CN201887076U - Improved Combination of Substrate and Heat Dissipation Structure - Google Patents

Abstract

The utility model discloses a base plate and heat radiation structure's combination improvement, include: a base plate, which is provided with a top surface and a bottom surface, wherein the top surface of the base plate is plated with a first metal layer by a vacuum coating method, and the bottom surface of the base plate is plated with a second metal layer by the vacuum coating method; a heat dissipation structure, which is combined with the second metal layer on the bottom surface of the substrate through a combination means. No matter a ceramic substrate, an aluminum substrate (metal material) or other substrates with the characteristic of difficult welding are used, the vacuum coating method can be used for changing the conduction interface of the heat source from a polymer adhesive system into a metal interface with better heat transfer property, so that the overall heat transfer coefficient is greatly improved, and the service life and the service efficiency of LED crystal grain packaging are prolonged.

Description

Improved Combination of Substrate and Heat Dissipation Structure

technical field

The utility model relates to the application of a combination of heterogeneous materials, in particular to the improvement of a combination of a substrate and a heat dissipation structure.

Background technique

In recent years, the application territory of light-emitting diodes (LEDs) has continued to expand to the consumer market, and the application of white light lighting has also followed the issue of global warming, making LEDs continue to be popular after backlight applications. However, with the inevitable replacement trend of LED light sources, the problem of heat dissipation will officially become a key influence on the development of LEDs and product penetration; poor heat dissipation will cause several serious phenomena, first of all, it will cause wavelength changes, such as from 450nm The blue light becomes blue-green at 480nm, which will secondly reduce the brightness (the internal quantum conversion efficiency of the LED is reduced), and even finally affect the reliability of the product (heat will reduce the life of the packaging material).

In terms of high-power light-emitting diodes (High Power LED), in order to solve the problem of high heat generation, ceramic substrates, copper substrates or aluminum substrates are used as heat dissipation substrates. However, in addition to the copper substrate having metal weldability, the substrate and the heat dissipation fins can be directly welded to improve heat dissipation efficiency. The remaining two types of carrier boards all have the problem of difficult soldering. Due to the material characteristics of ceramic substrates, traditional silver printing is used to make the surface closely adhere to a layer of metal layer before post-processing. At present, aluminum substrates are the main metal-based printed circuit boards in the market. If aluminum substrates are to be used as high-power LED carrier boards, the non-solderable characteristics of aluminum substrates become the primary problem in improving heat transfer performance. essentials.

Referring to Fig. 1, it shows the main structure of an existing light-emitting diode module 100 using a ceramic substrate, including a substrate 1 (ceramic substrate), a silver glue layer 11 (coated on the top surface), a thermal paste 12 ( coated on the bottom surface), a cooling fin 13 and an LED die 14 . Since the ceramic substrate 1 is an insulating material, silver glue printing is used to form a conductive circuit layer for subsequent packaging processing with LED chips, and heat dissipation glue is still applied on the back of the substrate to connect with the heat dissipation fins 13. . At this time, the heat transfer coefficients of the two parts of the silver glue layer 11 and the heat dissipation glue 12 still have a large difference from the ceramic substrate 1 , which constitutes the main place that hinders the conduction of the heat source.

Referring to FIG. 2, it shows the main structure of an existing LED module 200 using an aluminum substrate, including a substrate 2 (aluminum substrate), an insulating layer 21 (low heat transfer coefficient) and a circuit layer 23 on the top surface thereof. , a heat dissipation glue 24 (low heat transfer coefficient), a heat dissipation fin 25 and an LED die 26 . The heat dissipation path is that the heat source generated by the LED dissipates into the atmosphere through the insulating layer 21 , the aluminum substrate 2 , the heat dissipation glue 24 , and the heat dissipation fins 25 . Among them, the two interfaces of the insulating layer 21 and the heat dissipation glue 24 are the main sources of thermal resistance in heat flow conduction. To improve the conduction of heat flow, it is one of the improvement methods to directly bond the substrate 2 and the heat dissipation fins 25 and the LED die 26 and the substrate 2 with a metal interface. Direct welding with the fins through the metal interface has its operational difficulties.

