CN102903833B - Wide angle based indoor lighting lamp - Google Patents
Wide angle based indoor lighting lamp Download PDFInfo
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
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- F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
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- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
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- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
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- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
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- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
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- F21V5/04—Refractors for light sources of lens shape
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- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Abstract
本发明提供了一个照明结构的实施例。该照明结构包括位于衬底上的发光二极管(LED)器件;被固定在衬底上并且位于LED器件上方的透镜;以及被固定在衬底上并且覆盖着透镜的漫射罩,其中,该透镜和漫射罩被设计和配置为:对来自LED器件的发射光进行再分配,从而进行广角照明。本发明还提供了一种广角室内照明灯。
The present invention provides an embodiment of a lighting structure. The lighting structure includes a light emitting diode (LED) device on a substrate; a lens fixed on the substrate and over the LED device; and a diffuser cover fixed on the substrate and covering the lens, wherein the lens and the diffuser cover are designed and configured to redistribute emitted light from the LED devices for wide-angle illumination. The invention also provides a wide-angle indoor lighting lamp.
Description
技术领域 technical field
本发明涉及半导体领域,更具体地,本发明涉及一种广角室内照明灯。The invention relates to the field of semiconductors, and more specifically, the invention relates to a wide-angle indoor lighting lamp.
背景技术 Background technique
发光二极管(LED)广泛地使用在各种应用中,包括指示器、光传感器、交通灯、宽带数据传输以及照明应用。特别是由于LED的低功耗和长使用寿命使LED更加适用于照明应用。在照明应用中,LED具有一些局限性,诸如,带状光谱较窄。可以通过集成各种类型的LED来克服该带状光谱较窄的局限性,从而提供了白光。另一种局限性是定向辐射。源于LED的辐射光功率通常以小立体角分配,该小立体角提供的视角很窄并且与目光照明不同。这种定向的照明和明亮的光线使人的眼睛感到不舒服并且使人的眼睛感到疼痛。除非是为了特定应用需要朝特定方向进行照明,否则不需要LED照明的窄视角,尤其是在室内照明功能中。当前的室内LED灯使用朗伯(Lambertian)发射器和漫射罩来分配发射的光。然而,这些用于分配光的技术仅可以达到140度的照度并且具有些许后向光。所以,LED的辐射仍然是定向的并且不能形成均匀的光分配图案。因此,需要LED结构的构造和方法来解决上述问题。Light emitting diodes (LEDs) are used in a wide variety of applications including indicators, light sensors, traffic lights, broadband data transmission, and lighting applications. In particular, LEDs are more suitable for lighting applications due to their low power consumption and long service life. In lighting applications, LEDs have some limitations, such as a narrow band spectrum. The narrow spectrum limitation of this band can be overcome by integrating various types of LEDs, thus providing white light. Another limitation is directed radiation. Radiant optical power from LEDs is typically distributed over a small solid angle, which provides a narrow viewing angle and differs from eye lighting. Such directional lighting and bright light are uncomfortable and painful to the human eye. The narrow viewing angle of LED lighting is not required, especially in interior lighting functions, unless lighting in a specific direction is required for a specific application. Current indoor LED lights use Lambertian emitters and diffusers to distribute the emitted light. However, these techniques for distributing light can only achieve 140 degrees of illumination with some backlighting. Therefore, the radiation of the LED is still directional and cannot form a uniform light distribution pattern. Accordingly, there is a need for configurations and methods of LED structures to address the above-mentioned problems.
发明内容 Contents of the invention
为了解决现有技术中所存在的问题,根据本发明的一个方面,提供了一种照明结构,包括:发光二极管(LED)器件,位于衬底上;透镜,被固定在所述衬底上,并且位于所述LED器件上方;以及漫射罩,被固定在所述衬底上,并且覆盖着所述透镜,其中,所述透镜和所述漫射罩被设计和配置为对来自所述LED器件的发射光进行再分配,以进行广角照明。In order to solve the problems existing in the prior art, according to one aspect of the present invention, a lighting structure is provided, comprising: a light emitting diode (LED) device located on a substrate; a lens fixed on the substrate, and located above the LED device; and a diffuser cover fixed on the substrate and covering the lens, wherein the lens and the diffuser cover are designed and configured to absorb light from the LED The emitted light from the device is redistributed for wide-angle illumination.
在该照明结构中,所述透镜包括内表面和外表面;所述内表面包括第一侧部和第一顶部;所述外表面包括第二侧部和第二顶部;以及所述第一侧部、所述第一顶部、所述第二侧部、和所述第二顶部被设计和配置为将从所述LED器件发射的光再分配到大于2π球面度的立体角中。In the lighting structure, the lens includes an inner surface and an outer surface; the inner surface includes a first side and a first top; the outer surface includes a second side and a second top; and the first side portion, the first top portion, the second side portion, and the second top portion are designed and configured to redistribute light emitted from the LED device into a solid angle greater than 2π steradians.
在该照明结构中,所述第一侧部、所述第一顶部、所述第二侧部、和所述第二顶部被设计和配置为使得所述发射光在所述照明结构的运行过程中包括:第一光束,穿过所述第一顶部和所述第二顶部,被分配在0球面度和大约2π*[1-cos(π/4)]球面度之间的第一立体角内;第二光束,穿过所述第一侧部和所述第二侧部,被分配在大约2π*[1-cos(π/4)]球面度和大约2π*[1-cos(100π/180)]球面度之间的第二立体角内;以及第三光束,穿过所述第一顶部,从所述第二顶部中反射出,并且穿过所述第二侧部,被分配在大约2π*[1-cos(100π/180)]球面度和4π球面度之间的第三立体角内。In the lighting structure, the first side, the first top, the second side, and the second top are designed and configured such that the emitted light is Including: a first light beam, passing through said first top and said second top, is assigned a first solid angle between 0 steradians and about 2π*[1-cos(π/4)] steradians Inside; a second light beam, passing through said first side and said second side, is distributed between about 2π*[1-cos(π/4)] steradian and about 2π*[1-cos(100π /180)] within the second solid angle between steradians; and a third beam, passing through the first top, reflected from the second top, and passing through the second side, is distributed Within the third solid angle between about 2π*[1-cos(100π/180)] steradians and 4π steradians.
在该照明结构中,所述第二顶部具有凹部。In this lighting structure, the second top has a recess.
在该照明结构中,所述第二顶部包括中心和环绕着所述中心的边沿;所述第二顶部沿着第一方向与所述衬底间隔开,从而沿着所述第一方向限定出从所述第二顶部的边沿到所述衬底的顶面的高度H;所述第二顶部沿着垂直于所述第一方向的第二方向从所述中心跨越到所述边沿,从而限定出第一半径r;所述凹部包括凹陷深度d,所述凹陷深度d被定义为沿着所述第一方向的从所述边沿到所述中心的距离;以及第一比例d/H的范围在大约0.5和大约0.8之间。In the lighting structure, the second top includes a center and an edge surrounding the center; the second top is spaced apart from the substrate along a first direction, thereby defining a boundary along the first direction. The height H from the edge of the second top to the top surface of the substrate; the second top spans from the center to the edge along a second direction perpendicular to the first direction, thereby defining a first radius r; the recess includes a recess depth d defined as a distance from the edge to the center along the first direction; and a range of a first ratio d/H Between about 0.5 and about 0.8.
在该照明结构中,所述第二侧面在所述衬底上限定出圆形区域,并且所述圆形区域具有沿着所述第二方向的第二半径R;并且第二比例r/R的范围在大约0.3和大约1.0之间。In the lighting structure, the second side defines a circular area on the substrate, and the circular area has a second radius R along the second direction; and a second ratio r/R ranges between about 0.3 and about 1.0.
在该照明结构中,所述第一顶部沿着所述第一方向与所述衬底间隔开,从而限定出所述第一顶部到所述衬底的顶面的高度h;并且第三比例h/H的范围在大约0.1和大约0.4之间。In the lighting structure, the first top is spaced apart from the substrate along the first direction, thereby defining a height h of the first top to the top surface of the substrate; and a third ratio The range of h/H is between about 0.1 and about 0.4.
在该照明结构中,进一步包括:第二透镜,覆盖着所述第一透镜,并且被配置在所述漫射罩内部。In the lighting structure, it further includes: a second lens covering the first lens and disposed inside the diffusion cover.
在该照明结构中,所述衬底包括机械底座。In the lighting structure, the substrate includes a mechanical base.
在该照明结构中,所述机械底座包含导热材料,并且被设计为散热器。In this lighting structure, the mechanical base contains thermally conductive material and is designed as a heat sink.
