CN108006489B - Light projector - Google Patents

Abstract

The invention discloses a projection lamp 10, comprising: the LED lamp comprises a support 11, a base 12, an LED lamp 13, a reflecting cup 14, a radiating fin 15 and a lens 16; wherein, the base 12 is connected with the bracket 11; the LED lamp 13 is fixedly connected to the middle position of the upper surface of the base 12; the reflecting cup 14 is fixedly connected to the upper surface of the base 12 and is positioned outside the LED lamp 13; the heat sink 15 is fixedly connected to the upper surface of the base 12 and located outside the reflective cup 14; the lens 16 is fixedly connected to the top end of the reflecting cup 14. The projection lamp provided by the invention has the advantages of good heat dissipation effect, simple structure and long service life.

Description

Spotlights

technical field

The invention belongs to the field of lighting, in particular to a floodlight.

Background technique

Flood light is a kind of projection lighting fixture with simple structure, convenient and flexible use, mainly used in large-area mines, building outlines, stadiums, overpasses, monuments, parks, flower beds and other places.

The current projection lamps basically use LED chips as their luminous sources. Due to the high brightness requirements of the projection lamps, the luminous sources usually use high-power LED chips, which will generate a lot of heat under long-term working conditions. Due to improper heat dissipation measures, the core components work in a high temperature environment for a long time, and the components are seriously aged, which greatly shortens the service life of the floodlight.

SUMMARY OF THE INVENTION

In order to solve the above problems existing in the prior art, the present invention provides a floodlight with good heat dissipation effect and high reliability. The floodlight 10 includes: a bracket 11, a base 12, an LED lamp 13, a reflector 14, a heat sink 15 and a lens 16; wherein,

The base 12 is connected with the bracket 11;

The LED light 13 is fixed at the middle position of the upper surface of the base 12;

The reflector 14 is fixed on the upper surface of the base 12 and is located outside the LED lamp 13;

The heat sink 15 is fixed on the upper surface of the base 12 and is located outside the reflector 14;

The lens 16 is fixed on the top of the reflector 14 .

In an embodiment of the present invention, the connection portion between the base 12 and the bracket 11 is an angle-adjustable structure.

In one embodiment of the present invention, the base 12 is made of aluminum material.

In an embodiment of the present invention, the reflector 14 is made of PPS material.

In one embodiment of the present invention, the heat sink 15 is made of aluminum material.

In an embodiment of the present invention, the outer surface of the heat sink 15 is provided with a concave groove.

In an embodiment of the present invention, the lens 16 is made of tempered glass.

In an embodiment of the present invention, a silicone sealing ring is provided between the lens 16 and the reflector 14 .

In an embodiment of the present invention, the LED lamp 13 includes:

heat dissipation substrate 21;

The LED chip is fixed on the heat dissipation substrate 21;

The silica gel layer includes a first lens layer 22 , a first encapsulation layer 23 , a second lens layer 24 and a second encapsulation layer 25 which are sequentially arranged on the upper surface of the LED chip, wherein the refractive index of the first lens layer 22 is greater than the refractive index of the first encapsulation layer 23 , the second lens layer 24 is greater than the refractive index of the second encapsulation layer 25 , and the refractive index of the first encapsulation layer 23 is smaller than that of the second encapsulation layer 25 refractive index.

In an embodiment of the present invention, the LED chip is a gallium nitride-based blue light chip.

Compared with the prior art, the beneficial effects of the present invention are:

The floodlight provided by the invention has good heat dissipation effect, simple structure and long service life.

Description of drawings

1 is a schematic structural diagram of a floodlight provided by an embodiment of the present invention;

FIG. 2 is a schematic structural diagram of an LED lamp according to an embodiment of the present invention;

3 is a schematic flowchart of an LED packaging method according to an embodiment of the present invention;

4 is a schematic structural diagram of a GaN-based blue light chip provided by an embodiment of the present invention;

FIG. 5 is a schematic diagram of a light-emitting principle of an LED lamp according to an embodiment of the present invention;

6A is a schematic diagram of the arrangement of a plurality of hemispherical lenses according to an embodiment of the present invention;

FIG. 6B is a schematic diagram of another arrangement of a plurality of hemispherical lenses according to an embodiment of the present invention.

