CN105489562A - Intelligent card core and fabrication method thereof - Google Patents
Intelligent card core and fabrication method thereof Download PDFInfo
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- CN105489562A CN105489562A CN201510674465.XA CN201510674465A CN105489562A CN 105489562 A CN105489562 A CN 105489562A CN 201510674465 A CN201510674465 A CN 201510674465A CN 105489562 A CN105489562 A CN 105489562A
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- circuit board
- integrated circuit
- smart card
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- 238000000034 method Methods 0.000 title claims abstract description 29
- 238000004519 manufacturing process Methods 0.000 title abstract description 13
- 239000000463 material Substances 0.000 claims abstract description 64
- 229920005989 resin Polymers 0.000 claims description 73
- 239000011347 resin Substances 0.000 claims description 73
- 239000010408 film Substances 0.000 claims description 37
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 33
- 238000001723 curing Methods 0.000 claims description 25
- 230000000694 effects Effects 0.000 claims description 17
- 238000006068 polycondensation reaction Methods 0.000 claims description 16
- 238000005538 encapsulation Methods 0.000 claims description 13
- 238000002360 preparation method Methods 0.000 claims description 13
- 238000006243 chemical reaction Methods 0.000 claims description 7
- 229920001971 elastomer Polymers 0.000 claims description 7
- 239000000806 elastomer Substances 0.000 claims description 7
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 claims description 6
- 229910052753 mercury Inorganic materials 0.000 claims description 6
- 239000010409 thin film Substances 0.000 claims description 6
- 238000005520 cutting process Methods 0.000 claims description 5
- 238000000016 photochemical curing Methods 0.000 claims description 5
- 239000012792 core layer Substances 0.000 claims description 4
- 230000010354 integration Effects 0.000 claims description 4
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 4
- 239000000123 paper Substances 0.000 claims description 3
- 238000007639 printing Methods 0.000 claims description 3
- 229920002799 BoPET Polymers 0.000 claims description 2
- 239000005041 Mylar™ Substances 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 239000004744 fabric Substances 0.000 claims description 2
- 229910052736 halogen Inorganic materials 0.000 claims description 2
- 150000002367 halogens Chemical class 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 239000004745 nonwoven fabric Substances 0.000 claims description 2
- 239000002985 plastic film Substances 0.000 claims description 2
- 229920006255 plastic film Polymers 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 239000004814 polyurethane Substances 0.000 claims description 2
- 229920002635 polyurethane Polymers 0.000 claims description 2
- 229910052724 xenon Inorganic materials 0.000 claims description 2
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 claims description 2
- 229920000178 Acrylic resin Polymers 0.000 claims 1
- 239000004925 Acrylic resin Substances 0.000 claims 1
- 238000003475 lamination Methods 0.000 abstract description 5
- 238000001746 injection moulding Methods 0.000 abstract description 2
- 239000000470 constituent Substances 0.000 abstract 2
- 239000004840 adhesive resin Substances 0.000 abstract 1
- 229920006223 adhesive resin Polymers 0.000 abstract 1
- 239000012778 molding material Substances 0.000 abstract 1
- 238000004806 packaging method and process Methods 0.000 abstract 1
- 239000002861 polymer material Substances 0.000 abstract 1
- 238000007711 solidification Methods 0.000 description 11
- 230000008023 solidification Effects 0.000 description 11
- 239000011469 building brick Substances 0.000 description 9
- 239000010410 layer Substances 0.000 description 8
- 230000010412 perfusion Effects 0.000 description 6
- 239000004033 plastic Substances 0.000 description 6
- 229920003023 plastic Polymers 0.000 description 6
- 238000007789 sealing Methods 0.000 description 6
- 239000007788 liquid Substances 0.000 description 5
- 239000004973 liquid crystal related substance Substances 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- 229920001187 thermosetting polymer Polymers 0.000 description 5
- 230000000712 assembly Effects 0.000 description 3
- 238000000429 assembly Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 230000036632 reaction speed Effects 0.000 description 3
- 239000012780 transparent material Substances 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000002352 surface water Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 239000004634 thermosetting polymer Substances 0.000 description 1
- 239000005341 toughened glass Substances 0.000 description 1
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- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The invention relates to an intelligent card core and a fabrication method thereof. The intelligent card core comprises an integrated circuit board and electronic components on the integrated circuit board and is characterized in that a material used for packaging the integrated circuit board is a photo-curable material, a frame is arranged at the periphery of the intelligent card core and used for limiting the position of the integrated circuit board, and diversion films are arranged on the upper surface and the lower surface of the integrated circuit board. The intelligent card core is packaged and formed by using photo-curving adhesive resin, and thus, an advance intelligent card core and a similar device or equipment with complicated electronic components integrated in a card structure can be fabricated; appropriate outer surfaces are covered and attached on the upper surface and the lower surface of an intelligent card through a lamination mode to form a complete intelligent card with high-quality appearance; and the fabrication method is distinguished from a traditional method using a dual-constituent or multi-constituent bonding material as an injection molding material, the photo-curable polymer material is used in the method, so that the efficiency can be greatly improved, and the maneuverability and the finished rate of a product can be improved.
