[go: up one dir, main page]

CN1097095C - 以沉淀硬化和固溶硬化为特征的铜基合金 - Google Patents

以沉淀硬化和固溶硬化为特征的铜基合金 Download PDF

Info

Publication number
CN1097095C
CN1097095C CN98810040A CN98810040A CN1097095C CN 1097095 C CN1097095 C CN 1097095C CN 98810040 A CN98810040 A CN 98810040A CN 98810040 A CN98810040 A CN 98810040A CN 1097095 C CN1097095 C CN 1097095C
Authority
CN
China
Prior art keywords
alloy
content
copper
present
hardening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN98810040A
Other languages
English (en)
Chinese (zh)
Other versions
CN1275171A (zh
Inventor
戴维·H·曼德尔
丹尼尔·D·法夸尔森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Miller Co
Original Assignee
Miller Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Miller Co filed Critical Miller Co
Publication of CN1275171A publication Critical patent/CN1275171A/zh
Application granted granted Critical
Publication of CN1097095C publication Critical patent/CN1097095C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
  • Laminated Bodies (AREA)
CN98810040A 1997-09-05 1998-08-21 以沉淀硬化和固溶硬化为特征的铜基合金 Expired - Fee Related CN1097095C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US5777997P 1997-09-05 1997-09-05
US60/057,779 1997-09-05

Publications (2)

Publication Number Publication Date
CN1275171A CN1275171A (zh) 2000-11-29
CN1097095C true CN1097095C (zh) 2002-12-25

Family

ID=22012718

Family Applications (1)

Application Number Title Priority Date Filing Date
CN98810040A Expired - Fee Related CN1097095C (zh) 1997-09-05 1998-08-21 以沉淀硬化和固溶硬化为特征的铜基合金

Country Status (12)

Country Link
EP (1) EP1021575B1 (de)
JP (1) JP2001515960A (de)
KR (1) KR20010023699A (de)
CN (1) CN1097095C (de)
AR (1) AR017044A1 (de)
AT (1) ATE240413T1 (de)
AU (1) AU9108398A (de)
BR (1) BR9811448A (de)
CA (1) CA2303164A1 (de)
DE (1) DE69814657T2 (de)
TW (1) TW364019B (de)
WO (1) WO1999013117A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101939460B (zh) * 2008-02-08 2012-09-05 三井住友金属矿山伸铜株式会社 沉淀硬化型铜合金条的制造方法

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7163753B2 (en) 2002-04-15 2007-01-16 Sumitomo Wiring Systems, Ltd. Arc-resistant terminal, arc-resistant terminal couple and connector or the like for automobile
JP4100629B2 (ja) * 2004-04-16 2008-06-11 日鉱金属株式会社 高強度高導電性銅合金
WO2007138956A1 (ja) 2006-05-26 2007-12-06 Kabushiki Kaisha Kobe Seiko Sho 高強度、高導電率および曲げ加工性に優れた銅合金
WO2010030031A1 (ja) * 2008-09-10 2010-03-18 大豊工業株式会社 ＰｂフリーＣｕ-Ｂｉ系焼結材料製摺動部品
CN106435250A (zh) * 2009-04-08 2017-02-22 瑞士金属-Ums瑞士金属加工有限公司 可机加工的铜基合金和生产它的方法
CN113646116A (zh) * 2019-02-07 2021-11-12 埃奎斯费雷斯公司 用于包括再熔工艺的应用的具有低沉淀物密度的合金及其制备方法
KR102107585B1 (ko) * 2019-11-22 2020-05-07 주식회사 풍산 내마모성이 우수한 동합금재 및 이의 제조방법
CN110923505B (zh) * 2019-12-31 2021-11-02 内蒙古工业大学 Cu-Ni-Mn合金及其制备方法和应用
CN113249612A (zh) * 2021-04-21 2021-08-13 铁岭富兴铜业有限公司 新型触点铜合金及其制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4337089A (en) * 1980-07-25 1982-06-29 Nippon Telegraph And Telephone Public Corporation Copper-nickel-tin alloys for lead conductor materials for integrated circuits and a method for producing the same
JPH02197543A (ja) * 1989-01-26 1990-08-06 Furukawa Electric Co Ltd:The 接続機器用銅合金

