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CN104411900B - 具有减少的重量和材料量的建筑镶板、生产地板镶板的方法和木基地板镶板 - Google Patents

具有减少的重量和材料量的建筑镶板、生产地板镶板的方法和木基地板镶板 Download PDF

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Publication number
CN104411900B
CN104411900B CN201380035260.6A CN201380035260A CN104411900B CN 104411900 B CN104411900 B CN 104411900B CN 201380035260 A CN201380035260 A CN 201380035260A CN 104411900 B CN104411900 B CN 104411900B
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CN
China
Prior art keywords
core
panels
layer
building panelling
wood
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201380035260.6A
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English (en)
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CN104411900A (zh
Inventor
D·佩尔万
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sierralok Innovation Inc
Original Assignee
Floor IPtech AB
Valinge Flooring Technology AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Floor IPtech AB, Valinge Flooring Technology AB filed Critical Floor IPtech AB
Priority to CN201710963476.9A priority Critical patent/CN107724641B/zh
Publication of CN104411900A publication Critical patent/CN104411900A/zh
Application granted granted Critical
Publication of CN104411900B publication Critical patent/CN104411900B/zh
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Classifications

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    • E04F15/02—Flooring or floor layers composed of a number of similar elements
    • E04F15/02005—Construction of joints, e.g. dividing strips
    • E04F15/02022—Construction of joints, e.g. dividing strips with means for aligning the outer surfaces of the flooring elements
    • E—FIXED CONSTRUCTIONS