Detailed ways

The present invention will be further described in detail below in conjunction with specific embodiments. However, it should not be construed that the scope of the above-mentioned subject matter of the present invention is limited to the following embodiments, and all technologies realized based on the content of the present invention belong to the scope of the present invention.

Example 1

Please refer to FIG. 1 , which is a schematic structural diagram of a floodlight according to an embodiment of the present invention. The floodlight 10 includes: a bracket 11, a base 12, an LED lamp 13, a reflector 14, a heat sink 15 and a lens 16; wherein,

The base 12 is connected with the bracket 11;

The LED light 13 is fixed at the middle position of the upper surface of the base 12;

The reflector 14 is fixed on the upper surface of the base 12 and is located outside the LED lamp 13;

The heat sink 15 is fixed on the upper surface of the base 12 and is located outside the reflector 14;

The lens 16 is fixed on the top of the reflector 14 .

The floodlight provided in this embodiment has a heat dissipation optimization design near the light source, and has good heat dissipation effect, simple structure and long service life.

Embodiment 2

This embodiment further describes the principle and implementation manner of the present invention on the basis of the first embodiment.

Specifically, the connection portion between the base 12 and the bracket 11 is an angle-adjustable structure. In practical applications, the illumination angles of the floodlight 10 are often different, so the angle-adjustable structure is designed here to ensure that it can be used in various places.

Preferably, the base 12 and the heat sink 15 are both made of aluminum material. Aluminum material has low density and low price. It is a good heat dissipation material and is widely used in electronic products.

Further, the outer surface of the heat sink 15 is provided with a concave groove. The purpose of disposing the concave grooves on the outer surface of the heat sink 15 is to increase the heat dissipation area to improve the heat dissipation efficiency.

Preferably, the reflector cup 163 is made of high-purity aluminum material. Because the high-purity aluminum reflector has low cost, good temperature resistance, and has the effect of heat dissipation.

Preferably, the reflector 14 is made of PPS material. PPS material has the characteristics of high temperature resistance. Since the LED lamp 13 in the flood light 10 will generate a lot of heat, the internal temperature will be high, and the PPS material will not deform at this temperature. In addition, PPS material also has characteristics such as corrosion resistance and excellent mechanical properties, so it can be used as a material for reflectors.

Preferably, the lens 16 is made of tempered glass. Tempered glass has the characteristics of high strength, not easy to break, easy to process, and good light transmittance, so it can be preferably used as the material for making the lens 16 .

Further, a silicone sealing ring is arranged between the lens 16 and the reflector 14 . The silicone sealing ring is used to prevent the water vapor from entering and leaving the inside of the flood light 10, and has a protective effect on the internal components thereof.

In addition, in order to improve the luminous efficiency and heat dissipation effect of the LED lamp 13, its structure is also optimized. For details, please refer to FIG. 2. FIG. 2 is a schematic structural diagram of an LED lamp provided by an embodiment of the present invention. Lamp 13 includes:

heat dissipation substrate 21;

The LED chip is fixed on the heat dissipation substrate 21;

The silica gel layer includes a first lens layer 22 , a first encapsulation layer 23 , a second lens layer 24 and a second encapsulation layer 25 which are sequentially arranged on the upper surface of the LED chip, wherein the refractive index of the first lens layer 22 is greater than the refractive index of the first encapsulation layer 23 , the second lens layer 24 is greater than the refractive index of the second encapsulation layer 25 , and the refractive index of the first encapsulation layer 23 is smaller than that of the second encapsulation layer 25 refractive index.

The first lens layer 22 and the second lens layer 24 are respectively composed of a plurality of hemispherical lenses.

Further, the second lens layer 24 and the second encapsulation layer 25 contain phosphors.

