TWI257345B - Over-molding product and method of making same - Google Patents

Abstract

An over-molding product comprises: a polymer with a high flexural strength not less than 900 kg/cm<2>; and an over-molding layer on at least a portion of the polymer, the over-molding layer being a thermoplastic material.

Description

1257345 IX. Description of the Invention: [Technical Field] The present invention relates to an encapsulated molded article and a method of producing the same, and more particularly to a molded article which can be coated with a large amount without warping The rubberized molding and its preparation method. [Prior Art] With the evolution of technology, the encapsulation technology for products, especially electronic products, has been continuously innovated to enhance surface treatment technology. In general, in order to achieve the purpose of insulation, aesthetics, etc., it is often necessary to use the encapsulation technology of the conventionally used encapsulation method, including: directly spraying the rubber paint on the surface of the material to be coated, and utilizing With adhesive material, the rubber-coated material is used on the surface of the material to be encapsulated. The plastic-formed product formed by the above two methods is easy to be formed due to thermal expansion and shrinkage, and the adhesion is insufficient. This leads to a phenomenon that leads to a shortened product life. At present, the preferred method of winning is the injection molding, which can effectively improve the shortcomings of the above-mentioned materials and the insufficient adhesion of the rubber-clad material, and can also provide a rubber-coated product with a beautiful silk surface. The encapsulation method of the f-phase phase generally includes the following steps: - molding the material by using the mold; placing the material to be encapsulated in the concave hole of the mold; - introducing the package at a high temperature between the mold and the material to be coated In the recessed hole; - Loosen the encapsulated component from the recessed hole. Material 2 "In (10) various electronic components. And the general encapsulation material is a plastic Bingsheng Ding two infiltration benzene 浠 (aC coffee 1 her ^ (four) one, A 峋 more ",, brother 1A map ~ brother 1B map , the system is dry and well-known material deformation ^^ + and the age of the reading contraction and this article is too private to think about it. In the knowledge of the praise of the good ^, the original H from the constant material package I molding process t , the package of rubber material 5 package j arrow direction. In addition, plus the production of the new ^ degree contraction, such as the first field material 7 will be along _5 (four). _ degree is insufficient, _ hai high score: the collection ' The direction forms a serious distortion of the fixed direction, as shown in Fig. 〇 801-A311〇7TWF(5.0) 5 1257345. Based on the above-mentioned rubber-coated product, how to form a rubber-coated and non-deformable rubber-coated product SUMMARY OF THE INVENTION In view of the above, an object of the present invention is to provide an overmolded article and a method for producing an overmolded article to provide a bending strength sufficient to resist the rubberized material. The encapsulated material of the contraction force generated by cooling to form a durable and non-deformable encapsulated molded article. To achieve the above purpose, the present invention Providing a rubber-molded article comprising: - a flexural strength, a high-strength polymer material of not less than 900 kg/cm 2 ; and a rubber layer disposed on at least a portion of the surface of the material, the package county - Thermoplastic glue. In order to achieve the above object, the present invention further provides a method for producing an encapsulated molded article, comprising: forming a high-strength polymer material having a bending strength of not less than 900 kg/cm 2 using a material cooker; taking out the southern molecular reservoir and placing the same - a cover towel having a recessed hole; introducing a silicone material in the over-molded plastic mold under i85_2Q5c)c to fill the recessed hole with the encapsulated material and covering the polymer - the surface and the job - package _, the towel of the county - thermoplastic glue - hardening the plastic material; and, from the plastic mold to take out the winning polymer material and perform a