CN108074856A - Single substrate processing apparatus - Google Patents

Abstract

The invention discloses a single substrate processing device, which comprises a base and a substrate carrying platform. The substrate carrier comprises a fixed shaft, a bearing part and a buffer structure. The fixed shaft is connected to the base, and an air pressure channel is formed in the fixed shaft. The bearing part is connected with the fixed shaft and bears the substrate. The bearing part is provided with at least one through hole which is communicated with the air pressure channel. The buffer structure is arranged on the bearing part, one surface of the buffer structure corresponds to the through hole, and the other surface of the buffer structure corresponds to the substrate.

Description

Single substrate processing device

technical field

The present invention relates to a single substrate processing device, in particular to a substrate carrier of the single substrate processing device.

Background technique

In the substrate processing technology, the center of the substrate is adsorbed by the stage to fix and drive the substrate to rotate, thereby performing the wet processing process of the substrate. However, after the substrate is processed through multiple processes, it will accumulate a lot of stress or have fine cracks. Therefore, when the substrate is transferred to the stage, it is very likely that the substrate will be damaged due to stress or cracks due to contact force or collision between the substrate and the stage, or after the suction force is activated.

At present, although soft bumps are installed on the stage to avoid direct contact between the substrate and the hard stage, the effect is not good. Moreover, when the attraction force is activated, the substrate will still squeeze the soft bump when it is attracted, and after the soft bump is over-compressed, the cushioning effect that can be produced is limited, so it cannot provide proper cushioning. Therefore, the prior art There is indeed a need for improvement.

Contents of the invention

In view of the above problems, the present invention provides a single substrate processing device, which includes a base and a substrate carrier, the substrate carrier includes a fixed shaft, a bearing part and a buffer structure, the fixed shaft is connected to the base, and has an air pressure channel, and the carrier part has A through hole communicating with the air pressure channel, and a buffer structure is arranged on the bearing part, and one surface of the buffer structure corresponds to the through hole, and the other surface corresponds to the substrate, so as to solve the problem that the existing carrier cannot provide a proper buffer effect.

The invention provides a single substrate processing device, which is used for wet processing a substrate. The single substrate processing device includes a base, a substrate carrier and a collecting unit. The substrate carrier includes a fixed shaft, a bearing part and a buffer structure. The fixed shaft is connected to the base, and there is an air pressure channel inside the fixed shaft. The carrying part is connected to the fixed shaft and carries the substrate. The bearing part has at least one through hole, and the through hole communicates with the air pressure channel. The buffer structure is disposed on the bearing part, and one surface of the buffer structure corresponds to the through hole, and the other surface corresponds to the substrate. The collection unit is arranged on the outside of the substrate platform, and collects a processing liquid obtained by wet processing of the substrate.

The invention further provides a single substrate processing device for calibrating a substrate. The single substrate processing device includes a base, a substrate carrier and a calibration unit. The substrate carrier includes a fixed shaft, a bearing part and a buffer structure. The fixed shaft is connected to the base, and there is an air pressure channel inside the fixed shaft. The bearing part is connected with the fixed shaft and carries the substrate. The bearing part has at least one through hole, and the through hole communicates with the air pressure channel. The buffer structure is disposed on the bearing part, and one surface of the buffer structure corresponds to the through hole, and the other surface corresponds to the substrate. The calibration unit controls the substrate carrier to rotate the substrate and calibrates the substrate.

According to an embodiment of the present invention, the buffer structure includes at least one movable buffer part, the movable buffer part covers the through hole, and the substrate carrier further includes a control unit, which controls the movable buffer part to a first height and a second height.

According to an embodiment of the present invention, when the control unit controls the movable buffer part to rise to the first height, the movable buffer part contacts the substrate; when the control unit controls the movable buffer part to descend to the second height, the movable buffer part The part and the substrate form a negative pressure area, and the movable buffer part absorbs the substrate.

