HK1180882A - A pre-lamination core and method for making a pre-lamination core for electronic cards and tags - Google Patents

Description

Pre-laminated core and method for manufacturing pre-laminated core for electronic card and tag

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims priority to U.S. provisional application No. 61/320,969, filed on 5/4/2010.

Technical Field

Background

The present invention relates generally to the field of cards, and more particularly, to the field of pre-laminated cores for cards (e.g., smart cards, Identification (ID) cards, credit cards, lifestyle cards, etc.) and methods of making such pre-laminated cores.

Typically, cards are constructed by assembling several plastic sheets into a sandwich array. The card may contain any of one or more electronic components and/or other objects that may be desired or that enable the card to perform a number of functions.

European patent No. 0350179 discloses a smart card in which an electronic circuit is encapsulated in a layer of plastic material introduced between two surface layers of the card. The disclosed method further includes urging the high tensile strength retention member against a side of a mold, positioning an electronic component of the smart card relative to the side, and then injecting a reaction moldable polymeric material into the mold such that it encapsulates the electronic component.

European patent application No. 95400365.3 teaches a method for manufacturing a contactless smart card. The method uses a rigid frame to position and secure an electronic module in a void space between an upper thermoplastic sheet and a lower thermoplastic sheet. After mechanically securing the frame to the lower thermoplastic sheet, the void spaces are filled with a polymerizable resin material.

U.S. patent No. 5,399,847 teaches a credit card that is constructed of 3 layers, namely a first outer layer, a second outer layer, and an intermediate layer. The intermediate layer is formed by injecting a thermoplastic adhesive material that encases the smart card's electronic components (e.g., the IC chip and the antenna) in the intermediate layer material. The adhesive material is preferably made of a blend of copolyamides or a glue with two or more chemically reactive components, which harden upon contact with air. The outer layer of the smart card may be made of various polymeric materials, such as polyvinyl chloride or polyurethane.

U.S. patent No. 5,417,905 teaches a method for manufacturing a plastic credit card in which a mold consisting of two shells is closed to define a cavity for producing such cards. A marker or image support is placed in each mold shell. The mold shells are then brought together and thermoplastic material is injected into the mold to form the card. The inflowing plastic forces the indicia or image support against the corresponding mold surface.

U.S. patent No. 5,510,074 teaches a method of manufacturing a smart card having a card body with substantially parallel major sides, a support member with a graphic element on at least one side, and an electronic module including an array of contacts secured to a chip. The manufacturing method generally comprises the steps of: (1) placing the support member in a mold defining the volume and shape of the card; (2) holding the support member against the first major wall of the mold; (3) injecting a thermoplastic material into the volume defined by the hollow space so as to fill the portion of the volume not occupied by the support member; and (4) inserting the electronic module in place in the thermoplastic material before the injected material has had a chance to fully solidify.

U.S. patent No. 4,339,407 discloses an electronic circuit encapsulation device in the form of a carrier whose walls have a particular configuration of lands, grooves and bosses that combine particular apertures. The wall sections of the mold hold the circuit assembly in a given alignment. The walls of the carrier are made of a somewhat flexible material in order to facilitate the insertion of the electronic circuits of the smart card. The carrier can be inserted into an outer mold. This causes the walls of the carriers to approach each other so as to hold the assembly tightly in alignment during the injection of the thermoplastic material. The carrier has projections on the outside of the walls for mating with detents on the walls of the mold to position and secure the carrier within the mold. The mold also has holes that permit escape of trapped gas.

U.S. patent No. 5,350,553 teaches a method of creating a decorative pattern on a plastic card with an injection molding machine, and placing an electronic circuit therein. The method comprises the following steps: (a) introducing and placing a thin film (e.g., a film with a decorative pattern) over an open mold cavity of an injection molding machine; (b) closing the mold cavity so as to hold and clamp the film in place therein; (c) inserting an electronic circuit chip into the mold cavity through the aperture of the mold so as to position the chip in the cavity; (d) injecting a thermoplastic support composition into the mold cavity to form a unified card; (e) removing any excess material; (f) opening the mold cavity; and (g) removing the card.