在该照明结构中,所述机械底座包括邻近所述LED器件的第一部分和远离所述LED器件的第二部分;沿着第一方向配置所述第一部分和所述第二部分;所述第一部分沿着与所述第一方向垂直的第二方向具有第一尺寸;所述第二部分沿着所述第二方向具有第二尺寸;并且所述第二尺寸大于所述第一尺寸。In the lighting structure, the mechanical base includes a first part adjacent to the LED device and a second part away from the LED device; the first part and the second part are arranged along a first direction; the first part A portion has a first size along a second direction perpendicular to the first direction; the second portion has a second size along the second direction; and the second size is greater than the first size.
在该照明结构中,进一步包括:散热电路板,与所述LED器件电连接,并且被配置在所述LED器件和所述衬底之间。In the lighting structure, it further includes: a heat dissipation circuit board electrically connected to the LED device and arranged between the LED device and the substrate.
根据本发明的另一方面,提供了一种照明结构,包括:发光二极管(LED)器件,被配置在衬底上;第一透镜,被固定在所述衬底上,并且覆盖着所述LED器件;以及第二透镜,被固定在所述衬底上,并且覆盖着所述第一透镜,其中,所述第一透镜和所述第二透镜被成形和配置为对从所述LED器件中发射出的光进行再分配,以进行广角照明。According to another aspect of the present invention, a lighting structure is provided, including: a light emitting diode (LED) device configured on a substrate; a first lens fixed on the substrate and covering the LED a device; and a second lens mounted on the substrate and covering the first lens, wherein the first lens and the second lens are shaped and configured to align with the LED device The emitted light is redistributed for wide-angle lighting.
在该照明结构中,所述第一透镜包括面向所述LED器件的第一内表面和背向所述LED器件的第一外表面;所述第二透镜包括面向所述LED器件的第二内表面和背向所述LED器件的第二外表面;并且第一内表面、第一外表面、第二内表面以及第二外表面中的每一个都被设计为具有选自由半球的一部分、半椭圆的一部分,以及具有带有凹部的顶部和侧部的表面所构成的组。In this lighting structure, the first lens includes a first inner surface facing the LED device and a first outer surface facing away from the LED device; the second lens includes a second inner surface facing the LED device surface and a second outer surface facing away from the LED device; and each of the first inner surface, the first outer surface, the second inner surface, and the second outer surface is designed to have a portion selected from a hemisphere, a half The group of parts of an ellipse and a surface that has a top and sides with recesses.
在该照明结构中,所述第一透镜和所述第二透镜中的每一个都包含透明材料,所述透明材料选自由聚碳酸酯(PC)和聚甲基丙烯酸甲酯(PMMA)所构成的组。In the lighting structure, each of the first lens and the second lens comprises a transparent material selected from polycarbonate (PC) and polymethyl methacrylate (PMMA). group.
在该照明结构中,所述第二透镜进一步包括散布在透明材料中的漫射粒子,以获得光漫射效果。In the lighting structure, the second lens further includes diffusion particles dispersed in the transparent material to obtain a light diffusion effect.
在该照明结构中,所述LED器件包括多个被配置在所述衬底上的LED芯片。In this lighting structure, the LED device includes a plurality of LED chips arranged on the substrate.
在该照明结构中,所述第一透镜被成形为具有蝙蝠翼结构。In the lighting structure, the first lens is shaped to have a batwing structure.
在该照明结构中,进一步包括:第三透镜,与所述第一透镜和所述第二透镜层叠,以进一步对从所述LED器件发射出的光进行再分配。In the lighting structure, it further includes: a third lens stacked with the first lens and the second lens to further redistribute the light emitted from the LED device.
根据本发明的又一方面,提供了一种制造照明结构的方法,包括:将发光二极管(LED)器件附接至衬底;将第一透镜附接至所述衬底,使所述第一透镜覆盖着所述LED器件;以及将第二透镜附接至所述衬底,使所述第二透镜覆盖着所述第一透镜。According to yet another aspect of the present invention, there is provided a method of manufacturing a lighting structure, comprising: attaching a light emitting diode (LED) device to a substrate; attaching a first lens to the substrate such that the first A lens overlies the LED device; and attaching a second lens to the substrate such that the second lens overlies the first lens.
在该方法中,进一步包括:在将所述第一透镜附接至所述衬底之前,形成第一透镜,所述第一透镜被成形为:对来自所述LED器件的发射光进行再分配,以形成广角照明。In the method, further comprising: prior to attaching the first lens to the substrate, forming a first lens, the first lens shaped to redistribute emitted light from the LED device , to create wide-angle lighting.
在该方法中,所述形成第一透镜包括:使用选自由喷射模塑和挤压模塑所构成的组的技术。In the method, said forming the first lens includes using a technique selected from the group consisting of injection molding and extrusion molding.
附图说明 Description of drawings
当结合附图进行阅读时,根据下面详细的描述可以更好地理解本发明。应该强调的是,根据工业中的标准实践,各种部件没有被按比例绘制。实际上,为了清楚的论述,各种部件的数量和尺寸可以被任意增加或减少。The present invention is better understood from the following detailed description when read with the accompanying figures. It is emphasized that, in accordance with the standard practice in the industry, various features are not drawn to scale. In fact, the number and size of the various components may be arbitrarily increased or decreased for clarity of discussion.
图1是根据一个或多个实施例构成的照明结构的截面图;Figure 1 is a cross-sectional view of a lighting structure constructed in accordance with one or more embodiments;
图2和图3是根据各个实施例构成并且集成在图1的照明结构中的发光二极管(LED)器件的俯视图;2 and 3 are top views of light emitting diode (LED) devices constructed in accordance with various embodiments and integrated in the lighting structure of FIG. 1;
图4在一个实施例中根据本发明的各个方面构成的图1的照明结构的散热器的俯视图;FIG. 4 is a top view of the heat sink of the lighting structure of FIG. 1 constructed in accordance with various aspects of the present invention in one embodiment;
图5至图8和图12是根据各个实施例构成的照明结构的截面图;5 to 8 and 12 are cross-sectional views of lighting structures constructed according to various embodiments;
图5a是根据一个实施例构成的位于图5的照明结构中的透镜的俯视图;以及Figure 5a is a top view of a lens in the lighting structure of Figure 5 constructed according to one embodiment; and
图9至图11是根据各个实施例的图8的照明结构中的透镜表面形状的截面图。9 to 11 are cross-sectional views of lens surface shapes in the lighting structure of FIG. 8 according to various embodiments.
具体实施方式 Detailed ways
可以理解,以下公开提供了多种不同实施例或实例,用于实现各个实施例的不同特征。以下将描述组件和布置的特定实例以简化本发明。当然,这些仅是实例并且不旨在限制本发明。本发明可以在各个实例中重复参考符号和/或字符。这种重复用于简化和清楚,并且其本身不表示所述多个实施例和/或配置之间的关系。It can be understood that the following disclosure provides a variety of different embodiments or examples for realizing different features of each embodiment. Specific examples of components and arrangements are described below to simplify the present disclosure. Of course, these are only examples and are not intended to limit the invention. The present invention may repeat reference symbols and/or characters in various instances. This repetition is for simplicity and clarity, and does not in itself indicate a relationship between the various embodiments and/or configurations described.
图1是照明结构100的截面图。图2和图3是根据各个实施例所构成的集成在照明结构100中的发光二极管(LED)器件的俯视图。图4是在一个实施例中根据本发明各个方面构成的照明结构100的散热器的俯视图。参考图1至图4,共同描述了照明结构100及其制造方法。照明结构100包括作为光发射源的LED器件102。该LED器件102与电路板112相连接并且进一步附接至衬底114。FIG. 1 is a cross-sectional view of a lighting structure 100 . 2 and 3 are top views of light emitting diode (LED) devices integrated in lighting structure 100 constructed according to various embodiments. FIG. 4 is a top view of a heat sink of a lighting structure 100 constructed in accordance with various aspects of the present invention in one embodiment. Referring to FIGS. 1 to 4 , a lighting structure 100 and a method of manufacturing the same are collectively described. The lighting structure 100 includes an LED device 102 as a light emitting source. The LED device 102 is connected to a circuit board 112 and further attached to a substrate 114 .