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU219368A1 (de) * 1966-07-16 1968-05-30 Припой Пайки Меди
JPS61143564A (ja) * 1984-12-13 1986-07-01 Nippon Mining Co Ltd 高力高導電性銅基合金の製造方法
JPH02122039A (ja) * 1988-10-31 1990-05-09 Nippon Mining Co Ltd 酸化膜密着性に優れた高力高導電銅合金
JPH0776397B2 (ja) * 1989-07-25 1995-08-16 三菱伸銅株式会社 Ｃｕ合金製電気機器用コネクタ
JP2780584B2 (ja) * 1992-11-13 1998-07-30 三菱伸銅株式会社 熱間加工性および打抜き加工性に優れた電気電子部品用Ｃｕ合金

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4337089A (en) * 1980-07-25 1982-06-29 Nippon Telegraph And Telephone Public Corporation Copper-nickel-tin alloys for lead conductor materials for integrated circuits and a method for producing the same
JPH02197543A (ja) * 1989-01-26 1990-08-06 Furukawa Electric Co Ltd:The 接続機器用銅合金

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101939460B (zh) * 2008-02-08 2012-09-05 三井住友金属矿山伸铜株式会社 沉淀硬化型铜合金条的制造方法

Also Published As

Publication number Publication date
TW364019B (en) 1999-07-11
AU9108398A (en) 1999-03-29
DE69814657T2 (de) 2004-03-25
CN1275171A (zh) 2000-11-29
JP2001515960A (ja) 2001-09-25
KR20010023699A (ko) 2001-03-26
EP1021575A1 (de) 2000-07-26
WO1999013117A1 (en) 1999-03-18
EP1021575B1 (de) 2003-05-14
DE69814657D1 (de) 2003-06-18
BR9811448A (pt) 2000-08-22
CA2303164A1 (en) 1999-03-18
AR017044A1 (es) 2001-08-22
ATE240413T1 (de) 2003-05-15

Similar Documents

Publication Publication Date Title
CN1040891C (zh) 具有高强度和高导电性的铜合金
CN1102963C (zh) 铜合金及其生产方法
CN1302145C (zh) 含银的铜合金
CN1183263C (zh) 用于电子和电机械和工具的零部件的铜合金材料
CN1177946C (zh) 连接器用铜合金及其制造方法
CN1250756C (zh) 具有良好弯曲特性的高强度铜合金及其制造方法,及使用该铜合金的接线端连接器
CN1800426A (zh) 铜基合金及其制造方法
CN1950525A (zh) 铜合金
CN101041868A (zh) 含钴、镍和硅的铜合金
CN1930314A (zh) 铜合金及其制造方法
JP2002180165A (ja) プレス打ち抜き性に優れた銅基合金およびその製造方法
CN1097095C (zh) 以沉淀硬化和固溶硬化为特征的铜基合金
CN1182271C (zh) 铜合金
JP5555580B2 (ja) 熱伝導性、強度及び成形性に優れたアルミニウム合金およびその製造方法
CN1086207C (zh) 晶粒细化的锡黄铜
CN1924049A (zh) 铜合金材料及其制造方法
CN110306077B (zh) 一种电连接器用耐蚀铜合金及其制备方法
US6379478B1 (en) Copper based alloy featuring precipitation hardening and solid-solution hardening
JP2956696B1 (ja) 高強度・高導電性銅合金およびその加工方法
JP2020033609A (ja) Ａｌ−Ｍｇ―Ｓｉ系合金板
EP1264905A2 (de) Legierung auf Kupferbasis, gekennzeichnet durch Ausscheidungshärtung und Härtung in der festen Lösung
CN1926253A (zh) 铜合金
CN1696320A (zh) Cu－Ni－Si－Mg系铜合金条
JP4257179B2 (ja) 成形加工用ｔ４処理アルミニウム合金圧延板およびその製造方法
HK1111442A (en) Copper alloy containing cobalt, nickel and silicon

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C19 Lapse of patent right due to non-payment of the annual fee
CF01 Termination of patent right due to non-payment of annual fee