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BR9811448A - Liga com base em cobre retratando têmpera por precipitação e têmpera por solução sólida - Google Patents

Liga com base em cobre retratando têmpera por precipitação e têmpera por solução sólida

Info

Publication number
BR9811448A
BR9811448A BR9811448-4A BR9811448A BR9811448A BR 9811448 A BR9811448 A BR 9811448A BR 9811448 A BR9811448 A BR 9811448A BR 9811448 A BR9811448 A BR 9811448A
Authority
BR
Brazil
Prior art keywords
quenching
solid solution
based alloy
copper based
weight
Prior art date
Application number
BR9811448-4A
Other languages
English (en)
Inventor
David H Mandle
Daniel D Farquharson
Original Assignee
Miller Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Miller Co filed Critical Miller Co
Publication of BR9811448A publication Critical patent/BR9811448A/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
  • Laminated Bodies (AREA)

Abstract

Patente de Invenção: <B>"LIGA COM BASE EM COBRE RETRATANDO TêMPERA POR PRECIPITAçãO E TêMPERA POR SOLUçãO SóLIDA"<D>. Uma liga de broze fosforoso consistindo de: 0,4 a 3,0 % em peso de Ni, 1,0 a 11,0 % em peso de Sn, 0,1 a 1,0 % em peso de Si, 0,01 a 0,35 % em peso de P, o restante sendo substancialmente Cu. A liga é adequada para condutores de chumbo elétricos e para interconexões elétricas ou eletrónicas.
BR9811448-4A 1997-09-05 1998-08-21 Liga com base em cobre retratando têmpera por precipitação e têmpera por solução sólida BR9811448A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US5777997P 1997-09-05 1997-09-05
PCT/US1998/017196 WO1999013117A1 (en) 1997-09-05 1998-08-21 Copper based alloy featuring precipitation hardening and solid-solution hardening

Publications (1)

Publication Number Publication Date
BR9811448A true BR9811448A (pt) 2000-08-22

Family

ID=22012718

Family Applications (1)

Application Number Title Priority Date Filing Date
BR9811448-4A BR9811448A (pt) 1997-09-05 1998-08-21 Liga com base em cobre retratando têmpera por precipitação e têmpera por solução sólida

Country Status (12)

Country Link
EP (1) EP1021575B1 (pt)
JP (1) JP2001515960A (pt)
KR (1) KR20010023699A (pt)
CN (1) CN1097095C (pt)
AR (1) AR017044A1 (pt)
AT (1) ATE240413T1 (pt)
AU (1) AU9108398A (pt)
BR (1) BR9811448A (pt)
CA (1) CA2303164A1 (pt)
DE (1) DE69814657T2 (pt)
TW (1) TW364019B (pt)
WO (1) WO1999013117A1 (pt)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10317330B4 (de) * 2002-04-15 2013-12-24 Autonetworks Technologies, Ltd. Lichtbogenbeständiger Anschluss, Verwendung davon für ein lichtbogenbeständiges Anschlusspaar, für einen Verbinder, für einen Anschlusskasten, für eine Unterbrechervorrichtung oder dgl. und für ein Kraftfahrzeug und einen Motor
JP4100629B2 (ja) * 2004-04-16 2008-06-11 日鉱金属株式会社 高強度高導電性銅合金
WO2007138956A1 (ja) 2006-05-26 2007-12-06 Kabushiki Kaisha Kobe Seiko Sho 高強度、高導電率および曲げ加工性に優れた銅合金
WO2009098810A1 (ja) * 2008-02-08 2009-08-13 Mitsui Mining & Smelting Co., Ltd. 析出硬化型銅合金条の製造方法
WO2010030031A1 (ja) * 2008-09-10 2010-03-18 大豊工業株式会社 ＰｂフリーＣｕ-Ｂｉ系焼結材料製摺動部品
CN106435250A (zh) * 2009-04-08 2017-02-22 瑞士金属-Ums瑞士金属加工有限公司 可机加工的铜基合金和生产它的方法
EP3921104A4 (en) * 2019-02-07 2022-10-19 Equispheres Inc. LOW PRECIPITATION DENSITY ALLOYS FOR USE IN REMELTING PROCESS APPLICATIONS AND PROCESSES FOR THEIR MANUFACTURE
KR102107585B1 (ko) * 2019-11-22 2020-05-07 주식회사 풍산 내마모성이 우수한 동합금재 및 이의 제조방법
CN110923505B (zh) * 2019-12-31 2021-11-02 内蒙古工业大学 Cu-Ni-Mn合金及其制备方法和应用
CN113249612A (zh) * 2021-04-21 2021-08-13 铁岭富兴铜业有限公司 新型触点铜合金及其制备方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU219368A1 (pt) * 1966-07-16 1968-05-30 Припой Пайки Меди
JPS5727051A (en) * 1980-07-25 1982-02-13 Nippon Telegr & Teleph Corp <Ntt> Copper nickel tin alloy for integrated circuit conductor and its manufacture
JPS61143564A (ja) * 1984-12-13 1986-07-01 Nippon Mining Co Ltd 高力高導電性銅基合金の製造方法
JPH02122039A (ja) * 1988-10-31 1990-05-09 Nippon Mining Co Ltd 酸化膜密着性に優れた高力高導電銅合金
JPH02197543A (ja) * 1989-01-26 1990-08-06 Furukawa Electric Co Ltd:The 接続機器用銅合金
JPH0776397B2 (ja) * 1989-07-25 1995-08-16 三菱伸銅株式会社 Ｃｕ合金製電気機器用コネクタ
JP2780584B2 (ja) * 1992-11-13 1998-07-30 三菱伸銅株式会社 熱間加工性および打抜き加工性に優れた電気電子部品用Ｃｕ合金

Also Published As

Publication number Publication date
EP1021575B1 (en) 2003-05-14
AR017044A1 (es) 2001-08-22
AU9108398A (en) 1999-03-29
EP1021575A1 (en) 2000-07-26
CN1275171A (zh) 2000-11-29
DE69814657T2 (de) 2004-03-25
TW364019B (en) 1999-07-11
DE69814657D1 (de) 2003-06-18
WO1999013117A1 (en) 1999-03-18
CN1097095C (zh) 2002-12-25
JP2001515960A (ja) 2001-09-25
KR20010023699A (ko) 2001-03-26
CA2303164A1 (en) 1999-03-18
ATE240413T1 (de) 2003-05-15

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Legal Events

Date Code Title Description
PC Transfer

Free format text: DUERER CORPORATION (US)

TC Change of name
B07A Application suspended after technical examination (opinion) [chapter 7.1 patent gazette]
B09B Patent application refused [chapter 9.2 patent gazette]

Free format text: INDEFERIMENTO COM BASE NO ART. 8O COMBINADO COM ART.13 DA LPI 9.279 DE 14/05/1996.