Description
Technical field
The present invention relates to a kind of smart card the core of the card and preparation method thereof, particularly a kind of photocurable materials that adopts encapsulates, and smart card the core of the card with integrated-optic device, battery, Sensitive Apparatus and display device and preparation method thereof.
Background technology
Along with the development of mobile payment, equipment bank card etc. to Information Authentication function proposes new security row and intelligentized requirement.Thus need these equipment to have the abilities such as calculating, display, prolonged application, recharging.Although normal procedure intelligent card has the infrastructure components such as integrated circuit, chip, antenna, not containing battery, the thermo-responsive and pressure-sensitive components and parts such as liquid crystal display.Novel advanced smart card can comprise such as battery, liquid crystal display, keyboard etc. and not appear at the parts in conventional smart card, and therefore Novel advanced smart card can provide the fail safe of more more complicated function and Geng Gao.
Smart card is widely used in data statistics storage, access security control, mobile payment, entry and exit control, and a lot of other fields.General intelligence card comprises user profile and a small amount of security control information, comprising identity information, and the data such as biological information, safe decoded information.
These smart cards are all made up of sandwich construction.So-called sandwich construction has one or more plastic layer, and these plastic layers are wrapped in chip, the assemblies such as antenna, provides hardness required for protection intraware and protection by these plastic layers.These plastic layers are all generally that the environment of HTHP frequently occurs in this process by the Combination of Methods of heat lamination together.The temperature of general plastic clip lamination is in the scope of 100 DEG C-140 DEG C, and in the scope of pressure from 1000Psi to 30,000Psi, such temperature and pressure, will cause fatal damage to battery and liquid crystal display equitemperature, presser sensor components and parts.Therefore, the method for heat lamination can not be used for the production of novel smart card the core of the card.
Also there is the method for two components resin perfusions that a kind of use normal temperature or low temperature (40 DEG C-80 DEG C) heating are cured at present.The method can solve the problem of pressure and temperature responsive type component package, but can run into inefficiency, problem that defect rate is high.Two component encapsulation material; will start upon mixing curing reaction occurs; the reaction speed of sealing resin can impel perfusion resin viscosity to raise fast soon; this is because the resin of two component; just start upon mixing curing reaction occurs, the viscosity of perfusion resin increases with the prolongation in reaction time, after the degree that reaction reaches enough; perfusion resin is formed as thermosets, becomes tough and tensile plastic protective layer.But the viscosity of sealing resin raises fast and causes mobility to decline, be difficult to get rid of by the bubble caused in the process of perfusion the core of the card in mould, sealing resin cannot carry out coated to electronic devices and components such as wiring boards well, and conforming product rate is below 93%.Use compared with the sealing resin of low reaction speed, exhaust in potting process and the resin coated problem to wiring board and electronic devices and components can be solved, but efficiency can be caused significantly to decline.Generally, the preliminary molding time of two component sealing resins was at 2-6 hour, and reaching maximum intensity needed within 12-24 hour, and its efficiency is very low, and therefore, the method is not widely used.Present urgent need is a kind of has the smart card the core of the card and preparation method thereof of integrated-optic device, battery, thermo-responsive and presser sensor electronic devices and components and display device.This product and the method should have higher production efficiency and conforming product rate.
