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CN107394568A - 电连接器组装方法 - Google Patents

电连接器组装方法 Download PDF

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Publication number
CN107394568A
CN107394568A CN201710517005.5A CN201710517005A CN107394568A CN 107394568 A CN107394568 A CN 107394568A CN 201710517005 A CN201710517005 A CN 201710517005A CN 107394568 A CN107394568 A CN 107394568A
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solder
weld part
electric connector
assembling method
width
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朱德祥
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Lotes Guangzhou Co Ltd
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Lotes Guangzhou Co Ltd
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Priority to CN201710517005.5A priority Critical patent/CN107394568A/zh
Publication of CN107394568A publication Critical patent/CN107394568A/zh
Priority to US15/869,709 priority patent/US10547152B2/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
    • H01R43/24—Assembling by moulding on contact members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0263—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for positioning or holding parts during soldering or welding process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/002—Soldering by means of induction heating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • H01R12/585—Terminals having a press fit or a compliant portion and a shank passing through a hole in the printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
    • H01R12/7011—Locking or fixing a connector to a PCB
    • H01R12/707—Soldering or welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H01R4/023—Soldered or welded connections between cables or wires and terminals
    • H01R4/024—Soldered or welded connections between cables or wires and terminals comprising preapplied solder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
    • H01R43/205—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve with a panel or printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7082—Coupling device supported only by cooperation with PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
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    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Manufacturing Of Electrical Connectors (AREA)

Abstract

本发明公开了一种电连接器组装方法，包括以下步骤：步骤1：提供一端子，该端子具有一焊接部；步骤2：将焊接部加热到一焊料的熔点温度；步骤3：提供所述焊料，并通过一治具将所述焊料压接于该焊接部，使得所述焊料熔融固定于所述焊接部；步骤4：将固定有焊料的端子插入一绝缘本体中。由于只对端子的焊接部加热，所需热能少，节约能源，降低了电连接器的生产成本；同时，由于不需要对绝缘本体加热，故避免了绝缘本体受热而翘曲变形。

