CN106784311A - 柔性面板及其制作方法 - Google Patents
柔性面板及其制作方法 Download PDFInfo
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- CN106784311A CN106784311A CN201611225146.1A CN201611225146A CN106784311A CN 106784311 A CN106784311 A CN 106784311A CN 201611225146 A CN201611225146 A CN 201611225146A CN 106784311 A CN106784311 A CN 106784311A
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- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
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- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
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- C09J7/00—Adhesives in the form of films or foils
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- C09J7/35—Heat-activated
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- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
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- H10K77/111—Flexible substrates
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
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- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
- B05D3/061—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation using U.V.
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- B05D3/067—Curing or cross-linking the coating
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- C09J2203/322—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of solar panels
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- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
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Abstract
本发明提供一种柔性面板及其制作方法,该方法包括:在玻璃基板上涂布光敏胶材形成感光层;在感光层上依次形成散射层和紫外线阻挡层;在紫外线阻挡层上形成柔性基板层;在柔性基板层上依次制作电子器件、光学器件以及封装层;从玻璃基板一侧通过紫外线照射感光层,使感光层的剥离强度降低,以致散射层从玻璃基板上分离,形成柔性面板。本发明提供的柔性面板的制作方法由于在玻璃基板上形成感光层、散射层以及紫外线阻挡层,感光层在紫外线的照射下,粘性骤减,剥离强度降低,从而可以非常容易方便地将散射层从玻璃基板上分离,该方法工艺流程简单、操作方便、且能提高柔性面板的良率。
Description
技术领域
本发明涉及显示技术领域,具体是指一种柔性面板及其制作方法。
背景技术
有机发光二极管(Organic Light-Emitting Diode,简称“OLED”)在显示技术具有自发光、广视角、对比度高、低耗电、反应速度快等优点,使其在显示技术领域中得到广泛应用,并且已经被逐渐应用到我们的日常生活中。OLED与传统的TFT-LCD相比,最大的优势是可制备大尺寸、超薄的柔性组件,但由于柔性基板易产生形变,在生产过程中难以操作,使得柔性组件的生产大大受到制约。
目前,制备OLED柔性组件的方法是先将柔性基板粘合在刚性基板上,制备好OLED柔性组件后,再将刚性基板与柔性基板分离开来。但是,由于刚性基板和柔性基板粘合度高,粘合的很紧,制备好器件后,二者很难分离开,从而导致不良率增加。