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    • E04F15/02—Flooring or floor layers composed of a number of similar elements
    • E04F15/02038—Flooring or floor layers composed of a number of similar elements characterised by tongue and groove connections between neighbouring flooring elements
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    • E04F15/10—Flooring or floor layers composed of a number of similar elements of other materials, e.g. fibrous or chipped materials, organic plastics, magnesite tiles, hardboard, or with a top layer of other materials
    • E04F15/107—Flooring or floor layers composed of a number of similar elements of other materials, e.g. fibrous or chipped materials, organic plastics, magnesite tiles, hardboard, or with a top layer of other materials composed of several layers, e.g. sandwich panels
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
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    • B27M3/04—Manufacture or reconditioning of specific semi-finished or finished articles of flooring elements, e.g. parqueting blocks
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    • B27M3/00—Manufacture or reconditioning of specific semi-finished or finished articles
    • B27M3/04—Manufacture or reconditioning of specific semi-finished or finished articles of flooring elements, e.g. parqueting blocks
    • B27M3/06—Manufacture or reconditioning of specific semi-finished or finished articles of flooring elements, e.g. parqueting blocks of composite floor plates per se by assembling or jointing the parqueting blocks
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
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    • E04C2/24—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by specified materials of wood, fibres, chips, vegetable stems, or the like; of plastics; of foamed products laminated and composed of materials covered by two or more of groups E04C2/12, E04C2/16, E04C2/20
    • E04C2/246—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by specified materials of wood, fibres, chips, vegetable stems, or the like; of plastics; of foamed products laminated and composed of materials covered by two or more of groups E04C2/12, E04C2/16, E04C2/20 combinations of materials fully covered by E04C2/16 and E04C2/20
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Abstract

本发明涉及一种建筑镶板，尤其是层压地板镶板，其设有锁定系统和在后侧的若干芯部凹槽，以便节约材料和减少重量。

Description

具有减少的重量和材料量的建筑镶板、生产地板镶板的方法 和木基地板镶板
技术领域
本公开一般地涉及形成镶板例如建筑镶板的领域。更具体地，本公开涉及形成地板镶板的方法和由该方法生产的地板镶板。
背景技术
发明的应用领域
本发明的实施例特别适合于在浮式地板中使用，上述浮式地板由通过锁定系统机械接合的地板块形成，并且由以下部分组成：一个或多个由层压装饰材料构成的上部层、由木纤维基材料构成的中间芯部和在芯部的后侧上的下部平衡层。因此，下文对已知技术、已知系统的问题以及本发明的目的和特征的描述将作为非限制性示例针对此应用领域，尤其是针对纸基或粉末基层压地板，该层压地板形成为预期在长边和短边二者上机械接合的矩形地板块。然而，应该强调的是，本发明的实施例可以用在通过机械锁定系统安装的所有类型地板中，例如实木地板、具有塑料表面层的LVT地板，以及用在木基建筑镶板例如护墙板和家具构件中。
发明背景
预期用于例如地板或家具构件的传统层压镶板通过下面如图1a-1d所示的步骤生产。将装饰纸2b和耐磨的透明覆盖纸2a浸渍热固性树脂如三聚氰胺，并施加在HDF(高密度纤维板)芯部3的上部上。将通常称为背衬的浸渍有三聚氰胺树脂的平衡纸4施加在HDF芯部的背面上。将具有上层2和下层4的芯部3移入到压机5中并在加热和压力作用下进行压制，这样以使热固性树脂固化并将各层附着到芯部上，如图1b中所示。
典型的压制参数是40巴压力和160-200℃的温度，且压制时间为12-30秒。
此生产方法和用这种方法生产的产品一般称为DPL(直接压力层压)法和DPL产品。上和下表面层一般具有的厚度为0.1-0.2mm。
HDF(高密度纤维板)包括木纤维和热固性树脂，其也通过加热和压力固化成为厚度约6-12mm和密度约800kg/m3的板。
最常见的地板尺寸是1.3×0.2m的矩形镶板，其厚度约为8mm。将若干镶板打包并成包供应，其中一包包含约10块镶板，地板面积约2m2。每包的重量约为16kg。
最近已经研制出了具有木粉基表面和背衬的新地板镶板。纸由粉末背衬4和粉末基表面层2代替，该粉末背衬4包括散布在芯部3的一侧上的木纤维和三聚氰胺颗粒，该粉末基表面层2包括木纤维、热固性树脂且优选三聚氰胺颗粒、氧化铝颗粒和颜料，其散布在通常是HDF板的芯部的另一侧上。散布是通过辊子和刷子进行的，并且能够以高精度将约100-800gr/m2的非常精确的层散布在一般具有约7-10mm厚度的HDF芯部材料上。在连续的或不连续的压机5中在加热和压力作用下压制表面2、芯部3和背衬4，以便得到具有无纸的固体表面层和背衬的产品。