Utility model content

However, although ceramic substrates and aluminum substrates have the advantage of better thermal conductivity, ceramic substrates, aluminum materials, or other substrates that are difficult to weld, should be directly welded to the heat dissipation fins through the metal interface. It has operational difficulties.

Therefore, an object of the present invention is to provide an improved combination of the substrate and the heat dissipation structure. The vacuum coating method is mainly used for surface treatment of the substrate to form a thin metal layer to facilitate subsequent welding and bonding operations.

The technical means adopted by the utility model to solve the problems of the prior art is a combined improvement of a base plate and a heat dissipation structure, including: a base plate with a top surface and a bottom surface, the top surface of the base plate is coated with a vacuum coating method The first metal layer, the bottom surface of the substrate is coated with a second metal layer by vacuum coating method; a heat dissipation structure, the second metal layer on the bottom surface of the substrate is combined with the heat dissipation structure through a combination means. In the embodiments of the present invention, ceramic substrates and aluminum substrates are used as examples for description.

Through the technical means adopted in the utility model, whether using ceramic substrates, aluminum substrates (metal material) or other substrates that are difficult to weld, the conduction interface of the heat source can be changed from a polymer glue system to a conduction interface by a vacuum coating method. The metal interface with better thermal properties greatly improves the overall heat transfer coefficient, solves the non-solderable characteristics of this type of substrate, and prolongs the life and efficiency of LED die packaging by improving thermal conductivity.

Description of drawings

Figure 1 shows an existing LED module using a ceramic substrate;

Figure 2 shows an existing LED module using an aluminum substrate;

Fig. 3 shows the first embodiment of the improved combination of the substrate and the heat dissipation structure of the present invention;

Fig. 4 shows the second embodiment of the improved combination of the substrate and the heat dissipation structure of the present invention;

FIG. 5 shows an improved third embodiment of the combination of the substrate and the heat dissipation structure of the present invention.

Description of main component symbols

LED Module 100

Substrate 1

Silver glue layer 11

Thermal Adhesive 12

Cooling fins 13

LED Die 14

LED module 200

Substrate 2

Insulation 21

Circuit layer 23

Thermal paste 24

Cooling fins 25

LED Die 26

LED module 300

Substrate 3

Top 301

Bottom 302

First metal layer 321

Second metal layer 322

Electronic components 33

Wiring 331

Solder 332

Heat dissipation structure 34

Thermally conductive attachment surface 341

LED module 400

Substrate 4

Top 401

Bottom 402

First metal layer 411

Second metal layer 412

Circuit Diagram 42

Circuit layer 421

Insulation layer 422

Electronic components 43

Wiring 431

Solder 432

Heat dissipation structure 44

Thermally conductive attachment surface 441

Substrate 5

Top 501

Bottom 502

First metal layer 511

Second metal layer 512

Circuit Diagram 52

Circuit layer 521

Insulation layer 522

Electronic components 53

Wiring 531

Solder 532

Heat dissipation structure 54

Thermally conductive attachment surface 541

Detailed ways

Referring to FIG. 3 , it shows an improved first embodiment of the combination of the substrate and the heat dissipation structure of the present invention. In this embodiment, the light emitting diode module 300 of ceramic substrate is taken as an example, which includes a substrate 3 (ceramic substrate), a heat dissipation structure 34 (radiation fins) and an electronic component 33 (LED chip). The heat dissipation fins and LED dies used in various embodiments of the present invention are mainly used as examples and not limited thereto, and may also be other types of heat dissipation structures or electronic components (such as IC components).

The substrate 3 has a top surface 301 and a bottom surface 302, and the top surface 301 of the substrate 3 is evenly coated with a first metal layer 321 (including a part that is combined with an electronic component and a part that is electrically connected to it) with a vacuum coating method (sputtering). circuit layer), the bottom surface 302 of the substrate 3 is coated with a second metal layer 322 (the part combined with the heat dissipation structure) by a vacuum coating method (sputtering), and the first metal layer 321 is patterned (such as exposure and development). As a circuit layer, the first metal layer 321 and the second metal layer 322 can be further thickened by electroplating.