cooling step to get a no Warped and deformed encapsulated molded article. By using the high-strength polymer material having a bending strength of not less than 900 kg/cm 2 by the present invention, an encapsulating material composition having a test strength sufficient to resist the shrinkage force generated by the cooling of the rubber material can be provided to form a durable and non-deformable rubber compound. Molded product. The above and other objects, features and advantages of the present invention will become more apparent and understood. [Embodiment] Please refer to Fig. 2, which is a schematic view showing a molding step of the polymer material of the present invention.利〇801-A311〇7TWF(5.〇) 6 1257345 Use - material mold 10 fine-bend (four) degree not less than _kg/em2 high-strength polymer material 20 'This invention uses bending strength as a shocking beer 2 material is better. 2: The molecular material 20 can be, for example, polyphenylene ether (1) 〇 1 勉 _ 〇 〇 ide , 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 旨 旨Preferably. The above polymer material 20 may further increase the flexural strength by adding 〇1% to 3% of the fiber according to the need of the continuous condition, wherein the content of the fiber is based on the total weight of the material. In addition to the above-mentioned 2 polymer material 2〇, Kexian added a mechanically shaped bismuth bis2 butadiene styrene (ABS), and the bending strength of ABS after adding 〇.! tree to 3% of the fiber High strength requirements of not less than 900kg/cm2. The fibers to be added in the present invention are preferably inorganic fibers such as asbestos, glass or carbon. In addition, the molecular material 20 can also be added with fillers, reinforcing agents, processing aids, flow promoters or pigments depending on actual needs. Please refer to Fig. 3, which is a schematic view showing the encapsulation step of the encapsulated molded article of the present invention. The polymer material 20 is taken out, placed in an encapsulating mold having a concave hole, and then introduced into the encapsulating material 40 under the i85_2〇5〇c, and the encapsulating mold 3 having the concave hole 50 is wiped. The encapsulating material 40 is filled in the recess 50 and covers one surface of the polymer material 2 to form an encapsulation layer 40. Wherein, when the encapsulation layer 40 is formed on the polymer material 2, an interface between the encapsulation layer 4 and the southern molecular material 20 forms an inter-melting layer (not shown), and the inter-melting layer The encapsulating layer 40 and the polymer material 20 are mutually melted. Here, the rubberized layer 4 is a thermoplastic rubber material, which can be selected as the free t-p-butyl phthalate plastic 2 (4) (10) - which she puts, pET), polycarbonate, polyamine, poly Ketone, polybutylene terephthalate plastic (4) ybuthylenethereplithalate, PBT), polyether ketone ether ketone ketone (p〇lyetherket〇ne etherket_ketone, PEKEKK), polyether ketone, poly sulphide, polyphenylene ether, polyphenyl sulfide , poly maple, polyether maple, polythenimine, polyether quinone imine, polyamidimide, polyamidoxime, thermoplastic polyurethane (therm〇plasiic polyurcthane, TPU), and the foregoing a group of substances composed of a composition. After the introduction of the rubber material 0801-A31107TWF (5.0) 7 1257345 〇 to the reduction: then harden the rubber material under 35_45 〇c. Referring to Fig. 4, there is shown the intention of the encapsulating mold 3 of the present invention to take out the encapsulation and enclose the encapsulating material. The self-encapsulating material 20 is not encapsulated with another surface-bonding material, 20 and cooled, and is 60. In addition, the member 7 — - she 6 ^ to a non-warped deformation of the (10) molded article invention _, cake 7G 峨 better, but the material composition. The overmolded article 60 of the present invention can be formed on a material such as, for example, a part of a T-LCD of a display casing, and the like. However, the rubber is turned over. 6G^,, χ is in the field of the function key panel of the liquid pain indicator. The description of Asia is not limited to this, it can also be applied to other electronic products. The high-strength and high-scoring of the bending strength of _ 9()()_1()(K)kg/em2 can be used to provide the test intensity enough. An encapsulating material that resists the contraction force of the rubberized material by