CN108006489A - Projecting Lamp - Google Patents

Abstract

The present invention discloses a projection lamp 10, comprising: a bracket 11, a base 12, an LED lamp 13, a reflective cup 14, a heat sink 15 and a lens 16; wherein, the base 12 is connected to the bracket 11; the The LED lamp 13 is affixed to the middle position of the upper surface of the base 12; the reflector cup 14 is affixed to the upper surface of the base 12 and is located outside the LED lamp 13; the heat sink 15 is affixed to the The upper surface of the base 12 is located outside the reflective cup 14 ; the lens 16 is fixed on the top of the reflective cup 14 . The projecting light provided by the invention has good heat dissipation effect, simple structure and long service life.

Description

Spotlights

technical field

The invention belongs to the field of lighting, and in particular relates to a floodlight.

Background technique

Flood light is a kind of projective lighting fixture with simple structure, convenient and flexible use, mainly used in large-area mines, building outlines, stadiums, overpasses, monuments, parks and flower beds and other places.

The current projection lamps basically use LED chips as their light sources. Due to the high brightness requirements of projection lamps, their light sources usually use high-power LED chips, which will generate a lot of heat under long-term working conditions. Due to improper heat dissipation measures, the core components work in a high-temperature environment for a long time, and the aging of the components is serious, which greatly shortens the service life of the floodlight.

Contents of the invention

In order to solve the above-mentioned problems in the prior art, the present invention provides a floodlight with good heat dissipation effect and high reliability. The floodlight 10 includes: a bracket 11, a base 12, an LED lamp 13, a reflector 14, a heat sink 15 and a lens 16; wherein,

The base 12 is connected with the support 11;

The LED lamp 13 is fixed at the middle position on the upper surface of the base 12;

The reflector 14 is fixed on the upper surface of the base 12 and is located outside the LED lamp 13;

The heat sink 15 is fixed on the upper surface of the base 12 and is located outside the reflective cup 14;

The lens 16 is fixed on the top of the reflective cup 14 .

In one embodiment of the present invention, the connection between the base 12 and the support 11 is an angle-adjustable structure.

In one embodiment of the present invention, the base 12 is made of aluminum material.

In one embodiment of the present invention, the reflective cup 14 is made of PPS material.

In one embodiment of the present invention, the heat sink 15 is made of aluminum material.

In one embodiment of the present invention, concave grooves are provided on the outer surface of the heat sink 15 .

In one embodiment of the present invention, the lens 16 is made of tempered glass.

In one embodiment of the present invention, a silicone sealing ring is provided between the lens 16 and the reflective cup 14 .

In one embodiment of the present invention, the LED lamp 13 includes:

Heat dissipation substrate 21;

The LED chip is fixedly connected on the heat dissipation substrate 21;

The silica gel layer includes a first lens layer 22, a first encapsulation layer 23, a second lens layer 24 and a second encapsulation layer 25 arranged on the upper surface of the LED chip in sequence, wherein the refractive index of the first lens layer 22 is greater than the refractive index of the first encapsulation layer 23, the second lens layer 24 is greater than the refractive index of the second encapsulation layer 25, and the refraction index of the first encapsulation layer 23 is smaller than that of the second encapsulation layer 25 refractive index.

In one embodiment of the present invention, the LED chip is a GaN-based blue light chip.

Compared with prior art, the beneficial effect of the present invention is:

The projecting light provided by the invention has good heat dissipation effect, simple structure and long service life.

Description of drawings

Fig. 1 is a schematic structural diagram of a projection lamp provided by an embodiment of the present invention;

Fig. 2 is a schematic structural diagram of an LED lamp provided by an embodiment of the present invention;

Fig. 3 is a schematic flow chart of an LED packaging method provided by an embodiment of the present invention;

FIG. 4 is a schematic structural diagram of a GaN-based blue light chip provided by an embodiment of the present invention;

Fig. 5 is a schematic diagram of an LED light emitting principle provided by an embodiment of the present invention;

FIG. 6A is a schematic diagram of an arrangement of a plurality of hemispherical lenses provided by an embodiment of the present invention;

FIG. 6B is a schematic diagram of another arrangement of multiple hemispherical lenses provided by an embodiment of the present invention.