经压制的粉末基层可以具有约0.2-1.0mm的厚度。典型的压制参数类似于常规层压地板，可以是40-80巴的压力，160-200℃的温度，10-40秒的压制时间。
这种木纤维基地板一般称为WFF地板，与传统的层压地板相比具有相当好的性能，这是因为可以通过低成本的方式生产更厚且更致密和耐磨的表面。
这两种生产方法可以相结合。
具有纸基表面层的层压地板可以具有在装饰纸下方的粉末基次级层(sublayer)，以便提供更好的抗冲击性和更深的压花。纸的背衬可以由粉末背衬代替。在压制期间可以利用次级层来浸渍装饰纸，此时来自次级层的树脂渗入到装饰纸中。
WFF地板也可以在上侧具有若干不同的层，例如高品质的顶层2a和在顶层下方的成本更低的次级层2b。次级层可以包括较低的树脂量且不需要氧化铝颗粒。
纸基或粉末基表面层、纸基或粉末基背衬层和HDF芯部的一个共同特征是，所有这些材料都包括木纤维和热固性粘结剂，优选三聚氰胺或脲醛，且它们是通过加热和压力进行固化。木纤维可以属于同一类型。
当上层和下层中的热固性树脂在压制期间固化时，这些层经历第一收缩。HDF芯部也被加热并变软和容易弯曲。背衬层平衡由表面层所产生的张力，镶板在离开压机时基本上是平的，带有向后弯曲的小的凸起。当镶板从约160-200℃冷却到室温时的第二温度收缩也通过背衬层平衡，并且镶板1基本上是平的。当在冬天期间相对湿度下降到20％或更低时，向后弯曲的小的凸起是优选的，因为这抵消了各边缘在干燥状况下的向上弯曲。
这种基本上平的压制板包含由表面层和平衡层的收缩所引起的张力。
所述板通常被切割和形成为若干在长边和短边上具有锁定系统的地板镶板，如图1c中所示。锁定系统一般包括用于垂直锁定的榫舌10和舌槽9，以及用于水平锁定的具有与锁定槽14配合的锁定元件8的板条6。
表面层2具有与背衬层4大致相同的长度和宽度，如图1d中所示。锁定系统可以与芯部形成一体部件。可选择地，可以利用单独的材料来形成例如榫舌10和/或板条6。
木纤维和热固性树脂的价格日益增长，并且由于短缺和将木纤维用于能量生产的可能性，未来预计其价格还会大幅增长。
已经采用了若干方法来节省材料和降低成本。这些方法主要目的在于制造包括最少量树脂的更薄的产品。进一步节约成本受到与地板镶板和锁定系统的几何形状有关的最低品质要求的限制。
如果能减少重量和材料量，则会是一个很大的优点。目前的层压地板和WFF地板存在的问题是，它们必须具有高密度的芯部例如HDF，这是稳定性、抗冲击性和强度所需的，以便抵抗来自压制操作的热和压力。另一个问题是，镶板必须具有最小的厚度和高剪切强度的芯部，以便能够形成具有足够强度的锁定系统和能够容易安装的几何形状。
已知的是，可以在实木地板的背侧上形成凹槽，主要是为了增加镶板的柔性。这些镶板更容易向下胶粘到底层地面上。在层压地板和WFF地板中不使用在镶板背侧的凹槽，这些地板通过机械锁定系统安装。主要原因是，这种凹槽对镶板的稳定性和锁定系统有负面影响，因为将从平衡层和锁定系统的下部除去材料。
一些术语的定义
在下文中，将安装好的地板块的可见表面称为“前侧”或者“表面”，而将面向底层地面的地板块的相对侧称为“后侧”。将用作基材的初始的板材称为“芯部”。当芯部涂覆有最接近前侧的表面层以及优选地还具有最接近后侧的平衡层时，它形成称为“板块”的半成品，在随后的操作中该板块通常被分割和机加工成多个“地板镶板”。
所谓“水平面”是指平行于表面层的外部部分延伸的平面。两个接合的地板块的两个相邻接合边缘的紧密并置的上部部分一起限定了与所述水平面垂直的“垂直面”。
将在地板块的边缘处的、在前侧和后侧之间的地板块的外部部分称为“接合边缘”。通常，接合边缘具有若干“接合表面”，这些接合表面可以是垂直的、水平的、成角度的、倒圆的、成斜面的、等等。
所谓“锁定系统”是指共同作用的连接机构，所述连接机构垂直地和/或水平地连接地板镶板。所谓“机械锁定系统”意味着接合可以不用胶水实现。
所谓“上或向上”是指朝向表面，所谓“下或向下”是指朝向后侧。所谓“向内”是指朝向地板块的中心，而所谓“向外”是指朝向相反的方向。