Summary of the invention
The object of the invention is to propose a kind of smart card the core of the card.
Smart card the core of the card of the present invention is achieved in that
A kind of smart card the core of the card, comprises the electronic devices and components on integrated circuit board and integrated circuit board, also comprises photocurable materials for encapsulation and integration wiring board.
Smart card the core of the card described above, one is execution mode preferably, is that the described encapsulating material for encapsulation and integration wiring board is light-curable resin material.
Smart card the core of the card described above, one is execution mode preferably, is that described photocurable materials is acrylate, polyurethane, epoxy resin or mylar.
Smart card the core of the card described above, one is execution mode preferably, is that described smart card the core of the card periphery has the frame limiting integrated circuit board position.
Smart card the core of the card described above, one is execution mode preferably, is that the upper and lower surface of described integrated circuit board has water conservancy diversion film.
Smart card the core of the card described above, one is execution mode preferably, is that the thickness of the smart card the core of the card through photo-curing material encapsulation is 0.2-0.84mm.
Smart card the core of the card described above, one is execution mode preferably, and be the described frame that can limit integrated circuit Board position, its thickness is between 0.2-0.84mm.
Smart card the core of the card described above, one is execution mode preferably, is that the described material that can limit the frame of integrated circuit Board position is PVC, PET, PBT, PC-ABC, ABS.
Smart card the core of the card described above, one is execution mode preferably, and be that the material of the water conservancy diversion film of described integrated circuit board upper and lower surface can be thin-film material, thickness is at 5-50g/m
2scope in.
Smart card the core of the card described above, one is execution mode preferably, is that the water conservancy diversion thin-film material of described integrated circuit board upper and lower surface can be paper, cloth, nonwoven fabrics, plastic film.
Another object of the present invention is the preparation method proposing described smart card the core of the card.
The preparation method of smart card the core of the card of the present invention is achieved in that
A preparation method for smart card the core of the card, its step comprises:
(1) frame can fixing integrated circuit board position is placed in the die cavity of printing opacity mould, and the laminating of frame mould intracavity wall, positioning frame is fixed on the position in die cavity;
(2) water conservancy diversion film is placed in the upper and lower surface of integrated circuit board, and integrated circuit board is placed in positioning frame;
(3) with the mode in gap, the upper film of mould and counterdie are fitted according between dies cavity upper surface and integrated circuit board, close die cavity;
(4) photocurable resin material is injected in die cavity by mould side under certain temperature and pressure condition, under the effect of water conservancy diversion film, light-cured resin injects with roughly balanced flow velocity, make the air scavenge in die cavity, the electronic devices and components on the complete coated wiring board of light-cured resin and wiring board;
(5) by positioning frame, integrated circuit board and water conservancy diversion film are fixed on original position, the light-solidifying poly condensation material of importing covers electronic unit integrated on water conservancy diversion film and integrated circuit board and integrated circuit board gradually completely;
(6) gas and excessive light-solidifying poly condensation material, get rid of from exhaust outlet.
(7) use curing light source to cause photo-curing material reaction, form thermo-setting elastomer after solidification, finally form the core of the card.
(8) opening mold, takes out smart card the core of the card from mould, carries out cutting and reduces, obtain required smart card core layer according to required specification.
Preparation method as above, one is execution mode preferably, and wherein light-solidifying poly condensation material injects space with the pressure between about absolute pressure 0.1-0.2Mpa, or injects space with the pressure between about absolute pressure 0-0.1Mpa.
Preparation method as above, one is execution mode preferably, and wherein light-solidifying poly condensation material injects greatly in the scope of 0 DEG C to 80 DEG C.
