CN108074838A - Substrate wet processing device - Google Patents

Abstract

The invention discloses a substrate wet processing device, which comprises a soaking tank, a spray rinsing processing tank, a conveying carrier and a control unit. The control unit controls wet processing of the plurality of substrates. The soaking tank comprises a multi-piece containing part, and the control unit respectively controls the soaking time sequence of each substrate in the multi-piece containing part. The spray washing treatment tank is adjacent to the soaking tank. The control unit controls the conveying carrier to transfer a first substrate to the multi-sheet accommodating part; transferring a second substrate to the multi-sheet accommodating part after a certain time interval; transferring the first substrate to a spray rinsing processing tank after a soaking processing time; after a time of spray rinsing treatment, removing the first substrate; and transferring the second substrate to a spray rinsing processing tank after the soaking processing time. The control unit schedules the interval time according to the spray rinsing processing time.

Description

Substrate wet processing device

technical field

The invention relates to a substrate wet processing device.

Background technique

In the semiconductor process, it is necessary to perform multiple cleaning procedures on the substrate (such as a wafer) to remove impurities on the surface of the substrate. Or, after forming a pattern on the substrate (such as a wafer) by photolithography, it is necessary to remove the photoresist (Photo Resistor, PR) or the metal film (Metal Film) through multiple cleaning procedures. Generally speaking, the substrate is soaked in a chemical solution first, then the substrate is cleaned by spray washing, and finally the substrate is dried by rotation, and each step uses a single-wafer horizontal processing unit. Therefore, each substrate needs to be soaked before subsequent steps such as cleaning and drying can be performed. Since the processing time of each step is different, such as a longer soaking time, the utilization efficiency of the substrate processing equipment is not good.

In order to improve the aforementioned situation, a substrate processing equipment with a batch-type soaking tank appears on the market. Multiple substrates are placed in the soaking tank at one time, and the soaking process is performed in batches. Through the design of batch soaking tanks, the utilization efficiency of substrate processing equipment is improved. However, if the follow-up procedure is still carried out using a single-wafer horizontal processing unit, it is still necessary to sequentially take out the substrates (1 piece/time) from the batch type soaking tank for cleaning, drying and other steps. Therefore, the design of the batch type soaking tank will cause the soaking time of each substrate that must maintain the same process conditions to be different (for example, if one substrate is taken out sooner, the soaking time will be shorter; on the contrary, the soaking time of the other substrate will be shorter. Long), the effect after soaking is also different. However, the subsequent cleaning and drying under the same conditions will make the cleaning degree of each substrate different, which will reduce the yield rate instead, and there is a need for improvement.

Contents of the invention

In view of the above problems, the main purpose of the present invention is to provide a substrate wet processing device, the substrate wet processing device includes a soaking tank with a multi-piece container, and the control unit controls the wet processing of a plurality of substrates, and by The transport carrier separately controls the soaking treatment sequence of each substrate in the multi-piece container (such as the first substrate and the second substrate), and the control unit schedules the soaking treatment sequence according to the spray cleaning treatment time required by the spray cleaning treatment tank, In order to solve the problem of substrate wet processing in the existing substrate processing device.

To achieve the above object, the present invention provides a substrate wet processing device, which includes a soaking tank, a spraying treatment tank, a transport carrier and a control unit. The control unit controls wet processing of a plurality of substrates. The soaking tank includes a multi-chip accommodating part, wherein the control unit respectively controls the soaking treatment sequence of each substrate in the multi-chip accommodating part. The spraying treatment tank is adjacent to the soaking tank and has at least one single-piece spraying unit. The transport carrier transfers each substrate between the soaking tank and the spraying treatment tank. The control unit controls the conveying carrier to transfer a first substrate among the substrates to the multi-chip container of the soaking tank, and after an interval time, transfers a second substrate among the substrates to the multi-chip container of the soaking tank. The first substrate is transferred from the soaking tank to the single-piece spraying unit of the spraying treatment tank after a soaking treatment time for spraying treatment, and after a spraying treatment time, the first substrate is removed from the single-piece spraying unit After the soaking treatment time, the substrate and the second substrate are successively transferred from the soaking tank to the single-chip spraying unit in the spraying treatment tank for spraying treatment, wherein the control unit schedules the interval time according to the spraying treatment time.

According to an embodiment of the present invention, the substrate wet processing device further includes a cleaning and drying unit, which is adjacent to the single-wafer spray cleaning unit, wherein the transport carrier transfers each of the substrates from the single-wafer spray cleaning unit to the cleaning and drying unit. unit.

According to an embodiment of the present invention, the cleaning and drying unit is arranged in the spray cleaning treatment tank, and each of the substrates is firstly sprayed and then cleaned and dried.