cooling, and a substance, to form a durable and non-deformable encapsulated molded article. The present invention has been disclosed in several preferred embodiments as above, but it is not intended to limit the invention to any of the micro-artists, and a few modifications and refinements should be made without departing from the scope of the invention. The handle of the rider and its solution are subject to change. [Simple description of the drawings] Fig. 1A to Fig. 1B _' show a schematic diagram of the process of deforming the material by shrinking the conventional rubber material after cooling. Fig. 2 is a view showing a molding step of the polymer material of the present invention. Fig. 3 is a view showing the steps of encapsulation of the encapsulated molded article of the present invention. Fig. 4 is a schematic cross-sectional view showing the encapsulated molded article of the present invention. 7 ~ material; [main component symbol description] 5 ~ package rubber; 0801-A31107TWF (5.0) 8 1257345 ίο ~ material mold; 30 ~ plastic mold; 50 ~ concave hole; 70 ~ member 0 20 ~ polymer material; 40~ rubberized material, 60~ rubberized molding; 0801-A31107TWF(5.0)

Claims (1)

Patent Application No. 12573⁄43⁄4135069 Revised 10, Patent Application Range: 1. A method for producing an encapsulated molded article, comprising: forming a polymer material having a bending strength of 900-1000 kg/cm2 by using a material mold; Putting it into a plastic mold with a concave hole; introducing a rubber material into the plastic mold having a concave hole at 185-205 ° C, so that the rubber material fills the concave hole The cover layer is formed on the surface of the polymer to form a rubber layer, wherein the rubber layer is a thermoplastic rubber; S hardens the rubber material; and the rubberized polymer material is taken out from the rubber mold. A cooling step is performed to obtain an overmolded article which is not warped. 2. The method for producing an encapsulated molded article according to claim 1, wherein when the rubberized layer is formed on the crane molecular material, the interface between the package riding and the silk molecule will form an intermingled layer. The interfacial layer is formed by melting the encapsulating layer and the polymer material. 3. The method for producing an encapsulated molded article according to claim 1, wherein the polymer material is poly carbonate (PQ. 4) as described in claim 1 of the scope of the invention. The method of molding a product, wherein the polymer material further comprises 0 to 1% by weight to 30% by weight of the fiber, and the content of the fiber is based on the total weight of the polymer material. 5. The production as described in claim 4 The method for producing an encapsulated molded article, wherein the polymer material is acrylonitrile butadiene styrene (ABS). 6. The method for producing an encapsulated molded article according to claim 1 , wherein the polymer material is polyphenylene oxide, ΡΡΟ), polycarbonate (p〇iy carbonate, pc), PC/ABS 〇' 7. The encapsulation is as described in claim 4 A method of molding a product, wherein the fiber is an inorganic fiber. 8. The method of producing an overmolded article according to claim 7, wherein the inorganic fiber is 石8〇1-A3H〇7TWF1; and I〇4〇〇6 10 1257345 is asbestos, glass or carbon. 9. The method of making an overmolded article of the invention of claim 1, wherein the material further comprises a filler, a reinforcing agent, a processing aid, a flow promoter or a pigment. The method of producing an overmolded article according to claim 9, wherein the thermoplastic adhesive is a thermoplastic polyurethane (TPU). 11. The method of producing an overmolded article according to claim 9, wherein the thermoplastic rubber is selected from polyethylene polyethylene terephthalate (polyethylene), polycarbonate, polyamine Polyketone, polyethylene terephthalate (PBT), polyetherketone etherketone ketone (PEKEKK), polyetherketone ketone (PEKK), polyphenyl sulfide , polyphenylene ether, polyphenylsulfonium sulfide, polysulfone, polyether oxime, polyimine, polyether oxime, polyamic acid imide, polyamidoxime, and a combination of the foregoing The ethnic group. The method of producing an overmolded article according to the invention of claim 2, wherein the overmolded article is an appearance member of a liquid crystal display (LCD). The method of producing an overmolded article according to the first aspect of the invention, wherein the appearance member is a function key panel of a liquid crystal display. An encapsulated molded article obtained by the method of producing an encapsulated molded article as described in the scope of the patent application. In the case of the overmolded article described in the U.S. Patent Application Serial No. U, the polymer material is poly carbonate (PC). 