所谓“雕刻(carving)”是指一种在镶板的边缘上形成凹槽或突起的方法，该方法包括：用一个或几个沿着进给方向设置的雕刻工具将边缘的一部分雕刻成它的最终形状，其中该雕刻工具包括若干非旋转的固定的去切屑表面。
发明内容
本发明的实施例的一个目标是，提供包括热固性树脂的层压镶板和生产这种镶板的方法，并且目的在于减少这些镶板尤其是地板镶板的重量和材料量，以及将这种节约成本和减少材料的方法与高品质的锁定系统和提供足够稳定性的芯部相结合，其中该芯部的足够稳定性是在压制操作中以及使用地板时所需要的。另一个目标是，提供具有减少的重量和材料量以及增加的稳定性的实木地板。
本发明的第一方面是建筑镶板，该建筑镶板具有在前侧的表面层、中间芯部和在芯部的后侧上的背衬层，其中芯部和各个层均包括木纤维和热固性树脂。镶板设有锁定系统，用于将第一建筑镶板的第一边缘垂直和水平地锁定到第二建筑镶板的相邻的第二边缘上。处于锁定位置的第一边缘和第二边缘的上部部分一起限定了与水平面垂直的垂直面，所述水平面平行于所述表面。上述锁定系统包括榫舌和舌槽以及板条，所述榫舌和舌槽构造为进行配合以用于垂直锁定，所述板条设有锁定元件并构造为与相邻边缘中所形成的向下开口的锁定槽配合以用于水平锁定。背衬层和芯部包括若干具有朝向后侧的开口的垂直延伸的芯部凹槽。背衬层的面积小于表面层的面积的约90％。
背衬层可以包括至少三个芯部凹槽，这些芯部凹槽与一对相对的边缘处的锁定系统水平地和向内地间隔开。
背衬层的面积可以小于表面层的面积的80％。
至少一个芯部凹槽的整个部分可以在所有边缘处位于垂直面VP内部。
镶板可以是具有长边和短边的矩形，并且芯部凹槽可以与长边平行。
芯部凹槽的凹槽深度可以是地板厚度的至少0.3倍。
芯部凹槽可以包括比该凹槽的内部部分大的开口。
背衬层可以包括与芯部基本上相同的纤维。
本发明的第二方面是一种生产地板镶板的方法，每个地板镶板都具有在前侧的表面层、中间芯部和在芯部的后侧上的背衬层，其中芯部和各个层都包括木纤维和热固性树脂。该方法包括以下步骤：
·通过在先前生产的镶板的后侧中形成芯部凹槽来产生木纤维碎屑，
·通过将木屑与热固性树脂混合来生产混合物，
·将木屑和热固性树脂的混合物散布在芯部的上侧和/或下侧，
·通过加热和压力使混合物固化以形成板块，
·将板块切割成若干地板镶板，和
·在第一和第二镶板边缘处形成锁定系统，该锁定系统包括用于水平锁定的板条、锁定元件和锁定槽，以及用于垂直锁定的榫舌和舌槽。
可以将混合物散布在芯部的下侧。
可以将混合物散布在芯部的上侧和下侧。
芯部可以是HDF。
可以在长边或短边上形成锁定系统之前形成芯部凹槽。
芯部凹槽可以由包括若干旋转式锯片的跳动工具(jumping tool)或者由雕刻工具形成。
经压制的板块可以比地板镶板更加凸起。
芯部凹槽用于产生木纤维材料，该木纤维材料可以用在形成地板镶板的上层或下层的第二步骤中。在形成芯部凹槽时从芯部除去的材料减少了镶板的重量，尽管原始的镶板厚度得以保持，并且通过利用形成芯部凹槽产生的碎屑可以形成比原始芯部更厚的镶板。包括上层和下层的整个地板镶板可以由包含来自芯部的材料的材料形成。
作为可供选择的方案，芯部和各个层可以包括热塑性材料，例如PVC(聚氯乙烯)、PET(聚对苯二甲酸乙二醇酯)或乙烯基树脂，其优选地设有填料，并且对于此可选择的实施例来说，所产生的碎屑是塑料碎屑。
作为可供选择的方案，锁定系统可以包括在第一或第二镶板边缘处的伸出的板条和在第一或第二镶板边缘的另一个的下侧的凹部。伸出的板条的上表面或凹部的下表面优选地设有胶粘剂例如胶粘带，优选地设有可移除的条带。
本发明的第三方面是一种具有实木的上层和下层的木基地板镶板。下层包括空腔，而上层形成空腔的上部部分。
镶板可以具有在两个相对的边缘处的机械锁定系统。
本发明的第四方面是一种生产基本上平坦的地板镶板的方法，每个地板镶板都具有在前侧上的表面层、在后侧上的背衬层、和中间芯部，其中表面层和背衬层包括热固性树脂，该方法包括以下步骤：
·通过利用加热和压力附接芯部、表面层和背衬层，形成具有向后的凸起预应力的大的板块；
·将板块分成若干地板镶板；
·在镶板的后侧形成芯部凹槽，以便所述凸起预应力至少部分地被释放。
可以在将板块分成若干地板镶板后形成芯部凹槽。