Description

电连接器组装方法
技术领域
本发明涉及一种电连接器组装方法，尤指一种可以减少焊料与端子焊接所需热能的电连接器组装方法。
背景技术
习知的位于芯片模块与电路板之间用以电性连接芯片模块与电路板的电连接器一般包括绝缘本体、收容于绝缘本体的导电端子，所述导电端子向上抵接芯片模块，向下和电路板相抵接，实现芯片模块与电路板之间的信号传输。
目前，端子的焊接部与电路板之间常设有一焊料，焊料实现焊接部与电路板的垫片之间的电性连接。焊接部与焊料的固定一般有加热进行预焊固定的方式，所谓预焊通常是将端子组装进入绝缘本体，使用定位焊料的机具将焊料与焊接部接触，再将绝缘本体、端子、焊料和定位机具一起置于加热的预焊装置进行预焊。此种预焊方式将电连接器的整体部件均置于加热的预焊装置进行加热，因进行加热的元件数量多，所以需要的热能多，造成能源的浪费；同时，由于对绝缘本体进行了加热，易造成绝缘本体受热而翘曲变形。
因此，有必要设计一种电连接器组装方法，以克服上述问题。
发明内容
针对背景技术所面临的问题，本发明的目的在于提供一种降低生产成本的电连接器组装方法。
为实现上述目的，本发明采用以下技术手段：
一种电连接器组装方法，包括以下步骤：步骤1：提供一端子，该端子具有一焊接部；步骤2：将焊接部加热到一焊料的熔点温度；
步骤3：提供所述焊料，并通过一治具将所述焊料压接于该焊接部，使得所述焊料熔融固定于所述焊接部；步骤4：将固定有焊料的端子插入一绝缘本体中。
进一步：在步骤2中,利用高频电流感应对焊接部加热，在焊接部停止加热后，在15秒内将焊料压接于焊接部。
进一步：所述焊接部呈竖直的平板状，所述焊料位于所述焊接部的板面一侧，且所述焊料的底面低于所述焊接部的底面。
进一步：所述焊料呈长方体，且所述焊料与所述焊接部以面对面贴合。
进一步：在水平方向上，所述焊接部的宽度小于所述焊料的宽度。
进一步：在水平方向上，所述焊接部的宽度大于所述焊料的宽度。
进一步：自所述焊接部竖直向上延伸形成一基部，自所述基部朝远离所述基部的竖直面弯折向上延伸形成一第一臂，自所述第一臂反向弯折向上延伸且越过所述基部的竖直面形成一第二臂，所述第一臂与所述焊料位于所述基部的竖直面的同一侧。
进一步：所述绝缘本体具有多个收容孔上下贯穿所述绝缘本体，每一所述收容孔具有一固持槽固持所述基部，所述收容孔于所述焊接部的一侧设有收容所述焊料的一收容槽，所述收容槽与所述固持槽相连通，所述固持槽的宽度大于所述收容槽的宽度，所述收容孔于所述焊接部的相对另一侧设有一让位槽，当从焊接部的一侧压合所述焊料时，所述让位槽给予所述焊接部提供变形空间。
进一步：所述基部的宽度大于所述焊接部的宽度，且所述基部设有防止虹吸的一阻隔层高于所述焊料。
进一步：当所述焊料焊接于一电路板后，所述焊料的高度与所述焊料焊接于电路板前相比减小0.3毫米以上。
与现有技术相比，本发明具有以下有益效果：
通过将端子的焊接部加热到焊料的熔点温度，再通过一治具将一焊料压接于该焊接部，使得所述焊料熔融固定于所述焊接部，由于只对端子的焊接部加热，所需热能少，节约能源，降低了电连接器的生产成本；同时，由于不需要对绝缘本体加热，故避免了绝缘本体受热而翘曲变形。
【附图说明】
图1为本发明电连接器的实施例一的立体剖视图；
图2为本发明电连接器的实施例一的另一视角的立体剖视图；
图3为本发明电连接器实施例一焊料与焊接部压合的示意图；
图4为本发明电连接器实施例一位于芯片模块与电路板之间且芯片模块未下压的平面剖视图；
图5为本发明电连接器实施例一位于芯片模块与电路板之间且芯片模块下压后的平面剖视图；
图6为本发明电连接器实施例二的立体剖视图；
图7为本发明电连接器实施例二的平面图。
具体实施方式的附图标号说明：
电连接器100 芯片模块200 导电片201 电路板300
加热装置400 绝缘本体1 收容孔11 固持槽110
收容槽111 让位槽112 凸块12 上表面13
下表面14 端子2 基部20 竖直面201
第一臂21 第二臂22 接触部23 连料部24
焊接部25 焊接部的宽度D1 防焊阻隔层26 焊料3
焊料的宽度D2 固持槽的宽度C1 收容槽的宽度C2
【具体实施方式】
为了便于更好的理解本发明的目的、结构、特征以及功效等，现结合附图和具体实施方式对本发明作进一步说明。
如图1至图5所示，为本发明的电连接器100实施例一，包括绝缘本体1、收容于绝缘本体1的端子2和与端子2固定的焊料3。
如图1和图3所示，所述绝缘本体1包括相对设置的一上表面13和一下表面14，所述上表面13向上凸设有多个凸块12用以向上支撑芯片模块200。所述绝缘本体1设有成行且错位设置的多个收容孔11贯穿绝缘本体1的上表面13和下表面14，所述收容孔11包括一固持槽110和位于所述固持槽110一侧的一收容槽111，所述收容槽111与所述固持槽110相连通，所述固持槽的宽度C1大于所述收容槽的宽度C2。
如图1至图3所示，所述端子2收容于收容孔11中。所述端子2包括呈平板状的一基部20，所述基部20固持于所述固持槽110。自所述基部20朝远离所述基部20的竖直面201弯折向上延伸形成一第一臂21，自所述第一臂21反向弯折向上延伸且越过所述基部20的竖直面201形成一第二臂22，所述第二臂22的末端形成弧形的一接触部23用以向上抵接芯片模块200的导电片201。自所述基部20向上延伸形成一连料部24用以连接料带（未图示，下同），所述连料部24与所述第一臂21之间有间隔。自所述基部20竖直向下延伸形成一焊接部25，所述焊接部25伸出绝缘本体1的下表面14，所述基部20和所述焊接部25位于同一竖直平面，使得所述端子2结构简单，易于成型。在水平方向上，所述焊接部的宽度D1小于所述基部20的宽度。
如图1至图3所示，所述基部20上设置有防止虹吸的一防焊阻隔层26，所述防焊阻隔层26高于所述焊料3，所述防焊阻隔层26可以为涂料或其他形式。
如图1至图3所示，所述焊料3呈长方体，所述焊料3位于所述焊接部25的一侧且与所述第一臂21位于所述竖直面201的同一侧，减小了收容孔11在端子2厚度方向上的长度，有利于实现端子2在绝缘本体1上的密集化，所述焊料3收容于所述收容槽111。在水平方向上，所述焊料的宽度D2大于所述焊接部的宽度D1，所述焊料3的下表面14低于所述焊接部25的下表面14。当然，在其他实施例中，所述焊料3可以为其他形状，如球形等，所述焊料3也可以不位于所述焊接部25的板面一侧，如位于所述焊接部25的底面。
如图1至图3所示，所述电连接器100的组装方法为：首先，用冲压模具（未图示）成型所述端子2；其次，将连接在料带上的连续的端子2的焊接部25置于加热装置400中，将焊接部25加热到焊料3的熔点温度，本实施例中，所述加热装置400采用高频电流感应（即高周波）对焊接部25加热，因为其与使用激光加热相比，高周波加热均匀；接着，在15秒内（否则，焊接部25的温度会下降到焊料3的熔点温度以下），使用一治具（未图示，下同）将焊料3从焊接部25的板面一侧压合，使得所述焊料3的侧面与所述焊接部25的板面贴合固定；最后，将固定有焊料3的端子2从上向下插入绝缘本体1的收容孔11中固定。电连接器100组装完成后，再将焊料3与电路板300焊接，从而电连接器100焊接于电路板300上。所述焊料3与电路板300焊接前后相比，所述焊料3的高度减小了0.3毫米以上。
如图6至图7所示，为本发明电连接器实施例二，其与上述实施例一的不同之处在于：所述焊接部的宽度D1大于所述焊料的宽度D2，所述固持槽110的相对另一侧设置有一让位槽112，所述让位槽112与所述固持槽110相连通，所述让位槽112与所述收容槽111位于所述焊接部25的相对两侧，所述让位槽112给予所述焊料3与所述焊接部25压合时所述焊接部25弹性变形的空间。
综上所述，本发明电连接器组装方法有下列有益效果：
（1）通过将端子2的焊接部25加热到焊料3的熔点温度，再通过一治具将一焊料3压接于该焊接部25，使得所述焊料3熔融固定于所述焊接部25，由于只对端子2的焊接部25加热，所需热能少，节约能源，降低电连接器100的生产成本；同时，由于不需要对绝缘本体1加热，故避免了绝缘本体1受热而翘曲变形；
（2）所述焊料3与第一臂21位于所述竖直面201的同一侧，减小了收容孔11在焊接部25厚度方向上长度，有利于实现端子2在绝缘本体1上的密集化；
（3）所述焊料3呈长方体，形状规则，使得用于压合焊料3的治具结构简单，易于成型和组装；
（4）在水平方向上，所述焊料的宽度D2大于所述焊接部的宽度D1，使得所述焊料3熔化时可以绕过所述焊接部25而与焊接部25的另一侧的板面相接触，将焊接部25四周包围，提高了端子2与电路板300的电性连接效果。
以上详细说明仅为本发明之较佳实施例的说明，非因此局限本发明的专利范围，所以，凡运用本创作说明书及图示内容所为的等效技术变化，均包含于本发明的专利范围内。