According to an embodiment of the present invention, the cleaning and drying unit includes a cleaning solution supply unit and a volatile solution supply unit, and the cleaning and drying unit applies a cleaning solution and a volatile solution to the substrate.

According to an embodiment of the present invention, the multi-piece accommodating portion is a horizontal multi-piece accommodating portion.

According to an embodiment of the present invention, the multi-piece accommodating portion is a vertical multi-piece accommodating portion.

According to an embodiment of the present invention, the monolithic spray washing unit is a vertical monolithic spray washing unit.

According to one embodiment of the present invention, the single-chip spray cleaning unit includes a spray cleaning tank and at least one fluid spray head, the fluid spray head is arranged on at least one side wall of the spray cleaning tank, and each of the substrates is sprayed on the spray cleaning tank. Moving vertically in the tank, the fluid spray head sprays each of the substrates.

According to an embodiment of the present invention, when the substrate moves vertically upwards in the spray cleaning tank, the fluid spray head sprays the substrate.

According to an embodiment of the present invention, the immersion tank includes a flow field control unit for processing substrates in a vertical multi-chip container with a downflow flow field.

According to an embodiment of the present invention, the conveying carrier carries the substrate vertically and moves to the vertical multi-chip accommodating portion and the vertical single-chip spray cleaning unit.

According to an embodiment of the present invention, the conveying carrier further includes a moving track disposed above the soaking tank and the spraying treatment tank.

According to an embodiment of the present invention, the vertical multi-piece accommodation part includes a plurality of single-piece accommodation slots, and each of the single-piece accommodation slots and the vertical single-piece spraying unit includes a processing carrier, The transport carrier carries the substrate to the processing carrier, and the processing carrier carries the substrate up and down and puts it into one of the single-piece accommodation slots or the vertical single-piece spray cleaning unit.

According to an embodiment of the present invention, the transporting carrier includes an additional circuit board, and the transporting carrier moves the additional circuit board and is lifted and lowered by the carrier substrate of the additional circuit board, so as to be put into the soaking tank or the spraying treatment tank.

According to an embodiment of the present invention, the substrate wet processing device further includes a pre-soaking spray cleaning unit, which is adjacent to the multi-chip accommodating part. The control unit first controls the transport carrier to transfer the substrate to the pre-soaking spray cleaning unit for spray cleaning. , and then transferred to the multi-piece container.

According to an embodiment of the present invention, the pre-soaking spray unit is arranged in the soaking tank, and the substrate is first sprayed and then transferred to the multi-chip accommodating part for soaking.

According to an embodiment of the present invention, the substrate wet processing device further includes a gas spraying unit, which is disposed above at least one of the soaking tank or the spraying treatment tank, and performs gas spraying when the substrate is moved out of the tank.

According to an embodiment of the present invention, the spray cleaning treatment tank is provided with a plurality of the single-chip spray cleaning units, and the control unit schedules the interval time according to the spray cleaning treatment time of the multiple single-chip spray cleaning units.

According to an embodiment of the present invention, the soaking treatment time of the substrate is longer than the spray cleaning treatment time, and the control unit schedules the interval time according to the soaking treatment time and the spray cleaning treatment time.

According to an embodiment of the present invention, the soaking treatment time of each of the substrates is separately controlled by the control unit, and the control unit schedules the interval time according to the soaking treatment time and the spray cleaning treatment time of each of the substrates.

As mentioned above, the substrate wet processing device according to the present invention includes a soaking tank, a spray cleaning tank, a transport carrier and a control unit. The soaking tank includes a multi-piece accommodating part, and the spraying treatment tank is adjacent to the soaking tank. The control unit controls the wet processing of multiple substrates, and separately controls the soaking processing sequence of each substrate in the multi-chip accommodating part through the conveying carrier. Wherein, a plurality of substrates are placed in the multi-piece accommodation part, and each substrate of the same process condition is respectively subjected to the same soaking treatment time, and then sequentially moved to the spray cleaning treatment tank. Since the soaking treatment time of each substrate is the same, it is possible to avoid the difference in cleaning degree caused by different soaking times, thereby improving the yield rate.

In addition, the interval between placing the first substrate and the second substrate in the soaking tank is greater than or equal to the spray cleaning treatment time, which can ensure that after the spray cleaning of the first substrate ranked earlier is completed, the soaking of the second substrate ranked later is completed. Therefore, the second substrates that are sorted later can smoothly move to the spray cleaning tank without being hindered by the first substrates that are sorted earlier.

In addition, in the substrate wet processing device of the present invention, the control unit can process multiple substrates with different process conditions according to process requirements. The soaking treatment time required by different process conditions is different, and the specific soaking treatment time required for each substrate can be controlled separately by the control unit; and the control unit schedules according to the soaking treatment time and spray cleaning treatment time of each substrate Intervals.