16. If you want to cover the cover of the second item, the polymer material further includes 0.1 wt% to 3% by weight of the fiber, and the fiber content is based on the total weight of the material. . L 17. The overmolded article of the invention of claim 16, wherein the fiber is: inorganic fiber 18, such as cotton, glass or carbon as claimed in the patent application. The encapsulated molded article of the above-mentioned item, wherein the inorganic fiber is a stone-shaped material, the acrylonitrile-butyl compound, wherein the inorganic material is acrylonitrile-butyl. Acrylonitrile butadiene styrene (ABS). 20. The encapsulated molded article according to claim 14, wherein the polymer material is polyphenylene ether (p〇ly (Phenyl) oxide, ΡΡΟ), polycarbonate (p〇ly carb〇nate, pc) ) or pc/ABs. 21. The encapsulated molded article of claim 14, wherein the polymeric material further comprises a filler, a reinforcing agent, a processing aid, a flow promoter or a pigment. 22. The overmolded article of claim 14, further comprising an interbed layer between the polymeric material and the encapsulating layer. The encapsulated molded article of claim 14, wherein the encapsulated molded article is an appearance member of a liquid crystal display (LCD). 24. The overmolded article of claim 23, wherein the appearance member is a function key panel of a liquid crystal display. The over-molded article according to claim n, wherein the thermoplastic rubber is a thermoplastic polyurethane (TPU). 26. As described in claim 14 of the Shenqing patent scope An overmolded molded article, wherein the thermoplastic adhesive is selected from the group consisting of polyethylene to polyethylene (polyethylene), polycarbonate, 1 酉 face, poly _, polybutylene terephthalate plastic (10) lybuthylenetherephthalate , PBT), polyetherketone etherketone ketone, polyetherketone ketone, polyphenylene ketone, polyphenylene sulfide, polyphenylene ether, polyphenylsulfonium sulfide, polysulfone, polyethersulfone, A group of polyimine, polyetherimide, polyamidimide, polyimine sulfone, thermoplastic polyurethane (TPU), and combinations of the foregoing. 27·—A type of encapsulated molded article, comprising: a polymer material having a bending strength of 9〇〇-i〇〇〇kg/cm2 formed by a mold; and a rubber layer disposed at the height via an overmold mold At least a portion of the surface of the molecular material, the rubberized layer is a thermoplastic adhesive. The encapsulated molded article according to claim 27, wherein the polymer material is poly carbonate (PC). The encapsulated article of claim 27, wherein the polymer material further comprises from 0.1 wt% to 30 wt% of the fiber, the fiber content being based on the total weight of the material. 30. The overmolded article of claim 29, wherein the fiber is an inorganic fiber. The encapsulated article of claim 30, wherein the inorganic fiber is asbestos, glass or carbon. 32. The encapsulated molded article according to claim 27, wherein the polymer material is acrylonitrile butadiene styrene (ABS) 〇 33, as claimed in claim 27 The encapsulated molded article, wherein the polymer material is poly(phenylene oxide, ΡΡΟ), polycarbonate (p〇ly carb〇nate, PC) or PC/ABS. 34. The overmolded article of claim 27, wherein the polymeric material further comprises a filler, a reinforcing agent, a processing aid, a flow promoter or a pigment. 35. The overmolded article of claim 27, wherein the thermoplastic rubber is a thermoplastic polyurethane (TPU). 36. The encapsulated molded article of claim 27, wherein the thermoplastic rubber is selected from polyethylene polyethylene terephthalate (polyethylene), polycarbonate, polyamine , polyketone I, polybutylene phthalate (PBT), polyetherketone etherketone ketone (polyetherketone etherketone ketone, 聚), polyetherketone ketone (ΡΕΚΚ), polyphenyl sulfide , polyphenylene ether, polyphenylsulfonium sulfide, polyhedral, polyether oxime, polyimine, polyether quinone imine, polyamidimide, polyimine hard, thermoplastic polyurethane A mixture of thermoplastic polyurethane, TPU), and a combination of the foregoing. 0801 -A31107TWF1 ;104006 13