Further, the material of the heat dissipation substrate 21 is a solid copper plate, and the thickness of the heat dissipation substrate 21 is greater than 0.5 mm and less than 10 mm.

Further, the refractive index of the first lens layer 22 is greater than the refractive index of the first encapsulation layer 23 , the second lens layer 24 is greater than the refractive index of the second encapsulation layer 25 , and the first encapsulation layer The refractive index of 23 is smaller than the refractive index of the second encapsulation layer 25 .

Further, the upper surface of the second encapsulation layer 25 is arc-shaped.

Further, the first lens layer 22 and the first encapsulation layer 23 are made of high temperature resistant silica gel.

Further, the diameters of the plurality of the hemispherical lenses are 10-200 microns, and the plurality of the hemispherical lenses are evenly spaced with a spacing of 10-200 microns.

Further, a plurality of the hemispherical lenses are arranged in a rectangle or in a staggered arrangement.

Further, a bracket is also included, and the heat dissipation substrate 21 is fixed on the bracket by means of snaps or glue.

Further, the LED chip is a gallium nitride-based blue light chip.

The beneficial effects of the present invention are specifically:

1. By arranging the first lens layer and the second lens layer, the light is more concentrated, and the upper surface of the second encapsulation layer is set in an arc shape to shape the light beam, which avoids adding additional lenses and reduces the production cost.

2. By arranging phosphors on the second lens layer and the second encapsulation layer, it is avoided to directly coat the phosphors on the LED chips, and the problem that the quantum efficiency of the phosphors is reduced under high temperature conditions is solved.

3. Taking advantage of the different refractive indices of different types of silica gel and phosphor glue, the refractive index of the first encapsulation layer is smaller than that of the second encapsulation layer, the refractive index of the first lens layer is greater than that of the first encapsulation layer, and the second The refractive index of the lens layer is greater than the refractive index of the first packaging layer and the refractive index of the second packaging layer. This arrangement can avoid total reflection, so that the light emitted by the LED chip can be irradiated through the packaging material more .

4. By adopting different arrangements for the hemispherical lenses, the light of the light source can be uniformly distributed in the concentrated area.

5. In the embodiment of the present invention, by providing a double lens layer, the lens can change the propagation direction of light, which can effectively suppress the total reflection effect, which is conducive to the emission of more light to the outside of the LED and improves the luminous efficiency of the LED.

Embodiment 3

Referring to FIG. 3 , FIG. 3 is a schematic flowchart of an LED packaging method according to an embodiment of the present invention; on the basis of the above embodiment, this embodiment will introduce the process flow of the present invention in more detail. The method includes:

Step 1. Prepare the heat dissipation substrate 21;

Specifically, it includes: selecting the heat dissipation substrate 21;

cleaning the heat-dissipating substrate 21, and cleaning the stains on the heat-dissipating substrate 21, especially oil stains;

The heat dissipation substrate 21 is dried.

Step 2, prepare LED chips, and fix the LED chips on the heat dissipation substrate 21;

In an embodiment of the present invention, as shown in FIG. 4 , FIG. 4 is a schematic structural diagram of a GaN-based blue light chip provided in an embodiment of the present invention; wherein layer 1 is a substrate material, layer 2 is a GaN buffer layer, and layer 3 is N type GaN layer, layer 4 and layer 6 are P-type GaN quantum well wide-bandgap materials, layer 5 is an INGaN light-emitting layer, layer 7 is an AlGaN barrier layer material, and layer 8 is a P-type GaN layer. The thickness is between 90 microns and 140 microns; the cathode lead and anode lead of the LED chip are welded to the top of the heat dissipation substrate 21 by the reflow soldering process, and then the welding wire is checked, and if it is qualified, it will go to the next step. , then re-solder.

Step X1, respectively configuring the silica gel material for preparing the first lens layer 22 and the first encapsulation layer 23;

Specifically, the silica gel material for preparing the first lens layer 22 and the silica gel material for preparing the first encapsulation layer 23 do not contain phosphors and are high temperature resistant silica gel materials; the refractive index of the first lens layer 22 is smaller than that of the first lens layer 22 The refractive index of the encapsulation layer 23 .