LED器件102包括如图2所示的一个芯片104,或者如图3所示的多个LED芯片104。当LED器件102包括多个LED芯片104时,为了获得期望的照明效果,可以将多个LED芯片配置成适当的阵列。例如,多个LED芯片104被配置为使得源于各个LED芯片的共同照明有助于发射光在大角度中具有增强的照明均匀度。在另一个实例中,多个LED芯片104包括单个的LED芯片104,每个单个的LED芯片104都被设计为提供不同波长或光谱的可视光,诸如,LED芯片的第一子集用于蓝色,而LED芯片的第二子集用于红色。在此情况下,各个LED芯片104共同提供白色照明或根据特定应用的其他照明效果。在各个实施例中,每个LED芯片104都包括一个发光二极管或多个发光二极管。作为一个实例,当LED芯片包括多个发光二极管时,为了高压工作,这些二极管被串联电连接,或进一步以串联连接的二极管组的形式并联电连接,从而提供冗余和器件耐用性(robustness)。The LED device 102 includes one chip 104 as shown in FIG. 2 , or a plurality of LED chips 104 as shown in FIG. 3 . When the LED device 102 includes a plurality of LED chips 104, in order to obtain a desired lighting effect, the plurality of LED chips can be arranged in an appropriate array. For example, multiple LED chips 104 are configured such that common illumination from individual LED chips facilitates enhanced uniformity of illumination of emitted light over large angles. In another example, the plurality of LED chips 104 includes individual LED chips 104 each designed to provide a different wavelength or spectrum of visible light, such as a first subset of LED chips for blue, while a second subset of LED chips is used for red. In this case, the individual LED chips 104 collectively provide white lighting or other lighting effects according to specific applications. In various embodiments, each LED chip 104 includes a light emitting diode or a plurality of light emitting diodes. As an example, when the LED chip includes a plurality of light emitting diodes, for high voltage operation, these diodes are electrically connected in series, or further electrically connected in parallel in series connected diode groups, thereby providing redundancy and device robustness .
作为一个实例,下面进一步描述LED器件102中的LED芯片104。LED芯片104包括半导体p-n结,该半导体p-n结可以在电磁光谱的紫外区域、可视区域或红外区域中发射自发辐射。在一个实施例中,LED发射蓝光。LED芯片104形成在生长衬底上,诸如,蓝宝石、碳化硅、氮化镓(GaN)或硅衬底。在一个实施例中,LED芯片104包括掺杂了n型杂质的熔覆层(cladding layer)以及掺杂了p型杂质的熔覆层,该熔覆层形成在n型掺杂的熔覆层上方。在一个实例中,n型熔覆层包含n型的氮化镓(n-GaN),而p型的熔覆层包含p型的氮化镓(p-GaN)。可选地,熔覆层可以包含以相应类型掺杂的GaAsP、GaPN、AlInGaAs、GaAsPN或AlGaAs。LED芯片104进一步包括设置在n-GaN和p-GaN之间的多量子阱(MQW)层。该MQW结构包括两层交替的半导体层(诸如,氮化铟镓/氮化镓(InGaN/GaN)),并且被设计为调整LED器件的辐射光谱。LED芯片104进一步包括电极,该电极分别与掺杂了n型杂质的熔覆层和掺杂了p型杂质的熔覆层电连接。例如,可以在掺杂了n型杂质的熔覆层上形成透明的导电层,诸如,氧化锡铟(ITO)。形成n电极并且该电极与掺杂了n型杂质的熔覆层相连接。在该实施例的改进形式中,可以使用引线互连件来连接电极和载体衬底上的端子。LED芯片104可以通过各种导电材料(诸如,银膏、焊料或金属接合)附接于载体衬底。在另一个实施例中,可以使用其他技术(诸如,硅通孔(TSV)和/或金属轨迹)将发光二极管与载体衬底相连接。As an example, the LED chip 104 in the LED device 102 is further described below. The LED chip 104 includes a semiconductor p-n junction that can emit spontaneous radiation in the ultraviolet, visible or infrared regions of the electromagnetic spectrum. In one embodiment, the LED emits blue light. The LED chip 104 is formed on a growth substrate, such as a sapphire, silicon carbide, gallium nitride (GaN), or silicon substrate. In one embodiment, the LED chip 104 includes a cladding layer doped with n-type impurities and a cladding layer doped with p-type impurities, and the cladding layer is formed on the n-type doped cladding layer. above. In one example, the n-type cladding layer includes n-type gallium nitride (n-GaN), and the p-type cladding layer includes p-type gallium nitride (p-GaN). Alternatively, the cladding layer may contain GaAsP, GaPN, AlInGaAs, GaAsPN or AlGaAs doped in a corresponding type. LED chip 104 further includes a multiple quantum well (MQW) layer disposed between n-GaN and p-GaN. The MQW structure includes two alternating semiconductor layers, such as Indium Gallium Nitride/Gallium Nitride (InGaN/GaN), and is designed to tune the radiation spectrum of the LED device. The LED chip 104 further includes electrodes, which are respectively electrically connected to the cladding layer doped with n-type impurities and the cladding layer doped with p-type impurities. For example, a transparent conductive layer, such as indium tin oxide (ITO), may be formed on the cladding layer doped with n-type impurities. An n-electrode is formed and connected to the cladding layer doped with n-type impurities. In a modification of this embodiment, lead interconnects may be used to connect the electrodes to the terminals on the carrier substrate. The LED chip 104 can be attached to the carrier substrate by various conductive materials such as silver paste, solder or metal bonding. In another embodiment, other techniques such as through silicon vias (TSVs) and/or metal traces may be used to connect the light emitting diodes to the carrier substrate.
在另一个实施例中,使用荧光粉将发射光转换成不同的光波长,该荧光粉可以与发射光相结合,从而产生光谱更宽的光,诸如,白光。实施例的范围既不局限于任何特定类型的LED,也不局限于任何特定的配色方案。在所述实施例中,为了变化和改变发射光的波长(诸如,从紫外(UV)到蓝色或从蓝色到红色),在发光二极管周围设置了一种或多种荧光粉。该荧光粉通常是粉末状的并且被包含在其他材料(诸如,环氧树脂或硅树脂(也被称作荧光粉胶))中。利用适当技术将该荧光粉胶应用到LED芯片104,并且进一步以适当的形状和尺寸将该荧光粉胶成形。In another embodiment, phosphors are used to convert the emitted light to different wavelengths of light, which can be combined with the emitted light to produce a broader spectrum of light, such as white light. The scope of the embodiments is neither limited to any particular type of LED nor to any particular color scheme. In the described embodiments, one or more phosphors are disposed around the light emitting diodes in order to vary and change the wavelength of emitted light, such as from ultraviolet (UV) to blue or from blue to red. The phosphor is usually powdered and contained in other materials such as epoxy or silicone (also known as phosphor glue). The phosphor paste is applied to the LED chips 104 using appropriate techniques and further shaped into the appropriate shape and size.
各个实施例可以使用适用于应用方式的任意种类的LED。例如,可以使用传统的LED,诸如,半导体基LED、有机LED(PLED)、聚合物LED(PLED)等。在高输出功率LED中,各个实施例可以具有特殊的使用方式来确保其光输出与所期望的白炽灯泡的光输出相类似。Various embodiments may use any type of LED suitable for the application. For example, conventional LEDs such as semiconductor-based LEDs, organic LEDs (PLEDs), polymer LEDs (PLEDs), etc. may be used. In high output power LEDs, various embodiments may be used in a specific manner to ensure that their light output is similar to that expected from an incandescent bulb.
LED芯片140进一步与电路板112相连接,从而提供电功率并且控制LED芯片104。电路板112可以是载体衬底的一部分。如果使用多个LED芯片104,那么这些LED芯片104可以分享一个电路板。在该实施例中,电路板112是用于有效地散热以及用于热消散的散热电路板112。在一个实例中,使用的是金属核心印刷电路板(MCPCB)。MCPCB可以适用于多种设计。所使用的示例性MCPCB中包括PCB,其中,该PCB的底座材料包括金属,诸如,铝、铜、铜合金等等。将导热介质层设置在底座金属层上面,从而将印刷电路板上的电路与下面的底座金属层电隔离。可以将LED芯片104及其相关的轨迹设置在该导热介电材料上面。The LED chip 140 is further connected to the circuit board 112 to provide electric power and control the LED chip 104 . The circuit board 112 may be part of a carrier substrate. If multiple LED chips 104 are used, then the LED chips 104 can share a circuit board. In this embodiment, the circuit board 112 is a heat-dissipating circuit board 112 for efficient heat dissipation as well as for heat dissipation. In one example, a metal core printed circuit board (MCPCB) is used. MCPCB can be applied to a variety of designs. Exemplary MCPCBs used include PCBs, wherein the base material of the PCB includes metals, such as aluminum, copper, copper alloys, and the like. The thermally conductive medium layer is disposed on the base metal layer, thereby electrically isolating the circuit on the printed circuit board from the underlying base metal layer. An LED chip 104 and its associated traces may be disposed over the thermally conductive dielectric material.