The heat dissipation structure 34 has a heat conduction attachment surface 341 , and the second metal layer 322 on the bottom surface 302 of the substrate 3 is bonded to the heat conduction attachment surface 341 of the heat dissipation structure 34 through a bonding means (such as welding).

The electronic component 33 is soldered to the first metal layer 321 on the top surface 301 of the substrate 3 through a combination means (such as a welding method), and the first metal layer 321 on the top surface 301 of the substrate 3 is welded with the solder 332 through the wire 331 It is electrically connected to the electronic component 33 . Although the electronic component 33 in this embodiment is an example of an LED chip, it is not limited thereto, and may also be an IC component or other electronic components.

In this embodiment, the first metal layer 321 on the top surface 301 of the substrate 3 can be used for die-bonding packaging of LED chips, and the second metal layer 322 on the bottom surface 302 can be soldered and fixed with the heat dissipation structure 34 . Compared with the existing method of printing silver glue, the heat conduction interface of this embodiment is changed from polymer glue to metal interface, which can greatly improve the overall heat transfer coefficient.

The vacuum coating method described in each embodiment of the present invention is mainly sputtering, which can include traditional vacuum sputtering, low-temperature vacuum sputtering, batch vacuum sputtering and continuous vacuum sputtering, etc. And deposited on the substrate to form a metal film with a thickness of 0.5 μm, the material of which can be metal materials such as copper or titanium. The thickening step is not a necessary condition, but may be determined according to actual conditions and requirements. If there is no electroplating for thickening, taking this embodiment as an example, if it is desired to use electroplating for thickening, the first metal layer 321 and the second metal layer 322 are sputtered to form a thickness of about 0.1-0.5 μm. Those skilled in the art in this field should know that these concepts can be analogized to the subsequent embodiments, so the description will not be repeated in the subsequent embodiments.

Referring to FIG. 4 , it shows an improved second embodiment of the combination of the substrate and the heat dissipation structure of the present invention. In this embodiment, the aluminum substrate LED module 400 is taken as an example, which mainly includes a substrate 4 (aluminum substrate), a heat dissipation structure 44 (radiation fins) and an electronic component 43 (LED die).

An insulating layer 422 is formed on the top surface 401 of the substrate 4 , and a first metal layer 411 is partially plated on a predetermined position on the top surface of the substrate by a vacuum coating method, and a second metal layer 412 is plated on the bottom surface 402 . The metal thin film formed on the insulating layer 422 is the circuit layer 421 to form a specific circuit pattern 42 . Next, the first metal layer 411 , the second metal layer 412 and the circuit layer 421 of the substrate 4 are thickened by electroplating.

Similarly, the heat dissipation structure 44 combines the second metal layer 412 on the bottom surface 402 of the substrate 4 with the heat conduction attaching surface 441 of the heat dissipation structure 44 through a soldering method. The electronic component 43 is also soldered to the first metal layer 411 on the top surface 401 of the substrate 4 through the soldering method, and the first metal layer 411 on the top surface 401 of the substrate 4 is welded with solder 432 through its wiring 431 to make it electrically connected. on electronic components 43. The effect and principle of this embodiment are similar to those of the above embodiment, and the heat source conduction interface can be changed from a polymer glue system to a metal interface to improve the overall heat transfer coefficient.

In addition, the substrate 3 of this embodiment can also be a substrate on which the circuit pattern 42 has been laid out, and the substrate is directly sputtered to form a partial first metal layer 411 and a second metal layer 412, and the LED crystal grains and heat dissipation fins are subsequently welded. The steps of the film are the same, and will not be repeated here. Although this approach is different in the manufacturing process, the structure obtained by this different manufacturing process still belongs to the protection scope of the present utility model.