Detailed ways

The present invention will be further described in detail below in combination with specific embodiments. However, it should not be understood that the scope of the above subject matter of the present invention is limited to the following embodiments, and all technologies realized based on the content of the present invention belong to the scope of the present invention.

Embodiment one

Please refer to FIG. 1 , which is a schematic structural diagram of a floodlight provided by an embodiment of the present invention. The floodlight 10 includes: a bracket 11, a base 12, an LED lamp 13, a reflector 14, a heat sink 15 and a lens 16; wherein,

The base 12 is connected with the support 11;

The LED lamp 13 is fixed at the middle position on the upper surface of the base 12;

The reflector 14 is fixed on the upper surface of the base 12 and is located outside the LED lamp 13;

The heat sink 15 is fixed on the upper surface of the base 12 and is located outside the reflective cup 14;

The lens 16 is fixed on the top of the reflective cup 14 .

The projecting light provided in this embodiment is optimized for heat dissipation near the light source, and has good heat dissipation effect, simple structure and long service life.

Embodiment two

This embodiment is based on the first embodiment to further describe the principle and implementation of the present invention.

Specifically, the connecting portion between the base 12 and the bracket 11 is an angle-adjustable structure. In practical application, the irradiation angle of the floodlight 10 is often different, so it is designed as an angle-adjustable structure here to ensure that it can be used in various places.

Preferably, both the base 12 and the heat sink 15 are made of aluminum. Aluminum material has low density and low price. It is a good heat dissipation material and is widely used in electronic products.

Further, the outer surface of the heat sink 15 is provided with concave grooves. The purpose of setting concave grooves on the outer surface of the heat sink 15 is to increase the heat dissipation area and improve the heat dissipation efficiency.

Preferably, the reflective cup 163 is made of high-purity aluminum. Because the cost of the high-purity aluminum reflector is low, the temperature resistance is good, and it also has the effect of heat dissipation.

Preferably, the reflective cup 14 is made of PPS material. PPS material has the characteristics of high temperature resistance. Since the LED lamp 13 in the floodlight 10 will generate a large amount of heat, resulting in high internal temperature, and the PPS material will not deform at this temperature. In addition, the PPS material also has the characteristics of corrosion resistance and superior mechanical properties, so it can be used as the material of the reflector cup.

Preferably, the lens 16 is made of tempered glass. Tempered glass has the characteristics of high strength, not easy to break, easy to process, and good light transmission, so it can be preferably used as the material for making the lens 16 .

Further, a silicone sealing ring is provided between the lens 16 and the reflective cup 14 . The silica gel sealing ring is used to prevent water vapor from entering and exiting the floodlight 10 and to protect the internal components.

In addition, in order to improve the luminous efficiency and heat dissipation effect of the LED lamp 13, its structure has also been optimized. For details, please refer to FIG. 2. FIG. 2 is a schematic structural diagram of an LED lamp provided by an embodiment of the present invention. Lamp 13 includes:

Heat dissipation substrate 21;

The LED chip is fixedly connected on the heat dissipation substrate 21;

The silica gel layer includes a first lens layer 22, a first encapsulation layer 23, a second lens layer 24 and a second encapsulation layer 25 arranged on the upper surface of the LED chip in sequence, wherein the refractive index of the first lens layer 22 is greater than the refractive index of the first encapsulation layer 23, the second lens layer 24 is greater than the refractive index of the second encapsulation layer 25, and the refraction index of the first encapsulation layer 23 is smaller than that of the second encapsulation layer 25 refractive index.

The first lens layer 22 and the second lens layer 24 are respectively composed of a plurality of hemispherical lenses.