Preparation method as above, one is execution mode preferably, and the curing light source wherein solidifying described light-cured resin is high-pressure mercury lamp, cold cathode low-voltage mercury lamp, hot-cathode low-pressure mercury lamp, ultraviolet xenon lamp, metal halogen lamp source or LED light source.
Preparation method as above, one is execution mode preferably, and the curing time of wherein said light-cured resin can be controlled in the scope of 5-60 second.
The invention provides the method for packing that a kind of thickness is no more than the smart card the core of the card of 0.84mm (thickness of conventional credit card), described the core of the card can comprise; Integrated circuit board, microprocessor, antenna, communication module (bluetooth, Wi-Fi etc.), integrated circuit (IC) chip, battery, light-emitting diode, liquid crystal display, polymer dome switches, resistance, transducer (such as fingerprint sensor), electric capacity.
The present invention is by providing a kind of method production of intelligent card the core of the card using light-cured resin; this the core of the card comprises the frame of the circuit board containing integrated electronic component, the upper and lower two-layer water conservancy diversion film of optional wiring board, restriction wiring board position; with the packing protective layer that light-cured resin is formed, this light-cured resin carries out safe encapsulation by the wiring board in core layer and electronic devices and components.
Use the mould that a kind of transparent material manufactures in the present invention, transparent material can use glass, toughened glass, the material that PC, PVC etc. are transparent, but is not limited in above-mentioned material.This mould has charging aperture and exhaust outlet, use apparatus all reaches by the opening and closing of mould, the inner surface of film up and down of mould scribbles release materials, the resin material after solidification and die surface is made to be easy to be separated, to be described mould basic function in the present invention, not do detailed describing.By positioning frame, wiring board, after in the die cavity that water conservancy diversion film (upper and lower surface that water conservancy diversion film covers wiring board is outer) is placed in transparent mould, upper and lower mould matched moulds, uses locking tool or device to be locked by mould.By charging aperture, light-cured resin is expelled in the die cavity of the mould that transparent material is made, because wiring board exists the gap of minimum 0.02-0.25mm in die cavity with upper and lower surface, injection moulding light-cured resin is allowed to be full of wherein, wrap electronic device, form surface that is smooth or given shape by the upper and lower surface of printing opacity mould cavity.By using curing light source, be cured in transparent mould by light-cured resin, curing time is 5-60 second, is got off the core of smart card after solidification from the mould inside demoulding.
The smart card the core of the card with integrated circuit and electronic devices and components of described formation can be made on single or continuous print plate, is then cut by machine tool, makes the specification become required for advanced smart card the core of the card.
Beneficial effect of the present invention: present invention employs light-cured resin, it has relative to the heat reactive resin adopted the advantage that efficiency is high, defect rate is low, flat appearance degree is high, easy and simple to handle.
The described light-cured resin reaction speed time that is fast, that reach maximum intensity is short, and generally its curing time is between 5-60 second, uses other Embedding Material (such as with other; Be heating and curing resin, multi-component room-temperature cured resin, multicomponent of double-component cold curing resin, two component is heating and curing resin, single-component thermosetting resin) compare there is great odds for effectiveness.
Described light-cured resin is not when being irradiated to the light source of characteristic frequency, light-cured resin is in stable state always, not there is chemical reaction, its viscosity does not change in time, so good flowing and row's bubble performance can be kept in the process of whole embedding, its operating time can be similar to thinks to have the longer operating time by endless compared with other Embedding Material, ensure that the high qualification rate of high product.
The range of viscosities of described light-cured resin is wider, adopts low viscous light-cured resin can form the higher smart card the core of the card of surface smoothness, and plays better encapsulation effect to the core of the card internal electronic component.
