CN104812166B - A kind of reflective heat conduction metal-based pcb board manufacture method - Google Patents
A kind of reflective heat conduction metal-based pcb board manufacture method Download PDFInfo
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- 229910052751 metal Inorganic materials 0.000 title claims abstract description 79
- 239000002184 metal Substances 0.000 title claims abstract description 79
- 238000000034 method Methods 0.000 title claims abstract description 49
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 26
- 239000000758 substrate Substances 0.000 claims abstract description 36
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 22
- 229910052709 silver Inorganic materials 0.000 claims description 22
- 239000004332 silver Substances 0.000 claims description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 17
- 229910052802 copper Inorganic materials 0.000 claims description 17
- 239000010949 copper Substances 0.000 claims description 17
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 10
- 229910052782 aluminium Inorganic materials 0.000 claims description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 9
- 230000003064 anti-oxidating effect Effects 0.000 claims description 8
- 238000007747 plating Methods 0.000 claims description 8
- 239000000919 ceramic Substances 0.000 claims description 7
- 238000002310 reflectometry Methods 0.000 claims description 7
- JRBRVDCKNXZZGH-UHFFFAOYSA-N alumane;copper Chemical compound [AlH3].[Cu] JRBRVDCKNXZZGH-UHFFFAOYSA-N 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 239000002131 composite material Substances 0.000 claims description 6
- 238000005524 ceramic coating Methods 0.000 claims description 5
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 4
- 238000009713 electroplating Methods 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 230000001680 brushing effect Effects 0.000 claims description 2
- 238000007598 dipping method Methods 0.000 claims description 2
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 claims description 2
- 238000005507 spraying Methods 0.000 claims description 2
- 238000004544 sputter deposition Methods 0.000 claims description 2
- 238000007772 electroless plating Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 52
- 239000000463 material Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000011241 protective layer Substances 0.000 description 3
- 239000013078 crystal Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000003223 protective agent Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000011324 bead Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000001579 optical reflectometry Methods 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Led Device Packages (AREA)
Abstract
本发明涉及了一种反光导热金属基PCB板制造方法，通过在反光性良好的金属基板上附着导热非吸光绝缘层，从而得到反光性能良好的导热PCB板，解决LED照明行业PCB板的导热、反光问题，极大提高LED产品的出光效率。
The invention relates to a method for manufacturing a reflective and heat-conducting metal-based PCB board. By attaching a heat-conducting and non-light-absorbing insulating layer on a metal substrate with good reflective properties, a heat-conducting PCB board with good reflective performance is obtained, which solves the problems of heat conduction and heat conduction of PCB boards in the LED lighting industry. Reflective problems, greatly improving the light efficiency of LED products.
Description
技术领域technical field
本发明涉及金属基PCB板的制造方法，尤其涉及一种反光导热金属基PCB板制造方法以及使用该方法所制造的反光导热金属基PCB板。The invention relates to a method for manufacturing a metal-based PCB, in particular to a method for manufacturing a reflective and heat-conducting metal-based PCB and a reflective and heat-conducting metal-based PCB manufactured by the method.
背景技术Background technique
目前，许多大功率LED光源，因散热问题均会选择热传导好的基板，例如镜面铝PCB板、镜面铜PCB板、陶瓷基PCB板等。 虽然陶瓷基PCB板能满足大功率LED器件的散热、绝缘要求，但其反射率太低。目前国内陶瓷反射率只能做到85%-93%；国外陶瓷反射率能做到接近95%，但仍达不到镜面铝、镜面铜基板98%以上的反射率。At present, many high-power LED light sources will choose substrates with good heat conduction due to heat dissipation problems, such as mirror aluminum PCB boards, mirror copper PCB boards, ceramic substrate PCB boards, etc. Although the ceramic-based PCB board can meet the heat dissipation and insulation requirements of high-power LED devices, its reflectivity is too low. At present, the reflectance of domestic ceramics can only be 85%-93%; the reflectance of foreign ceramics can be close to 95%, but it still cannot reach the reflectance of mirror aluminum and mirror copper substrates above 98%.