Step X2, respectively disposing the silica gel material containing phosphor powder for preparing the second lens layer 24 and the silica gel material containing phosphor powder for preparing the second encapsulation layer 25,

Specifically, based on the embodiment of the present invention, the LED chip is a gallium nitride-based blue light chip. Therefore, the above-mentioned phosphor is a yellow phosphor; the silica gel and the yellow phosphor are mixed, and the ratio of the raw materials is adjusted, so as to make a non-refractive index After mixing the silica gel with the phosphor powder, it is necessary to perform a color test on the mixed silica gel material to ensure that the LED chip is irradiated on the phosphor powder, and the wavelength range of the fluorescence emitted is between 570nm-620nm.

Preferably, the refractive index of the second lens layer 24 is greater than the refractive index of the first encapsulation layer 23 and also greater than the refractive index of the second encapsulation layer 25 .

Step 3, forming a first lens layer 22 on the upper surface of the LED chip, and the first lens layer 22 includes a plurality of first hemispherical lenses;

Step 31, using a first hemispherical mold to form a plurality of hemispherical silica gel balls above the LED chip;

Step 32: Perform a first initial baking, demoulding and grinding on the plurality of hemispherical silica gel balls to form the first lens layer 22, the first initial baking temperature is 90-125°, and the time is 15-60 minutes .

Preferably, the arrangement of the plurality of first hemispherical lenses on the first lens layer 22 may be rectangular or rhombic, or staggered, and the smaller the distance between two adjacent first hemispherical lenses, the better.

Step 4, forming a first encapsulation layer 23 on the upper surface of the LED chip and above the first lens layer 22;

Step 41, coating a first silica gel layer on the upper surface of the LED chip and above the first lens layer 22;

Step 42 , performing a second preliminary baking and polishing on the first silica gel layer to form the first encapsulation layer 23 , the second preliminary baking temperature is 90-125°, and the time is 15-60 minutes.

Specifically, the lower surface of the first silicone layer is in contact with the LED chip or in contact with the first lens layer 22 , wherein the upper surface of the first silicone layer is flat, so that the second lens layer 24 can be arranged thereon, and the good The flatness is favorable for the light beam to pass through the first encapsulation layer 23 .

Step 5, forming a second lens layer 24 above the first encapsulation layer 23, the second lens layer 24 includes a plurality of second hemispherical lenses, and the plurality of the second hemispherical lenses contain phosphors;

Step 51 , using a second hemispherical mold to form a plurality of hemispherical silica gel balls above the first encapsulation layer 23 , and the hemispherical silica gel balls contain phosphors;

Step 52: Perform a third preliminary baking, demoulding and grinding on the plurality of hemispherical silica gel balls to form the second lens layer 24, the third preliminary baking temperature is 90-125°, and the time is 15-60 minutes .

Step 6, forming a second encapsulation layer 25 above the second lens layer 24, and the second encapsulation layer 25 contains phosphor;

Step 61: Coating a second silica gel layer on the second lens layer 24 and the first encapsulation layer 23;

Step 62, using the hemispherical mold to form an arc on the upper surface of the second silica gel layer;

Step 63 , performing a fourth preliminary baking, demoulding and polishing on the second silica gel layer to form the second encapsulation layer 25 . The fourth preliminary baking temperature is 90-125° and the time is 15-60 minutes.

Specifically, the upper surface of the second encapsulation layer 25 is set in an arc shape, forming the appearance feature of high in the middle and low at both ends, so that the second encapsulation layer 25 has the function of a large lens, which can reshape the light beam. Moreover, there is no need to add external lenses, which reduces the production cost.

Step 7. Long bake the LED lamp including the first lens layer 22 , the first encapsulation layer 23 , the second lens layer 24 and the second encapsulation layer 25 to complete the packaging of the LEDs .