发明内容
本发明提供一种柔性面板及其制作方法,以解决现有技术中制备OLED柔性组件的方法中很难将刚性基板与柔性基板分离开,且容易导致不良率的技术问题。
为解决上述技术问题,本发明采用的一个技术方案是:提供一种柔性面板的制作方法,所述方法包括:
在玻璃基板上涂布光敏胶材形成感光层;
在所述感光层上依次形成散射层和紫外线阻挡层;
在所述紫外线阻挡层上形成柔性基板层;
在所述柔性基板层上依次制作电子器件、光学器件以及封装层;
从所述玻璃基板一侧通过紫外线照射所述感光层,使所述感光层的剥离强度降低,以致所述散射层从所述玻璃基板上分离,形成所述柔性面板。
根据本发明一实施例,所述在所述感光层上依次形成散射层和紫外线阻挡层的步骤包括:
在所述感光层上采用旋涂工艺依次形成散射层和紫外线阻挡层。
根据本发明一实施例,所述在所述紫外线阻挡层上形成柔性基板层的步骤包括:
在所述紫外线阻挡层上采用喷涂工艺形成柔性基板层。
根据本发明一实施例,所述柔性基板层的材料为聚酰亚胺或者聚甲基丙烯酸甲。
根据本发明一实施例,所述光敏胶材的材料为环氧封端聚硅氧烷或者有机硅材料。
根据本发明一实施例,所述散射层的材料为二氧化钛。
根据本发明一实施例,所述紫外线阻挡层的材料为透明的有机材料或者无机材料。
根据本发明一实施例,所述电子器件为晶体薄膜管。
根据本发明一实施例,所述光学器件为有机发光二极管。
为解决上述技术问题,本发明采用的另一个技术方案是:提供一种柔性面板,其特征在于,所述柔性面板采用上述所述的方法制成。
本发明的有益效果是:区别于现有技术的情况,本发明提供的柔性面板的制作方法由于在玻璃基板上形成感光层、散射层以及紫外线阻挡层,感光层在紫外线的照射下,粘性骤减,剥离强度降低,从而可以非常容易方便地将散射层从玻璃基板上分离,该方法工艺流程简单、操作方便、且能提高柔性面板的良率。
附图说明
为了更清楚地说明本发明实施例中的技术方案,下面将对实施例描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图,其中:
图1是本发明提供的柔性面板的制作方法第一实施方式的流程示意图;
图2是本发明第一实施方式柔性面板未分离的结构示意图;
图3是本发明柔性面板第一实施例的结构示意图;
图4是本发明提供的柔性面板的制作方法第二实施方式的流程示意图;
图5是本发明柔性面板第二实施例的结构示意图。
具体实施方式
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅是本发明的一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
请一并参阅图1和图2,图1是本发明提供的柔性面板的制作方法第一实施方式的流程示意图,图2是本发明第一实施方式柔性面板未分离的结构示意图。在本实施例中,在玻璃基板上形成感光层、散射层以及紫外线阻挡层,从玻璃基板一侧通过紫外线照射感光层,使感光层的剥离强度降低,以致散射层从玻璃基板上分离。具体来说,本实施例的方法包括以下步骤:
步骤S11:在玻璃基板上涂布光敏胶材形成感光层。
如图2所示,首先将玻璃基板101放置在基板载台(图未示)上,再清洗玻璃基板101,之后在洗干净的玻璃基板101的表面涂布光敏胶材形成感光层110。感光层110的厚度范围为10~1000μm;进一步的,感光层110的厚度范围为50~500μm。
光敏胶材为光敏胶,又称无影胶、紫外线固化胶,光敏胶是一种必须通过紫外线照射才能固化的一类胶粘剂,它可以作为粘接剂使用,也可作为油漆、涂料、油墨等的胶料使用。紫外线(Ultraviolet Rays,简称“UV”)是肉眼看不见的,是可见光以外的一段电磁辐射,波长范围为110~400nm。光敏胶固化原理是UV固化材料中的光引发剂(或光敏剂)在紫外线的照射下吸收紫外光后产生活性自由基或阳离子,引发单体聚合、交联化学反应,使粘合剂在单位时间内由液态转化为固态。本实施例中,光敏胶材的材料为环氧封端聚硅氧烷或者有机硅材料。
步骤S12:在感光层上依次形成散射层和紫外线阻挡层。
具体的,在感光层110上采用旋涂工艺依次形成散射层120和紫外线阻挡层130,感光层110的面积大于散射层120的面积,且散射层120位于感光层110的中部。其中,旋涂是旋转涂抹法的简称,是有机发光二极管中常用的制备方法,主要的设备为匀胶机,旋涂法包括:配料,高速旋转,以及挥发成膜三个步骤,通过控制匀胶的时间,转速,滴液量以及所用溶液的浓度、粘度来控制成膜的厚度。
散射层120的材料为具有阻隔UV光,且对可见光具有光提取作用的无机材料,本实施例中,散射层120的材料为二氧化钛(TiO2)。二氧化钛既能吸收紫外线,又能反射、散射紫外线,还能透过可见光,是性能优越、极有发展前途的物理屏蔽型的紫外线防护剂。其中,二氧化钛的抗紫外线能力是由于其具有高折光性和高光活性。正常情况下,光是沿直线传播的,在不同介质表面发生折射和反射,发生全反射的光就无法发射出去,而本实施例的散射层120是由很多不同形状、不同大小尺寸的二氧化钛纳米粒子组成的,光束射到这些二氧化钛纳米粒子表面后,会往各个方向进行反射和折射,提高光发射出去的几率,同样,原本发生全反射无法出射出去的光照射到散射层120的二氧化钛纳米粒子上后,可以发射出去,进一步提高光发射出去的几率,使得散射层120具有光提取的作用。散射层120的厚度范围为10~1000nm;进一步的,散射层120的厚度范围为250~500nm。