发明内容Contents of the invention
本发明要解决的技术问题是提供一种光反射率高、热传导率高的反光导热金属基PCB板的制造方法。The technical problem to be solved by the present invention is to provide a method for manufacturing a reflective and heat-conducting metal-based PCB board with high light reflectivity and high thermal conductivity.
一种反光导热金属PCB板制造方法，包括以下步骤：1）准备反光A method for manufacturing a reflective heat-conducting metal PCB, comprising the following steps: 1) preparing reflective
金属基板；2）在反光金属基层附着导热非吸光绝缘层；3）在绝缘层上做印制电路；4）分割反光导热金属基PCB板；5）涂覆导热绝缘层。Metal substrate; 2) Attach a heat-conducting non-light-absorbing insulating layer to the reflective metal base; 3) Make a printed circuit on the insulating layer; 4) Split the reflective and heat-conducting metal-based PCB board; 5) Coat the heat-conducting insulating layer.
上述的一种反光导热金属基PCB板制造方法，其中：所述的反光金属基板为镜面铝、镜面铜或镜面铜铝复合板等。The above-mentioned method for manufacturing a reflective and heat-conducting metal-based PCB, wherein: the reflective metal substrate is mirror-finished aluminum, mirror-finished copper, or a mirror-finished copper-aluminum composite board.
上述的一种反光导热金属基PCB板制造方法，其中：所述反光金属The above-mentioned method for manufacturing a reflective and heat-conducting metal-based PCB, wherein: the reflective metal
基板的镜面层是采用真空镀工艺获得。The mirror layer of the substrate is obtained by vacuum plating process.
上述的一种反光导热金属基PCB板制造方法，其中：所述基板反光The above-mentioned method for manufacturing a reflective and heat-conducting metal-based PCB, wherein: the substrate is reflective
层可由电镀工艺获得。Layers can be obtained by electroplating processes.
上述的一种反光导热金属基PCB板制造方法，其中：所述的反光金属基板的镜面表层有防氧化的保护层。The above-mentioned method for manufacturing a reflective and heat-conducting metal-based PCB board, wherein: the mirror surface layer of the reflective metal substrate has an anti-oxidation protective layer.
上述的一种反光导热金属基PCB板制造方法，其中：所述的绝缘层为透光性能、反光性能及导热性能良好的绝缘层。The above-mentioned method for manufacturing a reflective and heat-conducting metal-based PCB board, wherein: the insulating layer is an insulating layer with good light transmission performance, light reflection performance and thermal conductivity.
上述的一种反光导热金属基PCB板制造方法，其中：所述的绝缘层The above-mentioned method for manufacturing a reflective and heat-conducting metal-based PCB, wherein: the insulating layer
可以通过真空镀、喷涂、刷涂、浸涂等工艺获得。It can be obtained by vacuum plating, spraying, brushing, dipping and other processes.
上述的一种反光导热金属基PCB板制造方法，其中：所述的绝缘层The above-mentioned method for manufacturing a reflective and heat-conducting metal-based PCB, wherein: the insulating layer
为纳米陶瓷涂层或陶瓷镀层。It is nano-ceramic coating or ceramic coating.
上述的一种反光导热金属基PCB板制造方法，其中：所述的印刷电The above-mentioned method for manufacturing a reflective and heat-conducting metal-based PCB, wherein: the printed circuit board
路的导体可以是通过真空镀、化学镀以及粘贴工艺获得。The conductor of the circuit can be obtained by vacuum plating, chemical plating and pasting process.
上述的一种反光导热金属基PCB板制造方法，其中：所述的分割后The above-mentioned method for manufacturing a reflective and heat-conducting metal-based PCB, wherein: after the division
的反光导热金属基PCB板可再涂覆导热绝缘涂层。The reflective heat-conducting metal-based PCB board can be coated with heat-conducting insulating coating.