U.S. patent No. 4,961,893 teaches a smart card that features a support element that supports an integrated circuit chip. The support member is used to position the chip inside the mold cavity. The card body is formed by injecting a plastic material into the cavity such that the chip is entirely embedded in the plastic material. In some embodiments, the edge regions of the support member are sandwiched between the load bearing surfaces of the respective molds. The support element may be a film that is peeled off of the finished card or it may be a sheet that remains as an integral part of the card. If the support member is a release film, any graphic elements contained therein are transferred and still visible on the card. Such graphic elements are formed on the surface of the support element and are therefore visible to the card user if the support element remains an integral part of the card.

5,498,388 teaches a smart card device including a card plate having a through opening. The semiconductor module is mounted on the opening. Injecting a resin into the opening so that the resin molding is formed under conditions that only the electrode terminal face is exposed for external connection of the semiconductor module. The card is completed by mounting a card plate having a through opening on a lower mold of two opposing molding dies, mounting a semiconductor module on the opening of the card plate, fastening an upper die having a gate leading to the lower die, and injecting a resin into the opening via the gate.

U.S. Pat. No. 5,423,705 teaches a disc having a disc body made of a thermoplastic injection molded material and a laminate integrally joined with the disc body. The laminate comprises a transparent outer leaf and a white opaque inner leaf. The imaging material is sandwiched between the leaves.

U.S. patent No. 6,025,054 discloses a method to construct a smart card that uses a low shrinkage glue to hold the electronic device during immersion of the device in a thermosetting material that becomes the core layer of the smart card.

Generally, all of the above methods involve the use of specialized equipment to assemble printed covers deposited on electronic devices. In view of this shortcoming, there is a need for a pre-lamination core that is self-sufficient and capable of being shipped to card manufacturing companies for incorporation into a variety of different electronic cards. Furthermore, there is a need to make pre-laminated cores capable of being incorporated into electronic cards with conventional card making equipment that coats a printed overlay and laminates to the pre-laminated core.

Disclosure of Invention

According to one embodiment of the present invention, a pre-laminated core for a card is provided. The pre-laminated core may include: a circuit or non-electronic component; a bottom cover sheet (wherein the bottom cover sheet comprises a heat seal material attached to a slide); a top cover sheet positioned over the circuit or non-electronic component (wherein the top cover sheet comprises a heat seal material attached to a carrier sheet); and a layer of thermoset material between the bottom cover sheet and the top cover sheet. The total thickness of the pre-laminated core without a carrier sheet may be less than 0.050 inches, or less than 0.010 inches.

According to another embodiment of the invention, a card is disclosed that includes a pre-laminated core, a top cover, and a bottom cover. The pre-laminated core may include: a circuit or non-electronic item attached to a bottom cover sheet (where the bottom cover sheet comprises a heat seal material attached to a carrier sheet); a top cover sheet positioned over the circuit or non-electronic item, wherein the top cover sheet comprises a heat seal material attached to a carrier sheet, and a layer of thermoset material between the bottom cover sheet and the top cover sheet. The top cover may be heat laminated to the top surface of the pre-laminated core, while the bottom cover may be heat laminated to the bottom surface of the pre-laminated core.

According to another embodiment of the present invention, a method for manufacturing a pre-laminated core is disclosed, comprising the steps of: providing a circuit or a non-electronic article; securing the circuit or non-electronic item to a bottom cover sheet, wherein the bottom cover sheet comprises a heat seal material attached to a carrier sheet; loading the circuit or non-electronic item and bottom cover sheet into an injection molding apparatus; loading a top cover sheet into the injection molding apparatus, wherein the top cover sheet comprises a heat seal material attached to a slide; and injecting a thermoset polymeric material between the top and bottom cover sheets.

According to yet another embodiment, a method for manufacturing a card is disclosed, comprising the steps of: providing a circuit or a non-electronic article; securing the circuit or non-electronic item to a bottom cover sheet, wherein the bottom cover sheet comprises a heat seal material attached to a carrier sheet; loading the circuit and non-electronic article with the bottom cover sheet into an injection molding apparatus; loading a top cover sheet positioned over the circuit and non-electronic items into the injection molding apparatus, wherein the top cover sheet comprises a heat seal material attached to a carrier sheet; injecting a thermoset polymeric material between the top and bottom cover sheets to make a pre-laminated core; removing the pre-lamination core from the injection molding apparatus; separating the carrier sheet from the heat seal material; and providing a top cover and a bottom cover for heat lamination to the pre-laminated core.