上述目的通过根据本发明的实施例的锁定系统、地板镶板和生产方法全部或部分地实现。
附图说明
下面将参照所附的示出本发明的实施例的示意图作为示例更详细地描述本发明。
图1a-1d示出已知技术。
图2a-2d示出根据本发明的实施例的地板镶板。
图3a-3e示出本发明的可供选择的实施例。
图4a-4d示出根据本发明的实施例的地板镶板的形成。
图5a-5e示出芯部凹槽的实施例。
图6a-6e示出根据本发明的实施例，具有芯部凹槽的镶板的平衡以及实木地板中的芯部凹槽。
图7a-7c示出形成芯部凹槽的工具的实施例。
图8a-8c示出可以与芯部凹槽结合的低成本锁定系统的实施例。
具体实施方式
根据本发明的设有机械锁定系统的地板块的第一实施例在图2a-2d中示出。地板镶板包括在长边1a、1b和短边1c、1d上的锁定系统。图2a示出具有表面层2的前侧，图2b示出具有背衬层4的后侧。表面层的面积A’基本上与背衬层4的面积A相同。图2c显示，具有朝向镶板后侧的开口的基本上垂直的芯部凹槽19a、19b可以形成在后侧上并位于背衬层4中和芯部3中，该芯部3可以是木基板例如HDF、刨花板或胶合板。芯部还可以包括塑料材料。上述成形可以通过如图2d中所示的旋转式锯片20a完成。也可以采用雕刻法。镶板通常在表面层2朝向下的情况下进行机加工。跳动式锯片从上方移向镶板20a，或者如果表面层2朝上，则跳动式锯片从下方移向镶板20a，并且在镶板相对于旋转式锯片移动时，跳动式锯片远离镶板20c。形成若干芯部凹槽19a、19b，在此优选实施例中，这些芯部凹槽19a、19b从边缘向内定位且优选地还从垂直面VP向内定位，以使得这些芯部凹槽不与长边和短边上的锁定系统的任何部分相交。凹槽19也可以通过固定的或跳动的非旋转雕刻工具形成。
凹槽的形成产生了木屑21，按照本发明的实施例，可以将该木屑21磨碎并筛分成木粉末，该木粉末可以与热固性树脂混合并散布在芯部上以形成表面层和/或背衬层。芯部凹槽主要用来提供可以在上层2或下层4中使用的木纤维材料，以便节约材料。它们也可以用来减少地板镶板的重量。
图3a-3e显示，芯部凹槽19可以形成为具有许多不同的几何形状和图案。芯部凹槽19可以具有不同的宽度，如图3b中所示，并且凹槽长度可以小于背衬层的长度BL。芯部凹槽可以是不连续的，如图3c和3d中所示，并且它们可以从一个边延伸到另一个边，如图3e中所示。凹槽也可以主要位于背衬层的外部部分处，并且存在没有任何凹槽的中间区域MA。这可以用来增加镶板的稳定性并且在除去部分背衬层时减少对背衬层的负面影响。凹槽可以沿着长边和/或沿着短边形成。镶板也可以是方形的。
芯部凹槽减小了背衬层的面积A。在所示的实施例中，背衬层的面积A约为表面层的面积A’的60％-85％。这意味着平衡层将损失其强度的40-15％。更厚的背衬层或增加的树脂量可以补偿这种减少的背衬面积。
可以形成这样的芯部凹槽，即，相比于压制之后的初始面积和表面层的面积A’，该芯部凹槽使背衬面积A减少50％以上。
图4a-4d示出根据本发明的实施例的地板镶板1的形成。将木粉末基次级层2b施加在芯部3上。图4b显示，包括木粉末或者装饰纸和覆盖层构成的顶层2a的表面层2可以施加在次级层2b上。在芯部3的后侧上可以施加粉末背衬层4。图4c示出芯部凹槽19的形成，其产生碎屑21。这些碎屑可以被研磨、筛分并与热固性粘接剂混合。该材料可以散布在芯部上以便形成木基顶层和/或次级层和/或背衬层，如图4b中所示。最后，形成锁定系统10、9、6、8、14，如图4d中所示。
芯部凹槽的铣削或雕刻可以在以下时间进行：在压制之后和将大的板块锯切成单个镶之前，在锯切之后但在形成锁定系统之前，在两个相对的边缘例如长边上形成锁定系统之后，或者作为最终的操作在形成锁定系统之后。这些生产步骤可以进行组合，并且一些凹槽可以在若干生产步骤中形成。
芯部凹槽可以很容易地为上述不同的层提供足够的木纤维材料。来自碎屑的固化的热固性树脂与混合到木粉末中的三聚氰胺粉末是相容的，不需要将纤维与固化的树脂分离。背衬和表面可以包括新的原始的热固性树脂和已经固化的树脂。