在正常运行期间,LED芯片104产生热量和光。热量的积聚可能会损坏LED芯片104和/或随着时间的推移降低LED芯片104的光输出。MCPCB可以有效地将热量从LED芯片中去除。具体来讲,在一个实例中,通过导热介电层将LED芯片104中的热量传递给金属底座。然后,金属底座将热量传导给散热器,散热器将热量驱散到环境大气中。换言之,导热介电层和金属底座充当了热桥,从而将热量有效地和高效地从LED中传送给散热器。During normal operation, LED chips 104 generate heat and light. The buildup of heat may damage the LED chip 104 and/or reduce the light output of the LED chip 104 over time. MCPCB can effectively remove heat from LED chips. Specifically, in one example, the heat in the LED chip 104 is transferred to the metal base through a thermally conductive dielectric layer. The metal base then conducts the heat to the heat sink, which dissipates the heat into the ambient atmosphere. In other words, the thermally conductive dielectric layer and the metal base act as a thermal bridge to transfer heat effectively and efficiently from the LED to the heat sink.
在一些实例中,金属底座直接接触散热器,而在其他实例中,在散热器和电路板112之间使用了中间材料。该中间材料可以包括,例如,双面热胶带、热胶、热脂等。各个实施例可以适用于使用其他类型的MCPCB。例如,一些MCPCB包括多个线路层,并且在适当时可以使用这种MCPCB。电路板可以由与上述那些材料不同的材料制成。实际上,可以使用适当的材料,甚至可以使用导热性低于MCPCB中所使用的那些材料的材料。例如,其他实施例可以使用由FR-4、陶瓷等制成的电路板。In some instances, the metal base directly contacts the heat sink, while in other instances an intermediate material is used between the heat sink and circuit board 112 . The intermediate material may include, for example, double-sided thermal tape, thermal glue, thermal grease, or the like. Various embodiments may be adapted to use other types of MCPCBs. For example, some MCPCBs include multiple wiring layers, and such MCPCBs may be used where appropriate. The circuit board may be made of materials other than those described above. In fact, suitable materials can be used, even materials with lower thermal conductivity than those used in MCPCBs. For example, other embodiments may use circuit boards made from FR-4, ceramic, and the like.
在另一个实例中,电路板112可以进一步包括功率转换模块。通常都以交流电(ac)(诸如,在美国用120V/60Hz,而在欧洲和亚洲的大部分地区用200V和50Hz以上的交流电)为室内照明提供电功率,并且白炽灯通常直接将功率施加到灯泡的灯丝上。LED器件102需要功率转换模块来将普通的室内电压/频率(高压AC)改变成适用于LED器件102的功率(直流)。各个实施例可以将任意期望的功率类型应用于LED阵列来实现任意期望的照明作用。In another example, the circuit board 112 may further include a power conversion module. Electric power for indoor lighting is usually provided by alternating current (ac) such as 120V/60Hz in the United States and 200V and over 50Hz in most of Europe and Asia, and incandescent lamps usually apply power directly to the bulb on the filament. The LED device 102 requires a power conversion module to change the common room voltage/frequency (high voltage AC) to power suitable for the LED device 102 (DC). Various embodiments may apply any desired type of power to the LED array to achieve any desired lighting effect.
衬底114是用于为LED器件102提供机械支撑的机械底座。衬底114包括金属,诸如,铝、铜或其他适当金属。可以通过适当的技术(诸如,挤压模塑(extrusion molding)或压模铸造(die casting))来形成衬底114。衬底114或衬底114的至少一部分还充当散热器(因此也被称作散热器114)。在一个实施例中,散热器114被设计为具有顶部114a以及底部114b,该顶部具有避免将LED器件102中发射的后向光屏蔽的第一尺寸,而该底部具有大于第一尺寸的第二尺寸,从而提供了有效的热消散。第一部分和第二部分以所期望的热导率连接或被形成为一个部分。散热器114的第一部分114a被设计用于固定LED器件104和电路板112。Substrate 114 is a mechanical base for providing mechanical support for LED device 102 . Substrate 114 includes a metal, such as aluminum, copper, or other suitable metal. Substrate 114 may be formed by a suitable technique such as extrusion molding or die casting. Substrate 114 , or at least a portion of substrate 114 , also acts as a heat sink (hence also referred to as heat sink 114 ). In one embodiment, the heat sink 114 is designed to have a top 114a having a first dimension to avoid shielding the backward light emitted in the LED device 102 and a bottom 114b having a second dimension greater than the first dimension. size, thus providing efficient heat dissipation. The first part and the second part are connected or formed as one part with a desired thermal conductivity. The first portion 114 a of the heat sink 114 is designed to fix the LED device 104 and the circuit board 112 .
根据另一个实施例,为了在提供令人满意的光图案的同时完成热量管理工作,散热器114具有多个面,每个面都具有与灯本身的长度尺寸平行的长度尺寸(在图1中也被称作第一方向或z方向)。这些面对于从外表上看去的灯泡形状系数和表面非常重要。According to another embodiment, in order to accomplish thermal management while providing a satisfactory light pattern, the heat sink 114 has multiple faces, each face having a length dimension parallel to the length dimension of the lamp itself (in FIG. 1 Also referred to as the first direction or the z direction). These faces are important to the apparent bulb form factor and surface.
为了增强热传递,散热器114具有鳍。在特定的实例中,第二部分114b具有如图4所示的鳍。每个鳍都被放置在两个邻接的面之间并且从灯的中心轴向外伸出。这些鳍具有暴露在环境大气中的基本表面积,由此有助于热量从灯的中心传递到空气中。鳍之间的间隔所提供的构造使得发射出的后向光(该立体角大于2π球面度)可以大体上不受阻挡地穿过。To enhance heat transfer, heat sink 114 has fins. In a particular example, the second portion 114b has fins as shown in FIG. 4 . Each fin is positioned between two adjoining faces and projects outwardly from the central axis of the lamp. These fins have a substantial surface area exposed to the ambient atmosphere, thereby facilitating heat transfer from the center of the lamp to the air. The spacing between the fins provides a configuration such that emitted backward light (with a solid angle greater than 2π steradians) can pass through substantially unobstructed.
照明结构100包括透镜122,该透镜被配置为位于LED器件102周围。透镜122包括内表面124和外表面126。内表面124和外表面126被设计成相应的形状和尺寸,从而有效地将发射光从LED器件102分配到广角中。在一个实例中,透镜122的外表面126被设计为包括凹部,使得外表面126朝向中心向下倾斜。更具体地,当沿着第一方向(z方向)测量时,透镜122的外表面的中心部分比边沿低。The lighting structure 100 includes a lens 122 configured to be positioned around the LED device 102 . Lens 122 includes an inner surface 124 and an outer surface 126 . Inner surface 124 and outer surface 126 are shaped and sized accordingly to efficiently distribute emitted light from LED device 102 into a wide angle. In one example, the outer surface 126 of the lens 122 is designed to include a recess such that the outer surface 126 slopes downward toward the center. More specifically, the central portion of the outer surface of the lens 122 is lower than the edges when measured along the first direction (z direction).
透镜122包括对来自LED器件的发射光而言基本上是透明的材料。在一个实例中,来自LED器件102的发射光的透射比大于大约90%。在各个实施例中,透镜122包含聚甲基丙烯酸甲酯(PMMA)、聚碳酸酯(PC)或其他适当的材料。可以通过任意适当的技术(诸如,喷射模塑或挤压模塑)来形成透镜122。在适当地设计和配置透镜122的情况下,从LED器件中102发射出的光可以被分配到超过2π*[1-cos(100π/180)]球面度的立体角中。可以将第二透镜或多个透镜集成到照明结构100,从而进一步加强广角照明。下面描述照明结构100的各个实施例。这些实施例被提供用于说明本发明,而不用于限制本发明的范围。Lens 122 comprises a material that is substantially transparent to emitted light from the LED device. In one example, the transmittance of emitted light from LED device 102 is greater than about 90%. In various embodiments, lens 122 comprises polymethyl methacrylate (PMMA), polycarbonate (PC), or other suitable materials. Lens 122 may be formed by any suitable technique, such as injection molding or extrusion molding. With proper design and configuration of lens 122, light emitted from LED device 102 can be distributed over a solid angle of more than 2π*[1-cos(100π/180)] steradians. A second lens or lenses may be integrated into the lighting structure 100 to further enhance wide angle lighting. Various embodiments of the lighting structure 100 are described below. These examples are provided to illustrate the present invention, not to limit the scope of the present invention.
图5提供了在一个实施例中的根据各个方面构成的照明结构100(为了简化示出了部分)的截面图。该照明结构100包括透镜122,该透镜具有内表面124和外表面126。在一个实施例中,内表面124具有第一侧面(或内侧面)124a和第一顶面(或内顶面)124b。外表面126包括第二侧面(或外表面)126b和第二顶面(或外顶面)126b。FIG. 5 provides a cross-sectional view of a lighting structure 100 (parts shown for simplicity) constructed in accordance with various aspects in one embodiment. The lighting structure 100 includes a lens 122 having an inner surface 124 and an outer surface 126 . In one embodiment, the inner surface 124 has a first side (or inner side) 124a and a first top (or inner top) 124b. The outer surface 126 includes a second side (or outer surface) 126b and a second top surface (or outer top surface) 126b.