In one embodiment, a method of making a card includes placing the pre-laminated core between the top cover and the bottom cover to make an assembly, placing the assembly in a lamination press, and performing a thermal lamination process of the assembly.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention as claimed.

Drawings

These and other features, aspects, and advantages of the present invention will become apparent from the following description, appended claims, and the accompanying exemplary embodiments shown in the drawings.

FIG. 1(a) shows a cross-sectional view of a pre-laminated core for a card according to an embodiment of the invention.

FIG. 1(b) shows a cross-sectional view of a pre-laminated core for a card according to an embodiment of the invention.

Figure 2(a) shows a cross-sectional view of a card having a pre-laminated core according to an embodiment of the invention.

FIG. 2(b) shows a cross-sectional view of a card having a pre-laminated core according to an embodiment of the invention.

Fig. 3(a) shows a cross-sectional view of an electronic pre-lamination core and a nozzle used to inject a thermoset material between the top and bottom cover sheets.

Figure 3(b) shows a cross-sectional view of an electronic pre-lamination core and a nozzle used to inject a thermoset material between the top and bottom cover sheets.

FIG. 4 shows a top view of an assembly including a pre-laminated core, a top cover, and a bottom cover in a lamination press according to an embodiment of the invention.

FIG. 5 is a flow diagram for manufacturing a pre-laminated core according to one embodiment.

Detailed Description

According to one embodiment of the present invention, as shown in fig. 1(a) and 2(a), the pre-laminated core 1 may comprise an electronic circuit 100, a bottom cover sheet 40 comprising a layer of heat seal material 104 attached to the bottom of the electronic circuit 100, and a top cover sheet 30 comprising a layer of heat seal material 102 over the electronic circuit 100. According to another embodiment, fig. 1(b) shows a pre-laminated core 1 comprising a non-electronic article 110, instead of an electronic circuit 100.

As can be seen in fig. 2(a), the pre-laminated core 1 with electronic circuit 100 may include a circuit board 10, a plurality of circuit components 20a-20c, a layer of thermoset material 50, a top cover sheet 30, and a bottom cover sheet 40, according to one embodiment. According to one embodiment, the circuit board 10 has a top surface and a bottom surface. According to one embodiment of the present invention, the circuit board 10 may be a double-sided type. Thus, the circuit board 10 may be configured to accommodate a plurality of circuit traces 14 (shown in fig. 4) on both the top and bottom surfaces. The circuit traces 14 are configured to operatively connect a plurality of circuit components 20a-20c secured to the circuit board 10. The circuit traces 14 are electrically connected to a plurality of circuit components 20a-20c so that they can perform electrical functions within the electronic card 1. The circuit board 10 is constructed of any conventional material suitable for receiving electronic circuitry. For example, the circuit board 10 may be constructed of a flame retardant laminate with a reinforced glass fabric epoxy. This material is also known as FR-4 board. Alternatively, the circuit board 10 may be constructed of a plastic compound suitable for receiving conductive ink (e.g., polyester).

For exemplary purposes only, the plurality of circuit components 20a-20c may be one of a battery, an LED, a button, or a switch. In addition, any or all of these circuit components may be incorporated into circuit board 10. Further, the additional circuit components 20a-20c may include (but are not limited to): microprocessor chip, speaker, a plurality of LED, flexible display, RFID antenna and emulation ware.