According to an embodiment of the present invention, the buffer structure further includes at least one fixed buffer part. When the control unit controls the movable buffer part to drop to the second height, the movable buffer part and the substrate form a negative pressure area, and the fixed buffer part contact with the substrate.

According to an embodiment of the present invention, the control unit is an air pressure control unit, which controls the air pressure channel to switch between a negative pressure state and a non-negative pressure state, so as to control the movable buffer part at the first height and the second height to move between.

According to an embodiment of the present invention, when the air pressure control unit controls the air pressure channel to switch to a negative pressure state, the movable buffer part descends to the second height, and the fixed shaft and the movable buffer part jointly absorb the substrate.

According to an embodiment of the present invention, the fixed shaft is arranged in the central area of the substrate carrier, and an opening of the air pressure channel is located in the central area of the carrying part, and the movable buffer part is arranged on the periphery of the opening. When the air pressure control unit controls the air pressure channel Switching to the negative pressure state, the movable buffer part is lowered to the second height, and the opening of the air pressure channel and the movable buffer part jointly absorb the substrate.

According to an embodiment of the present invention, the movable buffer part is a ring structure, which is arranged around the periphery of the opening of the air pressure channel.

According to an embodiment of the present invention, the substrate carrier further includes an outer ring buffer structure disposed on an outer wall of the substrate carrier, and a top edge of the outer ring buffer structure contacts the substrate.

According to an embodiment of the present invention, the single substrate processing apparatus further includes a fluid cleaning unit disposed on the base and surrounding the periphery of the substrate carrier.

According to an embodiment of the present invention, the single substrate processing apparatus further includes a fluid acceleration unit, which is rotatably disposed on the base and is disposed around the periphery of the fluid cleaning unit.

Based on the above, the single substrate processing apparatus according to the present invention, whether used for wet processing of substrates (first embodiment) or calibration (second embodiment), includes a base and a substrate carrier. Wherein, the substrate carrier includes a fixed shaft, a bearing part and a buffer structure, the fixed shaft is connected to the base, and has an air pressure channel, and the bearing part has a through hole communicating with the air pressure channel. The buffer structure is arranged on the bearing part, and one surface of the buffer structure corresponds to the through hole, and the other surface corresponds to the substrate, so when the air pressure channel is in a negative pressure state, it can simultaneously generate negative pressure attraction to the buffer structure, making the buffer structure Move or compress in the direction of the through hole. Setting the buffer structure can avoid extra stress on the substrate, so as to achieve the effect of buffering the substrate, preventing the substrate from cracking, and having the function of absorbing and fixing the substrate.

Description of drawings

FIG. 1A is a schematic diagram of a single substrate processing apparatus according to a first embodiment of the present invention.

FIG. 1B is a schematic perspective view of the substrate carrier shown in FIG. 1A .

FIG. 2A is an enlarged view of the substrate stage shown in FIG. 1 .

FIG. 2B is a schematic diagram of the air pressure channel shown in FIG. 2A in a negative pressure state.

FIG. 3 is a schematic diagram of another implementation of the buffer structure shown in FIG. 2 .

FIG. 4 is a schematic diagram of another embodiment of the substrate stage shown in FIG. 1A .

FIG. 5 is a schematic diagram of another implementation of the single substrate processing apparatus according to the first embodiment of the present invention.

FIG. 6 is a schematic diagram of a single substrate processing apparatus according to a second embodiment of the present invention.

FIG. 7 is a top view of another embodiment of the single substrate processing apparatus according to the second embodiment of the present invention.