Referring to FIG. 5 , it shows an improved third embodiment of the combination of the substrate and the heat dissipation structure of the present invention. This embodiment also takes the aluminum substrate LED module 500 as an example, which mainly includes a substrate 5 (aluminum substrate), a heat dissipation structure 54 (radiation fins) and an electronic component 53 (LED die).

The first metal layer 511 is plated on the top surface 501 of the substrate 5 by vacuum coating method, and the second metal layer 512 is plated on the bottom surface 502. The first metal layer 511 and the second metal layer 512 can be thickened by electroplating as required. A circuit pattern 52 composed of a circuit layer 521 and an insulating layer 522 is formed on the first metal layer 511, and is subjected to patterning treatment such as exposure and development to form a specific circuit pattern.

Similarly, the heat dissipation structure 54 combines the second metal layer 512 on the bottom surface 502 of the substrate 5 with the heat conduction attaching surface 541 of the heat dissipation structure 54 through a soldering method. The electronic component 53 is also soldered to the first metal layer 511 on the top surface 501 of the substrate 5 through the soldering method, and the first metal layer 511 on the top surface 501 of the substrate 5 is soldered with solder 532 through its wiring 531 to make it electrically connected. on electronic components 53. The effect and principle of this embodiment are similar to those of the above-mentioned embodiment, and the conduction interface of the heat source can be changed from a polymer glue to a metal interface to improve the overall heat transfer coefficient.

It can be seen from the above examples that the improvement of the combination of the substrate and the heat dissipation structure provided by the utility model has industrial application value, but the above description is only a description of the preferred embodiment of the utility model, and those who are proficient in this technology Other various improvements can be made according to the above description, but these changes still belong to the spirit of the present utility model and the scope of claims.

Claims (14)

1. the improvement that combines of a substrate and radiator structure is characterized in that, comprising:

One substrate has an end face and a bottom surface, and the end face of this substrate is coated with a first metal layer with Vacuum Coating method, and the bottom surface of this substrate is coated with one second metal level with Vacuum Coating method;

One radiator structure sees through second metal level that an engagement means is incorporated into this substrate bottom surface.

2. the improvement that combines of substrate as claimed in claim 1 and radiator structure is characterized in that, the first metal layer of this substrate top surface also comprises and sees through this engagement means in conjunction with an electronic component.

3. the improvement that combines of substrate as claimed in claim 2 and radiator structure is characterized in that this electronic component is LED crystal grain or IC element.

4. the improvement that combines of substrate as claimed in claim 1 and radiator structure is characterized in that this Vacuum Coating method is a sputter.

5. the improvement that combines of substrate as claimed in claim 1 and radiator structure is characterized in that the material of this first metal layer and second metal level is copper or titanium.

6. as of the combine improvement of claim 1 a described substrate, it is characterized in that this first metal layer is for being formed at the end face of this substrate partly with radiator structure.

7. the improvement that combines of substrate as claimed in claim 1 and radiator structure is characterized in that, this substrate is one to be furnished with the substrate of circuit pattern.

8. the improvement that combines of substrate as claimed in claim 1 and radiator structure is characterized in that this substrate is a ceramic substrate.

9. the improvement that combines of substrate as claimed in claim 1 and radiator structure is characterized in that this substrate is an aluminium base.

10. the improvement that combines of substrate as claimed in claim 1 and radiator structure is characterized in that the first metal layer of this substrate and second metal layer thickness are at least 0.5 μ m.

11. the improvement that combines of substrate as claimed in claim 1 and radiator structure is characterized in that the first metal layer of this substrate and second metal level also thicken with galvanoplastic and make its thickness be at least 0.5 μ m.

12. the improvement that combines of substrate as claimed in claim 1 and radiator structure is characterized in that this radiator structure is a radiating fin.

13. the improvement that combines of substrate as claimed in claim 1 and radiator structure is characterized in that this first metal layer is a circuit layer.

14. the improvement that combines of substrate as claimed in claim 1 and radiator structure is characterized in that this engagement means is a welding.

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