesive composition was applied on the silicone release-treated surface of the PET separator (thickness 50 μm) having the silicone release-treated surface using an applicator to form a pressure-sensitive adhesive composition layer. Then, the composition layer was subjected to desolvation by heating at 120° C. for 2 minutes to form an adhesive layer with a thickness of 10 μm on the PET separator.

Then, using a laminator, an EVA film (thickness: 125 μm) as a base material was bonded to the exposed surface of the pressure-sensitive adhesive layer at room temperature. Then, the bonded body was stored at 50°C for 24 hours. As described above, the dicing tape of Comparative Example 4 was produced.

(Production of dicing die-bonding film)

The PET separator was peeled off from the dicing tape of Comparative Example 4, and the adhesive layer of Example 1 was bonded to the exposed adhesive layer. Use a hand roller for lamination. In this way, the dicing die-bonding film of Comparative Example 4 was produced.

Comparative Example 5

In the preparation of the pressure-sensitive adhesive layer, except that the compounding amount of the polyisocyanate compound (trade name "CORONATE L", manufactured by Tosoh Corporation) was set to 1 part by mass, it was carried out in the same manner as in Comparative Example 4 to prepare a comparison. The dicing tape and the dicing die-bonding film of Example 5.

Comparative Example 6

In the preparation of the pressure-sensitive adhesive layer, a silicone mold release treatment was performed on a PET separator (thickness 50 μm, arithmetic mean surface roughness of the mold release treated surface: 1.0 μm) having a silicone mold release treated surface using an applicator A dicing tape and a dicing die-bonding film of Comparative Example 6 were produced in the same manner as in Example 2, except that the adhesive composition was coated on the surface to form an adhesive composition layer.

<Evaluation>

The following evaluations were performed on the dicing die-bonding films obtained in Examples and Comparative Examples. The results are shown in the table.

(1) Surface roughness

The surface of the adhesive layer of the dicing die-bonding films obtained in the Examples and Comparative Examples in the region where the adhesive layer was not laminated was examined using a laser confocal microscope (trade name "Shape Measuring Laser Microscope VK-X100", KEYENCE CORPORATION), and the arithmetic mean surface roughness (Ra) was measured at a magnification of 10 times the eyepiece and 20 times the objective lens.

(2) Water contact angle

Using a contact angle meter "CA-X type" (manufactured by Kyowa Interface Science Co., Ltd.), one drop of the reagent was dropped on the surface of the pressure-sensitive adhesive layer, and the angle at that time was measured to measure the water contact angle.

(3) The value of the polar component of the surface free energy obtained from the Kaelble Uy equation

In the same manner as the measurement of the above-mentioned water contact angle, the diiodomethane contact angle of the pressure-sensitive adhesive layer surface was measured. Then, using the water contact angle measured in the contact angle evaluation as θw and the diiodomethane contact angle as θi, γs ^p was obtained from the following equations (2) and (3) as the value of the polar component of the surface free energy. value. It should be noted that γw is 72.8 mJ/m ² , γw ^d is 21.8 mJ/m ² , γw ^p is 51.0 mJ/m ² , γi is 50.8 mJ/m ² , γi ^d is 48.5 mJ/m ² , and γi ^p is 2.3mJ/m ² .

γw(1+cosθw)=2(γs ^d γw ^d ) ^1/2 +2(γs ^p γw ^p ) ^1/2 (2)

γi(1+cosθi)=2(γs ^d γi ^d ) ^1/2 +2(γs ^p γi ^p ) ^1/2 (3)

(4) Floating of semiconductor chip with die-bonding film

Using the trade name "ML300-Integration" (manufactured by Tokyo Seiki Co., Ltd.) as a laser processing device, the light-converging point was aligned with the inside of a 12-inch semiconductor wafer, and the laser was irradiated along the pre-segmentation lines in a lattice shape (10 mm × 10 mm). A modified region is formed inside the semiconductor wafer. The irradiation of the laser light was performed under the following conditions.