Among them, reference signs:

Single substrate processing apparatus 1, 1c, 1d, 1e

Base 10, 10c, 10d, 10e

Substrate stage 20, 20a, 20b, 20c, 20d, 20e

Outer wall 201b

Fixed shafts 21, 21b, 21c, 21d

Air pressure channels 211, 211b

Openings 212, 212b

Carrying parts 22, 22b

Via 221

Buffer structure 23, 23a, 23b, 23c

Movable buffer parts 231, 231a, 231b

Fixed buffer parts 232, 232a, 232b

control unit 24

Outer ring buffer structure 25b

Top edge 251b

collection unit 30

Fluid cleaning unit 40c

Fluid acceleration unit 50c

Calibration unit 60d, 60e

Substrates 90, 90b, 90c, 90d, 90e

Treatment solution 100

First height H1

Second height H2

Negative pressure area V

Detailed ways

In order to enable your review committee members to better understand the technical content of the present invention, the preferred specific embodiments are described as follows.

FIG. 1A is a schematic diagram of a single substrate processing apparatus according to a first embodiment of the present invention, and FIG. 1B is a schematic perspective view of the substrate carrier shown in FIG. 1A . Please refer to FIG. 1A and FIG. 1B together below. Firstly, the single substrate processing apparatus 1 of the first embodiment can be used for wet processing a substrate 90 , wherein the single substrate processing apparatus 1 includes a base 10 , a substrate carrier 20 and a collection unit 30 . The substrate stage 20 is used to carry and fix the substrate 90, and the collecting unit 30 is arranged on the outside of the substrate stage 20, and can be raised and lowered to collect the processing liquid 100 sprayed by the substrate 90 after the wet processing (refer to FIG. Shown), wherein the form and driving method of the collecting unit 30 are not limited by the present invention.

In this embodiment, the substrate stage 20 includes a fixed shaft 21 , a supporting portion 22 and a buffer structure 23 . Wherein, the substrate stage 20 is connected to the base 10 through the fixed shaft 21 , and the carrying portion 22 is connected to the fixed shaft 21 for carrying and fixing the substrate 90 . The substrate stage 20 of this embodiment fixes the substrate 90 by negative pressure adsorption. Correspondingly, the fixed shaft 21 has an air pressure channel 211 inside, and the opening 212 of the air pressure channel 211 is opened on the carrying portion 22 . Preferably, the fixed shaft 21 is disposed at the central area of the substrate stage 20 , and the opening 212 of the air pressure channel 211 is also located at the central area of the carrying portion 22 , for example, at the center of the carrying portion 22 .

In detail, the substrate carrier 20 of this embodiment further includes a control unit 24 (simplified as a block diagram in FIG. 1A ), preferably an air pressure control unit, which can control the air pressure channel 211 in a negative pressure state and a non-negative pressure state. Therefore, the pressure in the air pressure channel 211 can be adjusted to buffer the substrate 90 and fix the substrate 90 by adsorption. Specifically, when the substrate stage 20 does not carry the substrate 90, the air pressure channel 211 is in a non-negative pressure state (including a normal pressure state with the same external atmospheric pressure, or a positive pressure state greater than the atmospheric pressure), and when the substrate 90 is placed on the carrying portion After 22, the control unit 24 can convert the internal pressure of the air pressure channel 211 into a negative pressure state, so as to absorb and fix the substrate 90 . In addition, the single substrate processing apparatus 1 of this embodiment is used for wet processing. Preferably, the fixed shaft 21 is rotatably connected to the base 10 so that the substrate stage 20 can fix and rotate the substrate 90 .

FIG. 2A is an enlarged view of the substrate carrier shown in FIG. 1 , and the air pressure channel 211 shown in FIG. 2A is in a non-negative pressure state. Please refer to FIG. 2A for reference. The carrying portion 22 of this embodiment has at least one through hole 221 , and the through hole 221 communicates with the air pressure channel 211 . Moreover, the buffer structure 23 is disposed on the bearing portion 22 , and one surface of the buffer structure 23 corresponds to the through hole 221 , and the other surface corresponds to the substrate 90 . Preferably, the cushioning structure 23 of this embodiment can be an elastic material, such as soft silicone or rubber, which can produce deformation. The appearance design can also be designed as a compressible configuration. The buffer structure 23 part (movable buffer part 231) shown in Figure 2A is semicircular or arched, wherein the movable buffer part 231 is in this state The substrate 90 is supported in a cushioned manner. In addition, the buffer structure 23 can also be a conductive material, such as metal or graphite, which also has the function of eliminating static electricity. In addition, carbon can also be added to the buffer structure 23 to adjust the resistance of the buffer structure 23 to become a static dissipative material to prevent static electricity from accumulating, that is, to reduce the static electricity generated by friction with air or liquid when the substrate 90 rotates.