Further, the second lens layer 24 and the second encapsulation layer 25 contain fluorescent powder.

Further, the material of the heat dissipation substrate 21 is a solid copper plate, and the thickness of the heat dissipation substrate 21 is greater than 0.5 mm and less than 10 mm.

Further, the refractive index of the first lens layer 22 is greater than the refractive index of the first encapsulation layer 23, the second lens layer 24 is greater than the refractive index of the second encapsulation layer 25, and the first encapsulation layer The refractive index of 23 is smaller than the refractive index of the second encapsulation layer 25 .

Further, the upper surface of the second encapsulation layer 25 is arc-shaped.

Further, the first lens layer 22 and the first encapsulation layer 23 are made of high temperature resistant silicone.

Further, the diameter of the plurality of hemispherical lenses is 10-200 microns, and the plurality of hemispherical lenses are evenly spaced apart with a pitch of 10-200 microns.

Further, a plurality of said hemispherical lenses are arranged in a rectangular shape, or arranged in a staggered manner.

Further, a bracket is also included, and the heat dissipation substrate 21 is fixed on the bracket by buckle or glue.

Further, the LED chip is a gallium nitride-based blue light chip.

The beneficial effects of the present invention are specifically:

1. By setting the first lens layer and the second lens layer, the light is more concentrated, and the upper surface of the second encapsulation layer is set in an arc shape to shape the light beam, avoiding the addition of additional lenses and reducing production costs.

2. By arranging phosphor powder on the second lens layer and the second encapsulation layer, direct coating of phosphor powder on the LED chip is avoided, and the problem of decrease in quantum efficiency of phosphor powder caused by high temperature conditions is solved.

3. Utilizing the characteristics of different refractive indices of different types of silica gel and phosphor glue, the refractive index of the first packaging layer is smaller than that of the second packaging layer, the refractive index of the first lens layer is greater than that of the first packaging layer, and the second The refractive index of the lens layer is greater than that of the first encapsulation layer and that of the second encapsulation layer. This arrangement can avoid total reflection, so that more light emitted by the LED chip can be irradiated through the encapsulation material. .

4. By adopting different arrangements for the hemispherical lenses, it can ensure that the light of the light source is evenly distributed in the concentrated area.

5. In the embodiment of the present invention, by setting double lens layers, the lens can change the propagation direction of light, which can effectively suppress the total reflection effect, facilitate more light emission to the outside of the LED, and improve the luminous efficiency of the LED.

Embodiment Three

Please refer to FIG. 3 . FIG. 3 is a schematic flowchart of an LED packaging method provided by an embodiment of the present invention; on the basis of the above embodiments, this embodiment will introduce the process flow of the present invention in more detail. The method includes:

Step 1, preparing the heat dissipation substrate 21;

Specifically include: selecting the heat dissipation substrate 21;

Clean the heat dissipation substrate 21, and clean the stains on the heat dissipation substrate 21, especially the oil stains;

The heat dissipation substrate 21 is dried.

Step 2, preparing LED chips, and fixing the LED chips on the heat dissipation substrate 21;

In the embodiment of the present invention, as shown in Figure 4, Figure 4 is a schematic structural diagram of a GaN-based blue light chip provided by the embodiment of the present invention; wherein layer 1 is the substrate material, layer 2 is the GaN buffer layer, and layer 3 is the N Type GaN layer, layer 4 and layer 6 are P-type GaN quantum well wide bandgap material, layer 5 is INGaN light-emitting layer, layer 7 is AlGaN barrier layer material, layer 8 is P-type GaN layer, the GaN-based blue light wick The thickness is between 90 microns and 140 microns; the cathode lead and anode lead of the LED chip are soldered to the top of the heat dissipation substrate 21 by reflow soldering process, and then the welding wire is inspected, and if it is qualified, then enter the next process, if not , then re-solder.