Specifically, the baking temperature of the long baking is 100-150° C., and the baking time is 4-12 hours, so as to eliminate the internal stress of the LED lamp.

After the LED packaging is completed, it also includes testing, sorting the packaged LEDs, and packaging and testing qualified LED lights to facilitate subsequent product applications.

Embodiment 4

2, FIG. 5, and FIGS. 6A and 6B, FIG. 2 is a schematic structural diagram of an LED lamp provided by an embodiment of the present invention; FIG. 5 is a schematic diagram of a lighting principle of an LED lamp provided by an embodiment of the present invention; FIG. 6A is a schematic diagram of an arrangement of a plurality of hemispherical lenses according to an embodiment of the present invention; FIG. 6B is a schematic diagram of an arrangement of another plurality of hemispherical lenses according to an embodiment of the present invention.

Wherein, the LED lamp provided by the embodiment of the present invention includes

heat dissipation substrate 21;

The LED chip is fixed on the package heat dissipation substrate 21;

The silica gel layer includes a first lens layer 22, a first encapsulation layer 23, a second lens layer 24 and a second encapsulation layer 25 which are sequentially arranged on the upper surface of the LED chip, wherein the first lens layer 22 and the The second lens layers 24 are respectively composed of a plurality of hemispherical lenses.

It can be seen from this that in the LED lamp of the embodiment of the present invention, the first lens layer 22 and the second lens layer 24 are stacked to form a multi-layer lens structure, which makes the light in the concentrated area more uniform, and the first lens layer 22 and the second lens layer in contact with the LED chip are more uniform. Neither the lens layer 22 nor the first encapsulation layer 23 contains phosphors, which prevents the chip from absorbing the light that is dissipated in the backward direction, thus improving the light extraction efficiency.

In the embodiment of the present invention, the LED chip is a gallium nitride based blue light chip, the second lens layer 24 and the second encapsulation layer 25 contain yellow phosphors, when the gallium nitride based blue light chip emits light, as shown in FIG. 5 It is shown that when the LED chip is irradiated on the yellow phosphor, the yellow phosphor is excited to emit light and finally white light is formed. In this way, the LED chip is separated from the phosphor, which solves the problem of the decrease of the quantum efficiency of the phosphor caused by high temperature conditions.

In the embodiment of the present invention, the material of the heat dissipation substrate 21 is a solid copper plate, and the thickness of the heat dissipation substrate 21 is greater than 0.5 mm and less than 10 mm. The heat can be quickly dissipated through the solid copper plate, and the thickness of the heat-dissipating substrate 21 is between 0.5-10mm. The larger thickness can prevent the heat-dissipating substrate 21 from being deformed by heat, and ensure that the heat-dissipating substrate 21 is in close contact with the LED chip to ensure the heat dissipation effect.

In the embodiment of the present invention, the refractive index of the first lens layer 22 is greater than the refractive index of the first encapsulation layer 23 , the refractive index of the second lens layer 24 is greater than the refractive index of the second encapsulation layer 25 , and the The refractive index of an encapsulation layer 23 is smaller than that of the second encapsulation layer 25 . In the embodiment of the present invention, the material of the plurality of hemispherical lenses on the first lens layer 22 and the second lens layer 24 may be a mixture of polycarbonate, polymethyl methacrylate and glass. The refractive index of the hemispherical lens can be adjusted. The first encapsulation layer 23 does not contain phosphors, and its main constituent materials can be organic silicon materials, etc., while the materials of the second encapsulation layer 25 can be methyl silicone rubber and phenyl high refractive index. Silicone rubber is mixed. In the embodiment of the present invention, the refractive index of the lens layer is greater than that of the encapsulation layer, and the refractive index of the encapsulation layer increases sequentially from bottom to top. This arrangement can better suppress the phenomenon of total reflection. The light is radiated to the maximum extent, and the total reflection is avoided, so that the light is absorbed by the packaging structure and becomes heat, and the light extraction efficiency is improved.