When the air pressure channel 211 is in a negative pressure state, since the through hole 221 and the air pressure channel 211 communicate with each other, it can generate a negative pressure attraction to the buffer structure 23 at the same time, so that the buffer structure 23 moves or compresses in the direction of the through hole 221, such as As shown in FIG. 2B , FIG. 2B is a schematic diagram of the air pressure channel shown in FIG. 2A in a negative pressure state. In this way, additional stress on the substrate 90 is avoided, so as to achieve the effect of buffering the substrate 90 and absorbing and fixing the substrate 90 .

Specifically, the buffer structure 23 includes a movable buffer portion 231 , which is the aforementioned elastic material, and has a compressible cross-section (such as a semicircular or arched structure). The movable buffer part 231 covers the through hole 221, so when the control unit 24 controls the air pressure channel 211 to switch between the negative pressure state and the non-negative pressure state, it can also control the movable buffer part 231 at the first height H1 at the same time. Move between the second height H2. It should be noted that the midpoint of the movable buffer portion 231 can move between the first height H1 and the second height H2, and the first height H1 and the second height H1 are defined based on the bottom edge of the through hole 221. Height H2.

As shown in FIG. 2A, by virtue of the material characteristics of the movable buffer part 231, when the control unit 24 controls the air pressure channel 211 to switch to a non-negative pressure state (such as normal pressure or positive pressure), the air pressure is provided through the through hole 221. to the movable buffer part 231 to control the midpoint of the movable buffer part 231 to rise to the first height H1. At this moment, the movable buffer part 231 contacts the substrate 90 , provides part of the force for carrying the substrate 90 , and prevents the substrate 90 from contacting the rigid carrying part 22 . In addition, since the substrate stage 20 does not attract the substrate 90 at this time, the substrate 90 can be freely carried in and out of the substrate stage 20 .

As shown in Figure 2B, when the control unit 24 switches the air pressure channel 211 to a negative pressure state, it also controls the deformation of the movable buffer part 231, so that the midpoint of the movable buffer part 231 drops to the second height H2 . At this time, the air pressure channel 211 of the fixed shaft 21 can pass through the opening 212 to absorb the substrate 90. At the same time, because the substrate 90 is closely attached to the supporting part 22, a negative pressure area V is formed between the movable buffer part 231 and the substrate 90. , can also help to adsorb the substrate 90 . In other words, the fixed shaft 21 and the movable buffer part 231 jointly absorb the substrate 90, thereby fixing the substrate 90 on the substrate stage 20, and continuing the wet processing procedure. Through the control of the air pressure, the movable buffer part 231 is raised or lowered, so as to achieve the effect of buffering the substrate 90 and reduce the cracking of the substrate 90 due to stress or cracks. The opening 212 of the air pressure passage 211 is opened at the center of the supporting part 22, and together with the movable buffer part 231, absorbs the substrate 90, and prevents the substrate 90 from being displaced due to rotation.

In this embodiment, the movable buffer part 231 is a ring structure, which surrounds the periphery of the opening 212 of the air pressure channel 211 in a concentric manner, as shown in FIG. 1B . In other embodiments, the movable buffer portion 231a can also be a ring structure composed of multiple units, as shown in FIG. 3 , which is a schematic diagram of another implementation of the buffer structure shown in FIG. 2 . In other words, the movable buffer portion 231 shown in FIG. 1B is a continuous annular structure, while the movable buffer portion 231a shown in FIG. 3 is a discontinuous and segmented structure, and its structural shape is not limited by the present invention. .