本发明是在反光金属基板的反光面，附着一层导热非吸光绝缘层，再在绝缘层上生成印制电路。反光金属基板的反光面可以反射穿过绝导热非吸光绝缘层的光，使反光导热金属基PCB板的反射率提高。且工艺简单，操作方便，可以实现批量化生产，满足日益增长的市场需求。In the invention, a layer of heat-conducting and non-light-absorbing insulating layer is attached to the reflective surface of the reflective metal substrate, and then a printed circuit is formed on the insulating layer. The reflective surface of the reflective metal substrate can reflect the light passing through the heat-conducting and non-light-absorbing insulating layer, so that the reflectivity of the reflective and heat-conducting metal-based PCB board can be improved. Moreover, the process is simple, the operation is convenient, mass production can be realized, and the increasing market demand can be met.
附图说明]Description of drawings]
为了便于说明，本发明由下述较佳的实施案例及附图作以详细描述。For ease of illustration, the present invention is described in detail by the following preferred implementation examples and accompanying drawings.
图1为本发明实施例一反光导热金属基PCB板的制造方法流程图。FIG. 1 is a flowchart of a method for manufacturing a reflective and heat-conducting metal-based PCB according to an embodiment of the present invention.
图2所示是本发明实施例一 反光导热金属基PCB板的主视图。Figure 2 is a front view of a reflective and heat-conducting metal-based PCB according to Embodiment 1 of the present invention.
图3所示是本发明实施例一 反光导热金属基PCB板的剖视图。Fig. 3 is a cross-sectional view of a light-reflecting and heat-conducting metal-based PCB board according to Embodiment 1 of the present invention.
图4所示是本发明实施例三 反光导热金属基PCB板的剖视图。FIG. 4 is a cross-sectional view of a light-reflecting and heat-conducting metal-based PCB board according to Embodiment 3 of the present invention.
图5为本发明实施例二、三反光导热金属基PCB板的制造方法流程图。Fig. 5 is a flow chart of the manufacturing method of the light-reflecting and heat-conducting metal-based PCB in the second and third embodiments of the present invention.
附图中的标号说明Explanation of symbols in the attached drawings
21、31反光金属基板 41反光金属基板的铝层 210、310、410印刷电路 213、311、411阻焊层 211、312、412导热非吸光绝缘层 313、413防氧化层 314、414反光镜面银层 415反光金属基板的铜层 315、416导热的绝缘层21, 31 Reflective metal substrate 41 Aluminum layer of reflective metal substrate 210, 310, 410 Printed circuit 213, 311, 411 Solder resist layer 211, 312, 412 Thermally conductive non-light-absorbing insulating layer 313, 413 Anti-oxidation layer 314, 414 Reflective mirror silver Layer 415 Copper layer 315, 416 Thermally conductive insulating layer of reflective metal substrate
[具体实施方式] [detailed description]
实施案例一Implementation Case 1
图1给出了本发明的一种反光导热金属基PCB板制造方法的流程图，图2、图3给出了由本发明制造的反光导热金属基PCB板的结构，下面结合附图1、2、3予以具体说明:Fig. 1 has provided the flow chart of a kind of reflective heat conduction metal base PCB board manufacturing method of the present invention, Fig. 2, Fig. 3 have provided the structure of the reflective heat conduction metal base PCB board manufactured by the present invention, below in conjunction with accompanying drawing 1,2 , 3 to give specific instructions:
如图1 所示，一种反光导热金属基PCB板的制造方法具体流程如下：1）准备反光金属基板21、31；2）附着绝缘层211、312；3）形成印制电路210、310；4）分割成型；5）涂覆导热绝缘层315。（见附图2、3）As shown in Figure 1, the specific process of manufacturing a reflective and heat-conducting metal-based PCB board is as follows: 1) preparing reflective metal substrates 21, 31; 2) attaching insulating layers 211, 312; 3) forming printed circuits 210, 310; 4) Segmentation and molding; 5) Coating a thermally conductive insulating layer 315 . (see attached drawings 2 and 3)
在 1）中，反光金属基板是有防氧化层的镜面铝板，为了达到良好的反光、导热效果，金属基材要用反光率达到98%的镜面铝板。In 1), the reflective metal substrate is a mirror aluminum plate with an anti-oxidation layer. In order to achieve good reflection and heat conduction effects, the metal substrate should use a mirror aluminum plate with a reflectivity of 98%.