Accompanying drawing explanation
Fig. 1 is the cross sectional side view of the advanced smart card the core of the card openly instructing manufacture according to the present invention.This smart card the core of the card comprises the photocurable resin material 10 of encapsulation, for dredging the water conservancy diversion film 5 of light-cured resin, intermediate layer 7 be circuit board and its above electronic building brick (such as; Flexible printed circuit board and polyimides or traditional printed circuit board (PCB), comprising a lot of electronic building brick, as 9 chips running through wiring board, 8 attachments battery etc. in the circuit board), for the positioning frame 6 of permanent circuit Board position.Photocurable resin material 10 solidifies under the effect of curing light source, and the assembly in this advanced smart card the core of the card encapsulates by thermosets completely that formed after solidification, but forms the entirety of this smart card the core of the card.
Fig. 2 is the top view of the smart card the core of the card openly instructing manufacture according to the present invention.There is shown on integrated circuit board 7, with the various electronic building bricks on integrated circuit board, comprise battery 8, LCDs 13, integrated chip 15, integrated switch 14, the limited frame 6 of integrated circuit board containing these assemblies surrounds, integrated circuit board can be fixed in a mold by spacing frame 6, and any movement does not occur.By the effect of curing light source, light-cured resin can solidify within 5-60 second, form thermosets after light-cured resin solidification, these thermosets are good bonding and coated by being formed assembly described before, the entirety of formation advanced smart card the core of the card.
Fig. 3 is the mould cross sectional side view of the first preferred embodiment openly instructing the advanced smart card the core of the card of manufacture according to the present invention.On wiring board 7 shown in thickness 12 about 6mm. figure that distance in Fig. 3 between the lower surface 2 in upper mould chamber 1 and the upper surface 4 in lower mould chamber 3 shows this smart card the core of the card, the maximum height position 11 of assembly is no more than 5mm.One deck water conservancy diversion film 5 is there is between die cavity upper and lower surface and circuit board assemblies, this water conservancy diversion film can dredge liquid with uniform speed trickling exhaust, (water conservancy diversion film is porous film material in 5-50 gram, the grammes per square metre position of this water conservancy diversion film every square metre, have compressibility, its thickness is represented by weight per square meter usually).Its thickness is extremely little, does not form impact to gap.Gap between die cavity upper and lower surface and chip maximum height allows light-cured resin 10 to be entered by major ingredient mouth on the left of mould under liquid or semi-liquid state, gas in mould and unnecessary light-cured resin 10 are slowly got rid of by the exhaust outlet on the right side of mould along water conservancy diversion film by light-cured resin under the effect of certain pressure and temperature, and light-cured resin will be full of between mould upper and lower surface and integrated circuit board and the gap on it between electronic building brick completely.
Fig. 4 is the mould top view of the first preferred embodiment openly instructing the advanced smart card the core of the card of manufacture according to the present invention.
Fig. 5 illustrates the mould cross sectional side view of curing light source solidification advanced smart card the core of the card, and the coated smart card system of light-cured resin solidifies under the effect of curing light source 31, forms senior smart card the core of the card.
The test schematic diagram of situation when Fig. 6 illustrates the die sinking of advanced smart card the core of the card, the system manufacture as shown in Figure 3 of wherein said the core of the card.
Fig. 7 describes a kind of mold system schematic diagram that simultaneously can manufacture 6 high-grade intelligent the core of the cards.
Embodiment;
In order to there be understanding clearly to technical characteristic of the present invention, object and effect; in conjunction with case study on implementation, a kind of smart card the core of the card and preparation method thereof is further detailed; not determinate, do not limit protection scope of the present invention with following case study on implementation.