Description of drawings

FIG. 1 is a schematic diagram of a substrate wet processing device according to an embodiment of the present invention.

Fig. 2 is a schematic cross-sectional view of the soaking tank, the spraying treatment tank and the cleaning and drying unit shown in Fig. 1 .

FIG. 3 is a three-dimensional schematic diagram of the soaking tank and the spraying treatment tank shown in FIG. 1 .

FIG. 4 is a schematic flowchart of a substrate wet processing method according to an embodiment of the present invention.

FIG. 5 is a schematic diagram of the operation of the soaking tank shown in FIG. 3 .

Fig. 6 is a schematic diagram of a soaking tank according to another embodiment of the present invention.

Fig. 7 is a schematic diagram of the downflow flow field of the soaking tank shown in Fig. 3 .

Fig. 8 is a schematic diagram of a spray cleaning treatment tank according to another embodiment of the present invention.

Fig. 9 is a schematic diagram of a spray washing treatment tank and a washing and drying unit according to another embodiment of the present invention.

Fig. 10 is a schematic diagram of a spray washing treatment tank and a washing and drying unit according to another embodiment of the present invention.

FIG. 11 is a schematic diagram of a substrate wet processing device according to another embodiment of the present invention.

Wherein reference sign is:

Substrate wet processing device 1, 1d

Soaking tank 10, 10a, 10d

Multi-piece housing part 11, 11a, 11d

Single-piece storage slot 111d

Substrate horizontal and vertical conversion units 12, 12d

Spray washing treatment tanks 20, 20a, 20b, 20c, 20d

Single-piece spray washing unit 21, 21a, 21b, 21c, 21d

Spray tank 211

Fluid Nozzle 212

Treatment liquid collection unit 22c

Conveyor 30

Additional circuit board 31, 31d

Moving part 32, 32d

Moving track 33, 33d

control unit 40

Washing and drying unit 50, 50b, 50c

Washing liquid supply unit 51, 51b, 51c

Washing liquid collection unit 52c

Gas spray unit 60

Handle carrier A

Substrate S

first substrate S1

Second Substrate S2

Detailed ways

In order to enable your review committee members to better understand the technical content of the present invention, the preferred specific embodiments are described as follows.

Fig. 1 is a schematic diagram of a substrate wet processing device according to an embodiment of the present invention; Fig. 2 is a schematic cross-sectional view of the soaking tank, the spraying treatment tank and the cleaning and drying unit shown in Fig. 1; Fig. 3 is the soaking tank shown in Fig. 1 and the three-dimensional schematic diagram of the spraying treatment tank, please refer to Fig. 1, Fig. 2 and Fig. 3 together. The substrate wet processing device 1 of this embodiment is used to process a plurality of substrates S, and processes such as immersion, spray washing, cleaning and drying are respectively performed on the plurality of substrates S, and the operating parts are the first substrate S1 and the second substrate S The second substrate S2 is described as an example. The substrate wet processing device 1 of this embodiment includes a soaking tank 10 , a spray cleaning tank 20 , a transport carrier 30 , a control unit 40 and a cleaning and drying unit 50 . Wherein, the spraying treatment tank 20 is adjacent to the soaking tank 10, and the transport carrier 30 moves between the soaking tank 10 and the spraying treatment tank 20, thereby transferring each substrate S to the soaking tank 10 and the spraying treatment tank 20 .

In addition, the control unit 40 of this embodiment has performed wet processing on a plurality of substrates S by controlling the movement of the transport carrier 30, and separately controls each substrate S (first substrate S1, second substrate S2) to Sequence of immersion treatment of the multi-chip container 11 of the immersion tank 10 . Moreover, the control unit 40 stores a substrate wet processing method (program), as shown in FIG. 4 , which is a schematic flowchart of a substrate wet processing method according to an embodiment of the present invention. The control unit 40 can control the transport carrier 30 to perform the following steps: transfer the first substrate among the plurality of substrates to the multi-chip accommodating portion of the soaking tank (step S10); after an interval, transfer the second substrate among the plurality of substrates Substrates to the multi-chip accommodating part of the soaking tank (step S20); after a soaking treatment time, the first substrate is transferred from the soaking tank to the single-chip spraying unit of the spraying treatment tank for spraying treatment (step S30); After a spraying treatment time, the first substrate is removed from the single-piece spraying unit (step S40); and the second substrate is transferred from the soaking tank to the single-piece spraying unit of the spraying treatment tank after the soaking time A spray cleaning process is performed (step S50). The structural features of the substrate wet processing apparatus 1 of the present embodiment will be further described in conjunction with each step below.