在 2）中，在反光率98%的镜面铝基板的镜面真空蒸镀一层导热非In 2), a layer of thermally conductive non
吸光的纳米陶瓷层，厚度控制在10-150um之间；透过导热非吸光绝缘层的光一部份由绝缘层反射回去，另一部份光穿过绝缘层，由镜面铝基板的镜面反射回去；由此反光导热金属基PCB板的反射率得以提高，反射率达到98%以上。The thickness of the light-absorbing nano-ceramic layer is controlled between 10-150um; part of the light passing through the heat-conducting non-light-absorbing insulating layer is reflected back by the insulating layer, and the other part of the light passes through the insulating layer and is reflected back by the mirror surface of the mirror aluminum substrate ; As a result, the reflectivity of the reflective and heat-conducting metal-based PCB board can be improved, and the reflectivity can reach more than 98%.
在 3）中，在镜面上的绝缘层表面做印刷电路。通过真空溅镀工In 3), a printed circuit is made on the surface of the insulating layer on the mirror. Vacuum sputtering
艺形成２００-５００埃的导电镍层，再在镍层上电镀铜至１５-２０um；再通过图形转移，在铜层上形成设计所需的印制电路；然后在印制电路表面印刷10-15um的阻焊层，最后在形成电路的PCB板的导体表面做化镍金处理，镍层厚镀为100-150 u″,金层厚度为2-5u″,以保证LED灯珠打线及焊接的工艺需求。A conductive nickel layer of 200-500 angstroms is formed by the process, and copper is electroplated on the nickel layer to 15-20um; then, the printed circuit required for the design is formed on the copper layer through pattern transfer; and then printed on the surface of the printed circuit 10- 15um solder resist layer, and finally do nickel-gold treatment on the conductor surface of the PCB board forming the circuit. The thickness of the nickel layer is 100-150 u″, and the thickness of the gold layer is 2-5u″, so as to ensure the wiring of LED lamp beads and Welding process requirements.
在 4）中，通过自动V-CUT 机，分割已形成印制电路的反光导热金属基PCB板，切割金属基PCB板深度控制在反光导热金属基PCB板厚度的1/3；In 4), through the automatic V-CUT machine, the reflective heat-conducting metal-based PCB board that has formed the printed circuit is divided, and the cutting depth of the metal-based PCB board is controlled at 1/3 of the thickness of the reflective heat-conducting metal-based PCB board;
在 5）中，在切割后的反光导热金属基PCB板金属部份，涂覆导热性能优异的纳米陶瓷涂料，以提高反光导热金属基PCB板的绝缘性能。In 5), the metal part of the reflective heat-conducting metal-based PCB board after cutting is coated with a nano-ceramic coating with excellent thermal conductivity to improve the insulation performance of the reflective heat-conducting metal-based PCB board.
本实施例提供的一种反光导热金属基PCB板制造方法，通过在有反光性良好的金属基板上附着导热非吸光绝缘层，从而得到反光性能良好的反光导热金属基PCB板，其反光率达到98%以上；解决了LED照明行业PCB板的反光问题，极大提高LED产品的出光效率。This embodiment provides a method for manufacturing a reflective and heat-conducting metal-based PCB board. By attaching a heat-conducting non-light-absorbing insulating layer on a metal substrate with good reflective properties, a reflective and heat-conducting metal-based PCB board with good reflective performance is obtained. More than 98%; it solves the reflection problem of PCB board in LED lighting industry, and greatly improves the light output efficiency of LED products.
实施案例二Implementation Case 2
图2、3同时还给出了本发明一种反光导热金属基PCB板制造方法的第二个具体实施案例，图5给出了本发明一种反光导热金属基PCB板的另一个制程方法流程图，下面结合附图2、3、5对其方法进行具体说明。Figures 2 and 3 also show the second specific implementation case of a method for manufacturing a reflective and heat-conducting metal-based PCB board of the present invention, and Figure 5 shows another process method flow for a reflective and heat-conducting metal-based PCB board of the present invention Figure, below in conjunction with accompanying drawing 2,3,5 its method is described in detail.