According to one embodiment and as shown in fig. 2(b), the pre-laminated core 1 comprises a non-electronic object 110 instead of the circuit 100. The bottom cover sheet 40 may be attached to the bottom of the printed circuit board 10 or the non-electronic article 110 by any of a variety of known methods. Preferably, the bottom cover sheet is attached to the printed circuit board 10 or the non-electronic article 110 with a spray adhesive. According to one embodiment, the adhesive may be any type of suitable adhesive, such as a pressure sensitive adhesive, a heat activated adhesive, a chemically activated adhesive, and the like. The adhesive may take a variety of forms, such as a tape, a film, or as a spray. The top cover sheet 30 is disposed over the top surface of the printed circuit board 10 or the non-electronic article 110. The top cover sheet 30 includes a top layer of heat seal material 102 attached to a polyethylene 106 carrier sheet. Preferably, the heat seal material is coated on the slide. The bottom cover sheet 40 includes a bottom layer of heat seal material 104 attached to a polyethylene 106 carrier. Preferably, the polyethylene carrier sheets are attached to the heat seal materials 102, 104 such that they loosely bond the heat seal materials 102, 104. According to one embodiment, the slide 106 may be constructed of paper with any of a silicone or wax coating, polypropylene, polycarbonate, or polyethylene. The heat seal materials 102, 104 are typically adhesive coated films. Preferably, the heat seal materials 102, 104 are aliphatic polyester waterborne polyurethane bond coat films that provide adhesion to a variety of materials, including (but not limited to): ethylene, polyesters, polyolefins, and the like. Further, the heat seal materials 102, 104 may be any of the following: w31 paint, W35 paint, W39 paint or W45 paint manufactured by Waytek corporation.

As shown in fig. 2(a) -2(b), the layer of thermoset material 50 is positioned between the top cover sheet 30 and the bottom cover sheet 40. In fig. 2(a), the thermosetting material layer 50 encloses the electronic circuit 100. In fig. 2(b), the thermoset material layer 50 encloses the non-electronic component 110. The layer of thermoset material 50 is preferably comprised of a thermoset polymeric material. For example, the thermoset material layer 50 may be comprised of polyurea.

Polyureas are known elastomers derived from the reaction product of an isocyanate component and a resin blend component. The isocyanate may be aromatic or aliphatic in nature. It may be any variation of monomers, polymers, or isocyanates, prepolymers or prepolymers. The prepolymer or quasi-prepolymer may be made from an amine-terminated polymer resin or a hydroxyl-terminated polymer resin. The resin blend must be composed of an amine-terminated polymer resin and/or an amine-terminated chain extender. The amine-terminated polymeric resin does not have any intentional hydroxyl moieties. Any hydroxyl groups are the result of incomplete conversion to amine-terminated polymer resins. The resin blend may also contain additives or non-primary ingredients. These additives may contain hydroxyl groups, such as predispersed pigments in a polyol carrier. Typically the resin blend will not contain a catalyst.

The use of a polyurea formulation (e.g., pure polyurea) as the thermoset material layer 50 allows the pre-laminated core 100 to withstand the thermal lamination temperatures used in the thermal lamination process when adding the top and bottom coverings to the pre-laminated core 100 to form the pre-laminated core 1. Such thermal lamination temperatures may include a range of 250 to 300 ° F.

The components shown generally in fig. 1(a) -3(b) may vary in thickness and length. For example, the thickness of the pre-laminated core 1 may be less than 0.03 inches. However, the total thickness of the pre-laminated core 1 is preferably between 0.016 and 0.028 inches. These dimensions thus allow the pre-laminated core 1 to be compatible with conventional equipment used by financial card certification authorities, which will laminate the bottom and top covers of a particular product to the heat seal materials 102 and 104.

Specifically, to manufacture cards that conform to the ISO 07816 standard, the thickness of the finished card cannot exceed 0.033 inches (or 0.76 millimeters). Therefore, the thickness of the top and bottom coverings used by the financial certification business and the thickness of the pre-laminated core 1 cannot be considered to be independent of each other. For example, if the top and bottom covers used by a financial certification business are 0.007 inches thick, the thickness of the pre-laminated core 1 cannot exceed 0.019 inches. However, if the top or bottom cover is less than 0.007 inches thick, the thickness of the electronic pre-laminate core 1 can be greater as long as the top and bottom covers do not combine with the thickness of the pre-laminate core 1 by more than 0.033 inches.

A method for manufacturing an electronic pre-laminated core 1 according to the invention will now be described with reference to fig. 5.