Step S10 : transferring the first substrate S1 among the plurality of substrates S to the multi-piece accommodating portion 11 of the soaking tank 10 .

The soaking tank 10 of the present embodiment contains soaking liquid, and includes a multi-piece accommodating portion 11 , which can accommodate a plurality of substrates S. As shown in FIG. Wherein, the multi-piece accommodating portion 11 can be horizontal or vertical, preferably vertical. The multi-piece accommodating portion 11 in this embodiment is a vertical multi-piece accommodating portion. The vertical design not only achieves the effect of saving space, but also enables the transport carrier 30 to clamp and transfer the substrate S specified by the control unit 40 without being limited by space. The transport carrier 30 of this embodiment is movably disposed in the soaking tank 10 and the spraying treatment tank 20 , and the transport carrier 30 vertically carries the substrate S. As shown in FIG. In detail, the transport carrier 30 includes an additional circuit board 31 , a moving part 32 and a moving track 33 . The additional circuit board 31 is used to receive the substrate S, so that the substrate S can be lifted and placed into the soaking tank 10 and the spraying treatment tank 20 . The moving track 33 is arranged above the soaking tank 10 and the spraying treatment tank 20 . The moving part 32 is disposed on two sides of the additional circuit board 31 and partially accommodated in the moving track 33 , so that the moving part 32 can move along the moving track 33 to drive the additional circuit board 31 to move the substrate S to a designated position. Each processing step is a single-piece processing of each substrate, so a single moving part 32 can be relied on to go back and forth between the soaking tank 10 and the spraying processing tank 20 to clamp and transfer the clamped substrate S specified by the control unit 40 . In other embodiments, a plurality of moving parts 32 may also be provided according to technological requirements, which is not limited by the present invention.

Generally speaking, the substrate S is sent into the substrate wet processing device 1 in a horizontal state by a mechanism such as a robot arm, so there is still a space in front of the soaking tank 10 where the substrate S in a horizontal state can be placed and a substrate horizontal-vertical conversion unit 12 . Preferably, the soaking tank 10 of this embodiment has a substrate horizontal-vertical conversion unit 12 , which converts the substrate S into a vertical state after receiving the substrate S in a horizontal state, and receives it by the additional circuit board 31 of the transport carrier 30 . Please match it as shown in Figure 5, which is a schematic diagram of the operation of the soaking tank shown in Figure 3. After the moving part 32 drives the additional circuit board 31 and the substrate S to move to a designated position, for example, the position where the substrate S has not been placed in the multi-piece accommodating part 11, the substrate S (taking the first substrate S1 as an example) is placed vertically. In the multi-chip accommodating part 11, at the same time, the control unit 40 records the placement time.

In other embodiments, please refer to FIG. 1 , the substrate horizontal-vertical conversion unit 12 is disposed between the spraying treatment tank 20 and the cleaning and drying unit 50 , and converts the substrate S in a vertical state into a horizontal state.

In other embodiments, the multi-piece accommodating portion 11a can also be horizontal, as shown in FIG. 6 , which is a schematic diagram of a soaking tank according to another embodiment of the present invention. The soaking tank 10a of this embodiment has a horizontal multi-chip accommodating portion 11a, and only needs to be equipped with other mechanisms so that the transport carrier 30 can take out one substrate at a time. Moreover, the horizontal design can make the substrate S not need to be converted into a vertical state when it enters the soaking tank 10a.

Step S20 : After an interval time, the second substrate S2 among the plurality of substrates S is transferred, and placed in the multi-piece accommodating portion 11 of the soaking tank 10 .

In other words, the conveying carrier 30 first transfers the first substrate S1 to the multi-piece container 11 to perform the soaking process (step S10), and then transfers the second substrate S2 to the multi-chip container 11 to perform the soaking process after an interval of time (step S10). Step S20 ), after repeated several times, can place multiple pieces of substrates S in the multi-piece container 11 to perform the soaking process. It should be noted that each substrate S (taking the first substrate S1 and the second substrate S2 as an example) enters and exits the soaking tank 10 independently, and the time difference between the placement times is the aforementioned interval time. In other words, the difference between the placement time of the first substrate S1 and the second substrate S2 is the aforementioned interval time. Therefore, after the first substrate S1 and the second substrate S2 (multiple substrates S) are placed in the soaking tank 10 in sequence, the soaking procedures can be carried out in the soaking tank 10 at the same time, without waiting for the first substrate S1 to be soaked before being placed. Place the second substrate S2, thereby improving the use efficiency of the substrate wet processing device 1 .