紫外线阻挡层130的材料可以为高透明的有机或无机材料,其中,有机材料为聚乙烯醇(PVA),无机材料为二氧化钛,与散射层120的材料一致。紫外线阻挡层130的作用包括:一方面,阻挡电子器件制备过程中紫外线对感光层110的影响;另一方面,在后段对柔性面板进行紫外线照射剥离感光层110时,防止紫外线对有机发光材料造成不良影响。紫外线阻挡层130的厚度范围为10~1000nm;进一步的,紫外线阻挡层130的厚度范围为250~500nm。
步骤S13:在紫外线阻挡层上形成柔性基板层。
具体的,在紫外线阻挡层130上采用喷涂工艺形成柔性基板层140。喷涂是通过喷枪或碟式雾化器,借助于压力或离心力,分散成均匀而微细的雾滴,施涂于被涂物表面的涂装方法。可分为空气喷涂、无空气喷涂、静电喷涂以及上述基本喷涂形式的各种派生的方式,在此不作限制。
柔性基板层140的材料为聚乙烯(PE)、聚丙烯(PP)、聚苯乙烯(PS),聚对苯二甲酸乙二醇(PET)、聚对萘二甲酸乙二醇脂(PEN)、聚甲基丙烯酸甲(PMMA)、聚酰亚胺(PI)中的一种;其中,柔性基板层140的材料优选为聚甲基丙烯酸甲(PMMA)或者聚酰亚胺(PI)。其中,聚酰亚胺(PI)是综合性能最佳的有机高分子材料之一,耐高温达400℃以上,长期使用温度范围-200~300℃,无明显熔点,具有优越机械性能、高绝缘性能,使得其为制作柔性基板最常用的材料。柔性基板层140的厚度范围为10~1000μm;进一步的,紫外线阻挡层130的厚度范围为250~500μm。
步骤S14:在柔性基板层上依次制作电子器件、光学器件以及封装层。
在柔性基板层140上依次制作电子器件150、发光器件160以及封装薄膜170。电子器件150为晶体薄膜管,用于控制并驱动发光器件160中的子像素进行发光。发光器件160为有机发光二极管(OLED),有机发光二极管(OLED)的基本结构是由一层薄而透明具半导体特性之铟锡氧化物(ITO),与电力之正极相连,再加上另一个金属阴极,包成如三明治的结构。其中,整个结构层中还包括了:空穴传输层(HTL)、发光层(EL)与电子传输层(ETL)。当电力供应至适当电压时,正极空穴与阴极电荷就会在发光层(EL)中结合,产生光亮,依其配方不同产生红、绿和蓝三原色,构成基本色彩。有机发光二极管(OLED)的特性是自己发光,不像传统的TFT-LCD需要背光,因此可视度和亮度均高,其次是电压需求低且省电效率高,加上反应快、重量轻、厚度薄、构造简单、成本低等,被视为最具前途的产品之一。发光器件160的制作方法与目前主流的制作方法相同,不是本发明的重点,在此不再详述。
封装层170是薄膜封装,是玻璃、有机薄膜、无机薄膜、金属箔的一种或任意几种组成的复合体。薄膜封装技术是将OLED材料从外部环境进行隔绝而达到保护作用的技术,其不仅在诉求轻与薄的大尺寸OLED领域受到关注,更被誉为显示技术的软性OLED与OLED照明领域上必备的技术,使得被OLED开发企业受到非常高的关注。而本发明的封装层170的制作方法与目前主流的制作方法相同,不是本发明的重点,在此不再详述。
步骤S15:从玻璃基板一侧通过紫外线照射感光层,使感光层的剥离强度降低,以致散射层从玻璃基板上分离,形成柔性面板。
本发明提供的柔性面板的制作方法由于在玻璃基板101上形成感光层110、散射层120以及紫外线阻挡层130,感光层110在紫外线的照射下,粘性骤减,剥离强度降低,从而可以非常容易方便地将散射层120从玻璃基板101上分离,该方法工艺流程简单、操作方便、且能提高柔性面板的良率。
请参阅图3,图3是本发明柔性面板第一实施例的结构示意图。如图3所示,从玻璃基板(见图1)一侧通过紫外线照射感光层(见图1),使感光层的剥离强度降低,以致散射层120从玻璃基板上分离,形成柔性面板100。
该柔性面板100采用上述的方法制成,具体依次包括:散射层120、紫外线阻挡层130、柔性基板层140、电子器件150、发光器件160以及封装薄膜170。
其中,柔性面板100的制作方法见上文,此处不再赘述。
请一并参阅图4和图5,图4是本发明提供的柔性面板的制作方法第二实施方式的流程示意图;图5是本发明柔性面板第二实施例的结构示意图。在本实施例中,在柔性基板上形成阻挡层,并且在阻挡层上依次制作电子器件、光学器件以及封装层。具体来说,本实施例的方法包括以下步骤:
步骤S21:在玻璃基板上涂布光敏胶材形成感光层。
步骤S22:在感光层上依次形成散射层和紫外线阻挡层。
步骤S23:在紫外线阻挡层上形成柔性基板层。
步骤S24:在柔性基板层上形成阻隔层。
步骤S25:在阻隔层上依次制作电子器件、光学器件以及封装层。
步骤S26:从玻璃基板一侧通过紫外线照射感光层,使感光层的剥离强度降低,以致散射层从玻璃基板上分离,形成柔性面板。
如图5所示,本实施方式的流程步骤与第一实施方式的流程步骤基本相同,制作的柔性面板200的结构也基本相同,不同的是,在步骤S25之前增加步骤S24:在柔性基板层240上形成阻隔层280,步骤S25就更改为在阻隔层280上依次制作电子器件250、光学器件260以及封装层270。