Fig. 1 describes a kind of advanced smart card the core of the card 01 cross sectional side view instructing manufacture disclosed in this patent.According to its final form, such smart card the core of the card comprises the photocurable resin material 10 of encapsulation, for dredging the water conservancy diversion film 5 of photocurable resin material, intermediate layer 7 be circuit board and its above electronic building brick (such as, flexible printed circuit board and polyimides or traditional printed circuit board (PCB), comprising a lot of electronic building brick, as 9 chips running through wiring board, 8 attachments battery etc. in the circuit board), positioning frame more than 6. material for permanent circuit Board position together constitutes the core of the card part of advanced smart card, wherein remainder in the core of the card is comprised water conservancy diversion film 5 by photocurable resin material 10, for limiting the positioning frame 6 of circuit Board position, electronic building brick 8 on wiring board 7 and wiring board, 9 wrap up completely, under the effect of curing light source, light-solidifying poly condensation material 10 is by polymerization reaction take place, thermoset resin material is become by liquid state within 5-60 second, light-solidifying poly condensation material 10 after solidification encapsulates completely by being formed all material of the core of the card.The light-solidifying poly condensation material 10 injected adopts in the process of applicant that relatively low temperature lower pressure is capable completes perfusion.Liquid crystal display 13 integrated on positioning frame 6 in Fig. 2, integrated circuit board 7 and wiring board, battery 8, chip 15, switch 14 are all bundled together by the link of light-solidifying poly condensation material, under the effect of curing light source, form unified entirety.
In Fig. 3, light-cured resin is under certain pressure and temperature, entered by charging aperture on the left of mould 21, under the effect of certain temperature and pressure, light-cured resin enters in die cavity with comparatively jogging speed, and advance with the exhaust outlet 22 of roughly the same speed on the right side of die cavity under the drag effect of water conservancy diversion film 5, air pressure can be reduced by the mode vacuumized in die cavity, make the bubbles burst of the light-solidifying poly condensation material inside entered on a small quantity, form the covering of continuous print light-cured resin.Under the effect of surface energy of liquid, light-cured resin can permeate the lower surface 2 that is placed on upper mould chamber 1 and (comprise chip 9 to the assembly on circuit board 7, assembly such as battery 8 grade) between water conservancy diversion film, and the gap-fill on the lower surface 2 in upper mould chamber 1 and the upper surface 4 in lower mould chamber 3 and integrated circuit board 7 between electronic building brick is full.
In Fig. 4, the cavity of mould 15 forms a closed spatial result, after mould 15 upper and lower mould is closed, only deposits the exhaust outlet 22 of the left side charging aperture 21 of a light-cured resin 10 and the spilling of one, right side gas and unnecessary light-cured resin 10.
On the lower surface 2 in the upper mould chamber 1 shown in Fig. 3 and the upper surface 4 of bed die 3, all coated release agent, such as, can use the coating of FREKOTE770NC as release agent of Henkel Corp..Curing molding under the effect of light-solidifying poly condensation material 10 at light source, can take out easily from die surface, form complete the core of the card structure and enter shown in Fig. 1.
Fig. 5 is under the irradiation of upper and lower both sides curing light source 31, light-cured resin 10 will solidify within 5-60 second, thermo-setting elastomer 32 is formed after solidification, this thermo-setting elastomer 32 is by the circuit board 7 in die cavity, and the electronic devices and components on circuit board comprise chip 9, batteries 8 etc., positioning frame 6, upper and lower two-layer water conservancy diversion film 5 is encapsulated the core of the card defining advanced smart card.Light-cured resin after solidifying is thermo-setting elastomer, and it has good intensity and toughness, can form good protection to coated wiring board and electronic devices and components, reduces the thermal stress of physical property and the destruction of pressure.Encapsulate the light-cured resin of all electronic units, form thermo-setting elastomer after solidification, this elastomeric intensity and property of toughness can disperse any one corner of the core of the card to receive bending, distortion or impulsive force.This elastomeric thermal insulation properties can also reduce during final lamination treatment, agree the thermal shock that can be subject to when using the thin-film materials such as PET or PVC to carry out the pressing of upper and lower surface.
Containing multiple electronic building brick in intelligent the core of the card in FIG, the present invention can be used for making compatibility and can be used for the design of a wide range of advanced smart card, can specifically be applied for integrated different electronic devices and components in the circuit board.These application can comprise: the data display of the access control of block entrance, bank card or atm card, bio-identification and cryptographic acess control etc.
For purposes of the present invention, be 85.60mm × 53.98mm according to the smart card dimensional requirement specification that ISO7810 specifies, the card of this specification is often used to identity card, bank card, member card etc.In the scope that ISO7810 requires, we do not do strict size to the chip on wiring board and wiring board and limit.