Preferably, the soaking tank 10 further includes a temperature control unit, a flow field control unit, or an oscillation unit, wherein the temperature control unit can maintain the soaking liquid in the soaking tank 10 at a specified temperature range, and the flow field control unit can control The flow field of the immersion liquid, to evenly soak the photoresist on the soft substrate S, for example, can be a downflow flow field, as shown by the arrow symbol in Figure 7, and Figure 7 is the downflow flow field of the soaking tank shown in Figure 3 schematic diagram. Specifically, the flow field control unit forms a downflow flow field in the vertical multi-piece accommodating portion 11 to further process the substrate S. If there is peeling on the substrate S, the downflow can be used to bring the peeling down. In addition, the vibration unit is connected to the multi-piece accommodation part 11 to shake the first substrate S1 and the second substrate S2 (multiple pieces of substrate S) placed in the multi-piece accommodation part 11, thereby speeding up removal of the substrate S. photoresist or metal film.

In other embodiments, the substrate wet processing device 1 may further include a pre-soaking spray unit, which is adjacent to the multi-chip accommodating portion 11 . Before step S10, the control unit 40 can first control the transport carrier 30 to transfer the first substrate S1 (single substrate S) to the pre-soaking spray cleaning unit, and then perform step S10 after performing the pre-soaking spray cleaning process, so that the first The substrate S1 is transferred to the multi-chip container 11 . Next, clamp the second substrate S2 and transfer it to the pre-immersion spray cleaning unit for spray cleaning treatment, and then perform step S20 (transfer the second substrate S2 to the multi-chip accommodating part 11 .

In addition, the pre-soaking spray unit can be arranged in the soaking tank 10 or adjacent to the soaking tank 10 . Taking the setting in the soaking tank 10 as an example, the soaking tank 10 can be divided into two spaces, one of which has a spray head as a spray cleaning unit before soaking, and the other is placed with a multi-piece container 11, and the substrate S can be cleaned first. After performing the spray washing process, it is successively transferred to the multi-chip storage unit 11 and subjected to soaking process.

Step S30: After a soaking treatment time, the first substrate S1 is transferred from the soaking tank 10 to the single-chip spraying unit 21 of the spraying treatment tank 20 for spraying treatment.

In other words, the first substrate S1 is placed in the soaking tank 10 and taken out after a soaking treatment time. It should be noted that each substrate S is taken out from the soaking tank 10 after a soaking treatment time. In addition, the soaking treatment time required by different processes is different, and the appropriate soaking treatment time can also be scheduled by the control unit 40 according to the process.

In this embodiment, since the multi-piece accommodating portion 11 is designed vertically, the transport carrier 30 also takes out the substrate S (first substrate S1) in a vertical manner. Compared with the horizontal design, it can The residual amount of the immersion liquid on the substrate S is greatly reduced. Preferably, the substrate wet processing device 1 can further have a gas spraying unit 60 (as shown in FIG. 2 ), which is arranged above the immersion tank 10. When the substrate S (first substrate S1) is taken out, the gas spraying unit 60 can be sprayed at the same time. The soaking liquid on the substrate S further reduces the residual amount of the soaking liquid. The gas spray unit 60 is disposed above the immersion tank 10 or above the tank wall of the immersion tank 10 , which is not limited by the present invention.

The spraying treatment tank 20 has at least one single-piece spraying unit 21. The present embodiment takes two adjacent single-piece spraying units 21 as an example, so different chemical liquids can be used for spraying according to requirements. , can also be two single-chip spray cleaning units 21 of the same chemical liquid, so as to increase the number of substrates S to be processed. Moreover, the single-piece spray cleaning unit 21 performs a spray cleaning process on a single substrate S to ensure that each substrate S can be cleaned under the same conditions. The monolithic spraying unit 21 can also be horizontal or vertical, preferably vertical, and the monolithic spraying unit 21 of the present embodiment is a vertical monolithic spraying unit, so it can undertake the last The vertical state of the soaking tank 10 of the station does not need to change the state of the substrate S. For example, after the first substrate S1 is soaked, the moving part 32 of the transport carrier 30 drives the additional circuit board 31 to the position of the first substrate S1, and the additional circuit board 31 moves downward to receive the first substrate S1 in a vertical state. Then, the additional circuit board 31 moves upwards to the original position (the top edge of the moving part 32), and the moving part 32 drives the additional circuit board 31 and the first substrate S1 to move to the single-chip spraying unit 21, and in the same way the second A substrate S1 is vertically placed in the single-chip spray cleaning unit 21 . In short, the transport carrier 30 vertically carries the substrate S and moves to the vertical multi-chip accommodating portion 11 and the vertical single-chip spray cleaning unit 21 .