Step X1, configuring silica gel materials for preparing the first lens layer 22 and the first encapsulation layer 23 respectively;

Specifically, neither the silica gel material used to prepare the first lens layer 22 nor the silica gel material used to prepare the first encapsulation layer 23 contains phosphor powder, and is a high temperature resistant silica gel material; the refractive index of the first lens layer 22 is smaller than that of the first The refractive index of the encapsulation layer 23 .

Step X2, separately configuring the silica gel material containing phosphor powder used for preparing the second lens layer 24 and the silica gel material containing phosphor powder used for preparing the second encapsulation layer 25,

Specifically, based on the embodiment of the present invention, the LED chip is a gallium nitride-based blue light chip, therefore, the above-mentioned fluorescent powder is a yellow fluorescent powder; the silica gel and the yellow fluorescent powder are mixed, and the ratio of raw materials is adjusted to produce Moreover, after mixing the silica gel and the phosphor powder, it is necessary to carry out a color test on the mixed silica gel material to ensure that the LED chip is irradiated on the phosphor powder, and the wavelength range of the fluorescence emitted is between 570nm and 620nm.

Preferably, the refractive index of the second lens layer 24 is greater than that of the first encapsulation layer 23 and also greater than that of the second encapsulation layer 25 .

Step 3, forming a first lens layer 22 on the upper surface of the LED chip, the first lens layer 22 comprising a plurality of first hemispherical lenses;

Step 31, using a first hemispherical mold to form a plurality of hemispherical silica gel balls above the LED chip;

Step 32: Carrying out the first preliminary baking, demolding and polishing the plurality of hemispherical silica gel balls to form the first lens layer 22, the temperature of the first preliminary baking is 90-125°, and the time is 15-60 minutes .

Preferably, the plurality of first hemispherical lenses on the first lens layer 22 may be arranged in a rectangular or rhombic shape, or in a staggered arrangement, and the smaller the distance between two adjacent first hemispherical lenses, the better.

Step 4, forming a first encapsulation layer 23 on the upper surface of the LED chip and the first lens layer 22;

Step 41, coating a first silica gel layer on the upper surface of the LED chip and the first lens layer 22;

Step 42: Carrying out a second initial baking and grinding on the first silicone layer to form the first encapsulation layer 23, the second initial baking temperature is 90-125°, and the time is 15-60 minutes.

Specifically, the lower surface of the first silica gel layer is in contact with the LED chip or with the first lens layer 22, wherein the upper surface of the first silica gel layer is flat, so that the second lens layer 24 is arranged thereon, and good The flatness is favorable for light beams to pass through the first encapsulation layer 23 .

Step 5, forming a second lens layer 24 above the first encapsulation layer 23, the second lens layer 24 includes a plurality of second hemispherical lenses, and the plurality of second hemispherical lenses contain phosphor;

Step 51, using a second hemispherical mold to form a plurality of hemispherical silica gel balls above the first encapsulation layer 23, and the hemispherical silica gel balls contain fluorescent powder;

Step 52: Carrying out the third preliminary baking, demolding and polishing the plurality of hemispherical silica gel balls to form the second lens layer 24, the temperature of the third preliminary baking is 90-125°, and the time is 15-60 minutes .

Step 6, forming a second encapsulation layer 25 above the second lens layer 24, and the second encapsulation layer 25 contains phosphor;

Step 61, coating a second silicone layer on the second lens layer 24 and the first encapsulation layer 23;

Step 62, using the hemispherical mold to form an arc on the upper surface of the second silica gel layer;

Step 63: Carry out a fourth initial baking, demoulding and polishing on the second silicone layer to form the second encapsulation layer 25, the fourth initial baking temperature is 90-125°, and the time is 15-60 minutes.

Specifically, the upper surface of the second encapsulation layer 25 is set in an arc shape, which forms the appearance characteristics of high middle and low ends, so that the second encapsulation layer 25 has the function of a large lens, which can perform secondary shaping on the light beam, Moreover, there is no need to add an external lens, which reduces the production cost.