The specification of the core of the card is created by the restriction more than ISO7810 according to the method shown in Fig. 3, (surfacing can be PET to be stained with surfacing in process in the core of the card upper and lower surface, the thin-film material such as PVC, synthetic paper) after, can cutting equipment be used, produced advanced smart card be cut into the smart card size that ISO7810 specifies.But the scope that the present invention uses is not limited to the size range of ISO7810 defined, the card specified more than ISO7810 for some still uses, such as Beijing's subway mass transit card, the scope of the advanced smart card the core of the card application that the available light cured resin methods such as certain bank's small size credit card make.
Embodiment 1
Untie mould locking device, open die cavity; The water conservancy diversion film cutting into solid shape is placed on the upper surface in lower mould chamber; Can the frame of fixed line Board position as in die cavity, and to be fitted in long for the both sides of frame limit and die cavity both sides, positioning frame are fixed on the position in die cavity; Wiring board with integrated electronic component is placed in positioning frame; Above upper surface water conservancy diversion film being placed in wiring board, cover the upper film of mould, use the upper and lower mould of locking device locking mould, close die cavity; The charging aperture of mould is connected with the injection port of light-cured resin, the gas outlet of mould is connected with vacuum extractor; Photocurable resin material is injected in die cavity by mould side under the pressure condition of room temperature (22 ± 3 DEG C) and absolute pressure 0.03Mpa, under the effect of water conservancy diversion film, light-cured resin is with roughly balanced flow velocity, by the air scavenge in die cavity, electronic devices and components on the complete coated wiring board of light-cured resin and wiring board, close the exhaust outlet of charging aperture.Due to the effect of positioning frame, wiring board and water conservancy diversion film are fixed on original position, and the light-solidifying poly condensation material of importing covers electronic unit integrated on water conservancy diversion film and wiring board and wiring board gradually completely; Gas and excessive light-solidifying poly condensation material, get rid of from exhaust outlet; Use curing light source to irradiate solidification at the upper and lower sides of transparent mould, curing time is 15 seconds simultaneously; Photo-curing material after solidification forms thermo-setting elastomer, by water conservancy diversion film, positioning frame, tightly encapsulates with the wiring board of integrated electronic component, finally forms the core of the card; Opening mold, takes out advanced smart card the core of the card from mould, is reduced obtaining required specification, obtain the core layer of required advanced smart card by cutting.
Comparative example 1
Other condition constant under condition, the light-cured resin of embodiment 1 please be replaced with the curable resin of other kind that following table is enumerated.
Table 1
As can be seen from the content of table 1, the core of the card of light-cured resin encapsulation is adopted to have simple operating conditions relative to the core of the card of other encapsulating material, the advantages such as curing rate is fast.And conforming product rate also improves greatly.
Comparative example 2
In constant under condition, please being removed by the water conservancy diversion film in embodiment 1 method of other condition, light-cured resin is directly adopted to encapsulate.There is technique effect as shown below:
Table 2
| Encapsulation the core of the card performance | Embodiment 1 | Comparative example 2 |
| Bubbles volume | Bubble-free | There is obvious bubble |
| Sealing | Wiring board and chip are sealed completely | Wiring board and chip have space |
The foregoing is only the schematic embodiment of the present invention, and be not used to limit scope of the present invention.Any those skilled in the art, the equivalent variations done under the prerequisite not departing from design of the present invention and principle and amendment, all should belong to the scope of protection of the invention.
Claims (15)
1. a smart card the core of the card, comprises the electronic devices and components on integrated circuit board and integrated circuit board, it is characterized in that for the material of encapsulation and integration wiring board be photocurable materials.
2. smart card the core of the card as claimed in claim 1, is characterized in that the described photocurable materials for encapsulation and integration wiring board is light-curable resin material.
3. smart card the core of the card as claimed in claim 1, is characterized in that described photocurable materials is acrylic resin, polyurethane, epoxy resin or mylar.