Moreover, the single-chip spray cleaning unit 21 of this embodiment includes a spray cleaning tank 211 and at least one fluid spray head 212, and the fluid spray head 212 is arranged on at least one side wall of the spray cleaning tank 211, and each substrate S is placed on the Moving vertically in the spray tank 211 , the fluid spray head 212 sprays each substrate S. In other words, when the first substrate S1 (or other substrates S) vertically moves into the spray tank 211 , the fluid spray head 212 located on the sidewall can directly spray the first substrate S1 .

In other embodiments, the single-piece spray cleaning unit 21a can also be horizontal, as shown in FIG. 8 , which is a schematic diagram of a spray cleaning treatment tank according to another embodiment of the present invention. The spray cleaning treatment tank 20a of this embodiment has a horizontal single piece spray cleaning unit 21a.

Step S40 : After a spray cleaning treatment time, remove the first substrate S1 from the single-chip spray cleaning unit 21 .

The first substrate S1 undergoes a spray cleaning process in the spray cleaning tank 211, and after the spray cleaning process lasts for a period of time, after the moving part 32 moves to the spray cleaning tank 211, the additional circuit board 31 moves downward to receive the first substrate S1, and then Move upward to remove the first substrate S1. Preferably, the fluid spray head 212 can be arranged above the side wall. When the first substrate S1 moves vertically upwards in the single-piece spray cleaning unit 21, the fluid spray head 212 can spray the peeling off from the first substrate S1 from top to bottom. (such as photoresist and metal film). At the same time, the S portion of the substrate that has been sprayed moves upwards, thereby achieving the effect of avoiding back-staining and scratching.

Preferably, besides above the immersion tank 10 , the substrate wet processing device 1 may further have another gas spray unit 60 , which is disposed above the spray cleaning tank 20 or above the tank wall of the spray cleaning tank 20 . While taking out the first substrate S1, the chemical liquid on the substrate S is sprayed to further reduce the residual amount of the chemical liquid. Next, the transport carrier 30 moves the first substrate S1 to the next procedure, which in this embodiment is moved to the cleaning and drying unit 50 . Moreover, the control unit 40 can schedule the interval time according to the spraying processing time of the plurality of single-chip spraying units 21 , or schedule the interval time according to the soaking processing time and the spraying processing time. For example, the interval time (for placing the first substrate S1 and the second substrate S2) is greater than or equal to the spray cleaning treatment time, so as to ensure that the previous substrate S (such as the first substrate S1) can be spray cleaned in real time without hindering the subsequent substrates S (such as the second substrate S2 ) moves to the timing of the spray cleaning treatment tank 20 . Preferably, the interval time is greater than the spray cleaning processing time, but if the transport carrier 30 has multiple additional circuit boards 31 and moving parts 32 or has multiple single-chip spray cleaning units 21 for parallel processing, the interval time can be less than or equal to The spray cleaning treatment time is not limited in the present invention.

Step S50: after the soaking treatment time, the second substrate S2 is transferred from the soaking tank 10 to the single-chip spraying unit 21 of the spraying treatment tank 20 for spraying treatment.

Firstly, the soaking treatment time of the first substrate S1 and the second substrate S2 are the same. Also, since the interval between placing the first substrate S1 and the second substrate S2 in the soaking tank 10 is greater than or equal to the spray cleaning treatment time, when the second substrate S2 is soaked, the first substrate S1 has also been spray cleaned and moved to Next procedure (washing and drying unit 50). Therefore, the transport carrier 30 can directly hold the second substrate S2 from the soaking tank 10 and transfer it to the single-piece spray cleaning unit 21 without any hindrance.

In addition, the soaking treatment time is longer than the spray cleaning time, which is designed to effectively remove the photoresist and metal films on the first substrate S1 and the second substrate S2. After the spray cleaning of the second substrate S2 is completed, it is also moved to the cleaning and drying unit 50 of the next procedure by the transport carrier 30 .

The cleaning and drying unit 50 is adjacent to the single-chip spray cleaning unit 21, and the cleaning and drying unit 50 is a single-chip cleaning rotary platform, and has a cleaning liquid supply unit 51, which can be used for one substrate S (such as the first substrate S1) at a time. Or the second substrate S2) after the cleaning solution is applied, the substrate S is dried in a rotating manner. The cleaning solution may be deionized water, so as to clean the remaining chemical solution on the substrate S. Referring to FIG. Preferably, the cleaning and drying unit 50 may further include a volatile solution supply unit for applying a volatile solution to the substrate S, such as isopropanol. When the substrate S is a wafer with a surface structure, after the deionized water is applied, a little isopropanol is further sprayed by the volatile solution supply unit to effectively remove the moisture remaining on the substrate S.