具体来说,在柔性基板层240上通过化学气相沉积方法(CVD)形成阻隔层280,气相沉积方法(CVD)指把含有构成薄膜元素的气态反应剂或液态反应剂的蒸气及反应所需其它气体引入反应室,在衬底表面发生化学反应生成薄膜的过程。在超大规模集成电路中很多薄膜都是采用化学气相沉积方法(CVD)方法制备,经过CVD处理后,表面处理膜密着性约提高30%,可以防止高强力钢的弯曲、拉伸等成形时产生的刮痕。阻挡层280的材料为氮化硅材料(SiNx),是一种超硬物质,氮化硅本身具有润滑性,并且耐磨损,具有高温时抗氧化的作用。
阻隔层280能够阻挡水分和氧气,为制作电子器件250和光学器件260提供保护作用。
综上所述,本领域技术人员容易理解,本发明提供的柔性面板的制作方法由于在玻璃基板上形成感光层、散射层以及紫外线阻挡层,感光层在紫外线的照射下,粘性骤减,剥离强度降低,从而可以非常容易方便地将散射层从玻璃基板上分离,该方法工艺流程简单、操作方便、且能提高柔性面板的良率。
以上所述仅为本发明的实施例,并非因此限制本发明的专利范围,凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换,或直接或间接运用在其他相关的技术领域,均同理包括在本发明的专利保护范围内。
Claims (10)
1.一种柔性面板的制作方法,其特征在于,所述方法包括:
在玻璃基板上涂布光敏胶材形成感光层;
在所述感光层上依次形成散射层和紫外线阻挡层;
在所述紫外线阻挡层上形成柔性基板层;
在所述柔性基板层上依次制作电子器件、光学器件以及封装层;
从所述玻璃基板一侧通过紫外线照射所述感光层,使所述感光层的剥离强度降低,以致所述散射层从所述玻璃基板上分离,形成所述柔性面板。
2.根据权利要求1所述的柔性面板的制作方法,其特征在于,所述在所述感光层上依次形成散射层和紫外线阻挡层的步骤包括:
在所述感光层上采用旋涂工艺依次形成散射层和紫外线阻挡层。
3.根据权利要求1所述的柔性面板的制作方法,其特征在于,所述在所述紫外线阻挡层上形成柔性基板层的步骤包括:
在所述紫外线阻挡层上采用喷涂工艺形成柔性基板层。
4.根据权利要求3所述的柔性面板的制作方法,其特征在于,所述柔性基板层的材料为聚酰亚胺或者聚甲基丙烯酸甲。
5.根据权利要求1所述的柔性面板的制作方法,其特征在于,所述光敏胶材的材料为环氧封端聚硅氧烷或者有机硅材料。
6.根据权利要求1所述的柔性面板的制作方法,其特征在于,所述散射层的材料为二氧化钛。
7.根据权利要求1所述的柔性面板的制作方法,其特征在于,所述紫外线阻挡层的材料为透明的有机材料或者无机材料。
8.根据权利要求1所述的柔性面板的制作方法,其特征在于,所述电子器件为晶体薄膜管。
9.根据权利要求1所述的柔性面板的制作方法,其特征在于,所述光学器件为有机发光二极管。
10.一种柔性面板,其特征在于,所述柔性面板采用权利要求1-9任一所述的方法制成。
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Cited By (12)
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| CN107644916A (zh) * | 2017-09-20 | 2018-01-30 | 京东方科技集团股份有限公司 | 薄膜晶体管及其制作方法 |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10522770B2 (en) | 2017-12-28 | 2019-12-31 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Fabricating method of flexivle panel and flexible display device |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102931136A (zh) * | 2012-08-09 | 2013-02-13 | 友达光电股份有限公司 | 可挠式显示模块的制作方法 |
| CN103325731A (zh) * | 2013-05-20 | 2013-09-25 | Tcl集团股份有限公司 | 柔性显示装置的制造方法 |
| CN105489789A (zh) * | 2016-01-18 | 2016-04-13 | 京东方科技集团股份有限公司 | 柔性器件制作方法及柔性显示器件 |
| CN106098939A (zh) * | 2016-08-26 | 2016-11-09 | 武汉华星光电技术有限公司 | 激光无损剥离柔性基板的方法 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090024490A1 (en) * | 2007-07-19 | 2009-01-22 | Satterfield Edward W | System and method for web to package printing |