Referring again to FIG. 2A and FIG. 2B , preferably, the buffer structure 23 also includes at least one fixed buffer portion 232 . The arrangement of the fixed buffer part 232 can increase the buffering effect when the substrate 90 is adsorbed. In detail, when the control unit 24 controls the midpoint of the movable buffer part 231 to drop to the second height H2, the fixed buffer part 232 can contact the substrate 90 to reduce the contact area between the substrate 90 and the rigid bearing part 22 . Therefore, when the substrate 90 is in the suction state, a good buffer effect can also be achieved by the fixed buffer portion 232 .

The present invention has no special limitation on the number and arrangement of the fixed buffer parts 232 , preferably, there may be more than two fixed buffer parts 232 , which are respectively arranged inside and outside of the movable buffer part 231 . In other words, more than two fixed buffer parts 232 (inside and outside of the aforementioned movable buffer part 231 ) can jointly form a groove-like structure, and the movable buffer part 231 can be disposed in the groove. In addition, like the arrangement of the movable buffer part 231, the fixed buffer part 232 can also be a continuous or discontinuous structure (Fig. array as an example).

FIG. 4 is a schematic diagram of another embodiment of the substrate carrier shown in FIG. 1A , please refer to FIG. 4 . When the substrate 90b has a concave or convex irregular curvature, the substrate stage 20b may further include an outer ring buffer structure 25b, which is arranged on an outer wall 201b of the substrate stage 20b, and the outer ring buffer structure 25b A top edge 251b contacts the substrate 90b. With the top edge 251b of the outer ring buffer structure 25b in contact with the uneven substrate 90b, in addition to assisting in carrying the substrate 90b, a closed space can be formed between the substrate stage 20b and the substrate 90b, allowing the air pressure of the fixed shaft 21b to The channel 211b can absorb the substrate 90b through the opening 212b, and can reduce the cracking of the substrate 90b with irregular curvature during the process. In this embodiment, the outer ring buffer structure 25b is disposed on the outer wall 201b of the bearing portion 22b, and the bottom of the outer ring buffer structure 25b is thicker. The outer ring buffer structure 25b can also be in other configurations, the present invention is not limited, only the top edge 251b of the outer ring buffer structure 25b can contact the substrate 90b, so that a closed space can be formed between the substrate carrier 20b and the substrate 90b That's it.

FIG. 5 is a schematic diagram of another implementation of the single substrate processing apparatus according to the first embodiment of the present invention, please refer to FIG. 5 . It should be noted that, in this specification, the single substrate processing apparatus 1, 1c used for wet processing is referred to as the first embodiment, and the single substrate processing apparatus 1d, 1e used for calibration is referred to as the second embodiment (further description will follow) . In this embodiment, the single substrate processing apparatus 1c further includes a fluid cleaning unit 40c, which is disposed on the base 10c, and is surrounded and fixedly disposed on the periphery of the substrate stage 20c. In the wet processing procedure, the fluid cleaning unit 40c will provide the required processing liquid 100 to clean the substrate 90c, and the cleaned processing liquid 100 is discharged to the collection unit on the periphery of the substrate carrier 20c (not drawn for simplicity of the drawing, refer to The collection unit 30) of FIG. 1A performs the collection. Preferably, the single substrate processing device 1c further includes a fluid acceleration unit 50c, which is rotatably disposed on the base 10c and is disposed around the periphery of the fluid cleaning unit 40c. Wherein, the fluid acceleration unit 50c can control the rotation speed and rotate relative to the substrate stage 20c. After the fluid acceleration unit 50c receives the processing liquid 100 discharged from the substrate stage 20c, it further accelerates the rotation to discharge the processing liquid 100 to the outside. The collection unit 30 (as described above, please refer to FIG. 1A ) is used to effectively discharge the treatment liquid 100 .