图5a-5e示出芯部凹槽的不同的优选几何形状，所述芯部凹槽可以包括例如是地板厚度T的0.1-0.5倍的垂直延伸的凹槽深度GD，约为地板厚度T的0.5-1倍的凹槽宽度GW，并且在芯部凹槽之间可以具有约为地板厚度T的0.2-1倍的水平延伸的间隙S，如图5a中所示。
芯部凹槽可以具有不同的形状，并且内芯部凹槽19b可以形成为具有比外芯部凹槽19a更小的凹槽深度GD，以便增加镶板的稳定性。芯部凹槽19c也可以通过例如雕刻工具20形成为具有侧切部(undercut)。
在墙壁镶板中可以形成凹槽深度GD例如为镶板厚度T的0.8倍的芯部凹槽，其中，墙壁镶板对于抗冲击性的要求比地板镶板低得多。
图5c-5e示出从长边看到的芯部凹槽19。镶板在短边1c、1d上具有向下折叠的锁定系统，该锁定系统包括允许通过垂直折叠进行锁定的柔性榫舌10。图5c示出，芯部凹槽19具有小于在相对的短边处的锁定系统之间的距离的凹槽长度GL。图5d显示，芯部凹槽19在一个短边1d处弯曲并且在另一个短边1c处与表面平行，以便它与锁定槽14的一部分相交。这些实施例允许跳动工具在形成期间仅在芯部凹槽19的形成开始或结束时才必须移动。图5e示出通过固定工具形成的芯部凹槽19，该芯部凹槽19与锁定板条6和锁定槽14相交。
芯部凹槽可以提供足够的材料以便例如生产0.5mm的背衬层和0.5mm的次级层。通过使用来自芯部的材料形成背衬层和优选地至少部分表面层，可以用7mm的HDF芯部来生产8mm的地板镶板。这可以导致约15％的重量减少和材料节约。
如果芯部凹槽形成为使得它们将背衬层减少地板表面的50％并且具有地板厚度T的40％的凹槽深度GD，则可以达到约20％的甚至更大的材料节约和重量减少。
芯部凹槽可以填充以下材料，即，该材料优选比木材更便宜和/或向地板提供其它性能，例如增加消声性能。
碎屑当然也可以完全或部分地用来产生热能。因此本发明的实施例也可以用在以下地板中：即，该地板包括木基芯部，并且芯部凹槽用于减少重量，碎屑在不同应用中用于能量或者作为填料。
在压制之后形成芯部凹槽提供了下述优点，即，背衬层抵消了在压制和冷却期间顶层的收缩，并且经压制的板块在此生产阶段不受在压制操作之后在地板镶板中形成的芯部凹槽的影响。
然而，芯部凹槽的形成除去了一部分平衡层，这可能导致张力释放和形成凹槽之后镶板边缘向上弯曲。这种镶板将不会完全是平的，可能沿着长度和宽度稍微凹入。
图6a-6c显示，如果大的板块形成为具有向后的预张力且该预张力适合于由形成芯部凹槽所引起的尺寸变化，则这些问题可以抵销并完全消除，如图6a中所示。例如，可以通过包括更多树脂并可以在比表面层更高的温度下固化的更厚的背衬层来实现该预张力。这种生产方法的特征在于，当被压制和冷却时，板块相比于最终的在后侧具有芯部凹槽的地板镶板具有更大的向后弯曲。甚至可以利用直接在压制之后当板块仍热时的机械弯曲来实现塑性变形和拉伸表面层，使得可以产生向后的“过度弯曲”，其在芯部凹槽19形成时部分回弹到基本上平坦的位置。图6b显示，当芯部凹槽形成时部分张力被释放，并且当凹槽和边缘如图6c中所示形成时，地板镶板可以基本上是平的。
图6c显示，芯部凹槽可以覆盖有单独的覆盖层23，例如纸、塑料箔、泡沫材料、软木或木饰面。这可以用来遮掩凹槽，提供防潮密封或降低噪音。根据本发明的实施例的芯部凹槽因此也可以在饰面地板中使用，在该饰面地板中，上和下木饰面被胶粘到木基芯部如胶合板、HDF或刨花板上。
图6d显示，形成芯部凹槽19的方法也可以在实木地板中使用，在该实木地板中，芯部凹槽19优选地在镶板的长度方向上沿着纤维24在实木本体3中形成。木饰面板或薄木板可以用作覆盖层23，以便覆盖芯部凹槽19的开口25。这种木基覆盖层23可以具有例如0.5-1.0mm或以上的厚度，其也可以提供稳定性并可以抵消弯曲和翘曲。饰面的含水量可以适合于实木本体的含水量，以便当饰面或薄木板收缩时获得张力。
图6e示出具有实木的上层2和下层4的木基地板镶板。所述层可以由相互胶粘在一起的不同类型木材制成。下层4包括若干空腔26。上层可以形成这些空腔的上部部分27。空腔也可以在上层中形成，并且下层可以形成这些空腔的下部部分。