In addition, the cleaning and drying unit 50 can be horizontal or vertical, and this embodiment takes the independently installed horizontal cleaning and drying unit 50 as an example. FIG. 9 is a schematic diagram of a spray washing treatment tank and a cleaning and drying unit according to another embodiment of the present invention, please refer to FIG. 9 . The cleaning and drying unit 50b can also be vertical, and can also be arranged in the spraying treatment tank 20b, that is, the cleaning and drying unit 50b and the single-chip spraying unit 21 can be arranged in the same tank body (the spraying treatment tank 20b) Different processing units, for example, the left side shown in FIG. 9 is a single-chip spraying unit 21b for spraying processing liquid, and the right side is a cleaning liquid supply unit 51b for spraying cleaning liquid. FIG. 10 is a schematic diagram of a spray washing treatment tank and a cleaning and drying unit according to another embodiment of the present invention, please refer to FIG. 10 . The single-chip spraying unit 21c and the cleaning and drying unit 50c are all horizontal, and are arranged in the same tank (spraying treatment tank 20c), and the same nozzle can be used to spray the treatment liquid or cleaning liquid in different time courses, or Use different nozzles to spray the treatment liquid and cleaning liquid respectively. However, two different units, the treatment liquid collection unit 22c and the cleaning liquid collection unit 52c, are arranged in the spray cleaning treatment tank 20c of this embodiment, and have respectively received the treatment liquid and the cleaning liquid.

FIG. 11 is a schematic diagram of a substrate wet processing device according to another embodiment of the present invention, please refer to FIG. 11 . In this embodiment, the vertical multi-piece accommodation part 11d includes a plurality of single-piece accommodation slots 111d, and the single-piece accommodation slots 111d and the vertical single-piece spraying unit 21d have a processing carrier A. The transport carrier 30d also includes an additional circuit board 31d, a moving part 32d and a moving track 33d, and the moving track 33d is arranged on the side wall of the substrate wet processing device 1d. The additional circuit board 31d of the transport carrier 30d carries the substrate S to the processing carrier A, and the substrate S is lifted and lowered by the processing carrier A to place the substrate S into one of the single-chip accommodation slots 111d, or into the vertical single-chip spray cleaning unit 21d. Wherein, the substrate S designated by the control unit 40 can be clamped and transferred by a single moving part 32d to and fro between the soaking tank 10d and the spraying treatment tank 20d.

In other embodiments, a plurality of moving parts 32d may also be provided according to technological requirements, which is not limited by the present invention.

In summary, according to the substrate wet processing device of the present invention, it includes a soaking tank, a spraying treatment tank, a transport carrier and a control unit. The soaking tank includes a multi-piece accommodating part, and the spraying treatment tank is adjacent to the soaking tank. The control unit controls the wet processing of a plurality of substrates, and separately controls the soaking processing sequence of each substrate in the multi-chip accommodating part through the transport carrier. Wherein, a plurality of substrates are placed in the multi-piece accommodation part, and each substrate of the same process condition is respectively subjected to the same soaking treatment time, and then sequentially moved to the spray cleaning treatment tank. Since the soaking treatment time of each substrate is the same, it is possible to avoid the difference in cleaning degree caused by different soaking times, thereby improving the yield rate.

In addition, the interval between placing the first substrate and the second substrate in the soaking tank is greater than or equal to the spray cleaning treatment time, which can ensure that after the spray cleaning of the first substrate ranked earlier is completed, the soaking of the second substrate ranked later is completed. Therefore, the second substrates that are sorted later can smoothly move to the spray cleaning tank without being hindered by the first substrates that are sorted earlier.

In addition, in the substrate wet processing device of the present invention, the control unit can process multiple substrates with different process conditions according to process requirements. The soaking treatment time required by different process conditions is different, and the specific soaking treatment time required for each substrate can be controlled separately by the control unit; and the control unit schedules according to the soaking treatment time and spray cleaning treatment time of each substrate Intervals.

No matter the purpose, means and effect of the present invention, it all shows its characteristics that are very different from the prior art. However, it should be noted that the above-mentioned embodiments are examples for the convenience of description, and the scope of protection claimed by the present invention should be determined by the claims, rather than limited to the above-mentioned embodiments.