It should be noted that, in the embodiment of the present invention, the refractive index of the second encapsulation layer 25 is as small as possible, and does not exceed 1.5, so as to avoid forming a large refractive index difference with the outside air, resulting in total light reflection and absorption by the packaging material Converted to heat, affecting the luminous efficiency.

It should be noted that, in the embodiment of the present invention, the first lens layer 22 includes a plurality of first hemispherical lenses, and the first hemispherical lenses are “plano-convex lenses”, and their focal lengths are f=R/(n2-n1 ), wherein, n2 is the average value of the refractive index of the first lens layer 22 and the refractive index of the second lens layer 24, and n1 is the average value of the refractive indices of the upper and lower encapsulation layers of the second lens layer 24 (implementation of the present invention) In the example, the refractive index of the first encapsulation layer 23 is smaller than that of the second encapsulation layer 25, but the refractive indices of the two are relatively similar, and the refractive index difference is not large), R is the radius of the first hemispherical lens.

In order to ensure that the light exits from the first lens layer 22 and reaches the second lens layer 24 in a converged state, in the embodiment of the present invention, the height of the distance L between the first lens layer 22 and the second lens layer 24 should be 2 times the height Within the focal length, that is, the range of L does not exceed 2R/(n2-n1).

In addition, in the embodiment of the present invention, the thickness of the second encapsulation layer 25 is relatively thick, and the top surface of the second lens layer 24 to the upper surface of the second encapsulation layer 25 is generally between 50-500 microns.

In the embodiment of the present invention, the upper surface of the second encapsulation layer 25 is arc-shaped, and the arc-shaped can be hemispherical, parabolic or flat, wherein the hemispherical light angle is the largest, which is suitable for general lighting applications; The light-emitting angle is the smallest, which is suitable for local lighting applications; the flat shape is between the two, which is suitable for indicating lighting; therefore, the specific shape can be selected according to the application site of the product, in order to achieve the best use effect. In this way, the appearance structure with high middle and low sides makes the second encapsulation layer 25 function as a lens. When the light irradiates the surface of the second encapsulation layer 25, it is shaped by the second encapsulation layer 25, so that the light is more concentrated and uniform, and no need Adding external lenses reduces production costs.

Since a large amount of heat is generated when the LED is working, the silicone material will be yellowed when heated, which affects the color of the light and the service life of the product. Therefore, in the embodiment of the present invention, the first lens layer 22 and the first lens layer that are in direct contact with the LED chip are The encapsulation layer 23 is made of high temperature resistant silica gel.

In the embodiment of the present invention, the diameter of a plurality of the hemispherical lenses is 10-200 microns, and the plurality of the hemispherical lenses are evenly spaced with a spacing of 10-200 microns. As shown in FIG. 2 , a plurality of hemispherical lenses are The diameter of the lens is 2R, which is between 10-200 microns. It should be noted that the diameters of multiple hemispherical lenses can be the same or different. The distance between two adjacent hemispherical lenses is A, and the range of A Between 10-200 microns, the smaller the distance between two adjacent hemispherical lenses, the better, and the distance A may be different from each other, or evenly arranged, which is not limited in this embodiment.

In the embodiment of the present invention, the arrangement of the plurality of hemispherical lenses is also appropriately limited. As shown in FIG. 6A , the plurality of hemispherical lenses are arranged in a rectangular shape, or as shown in FIG. 6B , the plurality of hemispherical lenses are arranged in a staggered manner. . Specifically, in the embodiment of the present invention, the first lens layers 22 are arranged in a rectangular shape, and the second lens layers 24 are arranged in a staggered manner, or are interchanged with each other, so as to realize the staggered arrangement of the hemispherical lenses of the first lens layer 22 and the second lens layer 24 The staggered arrangement can gather the light between adjacent lenses to produce a focusing effect.

When the arrangement of the hemispherical lenses of the first lens layer 22 and the second lens layer 24 is the same, the disordered light generated by the LED chip can be shaped to gather the light.

In the embodiment of the present invention, the packaging structure further includes a bracket, and the heat dissipation substrate 21 is fixed on the bracket, and the fixing method includes a buckle, an adhesive and the like.