| KR101440456B1 (ko) * | 2008-03-31 | 2014-09-18 | 삼성디스플레이 주식회사 | 표시 장치 및 이의 제조 방법 |
| DE102009057174A1 (de) * | 2009-12-05 | 2011-06-09 | Volkswagen Ag | Verfahren und Vorrichtung zur Steuerung von Hybrid-Funktionen in einem Kraftfahrzeug |
| EP2445029A1 (en) * | 2010-10-25 | 2012-04-25 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | Multilayered protective layer, organic opto-electric device and method of manufacturing the same |
| JP6002135B2 (ja) * | 2011-08-05 | 2016-10-05 | パナソニック株式会社 | フレキシブルデバイスの製造方法 |
| US9859028B2 (en) * | 2012-03-08 | 2018-01-02 | Max-Planck-Gesellschaft Zur Foerderung Der Wissenschaften E.V. | Method of producing a Fresnel Zone Plate for applications in high energy radiation |
| US9167248B2 (en) * | 2012-07-13 | 2015-10-20 | Qualcomm Incorporated | Reference picture list modification for video coding |
| KR101992899B1 (ko) * | 2012-12-17 | 2019-06-25 | 엘지디스플레이 주식회사 | 터치 패널 내장형 유기 발광 다이오드 표시 장치 및 이의 제조 방법 |
| KR101991100B1 (ko) * | 2013-01-09 | 2019-06-20 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 |
| CN105325056B (zh) * | 2013-06-18 | 2017-09-08 | 柯尼卡美能达株式会社 | 有机发光元件 |
| FR3007844B1 (fr) * | 2013-06-26 | 2015-07-17 | Schneider Electric Ind Sas | Dispositif d'estimation de l'impedance d'une liaison electrique de terre, procede d'estimation et systeme d'alimentation electrique associes |
| KR102113176B1 (ko) * | 2013-07-16 | 2020-05-29 | 삼성디스플레이 주식회사 | 플렉서블 표시장치 및 그 제조방법 |
| KR102279921B1 (ko) * | 2014-02-12 | 2021-07-22 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 이의 제조 방법 |
| KR102144865B1 (ko) * | 2015-08-13 | 2020-08-18 | 한국전자통신연구원 | 유기발광소자 및 그 제조 방법 |
| US10267972B2 (en) * | 2016-10-25 | 2019-04-23 | Svv Technology Innovations, Inc. | Shaped light guide illumination devices |
-
2016
- 2016-12-27 CN CN201611225146.1A patent/CN106784311A/zh active Pending
-
2017
- 2017-01-16 WO PCT/CN2017/071228 patent/WO2018120313A1/zh not_active Ceased
- 2017-01-16 US US15/327,625 patent/US10305050B2/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102931136A (zh) * | 2012-08-09 | 2013-02-13 | 友达光电股份有限公司 | 可挠式显示模块的制作方法 |
| CN103325731A (zh) * | 2013-05-20 | 2013-09-25 | Tcl集团股份有限公司 | 柔性显示装置的制造方法 |