First, in step 300, a circuit board 10 is provided that may include a plurality of components 20a-20 c. The circuit board 10 has a top surface and a bottom surface. In the alternative and as shown in fig. 1(b), 2(b), and 3(b), a non-electronic article 110, such as a medallion, badge, decorative design, or other non-electronic article, may be provided.

Next, in step 305, the bottom surface of the circuit board 10 is fixed to the bottom cover sheet 40. Preferably, a spray adhesive is used to attach the bottom surface of the circuit board to the bottom cover sheet 30. According to another embodiment, the non-electronic article 110 is secured to the bottom cover sheet 40 using an adhesive, preferably a spray-on adhesive. According to one embodiment, the spray adhesive may be a cyanoacrylate.

In step 310, the circuit board 10 attached to the bottom cover sheet 40 or the non-electronic article 110 attached to the bottom cover sheet 40 is then loaded into the injection molding apparatus as one complete sheet. In step 315, the top cover sheet 30 is placed into the injection molding apparatus and positioned such that the top cover sheet 30 is over the top surface of the circuit board 10 or the non-electronic article 110 and the bottom cover sheet 40. In particular, the injection molding apparatus may be a reaction injection molding machine (often individually referred to as "RIM").

The injection molding apparatus is closed and then in step 320, a thermosetting polymeric material is injected between the top cover sheet 30 and the circuit board 10 or the non-electronic article 110 attached to the bottom cover sheet 40 via the nozzle 60 (shown in fig. 3(a) -3 (b)) under low temperature and low pressure forming conditions, and the bottom cover sheet 30 forms the thermosetting material layer 50 from the thermosetting polymeric material. Preferably, the thermoset polymeric material may be polyurea, as described above, but other suitable materials may be used.

The formation conditions of low temperature and low pressure generally mean the formation conditions of the following cases: wherein the thermoset polymeric material has a temperature less than the heat distortion temperature of the top and bottom cover sheets 30 and 40 and the circuit board 10 or the non-electronic article 110 attached to the bottom cover sheet 40 and a pressure less than about 500 pounds per square inch (psi). Preferably, the low temperature forming temperature will be at least 100 ° F, which is less than the heat distortion temperature of the top and bottom cover-sheets 30 and 40 and the circuit board 10 or the non-electronic article 110 attached to the bottom cover-sheet 40.

A more preferred low temperature, low pressure forming procedure, according to one embodiment of the present invention, will involve injecting a thermosetting polymeric material at a temperature in the range of about 100F to about 160F at a pressure in the range of about one atmosphere to about 500 psig with a preferred pressure.

After the thermoset polymeric material is injected, the molded structure is removed from the injection molding apparatus in step 325. In step 330, for each of the top and bottom cover sheets 30, 40, the polyethylene carrier sheet 106 is removed from the top and bottom layers of heat seal material 102, 104, respectively. According to one embodiment of the invention, several pre-laminated cores 1 are formed in one profiled sheet 202. Fig. 4 depicts several pre-laminated cores 1 formed in one sheet 202. According to other embodiments, the injection sheet may correspond to a single pre-laminated core 1, a single stripe or row of pre-laminated cores 1, or an array of pre-laminated cores 1. For example, an injection sheet may include 3 rows of 7 pre-laminated cores 1, which allows existing card manufacturers to produce electronic cards with existing equipment and processes in which they are currently used.

The sheets 202 of pre-laminated core 1 may then be shipped to a card manufacturer where the top and bottom covers are applied to the sheets 202 of pre-laminated core 1 to form a card. The top and bottom coverings may be constructed of any suitable material, but are preferably constructed of polyvinyl chloride (PVC) or similar material. According to one embodiment of the invention, the surface of the cover has printed information. For example, the overlay may include printed information conforming to a standard credit card, including a name, expiration date, and account number.

According to another embodiment of the invention, the top and bottom covers may be clear or "2/5 clear/white printed". By "2/5 clear/white print" is meant that the covering includes a 0.005 "printed white PVC layer and a 0.002" clear laminate over the printed surface of the 0.005 "layer. Of course, other types of coverings may be used, such as a printed white PVC layer having a thickness of less than 0.005 "and/or a clear laminate having a thickness of less than 0.002".