Step 7, long-baking the LED lamp including the first lens layer 22, the first encapsulation layer 23, the second lens layer 24 and the second encapsulation layer 25, to complete the encapsulation of the LED .

Specifically, the baking temperature of the long-baking is 100-150° C., and the baking time is 4-12 hours, so as to eliminate the internal stress of the LED lamp.

After the LED packaging is completed, it also includes testing, sorting the packaged LEDs, and packaging and testing qualified LED lights, etc., to facilitate subsequent product applications.

Embodiment four

Please refer to Fig. 2, Fig. 5 and Fig. 6A and Fig. 6B. Fig. 2 is a schematic structural diagram of an LED lamp provided by an embodiment of the present invention; Fig. 5 is a schematic diagram of a light emitting principle of an LED lamp provided by an embodiment of the present invention; FIG. 6A is a schematic diagram of an arrangement of a plurality of hemispherical lenses provided by an embodiment of the present invention; FIG. 6B is a schematic diagram of an arrangement of another plurality of hemispherical lenses provided by an embodiment of the present invention.

Among them, the LED lamp provided by the embodiment of the present invention includes

Heat dissipation substrate 21;

The LED chip is fixedly connected to the packaging heat dissipation substrate 21;

The silicone layer includes a first lens layer 22, a first encapsulation layer 23, a second lens layer 24 and a second encapsulation layer 25 arranged on the upper surface of the LED chip in sequence, wherein the first lens layer 22 and the The second lens layer 24 is composed of a plurality of hemispherical lenses, respectively.

It can be seen that in the LED lamp of the embodiment of the present invention, the first lens layer 22 and the second lens layer 24 are stacked to form a multi-layer lens structure, which makes the illumination more uniform in the concentrated area, and the first lens layer in contact with the LED chip Both the first lens layer 22 and the first encapsulation layer 23 do not contain fluorescent powder, which prevents the chip from absorbing the light that is dissipated backwards, thus improving the light extraction efficiency.

In the embodiment of the present invention, the LED chip is a gallium nitride-based blue light chip, and the second lens layer 24 and the second encapsulation layer 25 contain yellow phosphor. When the gallium nitride-based blue light chip emits light, as shown in FIG. 5 It is shown that when the LED chip is irradiated on the yellow phosphor, the yellow phosphor is excited to emit light and finally forms white light, which separates the LED chip from the phosphor and solves the problem of the decrease in the quantum efficiency of the phosphor caused by high temperature conditions.

In the embodiment of the present invention, the material of the heat dissipation substrate 21 is a solid copper plate, and the thickness of the heat dissipation substrate 21 is greater than 0.5 mm and less than 10 mm. The heat can be dissipated quickly through the solid copper plate, and the thickness of the heat dissipation substrate 21 is between 0.5-10mm. The larger thickness can prevent the heat dissipation substrate 21 from being deformed by heat, and ensure the close contact between the heat dissipation substrate 21 and the LED chip to ensure the heat dissipation effect.

In the embodiment of the present invention, the refractive index of the first lens layer 22 is greater than the refractive index of the first encapsulation layer 23, the second lens layer 24 is greater than the refractive index of the second encapsulation layer 25, and the first The refractive index of the first encapsulation layer 23 is smaller than the refraction index of the second encapsulation layer 25 . In the embodiment of the present invention, the materials of the plurality of hemispherical lenses on the first lens layer 22 and the second lens layer 24 can be mixed by polycarbonate, polymethyl methacrylate and glass, according to the different components The refractive index of the hemispherical lens can be adjusted. The first encapsulation layer 23 does not contain fluorescent powder, and its main constituent material can be organic silicon materials, etc., while the material of the second encapsulation layer 25 can be methyl silicone rubber and phenyl high refractive index Silicone rubber is mixed. In the embodiment of the present invention, the refractive index of the lens layer is greater than that of the encapsulation layer, and the refraction index of the encapsulation layer increases from bottom to top. This arrangement can better suppress the total reflection phenomenon. The light is irradiated to the maximum extent, and the total reflection is avoided so that the light is absorbed by the packaging structure and turned into heat, which improves the light extraction efficiency.

