CN101808473A - Device for improving bonding force of fine lines and manufacturing method thereof - Google Patents

Abstract

The present invention relates to a fine circuit bonding improvement device and a manufacturing method thereof, the method comprising the following steps: providing a circuit substrate with a completed inner layer circuit, wherein the circuit substrate has a patterned copper layer; conformably forming an adhesive resin on the patterned copper layer; and flatly forming a dielectric layer on the adhesive resin. The present invention uses an adhesive resin to replace the known roughening method, which can completely replace the known copper surface roughening or dielectric layer roughening process, not only saving the cost of the surface roughening process, but also reducing the chance of poor bonding due to different materials, improving the surface bonding, and thus improving the product yield.

Description

Device for improving bonding force of fine lines and manufacturing method thereof

technical field

The invention relates to a bonding force improving device and a manufacturing method thereof, in particular to a fine circuit bonding force improving device and a manufacturing method thereof.

Background technique

In recent years, as electronic products continue to pursue lightness, thinness, shortness, and smallness, printed circuit boards (printed circuit boards, PCBs) are gradually developing towards high density. In order to meet this trend, the circuit patterns of printed circuit boards need to be more precise Refinement and high density.

In the current circuit forming technology, the surface of the insulating layer is roughened (such as soaking in an oxidant) to make the surface of the insulating layer have a certain roughness, and then the desired circuit is formed on the insulating layer by an image transfer process. In recent years, the lines have been developed to fine lines (line width/line spacing below 15/15μm). When the surface roughness of the insulating layer is too large, it will be difficult to form fine lines, and if the surface roughness of the insulating layer is too small, it is easy to cause bonding. Insufficient force causes abnormal short circuit of the line, so the control of roughness is very important.

However, in the known surface roughening treatment, it is necessary to select a suitable roughening method according to different insulating layer materials, and the degree of roughening is limited by the condition parameters set by the process itself. Therefore, in order to cope with the process of fine lines, it is necessary to improve the current roughening process.

Therefore, the industry urgently needs to develop a surface treatment method that can take into account both the fine line structure and the bonding force in the fine line.

Contents of the invention

The invention provides a method for manufacturing a device for improving the bonding force of fine lines, which includes the following steps: providing a circuit substrate with an inner layer circuit, wherein the circuit substrate has a patterned copper layer; conforming to the patterned copper layer forming a viscous resin; and forming a dielectric layer on the viscous resin.

The present invention also provides a device for improving the bonding force of fine circuits, which includes: a circuit substrate with inner circuit completed, wherein the circuit substrate has a patterned copper layer; a viscous resin conformably formed on the patterned copper layer layer; a dielectric layer is formed overlying the adhesive resin.

The present invention uses viscous resin to replace the known roughening method, which can completely replace the known copper surface roughening or dielectric layer roughening process, which not only saves the surface roughening process cost, but also reduces the poor bonding caused by different materials Opportunities to improve surface adhesion, thereby increasing product yield.

In order to make the above and other objects, features, and advantages of the present invention more comprehensible, preferred embodiments are listed below and described in detail in conjunction with the accompanying drawings.

Description of drawings

1 to 3 are a series of cross-sectional views for illustrating the manufacturing process of an embodiment of the present invention.

4 to 6 are a series of cross-sectional views for illustrating the manufacturing process of another embodiment of the present invention.

7 to 9 are a series of cross-sectional views to illustrate the manufacturing process of another embodiment of the present invention

And, the reference numerals in the above-mentioned accompanying drawings are explained as follows:

100～circuit board substrate;

110～patterned copper layer;

120～through hole;

200～viscous resin;

300～dielectric layer;

400～hole opening;

600～layer-increasing lines;

800～solder-resistant insulating layer;

810～open;

900 ~ tin ball.

Detailed ways

The manufacturing method of the device for improving the bonding force of fine circuits according to the embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It should be noted that these drawings are all simplified schematic diagrams to emphasize the features of the present invention, so the dimensions of the components in the drawings are not completely drawn to actual scale. And the embodiments of the present invention may also include components not shown in the figure.