The card manufacturer may receive the sheet 202 of pre-laminated core 1 and attach its top and bottom coverings to the sheet 202 of pre-laminated core 1 using a thermal lamination process. The layers of heat seal material 102, 104 help to attach the thermal lamination process to the cover. Therefore, due to the reduced equipment costs, for example, companies producing credit cards can easily manufacture electronic cards in a more cost-effective manner.

From the disclosure of the present invention, those skilled in the art will appreciate that there are other embodiments and modifications within the scope and spirit of the present invention. Accordingly, all modifications attainable by one versed in the art from the present invention within the scope and spirit of the present invention are to be included as further embodiments of the present invention. The scope of the invention should be defined by what is set forth in the following claims.

Claims (21)

1. A pre-laminated core comprising:

a circuit board having a top surface and a bottom surface;

a plurality of circuit components attached to the top surface of the circuit board;

a bottom cover sheet attached to the bottom surface of the circuit board, wherein the bottom cover sheet comprises a heat seal material attached to a carrier sheet;

a top cover sheet positioned over the top surface of the circuit board, wherein the top cover sheet comprises a heat seal material attached to a carrier sheet; and

a layer of thermoset material between the bottom cover sheet and the top cover sheet.

2. The pre-lamination core of claim 1, wherein the heat seal material of the top cover sheet is located between the carrier sheet of the top cover sheet and the plurality of circuit components, and the heat seal material of the bottom cover sheet is located between the carrier sheet of the bottom cover sheet and the circuit board.

3. The pre-laminated core of claim 1, wherein the total thickness of the pre-laminated core is less than 0.050 inches.

4. The pre-laminated core of claim 1, wherein the total thickness of the pre-laminated core is greater than 0.010 inches when the carrier sheet is removed.

5. The pre-laminated core of claim 1, wherein the thermoset material layer comprises polyurea.

6. The pre-laminated core of claim 1, wherein the thermoset material can withstand between 150 ° and 320 ° F

And (4) heat lamination process temperature.

7. A card, comprising:

a pre-laminated core comprising:

a circuit board having a top surface and a bottom surface;

a plurality of circuit components attached to the top surface of the circuit board;

a bottom cover sheet attached to the bottom surface of the circuit board, wherein the bottom cover sheet comprises a heat seal material attached to a carrier sheet;

a top cover sheet positioned over the top surface of the circuit board, wherein the top cover sheet comprises a heat seal material attached to a carrier sheet; and

a layer of thermoset material between the bottom cover sheet and the top cover sheet;

a top cover thermally laminated to a top surface of the pre-laminated core; and

a bottom cover thermally laminated to a bottom surface of the pre-laminated core.

8. The card of claim 7, wherein the heat seal material of the top cover sheet is located between the carrier sheet of the top cover sheet and the plurality of circuit components, and the heat seal material of the bottom cover sheet is located between the carrier sheet of the bottom cover sheet and the circuit board.

8. The pre-laminated core of claim 7, wherein the total thickness of the pre-laminated core is less than 0.050 inches.

9. The pre-laminated core of claim 7, wherein the total thickness of the pre-laminated core is greater than 0.010 inches when the carrier sheet is removed.

10. The electronic card of claim 7, wherein the layer of thermosetting material comprises polyurea.

11. The electronic card of claim 7, wherein the thermoset material can withstand thermal lamination process temperatures between 150 ° to 320 ° F.

12. A method for making a pre-laminated core, comprising:

providing a circuit board having a top surface and a bottom surface;

securing a plurality of circuit components to the top surface of the circuit board;

securing the bottom surface of the circuit board to a bottom cover sheet using an adhesive, wherein the bottom cover sheet comprises a heat seal material attached to a carrier sheet;

loading the circuit board and bottom cover sheet into an injection molding apparatus;

loading a top cover sheet positioned over a top surface of the circuit board into the injection molding apparatus, wherein the top cover sheet comprises a heat seal material attached to a carrier sheet;

injecting a thermoset polymeric material between the top and bottom cover sheets to form the pre-laminated core; and

removing the pre-lamination core from the injection molding apparatus; and

separating the carrier sheet from the heat seal material of the top and bottom cover sheets.