It should be noted that, in the embodiment of the present invention, the smaller the refractive index of the second encapsulation layer 25 is, the better it is, not exceeding 1.5, so as to avoid forming a large refractive index difference with the outside air, resulting in total reflection of light and being absorbed by the encapsulation material Turned into heat, affecting the light output efficiency.

It should be noted that, in the embodiment of the present invention, the first lens layer 22 includes a plurality of first hemispherical lenses, and these first hemispherical lenses are "plano-convex lenses" with a focal length f=R/(n2-n1 ), wherein, n2 is the average value of the refractive index of the first lens layer 22 and the refractive index of the second lens layer 24, and n1 is the average value of the refractive index of the upper and lower packaging layers of the second lens layer 24 (the present invention implements In the example, the refractive index of the first encapsulation layer 23 is smaller than that of the second encapsulation layer 25, but the values of the refraction indices of the two are relatively similar, and the difference in refraction index is not large), and R is the radius of the first hemispherical lens.

In order to ensure that the light is gathered when it reaches the second lens layer 24 after it emerges from the first lens layer 22, in the embodiment of the present invention, the height of the distance L between the first lens layer 22 and the second lens layer 24 should be 2 times Within the focal length, that is, the range of L does not exceed 2R/(n2-n1).

In addition, in the embodiment of the present invention, the thickness of the second encapsulation layer 25 is relatively thick, and the distance from the top surface of the second lens layer 24 to the upper surface of the second encapsulation layer 25 is generally between 50-500 microns.

In the embodiment of the present invention, the upper surface of the second encapsulation layer 25 is arc-shaped, and the arc can be hemispherical, parabolic or flat, and the hemispherical shape has the largest light emitting angle, which is suitable for general lighting applications; The light output angle is the smallest, which is suitable for local lighting applications; while the flat shape is in between, which is suitable for indicator lighting; therefore, specific shapes can be selected according to the application site of the product in order to achieve the best use effect. Such an appearance structure with a high center and low sides makes the second encapsulation layer 25 function as a lens. When the light hits the surface of the second encapsulation layer 25, it will be shaped by the second encapsulation layer 25 to make the light more concentrated and even without The addition of external lenses reduces production costs.

When the LED is working, it will generate a lot of heat, which will cause yellowing of the silicone material when heated, which will affect the color of the light and the service life of the product. Therefore, in the embodiment of the present invention, the first lens layer 22 and the first The encapsulation layer 23 is made of high temperature resistant silica gel.

In the embodiment of the present invention, the diameter of the plurality of hemispherical lenses is 10-200 microns, and the plurality of hemispherical lenses are evenly spaced and arranged at intervals of 10-200 microns, as shown in Figure 2, a plurality of hemispherical lenses The diameter of the lens is 2R, which is between 10-200 microns. It should be noted that the diameters of multiple hemispherical lenses can be the same or different. The distance between two adjacent hemispherical lenses is A, and the range of A Between 10-200 microns, the smaller the distance between two adjacent hemispherical lenses, the better, and the spacing A can be different or evenly arranged, which is not limited in this embodiment.

In the embodiment of the present invention, the arrangement of multiple hemispherical lenses is also appropriately limited. As shown in Figure 6A, multiple hemispherical lenses are arranged in a rectangular shape, or as shown in Figure 6B, multiple hemispherical lenses are arranged in a staggered manner . Specifically, in the embodiment of the present invention, the first lens layer 22 is arranged in a rectangle, and the second lens layer 24 is arranged in a staggered manner, or exchanged with each other, so as to realize the staggered arrangement of the hemispherical lenses of the first lens layer 22 and the second lens layer 24 The effect of the staggered arrangement can gather the light between adjacent lenses to produce a focusing effect.