(A) Laser

(B) Condensing lens

magnification 50 times

NA 0.55

Transmittance to laser wavelength 60%

(C) Movement speed of the stage on which the semiconductor substrate is placed: 100 mm/sec

After forming the modified region inside the semiconductor wafer, a protective tape for back grinding is attached to the surface of the semiconductor wafer, and the back surface is ground using a back grinding machine (trade name "DGP 8760", manufactured by DISCO Inc.) The thickness of the semiconductor wafer was 30 μm.

The semiconductor wafer and the dicing ring on which the modified region was formed were bonded to the dicing die-bonding films obtained in Examples and Comparative Examples. Then, using a die separation apparatus (trade name "DDS2300", manufactured by DISCO Inc.), the semiconductor wafer and the die-bonding film were cut. Specifically, first, a cold expansion unit is used to perform cold expansion under the conditions of a temperature of -15° C., an expansion speed of 100 mm/sec, and an expansion amount of 15 mm, to cut the semiconductor wafer. After the cold expansion, it was confirmed that there was no problem with the dicing and the floating of the semiconductor chip with the die-bonding film.

After the severing of the semiconductor wafer and the die-bonding film, the above-mentioned cold expansion unit was used as it was, and room temperature expansion was performed under the conditions of room temperature, expansion speed of 0.3 mm/sec, and expansion amount of 8 mm. Then, the area of the portion where the die-bonding film floated from the dicing tape (the ratio of the area of the semiconductor chip with the die-bonding film that floated when the area of the entire die-bonding film was 100%) was observed with a microscope. The case where the ratio of the area of the raised portion was less than 30% was evaluated as ○, the case of 30 to 50% was evaluated as Δ, and the case exceeding 50% was evaluated as ×.

[Table 1]

[Table 2]

As a summary of the above, the constitution of the present invention and its modifications are attached below.

[1] A dicing die-bonding film comprising:

A dicing tape having a laminated structure comprising a substrate and an adhesive layer; and

an adhesive layer, which is adhered to the above-mentioned adhesive layer in the above-mentioned dicing tape in a releasable manner,

In the said pressure-sensitive adhesive layer, the water contact angle of the surface of the said pressure-sensitive adhesive layer close-contact side is 110 degrees or less, and the arithmetic mean surface roughness Ra is 1.0 micrometer or less.

[2] The dicing die-bonding film according to [1], wherein the water contact angle is 108° or less (preferably 105° or less).

[3] The dicing die-bonding film according to [1] or [2], wherein the water contact angle is 80° or more (preferably 84° or more, more preferably 88° or more).

[4] The dicing die-bonding film according to any one of [1] to [3], wherein the arithmetic mean surface roughness Ra is 0.5 μm or less (preferably 0.3 μm or less).

[5] The dicing die-bonding film according to any one of [1] to [4], wherein the contact angle using water and the contact angle of diiodomethane on the surface of the adhesive layer are based on Kaelble Uy The value of the polar component of the surface free energy obtained by the formula is 0.10 or more (preferably 0.20 or more, more preferably 0.40 or more).

[6] The dicing die-bonding film according to any one of [1] to [5], wherein the adhesive layer contains an acrylic polymer as a base polymer.

[7] The dicing die-bonding film according to [6], wherein the acrylic polymer contains, as a monomer component, a hydrocarbon group-containing (meth)acrylate which may have an alkoxy group.

[8] The dicing die-bonding film according to [7], wherein the total number of carbon atoms in the ester portion of the hydrocarbon group-containing (meth)acrylate optionally having an alkoxy group is 6 to 10.

[9] The dicing die-bonding film according to [6], wherein the total number of carbon atoms in the ester portion of the hydrocarbon group-containing (meth)acrylate optionally having an alkoxy group is 2 to 4.

[10] The dicing die-bonding film according to any one of [7] to [9], wherein the hydrocarbon group ( The ratio of meth)acrylate is 20 mol% or more (preferably 30 mol% or more, more preferably 40 mol% or more).

[11] The dicing die-bonding film according to any one of [6] to [10], wherein the acrylic polymer contains a hydroxyl group-containing monomer as a monomer component.

[12] The dicing die-bonding film according to [11], wherein the hydroxyl group-containing monomer is 2-hydroxyethyl (meth)acrylate.