第一透镜122被设计为有效地将源于LED器件102的发射光分配到高于100度的顶角或2π*[1-cos(100π/180)]球面度的立体角中。在一个实施例中,内表面124被设计为具有从LED器件102到边缘(或边沿)限定的角度,在边缘处内侧面124a与内顶面124b相接触(meet)。在该实施例中,被限定的角度范围在大约70度和90度之间。在另一个实施例中,内顶面124b包括诸如平面、凹面或凸面的几何结构。在又另一个实施例中,外侧面126a包括诸如平面、凹面或凸面的几何结构。在又另一个实施例中,外顶面126b包括诸如平面、凹面或凸面的几何结构。The first lens 122 is designed to efficiently distribute the emitted light originating from the LED device 102 into an apex angle greater than 100 degrees or a solid angle of 2π*[1-cos(100π/180)] steradians. In one embodiment, inner surface 124 is designed to have an angle defined from LED device 102 to an edge (or rim) where inner side surface 124a meets inner top surface 124b. In this embodiment, the defined angular range is between approximately 70 and 90 degrees. In another embodiment, the inner top surface 124b includes a geometric structure such as a flat, concave, or convex surface. In yet another embodiment, the outer side 126a includes a geometric structure such as a flat, concave, or convex surface. In yet another embodiment, the outer top surface 126b includes a geometric structure such as a flat, concave, or convex surface.
内顶面124b沿着第一方向(z方向)与衬底114间隔开,从而如图5所示地相对于衬底114限定出第一高度h。图5a示出的是照明结构100中的透镜122的部分的俯视图。具体来讲,图5a中仅示出了透镜122的外表面126(126a和126b)。参考图5和图5a,进一步描述了外表面126。如图5a所示,在俯视图中外顶面126b包括中心(被标记为“中心”)和边沿(或第一边沿并且被标记为“边沿1”)。外顶面126b沿着第二方向,从中心跨越(span)到边沿,从而限定出第一半径“r1。如图5中所示,该第二方向垂直于第一方向并且也被称作r方向。外侧面126a在衬底114上限定出圆形区域并且该圆形区域具有沿着第二方向的第二半径R。特别地,是外侧面126a在第一边沿处与外顶面126a相接触并且在第二边沿(被标记为“边沿2”)处与衬底114相接触。沿着第二方向从中心到第二边沿限定出该第二半径R。The inner top surface 124b is spaced apart from the substrate 114 along a first direction (z-direction) to define a first height h relative to the substrate 114 as shown in FIG. 5 . FIG. 5 a shows a top view of part of the lens 122 in the lighting structure 100 . Specifically, only the outer surface 126 (126a and 126b) of lens 122 is shown in FIG. 5a. With reference to Figures 5 and 5a, the outer surface 126 is further described. As shown in Figure 5a, the outer top surface 126b includes a center (labeled "Center") and an edge (or first edge and labeled "Edge 1") in a top view. The outer top surface 126b spans from the center to the edge along a second direction, thereby defining a first radius "r1. As shown in Fig. 5, this second direction is perpendicular to the first direction and is also referred to as r Direction. Outer side 126a defines a circular area on substrate 114 and the circular area has a second radius R along the second direction. Particularly, outer side 126a is in contact with outer top surface 126a at a first edge Contacts and contacts the substrate 114 at a second edge (labeled "Edge 2"). The second radius R is defined along a second direction from the center to the second edge.
类似地,内顶面126a还包括中心。沿着第一方向限定出一条虚线并且该虚线穿过内顶面126a的中心和外顶面126b的中心。在图5中,该虚线被称为主轴。Similarly, inner top surface 126a also includes a center. A virtual line is defined along the first direction and passes through the center of the inner top surface 126a and the center of the outer top surface 126b. In FIG. 5, this dotted line is called the main axis.
外顶面126b沿着第一方向(z方向)与衬底114间隔开,从而限定出第一边沿与衬底114之间的第二高度H。在本实施例中,外顶面126b包括凹部,使得第一边沿高于外顶面126b的中心。外顶面126b是倾斜的,使得当该外顶面从第一边沿处接近中心时,越来越接近衬底102。如图5所示,可以通过参数d来测量外顶面126b的凹部,该参数被限定为沿着第一方向的外顶面的中心与外顶面的第一边沿之间的距离。The outer top surface 126b is spaced apart from the substrate 114 along a first direction (z-direction), thereby defining a second height H between the first edge and the substrate 114 . In this embodiment, the outer top surface 126b includes a concave portion such that the first edge is higher than the center of the outer top surface 126b. The outer top surface 126b is sloped such that it gets closer to the substrate 102 as it approaches the center from the first edge. As shown in FIG. 5 , the concave portion of the outer top surface 126 b can be measured by a parameter d, which is defined as the distance between the center of the outer top surface and the first edge of the outer top surface along a first direction.
在一个实施例中,内表面124和外表面126被设计为利用再分配机构有效地将发射光再分配,下面将进一步参考图6来描述该再分配机构。为了实现该再分配机构,根据各个实例,该透镜122被设计为:上面所限定的尺寸相互之间具有多个比例。在一个实例中,第一比例被确定为r/R并且该第一比例r/R的范围在大约0.3和大约1.0之间。在另一个实例中,第二比例被确定为d/H并且该第二比例d/H的范围在大约0.5和大约0.8之间。在另一个实例中,第三比例被限定为h/H并且该第三比例h/H的范围在大约0.1和大约0.4之间。In one embodiment, inner surface 124 and outer surface 126 are designed to efficiently redistribute emitted light using a redistribution mechanism, which will be further described below with reference to FIG. 6 . In order to realize the redistribution mechanism, according to various examples, the lens 122 is designed such that the dimensions defined above have ratios to each other. In one example, the first ratio is determined as r/R and the first ratio r/R ranges between about 0.3 and about 1.0. In another example, the second ratio is determined as d/H and the second ratio d/H ranges between about 0.5 and about 0.8. In another example, the third ratio is defined as h/H and the third ratio h/H ranges between about 0.1 and about 0.4.
根据一个或多个实施例,参考用于再分配机构的图6来进一步解释图5中的具有透镜122的照明结构100。在照明结构100的运行过程中,LED器件102发射出光。该发射光被分配到顶角为90度或更小的圆锥体中。参考图6所示的主轴来测量该顶角。相应的立体角为2π球面度或更小。发射光穿过透镜122并且通过透镜122的各个表面(包括内侧面124a、内顶面124b、外侧面126b以及外顶面126b)进行再分配。如用于解释目的的实例所描述的,来自LED器件102的发射光包括第一光束(被标记为“光束a”)、第二光束(被标记为“光束b”)以及第三光束(被标记为“光束c”)。如图6所示,第一光束最初定向到立体角中,使得该光束穿过内顶面124b并且随后穿过外顶面126b。该第一光束重定向(redirect)到处在0度和大约45度之间的顶角中。相应的立体角的范围在0球面度到大约2π*[1-cos(π/4)]球面度之间。如图6所示,第二光束最初定向到立体角中,使得该光束穿过内侧面124a并且随后穿过外侧面126a。第二光束重定向到处在大约45度和大约100度之间的顶角中。相应的立体角的范围在大约2π*[1-cos(π/4)]球面度和大约2π*[1-cos(100π/180)]球面度之间。如图6所示,第三光束最初定向到立体角中,使得该光束穿过内顶面124b,外顶面126b处进行反射并且穿过外侧面126a。第三光束重定向到处在大约100度和180度之间的顶角中。相应的立体角的范围在大约2π*[1-cos(100π/180)]球面度和4π球面度之间。因此,来自LED器件102的发射光被带有经过设计的内表面124和外表面126的透镜122再分配到广角中。在所述实例中,来自LED器件102的发射光被再分配到从0至4π球面度的完全立体角中。The lighting structure 100 with lens 122 in FIG. 5 is further explained with reference to FIG. 6 for a redistribution mechanism, according to one or more embodiments. During operation of the lighting structure 100, the LED devices 102 emit light. The emitted light is distributed into a cone with an apex angle of 90 degrees or less. The apex angle is measured with reference to the main axis shown in FIG. 6 . The corresponding solid angle is 2π steradians or less. The emitted light passes through lens 122 and is redistributed by various surfaces of lens 122 , including inner side 124a, inner top 124b, outer side 126b, and outer top 126b. As described as an example for purposes of explanation, emitted light from LED device 102 includes a first beam (labeled "beam a"), a second beam (labeled "beam b"), and a third beam (labeled "beam b"). labeled "beam c"). As shown in FIG. 6, the first light beam is initially directed into the solid corner such that the light beam passes through the inner top surface 124b and then through the outer top surface 126b. The first light beam is redirected into an apex angle between 0 degrees and about 45 degrees. The corresponding solid angles range from 0 steradian to approximately 2π*[1-cos(π/4)] steradian. As shown in FIG. 6, the second light beam is initially directed into the solid corner such that the light beam passes through inner side 124a and then through outer side 126a. The second light beam is redirected into an apex angle between about 45 degrees and about 100 degrees. The corresponding solid angle ranges between about 2π*[1-cos(π/4)] steradians and about 2π*[1-cos(100π/180)] steradians. As shown in FIG. 6, the third light beam is initially directed into the cube corner such that the light beam passes through the inner top surface 124b, reflects at the outer top surface 126b, and passes through the outer side 126a. The third light beam is redirected into an apex angle between approximately 100 and 180 degrees. The corresponding solid angles range between about 2π*[1-cos(100π/180)] steradians and 4π steradians. Thus, emitted light from LED device 102 is redistributed into a wide angle by lens 122 with engineered inner surface 124 and outer surface 126 . In the example, emitted light from LED devices 102 is redistributed into a full solid angle from 0 to 4π steradians.