However, when the hemispherical lenses of the first lens layer 22 and the second lens layer 24 are arranged in the same manner, the chaotic light generated by the LED chip can be shaped and the light can be gathered.

In the embodiment of the present invention, the packaging structure further includes a bracket on which the heat dissipation substrate 21 is fixed, and the fixing methods include buckle, glue and the like.

Specifically, in the embodiment of the present invention, the heat dissipation substrate 21 is a solid copper substrate, the thickness D of the heat dissipation substrate 21 is between 0.5-10mm, and the width W of the heat dissipation substrate 21 is cut according to the size of the LED chip, which is not mentioned here. As a limitation, the copper substrate has a large heat capacity, good thermal conductivity, and is not easily deformed by heat, which makes the heat dissipation of the LED chip better. The first lens layer 22, the radius of each hemispherical lens is R, the distance between two adjacent hemispherical lenses is A, the distance from the top surface of the first lens layer 22 to the bottom surface of the second lens layer 24 is L, L Between 0-2R/(n2-n1), the second lens layer 24 is arranged above the first encapsulation layer 23, the radius of the plurality of hemispherical lenses on the second lens layer 24 is also R, and the second The distance from the top surface of the plurality of hemispherical lenses on the lens layer 24 to the upper surface of the second encapsulation layer 25 is between 50-500 microns. In the embodiment of the present invention, the upper surface of the second encapsulation layer 25 is arc-shaped, forming A larger lens is used to reshape the beam without adding an external lens, thus reducing production costs.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: it can still be Modifications are made to the technical solutions described in the foregoing embodiments, or equivalent replacements are made to some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims (10)

1. A projector (10), characterized in that it comprises: the LED lamp comprises a support (11), a base (12), an LED lamp (13), a reflecting cup (14), a radiating fin (15) and a lens (16); wherein,

the base (12) is connected with the bracket (11);

the LED lamp (13) is fixedly connected to the middle position of the upper surface of the base (12);

the reflecting cup (14) is fixedly connected to the upper surface of the base (12) and is positioned on the outer side of the LED lamp (13);

the radiating fin (15) is fixedly connected to the upper surface of the base (12) and is positioned on the outer side of the reflecting cup (14);

the lens (16) is fixedly connected to the top end of the reflecting cup (14).

2. The floodlight (10) according to claim 1, characterized in that said connection between said base (12) and said support (11) is of angularly adjustable configuration.

3. The floodlight (10) according to claim 1, characterized in that said base (12) is made of aluminum material.

4. The floodlight (10) according to claim 1, characterized in that said reflector cup (14) is made of PPS material.

5. The projector (10) of claim 1 wherein the heat sink (15) is made of aluminum material.

6. The projector (10) of claim 1, characterised in that the external surface of the cooling fins (15) is provided with concave grooves.

7. Projector (10) according to claim 1, characterised in that said lens (16) is made of tempered glass.

8. The floodlight (10) according to claim 1, characterized in that a silicone gasket is provided between said lens (16) and said reflector cup (14).

9. The floodlight (10) according to claim 1, characterized in that said LED lamp (13) comprises:

a heat dissipation substrate (21);

the LED chip is fixedly connected to the heat dissipation substrate (21);

the silica gel layer comprises a first lens layer (22), a first packaging layer (23), a second lens layer (24) and a second packaging layer (25) which are sequentially arranged on the upper surface of the LED chip, wherein the refractive index of the first lens layer (22) is larger than that of the first packaging layer (23), the refractive index of the second lens layer (24) is larger than that of the second packaging layer (25), and the refractive index of the first packaging layer (23) is smaller than that of the second packaging layer (25).

10. The floodlight (10) according to claim 9, characterized in that said LED chip is a gallium nitride-based blue chip.