本实施例二与前述实施例一的区别在于反光金属基板的材质不同：The difference between the second embodiment and the first embodiment is that the material of the reflective metal substrate is different:
如图3所示，反光金属基板是紫铜板，紫铜板的热传导率达到300W/M.K以上。加工步骤如下：步骤1）准备一张紫铜板31；步骤2）在紫铜板的表面镀银314，再在银表面做防氧化处理313；余下作业步骤与实施案例一的3-5步骤相同（见附图3、5）。As shown in Figure 3, the reflective metal substrate is a copper plate, and the thermal conductivity of the copper plate is above 300W/M.K. The processing steps are as follows: step 1) prepare a red copper plate 31; step 2) plate silver 314 on the surface of the red copper plate, and then perform anti-oxidation treatment 313 on the silver surface; the remaining operation steps are the same as steps 3-5 of the implementation case 1 ( See attached drawings 3 and 5).
在步骤1）中，金属基板是厚1.2mm紫铜板，这样的金属基板热传导率很好，很大程度的提高了PCB板的导热性能。In step 1), the metal substrate is a copper plate with a thickness of 1.2 mm. Such a metal substrate has a good thermal conductivity, which greatly improves the thermal conductivity of the PCB board.
在步骤2）中，为了达到良好的反光效果，在紫铜板上的固晶区镀In step 2), in order to achieve a good reflective effect, the crystal-bonding area on the copper plate is plated with
上80-100u″的银层，银镀层区比固晶区单边大0.2mm,银层的反光率必须达到98%以上；再在银反光层表面做防氧化处理，形成一层保护银反光层的保护层，以防止银反光层被氧化。使用的材料是太平洋电镀防腐原料有限公司的79999银保护剂。On the 80-100u" silver layer, the silver plating area is 0.2mm larger than the single side of the crystal bonding area, and the reflective rate of the silver layer must reach more than 98%; then do anti-oxidation treatment on the surface of the silver reflective layer to form a layer of protective silver reflection The protective layer of the first layer is used to prevent the silver reflective layer from being oxidized. The material used is 79999 silver protective agent from Pacific Electroplating Anticorrosion Raw Material Co., Ltd.
余下的作业步骤见实施案例一的3-5步骤。See the 3-5 steps of the implementation case 1 for the rest of the operation steps.
本实施例提供的一种反光导热金属基PCB板制造方法，通过在镀银的紫铜板上附着导热非吸光绝缘层，从而得到反光、导热性能均良好的PCB板，其反光率达到98%以上；解决LED照明行业的PCB板导热、反光问题，极大提高LED产品的出光效率。This embodiment provides a method for manufacturing a reflective and heat-conducting metal-based PCB board. By attaching a heat-conducting non-light-absorbing insulating layer on a silver-plated copper plate, a PCB board with good reflective and heat-conducting properties can be obtained, and its light reflection rate can reach more than 98%. ; Solve the heat conduction and reflection problems of PCB boards in the LED lighting industry, and greatly improve the light output efficiency of LED products.
实施案例三Implementation Case Three
图4给出了本发明一种反光导热PCB板制造方法的第三个具体实施例，图5给出了本实施例的制造流程图，下面结合图4、图5对其方法进行具体说明。Fig. 4 shows a third specific embodiment of a method for manufacturing a reflective and heat-conducting PCB board of the present invention, and Fig. 5 shows a manufacturing flow chart of this embodiment. The method will be described in detail below in conjunction with Fig. 4 and Fig. 5 .
本实施例三与前述实施例一的区别在于反光金属层的材质不同：The difference between the third embodiment and the first embodiment is that the material of the reflective metal layer is different:
如图4所示，金属基板分为铝层 41 与铜层 415 ，加工步骤如下：步骤1）准备一张铜铝复合基板41、415；步骤2）在铜铝复合基板的铜面镀银414，再在银表面做防氧化处理413；余下作业步骤与实施案例一的3-5步骤相同（见附图4、5）。As shown in Figure 4, the metal substrate is divided into an aluminum layer 41 and a copper layer 415. The processing steps are as follows: step 1) prepare a copper-aluminum composite substrate 41, 415; step 2) plate silver 414 on the copper surface of the copper-aluminum composite substrate , and then do anti-oxidation treatment 413 on the silver surface; the rest of the operation steps are the same as the 3-5 steps of the implementation case 1 (see accompanying drawings 4 and 5).