图7提供了根据另一个实施例中的各个方面构成的照明结构100(为了简化只示出了部分)的截面图。图7的照明结构100与图5的照明结构100类似,但其进一步包括漫射罩128。在一个实施例中,漫射罩128被固定在衬底114的顶部114a上。为了均匀的照明,漫射罩128被设计带有适当的材料来漫射源于LED器件102的发射光。特别地,通过漫射罩128来漫射从透镜122中再分配的光。在一个实施例中,漫射罩128包括透明的材料,诸如,PC、PMMA或其他适当的材料。可以通过适当的技术(诸如,喷射模塑或吹塑模)来形成该漫射罩。为了获得光的漫射效果,漫射罩128进一步包括散布在透明材料中的漫射粒子。漫射粒子的尺寸和浓度被设计为有效地漫射发射光。Figure 7 provides a cross-sectional view of a lighting structure 100 (only partially shown for simplicity) constructed in accordance with various aspects in another embodiment. The lighting structure 100 of FIG. 7 is similar to the lighting structure 100 of FIG. 5 , but it further includes a diffuser cover 128 . In one embodiment, the diffuser cover 128 is secured to the top 114a of the substrate 114 . For uniform illumination, the diffuser cover 128 is designed with suitable materials to diffuse the emitted light from the LED devices 102 . In particular, light redistributed from lens 122 is diffused by diffuser cap 128 . In one embodiment, the diffuser cover 128 comprises a transparent material, such as PC, PMMA, or other suitable material. The diffuser cover may be formed by suitable techniques such as injection molding or blow moulding. In order to obtain a light diffusion effect, the diffusion cover 128 further includes diffusion particles dispersed in the transparent material. The size and concentration of the diffusing particles are designed to effectively diffuse the emitted light.
通过集成在照明结构100中的透镜122和漫射罩128,来自LED器件102的发射光被更均匀地再分配到广角中。在一个实例中,在0和大约2π*[1-cos(135π/180)]球面度之间的立体角区域中的光均匀度小于大约20%。光均匀度被限定为百分比,使得在立体角区域(在所述实例中,在0和2π*[1-cos(135π/180)]球面度之间)中的任意角度上的照明强度与整个角度区域的平均强度之间的差距都不应该大于上述百分比。在所述实例中,该百分比为20%。在特定实例中,光均匀度可以被公式化为|I-Iave|/Iave。在该公式中,参数I是在限定的角度区域中的任意角度上的照明强度。参数Iave被定义为在限定的角度区域上的平均照明强度。在上述实例中,光均匀度为|I-Iave|/Iave≤20%。在该实例的改进形式中,用于后向光的光均匀度为|I-Iave|/Iave≤5%。在该实例中,后向光被定义为处在大约2π*[1-cos(135π/180)]球面度和4π球面度之间的立体角内的从LED器件102中再分配的光。Through the lens 122 and the diffuser cover 128 integrated in the lighting structure 100, the emitted light from the LED devices 102 is more evenly redistributed into a wide angle. In one example, the light uniformity in the solid angle region between 0 and about 2π*[1-cos(135π/180)] steradians is less than about 20%. Light uniformity is defined as a percentage such that the intensity of illumination at any angle in the solid angle region (in the example described, between 0 and 2π*[1-cos(135π/180)] steradians) is equal to the overall The difference between the average intensities of the angular regions should not be greater than the above mentioned percentages. In the example described, this percentage is 20%. In a particular example, light uniformity can be formulated as |II ave |/I ave . In this formula, the parameter I is the intensity of illumination at any angle in a defined angular region. The parameter I ave is defined as the average illumination intensity over a defined angular area. In the above example, the light uniformity is |II ave |/I ave ≤20%. In a modification of this example, the light uniformity for the backward light is |II ave |/I ave ≦5%. In this example, backward light is defined as light redistributed from the LED device 102 within a solid angle between approximately 2π*[1-cos(135π/180)] steradians and 4π steradians.
图8提供的是根据另一个实施例中的各个方面构成的照明结构130(为了简化只示出部分)的截面图。就其他部件(诸如,LED器件102、电路板112以及衬底114)而言,图8的照明结构130与图5的照明结构100类似。然而,照明结构130包括被配置为包围着LED器件102的第一透镜122以及包围着第一透镜122的第二透镜132。第一透镜122包括第一内表面124和第一外表面126。第二透镜132包括第二内表面134和第二外表面136。第一透镜122和第二透镜132的各个表面被设计为将来自LED器件102的发射光有效地再分配到广角(诸如,>2π*[1-cos(100π/180)]球面度)中。在一个实施例中,第一透镜122和第二透镜132的各个表面(包括第一内表面124、第一外表面126、第二内表面134以及第二外表面136)中的每个表面都被设计为具有相应的形状和尺寸,使得从LED器件102中发射出来并且穿过第一和第二透镜的光有效地再分配到广角中。特别地,将第二透镜132的第二内表面134和第二外表面136设计和配置为能够将发射光向后折射(到大于2π球面度的立体角中)。Figure 8 provides a cross-sectional view of a lighting structure 130 (only partially shown for simplicity) constructed in accordance with various aspects in another embodiment. The lighting structure 130 of FIG. 8 is similar to the lighting structure 100 of FIG. 5 with respect to other components such as the LED device 102 , the circuit board 112 and the substrate 114 . However, the lighting structure 130 includes a first lens 122 that is configured to surround the LED device 102 and a second lens 132 that surrounds the first lens 122 . The first lens 122 includes a first inner surface 124 and a first outer surface 126 . The second lens 132 includes a second inner surface 134 and a second outer surface 136 . The respective surfaces of first lens 122 and second lens 132 are designed to efficiently redistribute emitted light from LED device 102 into a wide angle (such as >2π*[1-cos(100π/180)] steradians). In one embodiment, each of the surfaces of the first lens 122 and the second lens 132 (including the first inner surface 124, the first outer surface 126, the second inner surface 134, and the second outer surface 136) are each is designed to have a corresponding shape and size such that light emitted from the LED device 102 and passed through the first and second lenses is efficiently redistributed into a wide angle. In particular, second inner surface 134 and second outer surface 136 of second lens 132 are designed and configured to refract emitted light backwards (into a solid angle greater than 2π steradians).
在一个实施例中,第一透镜122和第二透镜132的各个表面(包括第一内表面124、第一外表面126、第二内表面134以及第二外表面136)中的每个表面都被设计为具有选自于由半球(如图9所示)、半椭圆(如图10所示)以及具有带有凹进处的顶部和侧部的表面(如图11所示)所构成的组的相应的几何结构。图9至图11是根据一个或多个实施例中的各个方面构成的表面几何结构的截面图。特别地,图11中的表面几何结构从中心下降了一个高度。在特定的实施例中,这些表面(124、126、134和136)中的至少一个表面被成形为如图11所示地具有带有凹部的顶部和侧部。In one embodiment, each of the surfaces of the first lens 122 and the second lens 132 (including the first inner surface 124, the first outer surface 126, the second inner surface 134, and the second outer surface 136) are each Designed to have a shape selected from the group consisting of hemispheres (as shown in Figure 9), semi-ellipses (as shown in Figure 10), and surfaces with recessed tops and sides (as shown in Figure 11) The corresponding geometry of the group. 9-11 are cross-sectional views of surface geometries constructed in accordance with various aspects in one or more embodiments. In particular, the surface geometry in Figure 11 drops one height from the center. In a particular embodiment, at least one of these surfaces ( 124 , 126 , 134 , and 136 ) is shaped to have a top and sides with recesses as shown in FIG. 11 .