4. smart card the core of the card as claimed in claim 1, is characterized in that smart card the core of the card periphery has the frame limiting integrated circuit board position.
5. smart card the core of the card as claimed in claim 1, is characterized in that the upper and lower surface of described integrated circuit board has water conservancy diversion film.
6. smart card the core of the card as claimed in claim 1, is characterized in that the thickness of the described smart card the core of the card through photo-curing material encapsulation is 0.2-0.84mm.
7. smart card the core of the card as claimed in claim 4, it is characterized in that the described frame that can limit integrated circuit Board position, its thickness is between 0.2-0.84mm.
8. smart card the core of the card as claimed in claim 4, is characterized in that the described material that can limit the frame of integrated circuit Board position is PVC, PET, PBT, PC-ABC, ABS.
9. smart card the core of the card as claimed in claim 5, it is characterized in that the material of the water conservancy diversion film of described integrated circuit board upper and lower surface can be thin-film material, thickness is at 5-50g/m
2scope in.
10. smart card the core of the card as claimed in claim 5, is characterized in that the water conservancy diversion thin-film material of described integrated circuit board upper and lower surface can be paper, cloth, nonwoven fabrics, plastic film.
The preparation method of 11. 1 kinds of smart card the core of the cards as claimed in claim 1, the step of described method comprises:
(1) frame can fixing integrated circuit board position is placed in the die cavity of printing opacity mould, and frame and mould intracavity wall are fitted, and positioning frame are fixed on the predeterminated position in die cavity;
(2) water conservancy diversion film is placed in the upper and lower surface of integrated circuit board, and integrated circuit board is placed in positioning frame;
(3) with the mode in gap, the upper film of mould and counterdie are fitted according between dies cavity upper surface and integrated circuit board, close die cavity;
(4) photocurable resin material is injected in die cavity by mould side under certain temperature and pressure condition, under the effect of water conservancy diversion film, light-cured resin injects with roughly balanced flow velocity, make the air scavenge in die cavity, the electronic devices and components on the complete coated wiring board of light-cured resin and wiring board;
(5) by positioning frame, integrated circuit board and flow-guilding mold are fixed on original position, the light-solidifying poly condensation material of importing covers electronic unit integrated on water conservancy diversion film and integrated circuit board and integrated circuit board gradually completely;
(6) gas and excessive light-solidifying poly condensation material, get rid of from exhaust outlet.
(7) use curing light source to cause photo-curing material reaction, form thermo-setting elastomer after reaction, finally form the core of the card.
(8) opening mold, takes out smart card the core of the card from mould, carries out cutting and reduces, obtain required smart card core layer according to required specification.
12. methods as claimed in claim 11, wherein light-solidifying poly condensation material injects space with the pressure between about absolute pressure 0.1-0.2Mpa, or injects space with the pressure between about absolute pressure 0-0.1Mpa.
13. methods as claimed in claim 11, wherein light-solidifying poly condensation material injects greatly in the scope of 0 DEG C to 80 DEG C.
14. methods as claimed in claim 11, the curing light source wherein solidifying described light-cured resin is high-pressure mercury lamp, cold cathode low-voltage mercury lamp, hot-cathode low-pressure mercury lamp, ultraviolet xenon lamp, metal halogen lamp source or LED light source.
15. methods as claimed in claim 11, the curing time of wherein said light-cured resin can be controlled in the scope of 5-60 second.
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| CN201510674465.XA CN105489562A (en) | 2015-10-18 | 2015-10-18 | Intelligent card core and fabrication method thereof |
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| CN201510674465.XA CN105489562A (en) | 2015-10-18 | 2015-10-18 | Intelligent card core and fabrication method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111883436A (en) * | 2020-07-14 | 2020-11-03 | 通富微电子股份有限公司技术研发分公司 | Chip packaging method and chip packaging device |
| CN113085091A (en) * | 2021-03-29 | 2021-07-09 | 上海胶泰新材料科技有限公司 | Mold, molding method of photocuring adhesive and packaging method of circuit board |
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