[13] The dicing die-bonding film according to [11] or [12], wherein the ratio of the hydroxyl group-containing monomer in the total monomer components for forming the acrylic polymer is 5 to 80 mol %.

[14] The dicing die-bonding film according to any one of [6] to [13], wherein the acrylic polymer contains a nitrogen atom-containing monomer (preferably a morpholine group-containing monomer, more preferably (methyl) acryloyl morpholine) as a monomer component.

[15] The dicing die-bonding film according to [14], wherein the ratio of the nitrogen atom-containing monomer in the total monomer components for forming the acrylic polymer is 3 to 50 mol %.

[16] The dicing die-bonding film according to any one of [6] to [15], wherein the hydroxyl-containing monomer and the nitrogen-containing atom in all monomer components for forming the acrylic polymer The total ratio of the monomers is 10 to 60 mol %.

[17] The dicing die-bonding film according to any one of [6] to [16], wherein the acrylic polymer contains: a structural unit derived from a monomer having a first functional group; The structure part of the compound of the 2nd functional group and the radiation polymerizable functional group which react with the said 1st functional group.

[18] The dicing die-bonding film according to [17], wherein the combination of the first functional group and the second functional group is a combination of a hydroxyl group and an isocyanate group, or a combination of an isocyanate group and a hydroxyl group.

[19] The dicing die-bonding film according to [17], wherein the first functional group is a hydroxyl group and the second functional group is an isocyanate group.

[20] The dicing die-bonding film according to any one of [17] to [19], wherein the compound having the second functional group and the radiation polymerizable functional group is a radiation polymerizable carbon-carbon double bond (especially (meth)acryloyl group) and the compound of an isocyanate group.

[21] The dicing die-bonding film according to any one of [17] to [20], wherein the compound having the second functional group and a radiation polymerizable functional group is 2-(meth)acryloyloxyethy base isocyanate.

[22] The dicing die-bonding film according to any one of [17] to [21], wherein the structural unit derived from the monomer having the first functional group, the second functional group and the radiation polymerizable functional group The molar ratio of the compound is 0.95 or more (preferably 1.00 or more, more preferably 1.05 or more, further preferably 1.10 or more).

[23] The dicing die-bonding film according to any one of [17] to [22], wherein the structural unit derived from the monomer having the first functional group, the second functional group and the radiation polymerizable functional group The molar ratio of the compound is 10.00 or less (preferably 5.00 or less, more preferably 3.00 or less, further preferably 2.00 or less, further preferably 1.50 or less, particularly preferably 1.30 or less).

[24] The dicing die-bonding film according to any one of [1] to [23], wherein the pressure-sensitive adhesive layer contains a crosslinking agent (especially a polyisocyanate compound).

[25] The dicing die-bonding film according to [24], wherein the crosslinking agent is used in an amount of 0.1 to 5 parts by mass relative to 100 parts by mass of the base polymer.

[26] The dicing die-bonding film according to any one of [1] to [25], wherein the adhesive layer is a curing catalyst (particularly, dibutyltin dilaurate).

Claims (4)

1. A dicing die-bonding film comprising:

a dicing tape having a laminated structure including a substrate and an adhesive layer; and

an adhesive layer releasably adhered to the adhesive layer in the dicing tape,

in the pressure-sensitive adhesive layer, the surface of the pressure-sensitive adhesive layer on the side of adhesion has a water contact angle of 110 DEG or less and an arithmetic mean surface roughness Ra of 1.0 [ mu ] m or less.

2. The dicing die-bonding film according to claim 1, wherein the surface of the adhesive layer has a polar component value of surface free energy of 0.10 or more, which is obtained from the Kaelble Uy equation using a contact angle of water and a contact angle of diiodomethane.

3. The dicing die-bonding film according to claim 1 or 2, wherein the adhesive layer contains an acrylic polymer containing a hydrocarbon-based (meth) acrylate optionally having an alkoxy group, and a hydroxyl-containing monomer as monomer components.

4. The dicing die-bonding film according to claim 3, wherein the adhesive layer contains a polyisocyanate compound as a crosslinking agent.

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