Claims (20)

1. A substrate wet processing device, characterized in that, comprising: a control unit for controlling the wet processing of a plurality of substrates; A soaking tank, including a multi-chip container, wherein the control unit respectively controls the soaking treatment sequence of each of the substrates in the multi-chip container; A spray cleaning treatment tank, located adjacent to the soaking tank, and has at least one single-piece spray cleaning unit; and a transport carrier for transferring each of the substrates between the soaking tank and the spraying treatment tank; Wherein the control unit controls the conveying carrier to transfer one of the first substrates among the substrates to the multi-piece container of the soaking tank, and after an interval, transfers a second substrate among the substrates to place In the multi-chip accommodating part of the soaking tank, the first substrate is transferred from the soaking tank to the single-chip spraying unit of the spraying treatment tank after a soaking treatment time for spraying treatment, After a spray cleaning treatment time, the first substrate is removed from the single-chip spray cleaning unit, and the second substrate is transferred from the soaking tank to the spray cleaning treatment tank after the soaking treatment time. The washing unit performs spray washing treatment, wherein the control unit schedules the interval time according to the spray washing treatment time. 2. The substrate wet processing device according to claim 1, further comprising: A cleaning and drying unit is adjacent to the single-chip spray cleaning unit, wherein the transport carrier transfers each of the substrates from the single-chip spray cleaning unit to the cleaning and drying unit. 3 . The substrate wet processing device according to claim 2 , wherein the cleaning and drying unit is disposed in the spray cleaning tank, and performs spray cleaning and subsequent cleaning and drying on each of the substrates. 4 . 4. The substrate wet processing device according to claim 2, wherein the cleaning and drying unit comprises a cleaning liquid supply unit and a volatile solution supply unit, and the cleaning and drying unit applies a cleaning to each of the substrates. liquid and a volatile solution. 5 . The substrate wet processing apparatus according to claim 2 , wherein the multi-chip accommodating portion is a horizontal multi-chip accommodating portion. 6 . The substrate wet processing apparatus according to claim 2 , wherein the multi-chip accommodating portion is a vertical multi-chip accommodating portion. 7. The substrate wet processing apparatus according to claim 6, wherein the single-chip spray cleaning unit is a vertical single-chip spray cleaning unit. 8. The substrate wet processing device according to claim 7, wherein the single-piece spray cleaning unit comprises a spray cleaning tank and at least one fluid nozzle, and the fluid nozzle is arranged on at least one side wall of the spray cleaning tank , and by vertically moving each of the substrates in the spray tank, the fluid spray head sprays each of the substrates. 9 . The substrate wet processing apparatus according to claim 8 , wherein the fluid spray head sprays each of the substrates when each of the substrates moves vertically upward in the spray cleaning tank. 10 . 10 . The substrate wet processing device according to claim 9 , wherein the immersion tank comprises a flow field control unit for processing the substrates with a downflow flow field in the vertical multi-piece container. 11 . 11. The substrate wet processing device according to claim 7, wherein the conveying carrier vertically carries each of the substrates and moves to the vertical multi-chip accommodating portion and the vertical single-chip spray cleaning unit . 12 . The substrate wet processing device according to claim 11 , wherein the conveying carrier further comprises a moving track disposed above the soaking tank and the spraying treatment tank. 13 . 13. The substrate wet processing device according to claim 12, characterized in that, the vertical multi-piece accommodating portion comprises a plurality of single-piece accommodating slots, and the single-piece accommodating slots and the vertical single-piece Each of the chip spraying units includes a processing carrier, the transport carrier carries each of the substrates to the processing carrier, and the processing carrier carries each of the substrates up and down and puts them into the single-chip accommodating tanks One of the bits or the vertical one-piece spray unit. 14. The substrate wet processing apparatus according to claim 12, wherein the transport carrier includes an additional circuit board, the transport carrier moves the additional circuit board and each of the substrates is lifted and lowered by the additional circuit board , to put into the immersion tank or the spray treatment tank. 15. The substrate wet processing device according to claim 1, further comprising: A pre-soaking spray cleaning unit is adjacent to the multi-chip accommodating part. The control unit first controls the transport carrier to transfer each of the substrates to the pre-soaking spray cleaning unit for spray cleaning, and then transfers to the multiple substrates. Chip housing. 16. The substrate wet processing device according to claim 15, wherein the pre-soaking spray unit is arranged in the soaking tank, and each of the substrates is firstly sprayed and then transferred to the multi-chip The accommodating part is soaked. 17. The substrate wet processing device according to claim 1, further comprising: A gas spraying unit is arranged above at least one of the soaking tank or the spraying processing tank, and performs gas spraying when each of the substrates is removed from the tank. 18. The substrate wet processing device according to claim 1, wherein the spray cleaning tank is provided with a plurality of single-chip spray cleaning units, and the control unit is based on the multiple single-chip spray cleaning units. The spray processing time schedules this interval. 19. The substrate wet processing device as claimed in claim 1, wherein the soaking treatment time of each of the substrates is longer than the spray cleaning treatment time, and the control unit arranges according to the soaking treatment time and the spray cleaning treatment time program the interval time. 20. The substrate wet processing device according to claim 1, wherein the soaking treatment time of each of the substrates is controlled separately by the control unit, and the control unit is based on the soaking treatment time of each of the substrates and The spray processing time schedules the interval time.