第二透镜132沿着第一方向(z方向)跨越(span)了第一尺寸并且沿着第二方向(r方向)跨越了第二尺寸。在一个实施例中,第一尺寸的范围在大约20mm和大约40mm之间。在另一个实施例中,第二尺寸的范围在大约30mm和大约60mm之间。The second lens 132 spans a first dimension along a first direction (z direction) and spans a second dimension along a second direction (r direction). In one embodiment, the first dimension ranges between about 20mm and about 40mm. In another embodiment, the second dimension ranges between about 30mm and about 60mm.
第一透镜122和第二透镜132中的至少一个包含高透明材料,诸如,透射比大于大约90%的材料。在一个实施例中,高透明材料包括玻璃或聚合材料。在各个实施例中,高透明材料包括通过适当的技术(诸如,喷射模塑)所形成的PMMA或PC。在另一个实施例中,第二透镜132包含带有高透射比的类漫射材料(diffuser-like)。例如,第二透镜132包括具有透射比大于大约90%并且混浊度(cloudiness)大于大约80%的材料。在一个实例中,为了获得光漫射效果,第二透镜132包含散布有漫射粒子的透明材料(诸如,PC或PMMA)。At least one of the first lens 122 and the second lens 132 includes a highly transparent material, such as a material having a transmittance greater than about 90%. In one embodiment, the highly transparent material includes glass or a polymeric material. In various embodiments, the highly transparent material comprises PMMA or PC formed by a suitable technique, such as injection molding. In another embodiment, the second lens 132 includes a diffuser-like material with high transmittance. For example, the second lens 132 includes a material having a transmittance greater than about 90% and a cloudiness greater than about 80%. In one example, in order to obtain light diffusion effect, the second lens 132 includes a transparent material (such as PC or PMMA) dispersed with diffusion particles.
在可选的实施例中,照明结构130进一步包括第三透镜或更多透镜,从而有效地将来自LED器件102的发射光以高角度均匀性再分配到广角中。In an optional embodiment, the lighting structure 130 further includes a third lens or more lenses to efficiently redistribute the emitted light from the LED devices 102 into a wide angle with high angular uniformity.
图12提供了根据另一个实施例中的各个方面构成的照明结构140(为了简化只示出了部分)的截面图。图12的照明结构140与图8的照明结构130类似,但其进一步包括漫射罩128。照明结构140具体包括利用一种或多种透明材料形成的第一透镜122和第二透镜132。在一个实施例中,照明结构140进一步包括固定在衬底114的顶部114a上的漫射罩128。为了在不同角度上的均匀照明,漫射罩128被设计为带有适当的用于漫射来自LED器件102的发射光的材料。特别地,来自第一透镜122和第二透镜132的再分配光通过漫射罩128被进一步漫射。在一个实施例中,漫射罩128包括透明材料,诸如,PC、PMMA、或其他适当材料。可以通过适当的技术(诸如,喷射模塑或吹塑模(plastic blow))来形成漫射罩128。为了获得光漫射效果,漫射罩128进一步包括散布在透明材料中的漫射粒子。Figure 12 provides a cross-sectional view of a lighting structure 140 (only partially shown for simplicity) constructed in accordance with various aspects in another embodiment. The lighting structure 140 of FIG. 12 is similar to the lighting structure 130 of FIG. 8 , but further includes a diffuser cover 128 . The lighting structure 140 specifically includes a first lens 122 and a second lens 132 formed using one or more transparent materials. In one embodiment, the lighting structure 140 further includes a diffuser cover 128 secured to the top 114 a of the substrate 114 . For uniform illumination at different angles, the diffuser cover 128 is designed with suitable materials for diffusing the emitted light from the LED devices 102 . In particular, the redistributed light from the first lens 122 and the second lens 132 is further diffused by the diffuser cover 128 . In one embodiment, the diffuser cover 128 comprises a transparent material, such as PC, PMMA, or other suitable material. Diffuser cover 128 may be formed by suitable techniques such as injection molding or plastic blow. In order to obtain light diffusion effect, the diffusion cover 128 further includes diffusion particles dispersed in the transparent material.
尽管在本发明中提供和阐释了多个实施例。但也可以在不背离本发明的主旨的条件下使用其他可选方案和实施例。在一个实施例中,为了期望的光再分配,第一透镜122和/或第二透镜132的各个表面可以被设计为分别带有不同的几何结构。在另一个实施例中,透镜122(和/或透镜132)具有蝙蝠翼结构。蝙蝠翼透镜具有用于折射光路的棱柱形的肋。特别地,面(124、126、134和136)之一具有蝙蝠翼结构。在一个具有蝙蝠翼结构的透镜表面的实例中,该透镜表面与图11中的几何结构类似,但该透镜表面在截面图中包括多个顶峰和凹陷诸,如,波浪般的表面轮廓。While a number of embodiments have been provided and illustrated in this disclosure. However, other alternatives and embodiments may also be used without departing from the spirit of the invention. In one embodiment, the respective surfaces of the first lens 122 and/or the second lens 132 may be designed with different geometric structures for desired light redistribution. In another embodiment, lens 122 (and/or lens 132 ) has a batwing configuration. Batwing lenses have prismatic ribs for refracting the light path. In particular, one of the faces (124, 126, 134 and 136) has a batwing structure. In one example of a lens surface with a batwing structure, the lens surface is similar to the geometry in FIG. 11 , but the lens surface includes peaks and depressions such as, for example, a wave-like surface profile in cross-section.
因此,本发明提供了照明结构。该照明结构包括位于衬底上的发光二极管(LED)器件;被固定在衬底上并且位于LED器件上方的透镜;以及被固定在衬底上并且覆盖着透镜的漫射罩,其中,该透镜和漫射罩被设计和配置为对来自LED器件的发射光进行再分配,以进行广角照明。Accordingly, the present invention provides lighting structures. The lighting structure includes a light emitting diode (LED) device on a substrate; a lens fixed on the substrate and over the LED device; and a diffuser cover fixed on the substrate and covering the lens, wherein the lens and a diffuser cover designed and configured to redistribute emitted light from the LED devices for wide-angle illumination.
在一个实施例中,透镜包括内表面和外表面;该内表面包括第一侧部和第一顶部;该外表面包括第二侧部和第二顶部;并且第一侧部、第一顶部、第二侧部以及第二顶部被设计和配置为将来自LED器件的发射光再分配到大于2π球面度的立体角中。In one embodiment, the lens includes an inner surface and an outer surface; the inner surface includes a first side and a first top; the outer surface includes a second side and a second top; and the first side, the first top, The second side and the second top are designed and configured to redistribute emitted light from the LED device into a solid angle greater than 2π steradians.
在另一个实施例中,第一侧部、第一顶部、第二侧部以及第二顶部被设计和配置为使得发射光在照明结构的运行过程中包括第一光束、第二光束以及第三光束,第一光束穿过第一顶部和第二顶部,被分配在0球面度和大约2π*[1-cos(π/4)]球面度之间的第一立体角内;第二光束穿过第一侧部和第二侧部,被分配在大约2π*[1-cos(π/4)]球面度和大约2π*[1-cos(100π/180)]球面度之间的第二立体角内;第三光束穿过第一顶部,从第二顶部中反射出来,并且穿过第二侧部,被分配在大约2π*[1-cos(100π/180)]球面度和4π球面度之间的第三立体角内。In another embodiment, the first side, the first top, the second side and the second top are designed and configured such that the emitted light comprises the first light beam, the second light beam and the third light beam during operation of the lighting structure. Beams, the first beam passing through the first top and the second top, are distributed within a first solid angle between 0 steradian and about 2π*[1-cos(π/4)] steradian; the second beam passing through Through the first side and the second side, the second side is assigned between about 2π*[1-cos(π/4)] steradian and about 2π*[1-cos(100π/180)] steradian Within the solid angle; the third beam passes through the first top, reflects from the second top, and passes through the second side, being distributed between about 2π*[1-cos(100π/180)] steradians and 4π steradians within the third solid angle between degrees.
在又一个实施例中,第二顶部具有凹部,在该实施例中,第二顶部包括中心和环绕着该中心的边沿;该第二顶部沿着第一方向与衬底间隔开,从而沿着第一方向限定出从第二顶部的边沿到衬底的顶面的高度H;第二顶部沿着与第一方向垂直的第二方向从中心延伸到边沿,从而限定出第一半径r;凹部包括凹陷深度d,该深度d被定义为沿着第一方向从边沿到中心的距离;并且第一比例d/H的范围在大约0.5至0.8之间。In yet another embodiment, the second top has a recess, and in this embodiment, the second top includes a center and a rim surrounding the center; the second top is spaced apart from the substrate along the first direction so as to be along The first direction defines a height H from the edge of the second top to the top surface of the substrate; the second top extends from the center to the edge along a second direction perpendicular to the first direction, thereby defining a first radius r; the recess Including a recess depth d, which is defined as the distance from the edge to the center along the first direction; and the first ratio d/H ranges from about 0.5 to 0.8.