Specifically, in the embodiment of the present invention, the heat dissipation substrate 21 is a solid copper substrate, the thickness D of the heat dissipation substrate 21 is between 0.5-10 mm, and the width W of the heat dissipation substrate 21 is cut according to the size of the LED chip. As a limitation, the copper substrate has a large heat capacity, good thermal conductivity, and is not easily deformed by heat, which makes the heat dissipation of the LED chip better. In the first lens layer 22, the radius of each hemispherical lens is R, the distance between two adjacent hemispherical lenses is A, and the distance from the top surface of the first lens layer 22 to the bottom surface of the second lens layer 24 is L, L Between 0-2R/(n2-n1), the second lens layer 24 is disposed above the first encapsulation layer 23, the radius of the plurality of hemispherical lenses on the second lens layer 24 is also R, and the second lens layer 24 is The distance from the top surfaces of the hemispherical lenses on the lens layer 24 to the upper surface of the second encapsulation layer 25 is 50-500 microns. In the embodiment of the present invention, the upper surface of the second encapsulation layer 25 is arc-shaped, forming a A larger lens is used to reshape the beam without adding external lenses, thus reducing production costs.

Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, but not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that it can still be The technical solutions described in the foregoing embodiments are modified, or some technical features thereof are equivalently replaced; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims (9)

1. A floodlight (10), characterized in that it comprises: a bracket (11), a base (12), an LED lamp (13), a reflector (14), a heat sink (15) and a lens (16); in, the base (12) is connected with the bracket (11); The LED lamp (13) is fixedly connected at the middle position of the upper surface of the base (12); The reflector (14) is fixed on the upper surface of the base (12) and is located outside the LED lamp (13); The heat sink (15) is fixed on the upper surface of the base (12) and is located outside the reflector (14); The lens (16) is fixed on the top of the reflector (14); The LED lamp (13) includes: a heat dissipation substrate (21); The LED chip is fixed on the heat dissipation substrate (21); A silica gel layer, comprising a first lens layer (22), a first encapsulation layer (23), a second lens layer (24), and a second encapsulation layer (25) sequentially arranged on the upper surface of the LED chip, wherein the The refractive index of the first lens layer (22) is greater than the refractive index of the first encapsulation layer (23), the second lens layer (24) is greater than the refractive index of the second encapsulation layer (25), and the The refractive index of an encapsulation layer (23) is smaller than the refractive index of the second encapsulation layer (25); The first lens layer (22) and the second lens layer (24) are respectively composed of a plurality of hemispherical lenses; the hemispherical lenses are "plano-convex lenses", and their focal lengths are f=R/(n2-n1 ), wherein, n2 is the average value of the refractive index of the first lens layer (22) and the refractive index of the second lens layer (24), and n1 is the refractive index of the upper and lower encapsulation layers of the second lens layer (24). The average value, R is the radius of the first hemispherical lens; the distance L between the first lens layer (22) and the second lens layer (24) does not exceed 2R/(n2-n1). 2 . The floodlight ( 10 ) according to claim 1 , wherein the connection part between the base ( 12 ) and the bracket ( 11 ) is an angle-adjustable structure. 3 . 3. The floodlight (10) according to claim 1, wherein the base (12) is made of aluminum material. 4. The floodlight (10) according to claim 1, wherein the reflector (14) is made of PPS material. 5. The floodlight (10) according to claim 1, wherein the heat sink (15) is made of aluminum material. 6. The floodlight (10) according to claim 1, characterized in that, the outer surface of the heat sink (15) is provided with a concave groove. 7. The floodlight (10) according to claim 1, wherein the lens (16) is made of tempered glass. 8 . The floodlight ( 10 ) according to claim 1 , wherein a silicone sealing ring is arranged between the lens ( 16 ) and the reflector ( 14 ). 9 . 9. The floodlight (10) according to claim 1, wherein the LED chip is a gallium nitride-based blue light chip.

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