FIG. 6 is a schematic diagram of a single substrate processing apparatus according to a second embodiment of the present invention, please refer to FIG. 6 . The single substrate processing apparatus 1d of the second embodiment is used for calibrating a substrate 90d. The single substrate processing device 1d includes a base 10d, a substrate stage 20d and a calibration unit 60d. The substrate stage 20d is also connected to the base 10d by the fixed shaft 21d. Regarding the component structure and link relationship of the substrate stage 20d, and the movement of the substrate stage 20d carrying and fixing the substrate 90d, please refer to the substrate of the first embodiment. The carrier 20 (20a, 20b, 20c) will not be described in detail here.

The calibration unit 60d of this embodiment is an optical detection unit, which is disposed on the base 10d and above the substrate stage 20d to calibrate the substrate 90d carried and fixed by the substrate stage 20d. The calibration unit 60d uses an optical method to detect the position of the substrate 90d for calibration (for example, it can detect the entire substrate or detect the edge of the substrate), and the calibration unit 60d can control the substrate stage 20d to rotate the substrate 90d, and displace the substrate stage 20d to Calibration is performed on the substrate 90d. Wherein, the optical detection of the calibration unit 60d can be equipped with a single optical element (please refer to FIG. 6 ), or multiple optical elements, such as a light transmitting element paired with a light receiving element, to achieve alignment optical detection (not shown in the figure). ), the present invention is not limited.

FIG. 7 is a top view of another embodiment of the single substrate processing apparatus according to the second embodiment of the present invention, please refer to FIG. 7 . The single substrate processing apparatus 1e of this embodiment is used to calibrate a substrate 90e, and is applicable to damaged substrates (for example, substrates with warpage or abnormal protrusions). The single substrate processing device 1e includes a base 10e, a substrate carrier 20e, and a calibration unit 60e. Similarly, the substrate carrier 20e is connected to the base 10e. Regarding its connection method, and the component structure and loading of the substrate carrier 20e For the movement of the substrate 90e, reference may be made to the substrate stage 20 (20a, 20b, 20c) of the first embodiment, and details are not repeated here. In this embodiment, the calibration units 60e are three cylinders and are disposed on the base 10e. If the substrate 90e is not damaged, the calibration unit 60e (three cylinders) can correctly clamp the substrate 90e once to complete the calibration of the substrate. If the three cylinders of the calibration unit 60e cannot correctly clamp the substrate 90e at one time, the calibration unit 60e can control the substrate stage 20e to rotate the substrate 90e and clamp the substrate 90e multiple times. Specifically, when the substrate carrier 20e is controlled to rotate the substrate 90e by a preset angle, the clamping unit (three cylinders in this embodiment) is controlled to clamp the substrate 90e once (thus, every time a preset angle is rotated, Then the substrate 90e is clamped once, divided into several times to calibrate the substrate 90e). It should be noted here that the preset angle is not particularly limited, and can be determined according to requirements, and the number of times the calibration unit 60e controls the rotation of the substrate stage 20e is not limited, it only needs to be carried out until the substrate calibration procedure of the substrate 90e can be completed. .

To sum up, the single substrate processing apparatus according to the present invention, whether it is used for wet processing of substrates (first embodiment) or for calibration (second embodiment), includes a base and a substrate carrier. Wherein, the substrate carrier includes a fixed shaft, a bearing part and a buffer structure, the fixed shaft is connected to the base, and has an air pressure channel, and the bearing part has a through hole communicating with the air pressure channel. The buffer structure is arranged on the bearing part, and one surface of the buffer structure corresponds to the through hole, and the other surface corresponds to the substrate, so when the air pressure channel is in a negative pressure state, it can simultaneously generate negative pressure attraction to the buffer structure, making the buffer structure Move or compress in the direction of the through hole. In this way, additional stress on the substrate can be avoided, so as to achieve the effect of buffering the substrate, preventing the substrate from cracking, and simultaneously absorbing and fixing the substrate.