Claims (10)

1.一种电连接器组装方法，其特征在于：包括以下步骤：
步骤1：提供一端子，该端子具有一焊接部；
步骤2：将焊接部加热到一焊料的熔点温度；
步骤3：提供所述焊料，并通过一治具将所述焊料压接于该焊接部，使得所述焊料熔融固定于所述焊接部；
步骤4：将固定有焊料的端子插入一绝缘本体中。
2.如权利要求1所述的电连接器组装方法，其特征在于：在步骤2中,利用高频电流感应对焊接部加热，在焊接部停止加热后，在15秒内将焊料压接于焊接部。
3.如权利要求1所述的电连接器组装方法，其特征在于：所述焊接部呈竖直的平板状，所述焊料位于所述焊接部的板面一侧，且所述焊料的底面低于所述焊接部的底面。
4.如权利要求3所述的电连接器组装方法，其特征在于：所述焊料呈长方体，且所述焊料与所述焊接部以面对面贴合。
5.如权利要求4所述的电连接器组装方法，其特征在于：在水平方向上，所述焊接部的宽度小于所述焊料的宽度。
6.如权利要求4所述的电连接器组装方法，其特征在于：在水平方向上，所述焊接部的宽度大于所述焊料的宽度。
7.如权利要求3所述的电连接器组装方法，其特征在于：自所述焊接部竖直向上延伸形成一基部，自所述基部朝远离所述基部的竖直面弯折向上延伸形成一第一臂，自所述第一臂反向弯折向上延伸且越过所述基部的竖直面形成一第二臂，所述第一臂与所述焊料位于所述基部的竖直面的同一侧。
8.如权利要求7所述的电连接器组装方法，其特征在于：所述绝缘本体具有多个收容孔上下贯穿所述绝缘本体，每一所述收容孔具有一固持槽固持所述基部，所述收容孔于所述焊接部的一侧设有收容所述焊料的一收容槽，所述收容槽与所述固持槽相连通，所述固持槽的宽度大于所述收容槽的宽度，所述收容孔于所述焊接部的相对另一侧设有一让位槽，当从焊接部的一侧压合所述焊料时，所述让位槽给予所述焊接部提供变形空间。
9.如权利要求7所述的电连接器组装方法，其特征在于：所述基部的宽度大于所述焊接部的宽度，且所述基部设有防止虹吸的一阻隔层高于所述焊料。
10.如权利要求1所述的电连接器组装方法，其特征在于：当所述焊料焊接于一电路板后，所述焊料的高度与所述焊料焊接于电路板前相比减小0.3毫米以上。
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