13. A method for manufacturing a card, comprising:

providing a circuit board having a top surface and a bottom surface;

securing a plurality of circuit components to the top surface of the circuit board;

securing the bottom surface of the circuit board to a bottom cover sheet using an adhesive, wherein the bottom cover sheet comprises a heat seal material attached to a carrier sheet;

loading the circuit board and bottom cover sheet into an injection molding apparatus;

loading a top cover sheet positioned over a top surface of the circuit board into the injection molding apparatus, wherein the top cover sheet comprises a heat seal material attached to a carrier sheet;

injecting a thermoset polymeric material between the top and bottom cover sheets to form the pre-laminated core; and

removing the pre-lamination core from the injection molding apparatus;

separating the carrier sheet from the heat seal material of the top and bottom cover sheets; and

a top cover and a bottom cover are provided for heat lamination to the pre-laminated core.

14. The method of claim 13 wherein the thermoset polymeric material comprises polyurea.

15. The method of claim 13, further comprising:

placing the pre-laminated core between the top cover and the bottom cover to make an assembly;

placing the assembly into a laminator; and

a thermal lamination process is performed on the assembly.

16. A pre-laminated core comprising:

a non-electronic object;

a bottom cover sheet attached to a bottom surface of the non-electronic item, wherein the bottom cover sheet comprises a heat seal material attached to a slide;

a top cover sheet positioned over a top surface of the non-electronic item, wherein the top cover sheet comprises a heat seal material attached to a slide; and

a layer of thermoset material between the bottom cover sheet and the top cover sheet.

17. The pre-laminated core of claim 16, wherein the heat seal material of the top cover sheet is located between the carrier sheet of the top cover sheet and the non-electronic item, and the heat seal material of the bottom cover sheet is located between the carrier sheet of the bottom cover sheet and the non-electronic item.

18. A card, comprising:

a pre-laminated core comprising:

a non-electronic object;

a bottom cover sheet, wherein the non-electronic item is attached to a top surface of the bottom cover sheet, wherein the bottom cover sheet comprises a heat seal material attached to a slide;

a top cover sheet positioned over the non-electronic item, wherein the top cover sheet comprises a heat seal material attached to a slide; and

a layer of thermoset material between the bottom cover sheet and the top cover sheet;

a top cover thermally laminated to a top surface of the pre-laminated core; and

a bottom cover thermally laminated to a bottom surface of the pre-laminated core.

19. The card of claim 18, wherein the heat seal material of the top cover sheet is located between the carrier sheet of the top cover sheet and the non-electronic item, and the heat seal material of the bottom cover sheet is located between the carrier sheet of the bottom cover sheet and the non-electronic item.

20. A method for making a pre-laminated core, comprising:

providing a non-electronic object;

securing the non-electronic item to a bottom cover sheet using an adhesive, wherein the bottom cover sheet comprises a heat seal material attached to a carrier sheet;

loading the non-electronic article and bottom cover sheet into an injection molding apparatus;

loading a top cover sheet positioned over a top surface of the circuit board into the injection molding apparatus, wherein the top cover sheet comprises a heat seal material attached to a carrier sheet;

injecting a thermoset polymeric material between the top and bottom cover sheets to form the pre-laminated core;

removing the pre-lamination core from the injection molding apparatus; and

separating the carrier sheet from the heat seal material of the top and bottom cover sheets.

21. A method for manufacturing a card, comprising:

providing a non-electronic object;

securing the non-electronic item to a bottom cover sheet using an adhesive, wherein the bottom cover sheet comprises a heat seal material attached to a carrier sheet;

loading the non-electronic article and bottom cover sheet into an injection molding apparatus;

loading a top cover sheet positioned over a top surface of the non-electronic item into the injection molding apparatus, wherein the top cover sheet comprises a heat seal material attached to a slide;

injecting a thermoset polymeric material between the top and bottom cover sheets to form the pre-laminated core;

removing the pre-lamination core from the injection molding apparatus;

separating the carrier sheet from the heat seal material of the top and bottom cover sheets; and

a top cover and a bottom cover are provided for heat lamination to the pre-laminated core.