It should be noted that the above-mentioned ones are only preferred embodiments of the present invention, and should not limit the implementation scope of the present invention, that is, all simple etc. Effective changes and modifications all still fall within the protection scope of the appended claims of the present invention.

Claims (11)

1. A single substrate processing device, for carrying out wet processing to a substrate, characterized in that, the single substrate processing device comprises: a base; A substrate carrier, comprising: A fixed shaft, connected to the base, has an air pressure channel inside the fixed shaft; a bearing part, connected to the fixed shaft, and bearing the substrate, the bearing part has at least one through hole, and the through hole communicates with the air pressure channel; and A buffer structure is arranged on the bearing part, and one surface of the buffer structure corresponds to the through hole, and the other surface corresponds to the substrate; and A collection unit is arranged on the outside of the substrate platform, and collects a processing solution of the substrate after wet processing. 2. A single substrate processing device for calibrating a substrate, characterized in that the single substrate processing device comprises: a base; A substrate carrier, comprising: A fixed shaft, connected to the base, has an air pressure channel inside the fixed shaft; a bearing part, connected to the fixed shaft, and bearing the substrate, the bearing part has at least one through hole, and the through hole communicates with the air pressure channel; and A buffer structure is arranged on the bearing part, and one surface of the buffer structure corresponds to the through hole, and the other surface corresponds to the substrate; and A calibration unit controls the substrate carrier to rotate the substrate and calibrates the substrate. 3. The single substrate processing apparatus according to claim 1 or 2, wherein the buffer structure comprises at least one movable buffer portion covering the through hole, wherein the substrate carrier is further It includes a control unit, which controls the movable buffer part to move between a first height and a second height. 4. The single substrate processing apparatus according to claim 3, wherein when the control unit controls the movable buffer part to rise to the first height, the movable buffer part touches the substrate, and when the control unit The movable buffer part is controlled to descend to the second height, the movable buffer part and the substrate form a negative pressure area, and the movable buffer part absorbs the substrate. 5. The single substrate processing apparatus according to claim 4, wherein the buffer structure further comprises at least one fixed buffer, and when the control unit controls the movable buffer to descend to the second height, the movable The movable buffer part and the substrate form the negative pressure area, and the fixed buffer part contacts the substrate. 6. The single substrate processing apparatus as claimed in claim 3, wherein the control unit is an air pressure control unit, which controls the air pressure channel to switch between a negative pressure state and a non-negative pressure state, so as to control the The movable buffer moves between the first height and the second height. 7. The single substrate processing apparatus as claimed in claim 6, wherein the fixed shaft is disposed at a central area of the substrate carrier, and an opening of the air pressure channel is located at the central area of the carrying portion, and the movable The buffer part is arranged on the periphery of the opening. When the air pressure control unit controls the air pressure channel to switch to the negative pressure state, the movable buffer part descends to the second height, and the opening of the air pressure channel and the movable buffer The parts jointly adsorb the substrate. 8 . The single substrate processing apparatus as claimed in claim 7 , wherein the movable buffer portion is a ring structure surrounding the periphery of the opening of the air pressure channel. 9. The single substrate processing apparatus according to claim 3, wherein the substrate carrier further comprises an outer ring buffer structure disposed on an outer side wall of the substrate carrier, and a top of the outer ring buffer structure edge contacts the substrate. 10. The single substrate processing apparatus according to claim 1, further comprising: A fluid cleaning unit is arranged on the base and is arranged around the periphery of the substrate carrier. 11. The single substrate processing apparatus according to claim 10, further comprising: A fluid accelerating unit is rotatably arranged on the base and is arranged around the periphery of the fluid cleaning unit.