Referring to FIG. 1 to FIG. 3 , the first embodiment of the method of manufacturing the device for improving the bonding force of fine circuits in the present invention will be described in detail. Please refer to Fig. 1, at first provide a circuit substrate 100 that completes inner circuit, there is patterned copper layer 110 on this circuit substrate 100, and via hole 120, wherein the core material of circuit substrate 100 comprises paper phenolic resin (paper phenolic resin) resin), composite epoxy resin (composite epoxy), polyimide resin (polyimide resin) or glass fiber (glass fiber), and the copper layer 110 on the circuit board 100 utilizes known electroplating, lamination and coating process, and then use the image transfer process, that is, through the steps of covering photoresist, developing (developing), etching (etching) and stripping (striping), to form a patterned copper layer on the circuit board substrate 100 110.

而该黏性树脂的表面粗糙度约为0.3～0.5μm。Please refer to FIG. 2 , this step is a key step of the present invention. A layer of adhesive resin 200 is conformally formed on the patterned copper layer 110 by roller coating, doctor blade printing or spraying. The thickness of the viscous resin formed is about 20~

The surface roughness of the viscous resin is about 0.3-0.5 μm.

3, a dielectric layer 300 is formed on the adhesive resin 200, wherein the dielectric layer 300 includes epoxy resin (epoxy resin), bismaleimide-triazine resin (bismaleimide triacine, BT), ABF film (ajinomoto build-up film), polyphenylene oxide (polyphenylene oxide, PPE) or polytetrafluoroethylene (polytetrafluoroethylene, PTFE).

The present invention mainly uses the adhesive resin 200 to help the bonding between the patterned copper layer 110 and the dielectric layer 300, wherein the adhesive resin 200 preferably comprises a metal complex composed of a five-membered pyrrole heterocyclic ring structure. , using the functional groups of the metal complex to form chemical bonds with the patterned copper layer 110 and the dielectric layer 300 respectively, which can improve the problem of poor bonding between the two layers due to different materials, and effectively improve the bond between the two layers. Binding force. In addition, the resin component in the adhesive resin 200 may include epoxy resin, acrylic resin, fluorine resin, or a mixture thereof.

It should be noted here that in the known technology, before forming the dielectric layer, the surface of the copper layer will be roughened, for example, by chemical etching (such as formic acid etching) to form rough and uneven surfaces on the copper surface. However, the roughening method is not only difficult to control the process parameters, but also not suitable for fine line process. However, the present invention does not need complicated roughening process, but only needs to apply a layer of viscous resin 200 to help the adhesion between two layers of materials and enhance the bonding force between materials.

In addition to being used between the patterned copper layer 110 and the dielectric layer 300 , the adhesive resin 200 of the present invention can also be used in a subsequent process to replace the roughening step in the known process.

Please refer to FIG. 4 to FIG. 6 for another embodiment of the present invention. This is a process following FIG. Aperture 400 is the location for subsequent pre-generated build-up lines. Next, referring to FIG. 5, an adhesive resin 200 is conformably formed on the opening 400 and the dielectric layer 300. The adhesive resin 200 used here is the same as the above-mentioned adhesive resin 200, which can also improve The bond between the two materials, therefore, facilitates the subsequent formation of build-up circuitry 600 as shown in FIG. 6 .

Next, referring to FIG. 6 , a build-up circuit 600 is formed on the adhesive resin 200 , and the build-up circuit 600 is also a conductive material, such as a copper layer. In the method of forming a build-up circuit, an electroless electroplating step is first performed on the dielectric layer 300 and the opening 400, and then an electroplating step is performed to form a conductive metal layer on the dielectric layer 300 and in the opening 400, The desired build-up circuit 600 is then formed through a patterning process, and the build-up circuit 600 is electrically connected to the patterned copper layer 110 . In addition, to simplify the description, the build-up circuit in the figure has only one layer, but the build-up circuit 600 is not limited to one layer, and those skilled in the art can design multi-layer build-up circuits according to the requirements of the process.

It should be noted that, in the known technology, before forming the build-up circuit 600, the dielectric layer 300 will be subjected to surface roughening treatment, such as soaking in an oxidant, so that the dielectric layer 300 forms a rough surface. However, the roughening method is not only difficult to control the process parameters, but also not suitable for fine line process. However, the present invention does not require complex roughening process, but only needs to apply a layer of adhesive resin 200 to help the adhesion between the dielectric layer 300 and the build-up circuit 600 and improve the bonding force between materials. .