在步骤1）中，反光金属基板是厚1.2mm铜铝复合板，既提高了PCB板的热传导率，又达到了降低成本的目的。In step 1), the reflective metal substrate is a copper-aluminum composite board with a thickness of 1.2 mm, which not only improves the thermal conductivity of the PCB board, but also achieves the purpose of reducing costs.
在步骤2）中，为了达到良好的反光效果，在铜铝复合板上的固晶In step 2), in order to achieve a good reflective effect, the die-bonding on the copper-aluminum composite board
区镀上80-100u″的银层，银镀层区比固晶区单边大0.2mm,银层的反光率必须达到98%；再在银反光层表面做防氧化处理，形成一层保护银反光层的保护层，以防止银反光层被氧化。使用的材料是太平洋电镀防腐原料有限公司的79999银保护剂。The area is plated with 80-100u" silver layer, the silver plated area is 0.2mm larger than the single side of the solid crystal area, and the reflective rate of the silver layer must reach 98%; then anti-oxidation treatment is performed on the surface of the silver reflective layer to form a layer of protective silver The protective layer of the reflective layer to prevent the silver reflective layer from being oxidized. The material used is 79999 silver protective agent from Pacific Electroplating Anticorrosion Raw Material Co., Ltd.
余下的作业步骤见实施案例一的3-5步骤。See the 3-5 steps of the implementation case 1 for the rest of the operation steps.
图4所示用本发明的方法制造的反光导热金属基PCB板，反光率达到98%，为LED照明行业提供了新型的高性价比的PCB基板。As shown in Fig. 4, the reflective heat-conducting metal-based PCB board manufactured by the method of the present invention has a reflectivity of 98%, providing a new type of cost-effective PCB substrate for the LED lighting industry.
以上对本发明的具体实施例进行了描述。需要理解的是，本发明并不局限于上述特定实施方式，其中未尽详细描述的设备和结构应该理解为用本领域中的普通方式予以实施；本领域技术人员可以在权利要求的范围内做出各种变形或修改，这并不影响本发明的实质内容。Specific embodiments of the present invention have been described above. It should be understood that the present invention is not limited to the specific embodiments described above, and the devices and structures not described in detail should be understood as being implemented in a common way in the art; those skilled in the art can make changes within the scope of the claims Various changes or modifications may be made without affecting the essence of the present invention.
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| CN106287248B (en) * | 2016-08-24 | 2019-08-23 | 深圳市环基实业有限公司 | A kind of LED light batten and its manufacturing method |
| CN108591974A (en) * | 2018-04-24 | 2018-09-28 | 武汉华星光电技术有限公司 | Drive substrate, preparation method and Minitype LED array emitting backlight module |
| US10512159B2 (en) | 2018-04-24 | 2019-12-17 | Wuhan China Star Optoelectronics Technology Co., Ltd. | Driving substrate, manufacturing process, and micro-LED array light-emitting backlight module |
| TWI684293B (en) * | 2018-06-29 | 2020-02-01 | 同泰電子科技股份有限公司 | Backlight circuit board structure with high reflectivity and method for making thereof |
| CN111076108A (en) * | 2019-09-06 | 2020-04-28 | 深圳科诺桥科技股份有限公司 | Light reflecting structure and preparation method thereof |
| CN111073539A (en) * | 2019-09-06 | 2020-04-28 | 深圳科诺桥科技股份有限公司 | Light reflecting structure and preparation method thereof |
| CN111491440A (en) * | 2020-04-20 | 2020-08-04 | 四会富仕电子科技股份有限公司 | Novel copper-based mirror aluminum composite substrate and production method thereof |
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