下面提供多个其他实施例。第二侧部在衬底上限定出圆形区域,并且该圆形区域沿着第二方向具有第二半径R;并且第二比例r/R的范围在大约0.3和大约1.0之间。第一顶部沿着第一方向与衬底间隔开,从而相对于衬底的顶面限定出高度h;并且第三比例h/H的范围在大约0.1和大约0.4之间。A number of other examples are provided below. The second side portion defines a circular area on the substrate, and the circular area has a second radius R along the second direction; and the second ratio r/R ranges between about 0.3 and about 1.0. The first top is spaced from the substrate along a first direction to define a height h relative to the top surface of the substrate; and the third ratio h/H ranges between about 0.1 and about 0.4.
照明结构可以进一步包括覆盖着第一透镜并且被配置在漫射罩内侧的第二透镜。衬底可以包括机械底座。该机械底座可以包括导热材料,并且被设计为散热器。在另一实施例中,该机械底座包括邻近LED器件的第一部分以及远离LED器件的第二部分;沿着第一方向配置该第一部分和第二部分;第一部分沿着与第一方向垂直的第二方向具有第一尺寸;第二部分沿着第二方向具有第二尺寸;并且第二尺寸大于第一尺寸。照明结构进一步包括与LED器件电连接的散热电路板;并且该散热电路版被配置在LED器件和衬底之间。The lighting structure may further include a second lens covering the first lens and disposed inside the diffuser cover. The substrate may include a mechanical mount. The mechanical base may comprise thermally conductive material and be designed as a heat sink. In another embodiment, the mechanical base includes a first portion adjacent to the LED device and a second portion away from the LED device; the first portion and the second portion are arranged along a first direction; the first portion is arranged along a direction perpendicular to the first direction The second direction has a first dimension; the second portion has a second dimension along the second direction; and the second dimension is greater than the first dimension. The lighting structure further includes a heat dissipation circuit board electrically connected with the LED device; and the heat dissipation circuit board is configured between the LED device and the substrate.
本发明还提供了照明结构的另一个实施例。该照明结构包括发光二极管(LED)器件,该发光二极管(LED)器件被配置在衬底上;被固定在衬底上,并且覆盖了LED器件的第一透镜;以及被固定在衬底上并且覆盖了第一透镜的第二透镜,其中,第一透镜和第二透镜被形成和配置为对源于LED器件的发射光进行再分配,以进行广角照射。The present invention also provides another embodiment of the lighting structure. The lighting structure includes a light emitting diode (LED) device configured on a substrate; a first lens that is fixed on the substrate and covers the LED device; and is fixed on the substrate and A second lens overlays the first lens, wherein the first lens and the second lens are formed and configured to redistribute light emitted from the LED device for wide-angle illumination.
在公开的照明结构的一个实施例中,第一透镜包括面向LED器件的第一内表面和背向LED器件的第一外表面;第二透镜包括面向LED器件的第二内表面和背向LED器件的第二外表面;并且第一内表面、第一外表面、第二内表面以及第二外表面中的每一个都被设计为具有选自由半球的一部分、半椭圆,以及半球圆的一部分和具有带有凹部的顶部和侧部的表面所构成的组。在另一个实施例中,第一透镜和第二透镜包含透明材料,该材料选自于由聚碳酸酯(PC)和聚甲基丙烯酸甲酯(PMMA)所构成的组。第二透镜可以进一步包括散布在透明材料中的漫射粒子,以获得光漫射效果。LED器件可以包括多个被配置在衬底上的LED芯片。第一透镜可以被成形为带有蝙蝠翼结构。照明结构可以进一步包括第三透镜,该第三透镜与第一透镜和第二透镜层叠(cascade),从而进一步对源于LED器件的发射光进行再分配。In one embodiment of the disclosed lighting structure, the first lens includes a first inner surface facing the LED device and a first outer surface facing away from the LED device; the second lens includes a second inner surface facing the LED device and a first outer surface facing away from the LED device. the second outer surface of the device; and each of the first inner surface, the first outer surface, the second inner surface, and the second outer surface is designed to have a portion selected from a hemisphere, a semiellipse, and a hemispherical circle and a surface having a top and a side with a recess. In another embodiment, the first lens and the second lens comprise a transparent material selected from the group consisting of polycarbonate (PC) and polymethyl methacrylate (PMMA). The second lens may further include diffusion particles dispersed in the transparent material to obtain a light diffusion effect. An LED device may include a plurality of LED chips configured on a substrate. The first lens may be shaped with a batwing structure. The lighting structure may further include a third lens cascaded with the first and second lenses to further redistribute the emitted light originating from the LED devices.
本发明还提供了制造照明结构的方法的实施例。该方法包括将发光二极管(LED)器件附接至衬底;将第一透镜附接至衬底,该第一透镜覆盖着LED器件;并且将第二透镜附接至衬底,该第二透镜覆盖着第一透镜。该方法可以进一步包括形成第一透镜,在将第一透镜附接至衬底之前,形成第一透镜,使该第一透镜成形为:对源于LED器件的发射光进行再分配。第一透镜的形成可以包括使用选自由喷射模塑和挤压模塑所构成的组的技术。The invention also provides embodiments of methods of manufacturing lighting structures. The method includes attaching a light emitting diode (LED) device to a substrate; attaching a first lens to the substrate, the first lens covering the LED device; and attaching a second lens to the substrate, the second lens covered with the first lens. The method may further include forming a first lens, prior to attaching the first lens to the substrate, forming the first lens, the first lens being shaped to redistribute emitted light from the LED device. Forming the first lens may include using a technique selected from the group consisting of injection molding and extrusion molding.
上面论述了若干实施例的部件,使得本领域普通技术人员可以更好地理解随后的具体说明。本领域普通技术人员应该理解,可以很容易地使用本发明作为基础来设计或更改其他用于达到与这里所介绍实施例相同的目的和/或实现相同优点的处理和结构。本领域普通技术人员也应该意识到,这种等效构造并不背离本发明的精神和范围,并且在不背离本发明的精神和范围的情况下,可以进行多种变化、替换以及改变。The foregoing discusses components of several embodiments so that those of ordinary skill in the art may better understand the detailed description that follows. It should be understood by those skilled in the art that the present invention can be easily used as a basis to design or modify other processes and structures for achieving the same purpose and/or achieving the same advantages as the embodiments presented herein. Those skilled in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the invention, and that they could make various changes, substitutions and alterations herein without departing from the spirit and scope of the invention.
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| US (3) | US8757845B2 (en) |
| CN (1) | CN102903833B (en) |
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| CN103375768A (en) * | 2012-04-26 | 2013-10-30 | 全亿大科技(佛山)有限公司 | Lens and light source module |
| DE102012109113A1 (en) * | 2012-09-26 | 2014-04-17 | Osram Opto Semiconductors Gmbh | Optical element and lighting device with an optical element |
| KR102081246B1 (en) * | 2013-04-15 | 2020-02-25 | 엘지전자 주식회사 | Display apparatus |
| US9435504B2 (en) * | 2013-10-30 | 2016-09-06 | Ford Global Technologies, Llc | Apparatus for radiating light from a virtual source |
| TWI599800B (en) * | 2013-12-26 | 2017-09-21 | 鴻海精密工業股份有限公司 | Lens and light source module having the same |
| CN105318278B (en) * | 2014-07-28 | 2019-10-15 | 晶元光电股份有限公司 | light emitting assembly |
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| KR20160054666A (en) * | 2014-11-06 | 2016-05-17 | 삼성전자주식회사 | Light source module and lighting device having the same |
| CN109882746A (en) * | 2017-07-09 | 2019-06-14 | 曹建新 | A kind of radiating LED lamp |
| KR102330015B1 (en) | 2017-07-21 | 2021-11-22 | 엘지디스플레이 주식회사 | Lens, light source device, back light unit and electronic device |
| CN108167674A (en) * | 2018-01-30 | 2018-06-15 | 中国科学院工程热物理研究所 | The filament lamp of micron LED chip |
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| CN1376314A (en) * | 1999-07-26 | 2002-10-23 | 拉博斯费尔株式会社 | Bulk lens, light emitting body, lighting device and optical information system |
Also Published As
| Publication number | Publication date |
|---|---|
| US8757845B2 (en) | 2014-06-24 |
| TWI534390B (en) | 2016-05-21 |
| CN102903833A (en) | 2013-01-30 |
| US20140293615A1 (en) | 2014-10-02 |
| TW201305497A (en) | 2013-02-01 |
| US20130027946A1 (en) | 2013-01-31 |
| US20160215939A1 (en) | 2016-07-28 |
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