In addition, please refer to FIG. 7 to FIG. 9 for another embodiment of the present invention. This is the process following FIG. 5 . After the build-up circuit 600 is completed, the adhesive resin 200 is conformably formed on the build-up circuit 600, The material and function of the viscous resin 200 are the same as those of the first and second embodiments, and will not be repeated here.

Please refer to FIG. 8 , a solder resist insulating layer 800 is formed on the viscous resin 200. The solder resist insulating layer 800 is made of a solder resist material, such as green paint. The purpose of forming this solder resist insulating layer 800 is to protect the interior. Buried lines are used to avoid oxidation and soldering short circuit of buried lines. Then, a plurality of openings 810 are formed in the solder resist insulating layer 800 by an image transfer process, and then, referring to FIG. .

It should be noted here that in the known technology, before forming the solder resist insulating layer 800, the surface of the build-up circuit 600 will be roughened, for example, by soaking in an acidic solution to make the build-up circuit 600 rough and uneven. However, the roughening method is not only difficult to control the process parameters, but also not suitable for fine line process. However, the present invention does not require complex roughening process, but only needs to apply a layer of adhesive resin 200 to help the adhesion between the build-up circuit 600 and the solder resist insulating layer 800, and improve the bonding between materials. force.

而其粗糙度约为0.3～0.5μm；以及一介电层300，坦覆性地形成于黏性树脂200之上。The present invention provides a device for improving the bonding force of fine lines. As shown in FIG. The adhesive resin 200 is conformably formed on the patterned copper layer 110 by roller coating, doctor blade printing or spraying. The thickness of the adhesive resin 200 is about 20-

The roughness is about 0.3-0.5 μm; and a dielectric layer 300 is formed on the viscous resin 200 in a flat manner.

By virtue of the metal complexes contained in the adhesive resin 200 forming chemical bonds with the patterned copper layer 110 and the dielectric layer 300 respectively, the problem of poor bonding caused by different materials of the two layers is effectively improved, and the two layers are improved. the bonding force between them.

而其粗糙度约为0.3～0.5μm；以及一增层线路600，坦覆性地形成于黏性树脂200之上，形成增层线路的方法需先进行无电极电镀步骤，接着进行电镀步骤而达成，其中此增层线路600电性连接到图案化铜层110，而此增层线路可以是一或多层的增层线路。The present invention provides a device for improving the bonding force of fine lines. As shown in FIG. 6, in addition to the device described in FIG. The method uses an image transfer process; the viscous resin 200 is formed on the opening 400 and the dielectric layer 300 by roller coating, squeegee printing or spraying, wherein the material of the viscous resin 200 is the same as that described in FIG. 3 Similarly, the bonding force between the dielectric layer 300 and the build-up circuit 600 can also be improved, and the thickness of the adhesive resin 200 is about 20-

The roughness is about 0.3-0.5 μm; and a build-up circuit 600 is formed on the viscous resin 200 in a flat manner. The method of forming the build-up circuit needs to firstly perform an electroless plating step, followed by an electroplating step. It is achieved that the build-up wiring 600 is electrically connected to the patterned copper layer 110, and the build-up wiring may be one or more layers of build-up wiring.

而其粗糙度约为0.3～0.5μm；一抗焊绝缘层800，坦覆性地形成于黏性树脂200之上，其用以保护内埋的线路；多个开口810，形成于抗焊绝缘层800之中；多个锡球900，形成于开口810中，其中锡球900电性连接到增层线路600。In addition, the present invention further provides a device for improving the bonding force of fine lines, as shown in FIG. 9 , this device, in addition to the device described in FIG. Formed by spraying, it is conformably formed on the build-up circuit 600, wherein the material of the viscous resin 200 is the same as that described in FIG. , and the thickness of the viscous resin 200 is about 20~

The roughness is about 0.3-0.5 μm; a solder resist insulation layer 800 is formed on the viscous resin 200 to protect the embedded circuit; a plurality of openings 810 are formed on the solder resist insulation In the layer 800 ; a plurality of solder balls 900 are formed in the opening 810 , wherein the solder balls 900 are electrically connected to the build-up circuit 600 .

In summary, the device for improving the bonding force of fine lines and its manufacturing method of the present invention can completely replace the known copper surface roughening or dielectric layer roughening process by using viscous resin instead of the known roughening method, and can not only save Surface roughening process costs, and can reduce the chance of poor bonding due to different materials, improve surface bonding, and thus increase product yield.