相互胶粘在一起的不同类型木材可以具有大致相同的厚度。锁定系统可以部分或全部地在下层4中形成。在下层4中还可以形成具有朝下的开口的芯部凹槽19。图6e中所示的实施例可以包括代替实木层的HDF板，其可以通过与上述相同的方式形成和胶粘在一起。这种组合芯部可以层压成常规的实心HDF板。此方法尤其适合用于厚度约为8-12mm的较厚层压镶板。
在实木中所形成的芯部凹槽或空腔提供了下述优点：即，实木地板的重量可以减少并可以得到增加的稳定性。
来自芯部凹槽或空腔的碎屑可以用于热能，或用来生产供其它粉末基地板或纤维基板块如颗粒板使用的木纤维。将木屑与粘结剂混合并生产人造木饰面板也是可行的，所述人造木饰面板可以作为单独的层被处理并胶粘到芯部凹槽的开口上。
在具有胶合板基芯部和饰面表面层的地板中可以使用相同的技术。
图7a示出包括若干旋转式锯片的工具20，其可以用来形成芯部凹槽19。
图7b示出具有若干水平偏置的雕刻齿20a-d的雕刻工具20。雕刻工具优选地在水平方向上固定，而镶板在与工具相对的进给方向FD上对着雕刻工具移动。每个雕刻齿都可以在HDF材料中雕刻约0.3-0.5mm。凹槽可以是V形或U形或甚至可以是具有内部部分的侧切部，该内部部分具有比开口更大的垂直于凹槽长度的水平延伸部分。
图8a-8c显示，通过适合于与大的板块分离的锁定系统可以达到进一步降低成本，所述大的板块具有搭接边缘OL和具有优选地通过雕刻工具20a、20b制成的非线性切口。图8a示出锁定系统，该锁定系统包括在同一边缘上的伸出的榫舌10和伸出的板条6。这种接头几何形状可以用于实现在切割镶板时和在形成锁定系统时所产生的废料W的显著减少。图8c显示，板条6的后侧6a可以形成为使得板条的后侧向上倾斜和使得板条的外部部分比内部部分更靠近表面。所有这些成形过程和废料都可以用来提供可以在镶板的上层或下层中使用的木纤维。
芯部凹槽可以与非线性分离和锁定系统相结合，其能将板块分成若干镶板，这些镶板具有的几何形状使得它们可以通过搭接的边缘定位在同一水平面HP中。
通过从其它地板镶板的芯部得到的木材形成整个地板镶板是可行的。仅需要将三聚氰胺粉末加到混合物中。上层可以比芯部更硬，因为在压制粉末混合物期间可以得到更高的密度。这些镶板可以形成为具有压花结构，并可以在工厂里施加涂料、喷漆或数字打印，或者在安装之后施加涂料和/或喷漆。

Claims (6)

1.一种建筑镶板(1，1’)，所述建筑镶板均具有在前侧上的表面层(2)、在后侧上的背衬层(4)、以及中间芯部(3)，其中，所述中间芯部以及表面层和背衬层都包括木纤维和热固性树脂，所述建筑镶板设有锁定系统，用于将第一建筑镶板(1)的第一边缘垂直和水平地锁定到第二建筑镶板(1’)的相邻的第二边缘，其中，处于锁定位置的第一边缘和第二边缘的上部部分一起限定了垂直于水平面(HP)的垂直面(VP)，所述水平面(HP)平行于表面层(2)，所述锁定系统包括构造为相互配合以实现垂直锁定的榫舌(10)和舌槽(9)，以及在第一边缘处的设有锁定元件(8)的板条(6)，该锁定元件(8)构造成与第二边缘中形成的向下开口的锁定槽(14)相互配合以实现水平锁定，其特征在于，背衬层(4)和中间芯部(3)包括至少两个具有朝向后侧的开口的垂直延伸的芯部凹槽(19)，其中芯部凹槽的深度(GD)是地板厚度(T)的至少0.3倍，背衬层的面积(A)小于表面层的面积(A’)的90％，至少一个芯部凹槽(19)的整个部分在所有边缘处均设置在垂直面VP内侧，所述芯部凹槽(19)覆盖有单独的覆盖层(23)。
2.如权利要求1所述的建筑镶板，其中，背衬层(4)包括与一对相对边缘处的锁定系统水平地和向内地间隔开的至少三个芯部凹槽(19)。
3.如权利要求1或2所述的建筑镶板，其中，背衬层的面积(A)小于表面层的面积(A’)的80％。
4.如权利要求1或2所述的建筑镶板，其中，所述建筑镶板是具有长边(1a，1b)和短边(1c，1d)的矩形，芯部凹槽(19)基本上与长边平行。
5.如权利要求1或2所述的建筑镶板，其中，芯部凹槽(19)包括开口，该开口具有大于凹槽的内部部分的凹槽宽度(GW)。
6.如权利要求1或2所述的建筑镶板，其中，背衬层(4)包括与芯部(3)相同类型的纤维。
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