| CN105489789A (zh) * | 2016-01-18 | 2016-04-13 | 京东方科技集团股份有限公司 | 柔性器件制作方法及柔性显示器件 |
| CN106098939A (zh) * | 2016-08-26 | 2016-11-09 | 武汉华星光电技术有限公司 | 激光无损剥离柔性基板的方法 |
Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107507927A (zh) * | 2017-07-11 | 2017-12-22 | 武汉华星光电半导体显示技术有限公司 | 柔性显示装置的制作方法 |
| CN107507927B (zh) * | 2017-07-11 | 2019-04-30 | 武汉华星光电半导体显示技术有限公司 | 柔性显示装置的制作方法 |
| CN107644916A (zh) * | 2017-09-20 | 2018-01-30 | 京东方科技集团股份有限公司 | 薄膜晶体管及其制作方法 |
| CN107644916B (zh) * | 2017-09-20 | 2020-05-08 | 京东方科技集团股份有限公司 | 薄膜晶体管及其制作方法 |
| CN107845741A (zh) * | 2017-10-23 | 2018-03-27 | 武汉华星光电半导体显示技术有限公司 | 柔性基板剥离方法及柔性基板 |
| CN107845741B (zh) * | 2017-10-23 | 2019-05-07 | 武汉华星光电半导体显示技术有限公司 | 柔性基板剥离方法及柔性基板 |
| CN107819073A (zh) * | 2017-10-26 | 2018-03-20 | 武汉华星光电半导体显示技术有限公司 | 基板及oled器件的制作方法 |
| CN107819073B (zh) * | 2017-10-26 | 2020-01-17 | 武汉华星光电半导体显示技术有限公司 | 基板及oled器件的制作方法 |
| CN109728142A (zh) * | 2017-10-31 | 2019-05-07 | 展晶科技(深圳)有限公司 | 发光二极管晶粒的制造方法 |
| CN109728142B (zh) * | 2017-10-31 | 2021-02-02 | 展晶科技(深圳)有限公司 | 发光二极管晶粒的制造方法 |
| CN108230904A (zh) * | 2017-12-28 | 2018-06-29 | 武汉华星光电半导体显示技术有限公司 | 一种柔性面板的制备方法及柔性显示装置 |
| CN108963111A (zh) * | 2018-05-03 | 2018-12-07 | 云谷(固安)科技有限公司 | 柔性显示面板及其制作方法、显示装置 |
| CN108766244A (zh) * | 2018-06-06 | 2018-11-06 | 京东方科技集团股份有限公司 | 一种柔性显示面板及其制备方法、显示装置 |
| CN110098225A (zh) * | 2019-04-18 | 2019-08-06 | 武汉华星光电半导体显示技术有限公司 | 柔性显示面板及其制备方法 |
| CN110429106A (zh) * | 2019-07-05 | 2019-11-08 | 武汉华星光电半导体显示技术有限公司 | 显示面板及其制备方法 |
| US11296309B2 (en) | 2019-07-05 | 2022-04-05 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Method of manufacturing same display panel having bending region of polymide film having different thickness than in other regions |
| CN111755632A (zh) * | 2020-07-30 | 2020-10-09 | 河南工程学院 | 一种柔性有机电致发光器件及其制备方法 |
| CN111755632B (zh) * | 2020-07-30 | 2022-07-19 | 河南工程学院 | 一种柔性有机电致发光器件及其制备方法 |
| CN116009300A (zh) * | 2022-11-30 | 2023-04-25 | 上海天马微电子有限公司 | 柔性调光装置及其制备方法、玻璃组件、汽车和玻璃幕墙 |
Also Published As
| Publication number | Publication date |
|---|---|
| US10305050B2 (en) | 2019-05-28 |
| WO2018120313A1 (zh) | 2018-07-05 |
| US20180219164A1 (en) | 2018-08-02 |
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