Although the present invention has been disclosed above with several preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art may make arbitrary changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention should be determined by the scope defined by the appended claims.

Claims (17)

1. A method of manufacturing a device for improving the bonding force of fine lines, comprising the following steps: Provide a circuit substrate with inner circuit, wherein the circuit substrate has a patterned copper layer; conformally forming an adhesive resin over the patterned copper layer; and A dielectric layer is blanket formed on the adhesive resin. 2. The manufacturing method of the device for improving the bonding force of fine circuits according to claim 1, wherein the core material of the circuit substrate comprises paper phenolic resin, composite epoxy resin, polyimide resin or glass fiber. 3. The manufacturing method of the device for improving the bonding force of fine lines as claimed in claim 1, wherein the adhesive resin further comprises epoxy resin, acrylic resin, fluororesin, or a mixture thereof. 4. The manufacturing method of the device for improving the bonding force of fine lines as claimed in claim 1, wherein the dielectric layer comprises epoxy resin, bismaleimide-triazine resin, ABF film, polyphenylene oxide or polyphenylene ether. Tetrafluoroethylene. 5. The manufacturing method of the device for improving the bonding force of fine lines as claimed in claim 1, wherein the manufacturing method of forming the viscous resin comprises roller coating, doctor blade printing or spraying manufacturing method. 6. The method of manufacturing the device for improving the bonding force of fine circuits as claimed in claim 1, wherein the surface roughness of the adhesive resin is about 0.3-0.5 μm. 7. The manufacturing method of the device for improving the bonding force of fine lines as claimed in claim 1, wherein the thickness of the viscous resin is about 20-

8. The manufacturing method of the device for improving the bonding force of fine lines as claimed in claim 1, wherein after forming the dielectric layer over the adhesive resin, further comprising the following steps: forming a plurality of openings in the dielectric layer; conformally forming the adhesive resin over the openings and the dielectric layer; and A build-up circuit is formed on the adhesive resin, wherein the build-up circuit is electrically connected to the patterned copper layer. 9. The manufacturing method of the device for improving the bonding force of fine circuits as claimed in claim 1, further comprising the following steps after forming the build-up circuit on the adhesive resin: conformally forming the adhesive resin over the buildup lines; forming a solder resist insulating layer on the adhesive resin; patterning the solder resist insulating layer to form a plurality of openings in the solder resist insulating layer; and A plurality of solder balls are formed in the plurality of openings, wherein the plurality of solder balls are electrically connected to the build-up circuit. 10. A device for improving the bonding force of fine lines, comprising: A circuit substrate with inner layer circuit completed, wherein the circuit substrate has a patterned copper layer; an adhesive resin conformably formed on the patterned copper layer; A dielectric layer is formed overlying on the adhesive resin. 11. The device for improving the adhesion of fine lines as claimed in claim 10, wherein the core material of the circuit substrate comprises paper phenolic resin, composite epoxy resin, polyimide resin or glass fiber. 12. The device for improving the adhesion of fine lines as claimed in claim 10, wherein the adhesive resin further comprises epoxy resin, acrylic resin, fluororesin, or a mixture thereof. 13. The device for improving the adhesion of fine lines as claimed in claim 10, wherein the dielectric layer comprises epoxy resin, bismaleimide-triazine resin, ABF film, polyphenylene ether or polytetrafluoroethylene . 14. The fine circuit bonding force improving device as claimed in claim 10, wherein the surface roughness of the adhesive resin is about 0.3-0.5 μm. 15. The device for improving the bonding force of fine lines as claimed in claim 10, wherein the adhesive resin has a thickness of about 20-

16. The device for improving bonding force of fine lines according to claim 10, further comprising: a plurality of openings formed in the dielectric layer; the adhesive resin is conformably formed over the plurality of openings and the dielectric layer; and A build-up line is formed over the adhesive resin, wherein the build-up line is electrically connected to the patterned copper layer. 17. The device for improving bonding force of fine lines according to claim 10, further comprising: the adhesive resin is conformably formed on the build-up circuit; a solder resist insulating layer is formed on the viscous resin; a plurality of openings formed in the solder resist insulating layer; and A plurality of solder balls are formed in the opening, wherein the plurality of solder balls are electrically connected to the build-up circuit.

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