CN104036828A - Heat-radiation membrane material - Google Patents
Heat-radiation membrane material Download PDFInfo
- Publication number
- CN104036828A CN104036828A CN201410205651.4A CN201410205651A CN104036828A CN 104036828 A CN104036828 A CN 104036828A CN 201410205651 A CN201410205651 A CN 201410205651A CN 104036828 A CN104036828 A CN 104036828A
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- heat
- endothermic reaction
- dissipation film
- film material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20472—Sheet interfaces
- H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D5/00—Devices using endothermic chemical reactions, e.g. using frigorific mixtures
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/02—Constructions of heat-exchange apparatus characterised by the selection of particular materials of carbon, e.g. graphite
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
- F28F21/081—Heat exchange elements made from metals or metal alloys
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Combustion & Propulsion (AREA)
- Thermotherapy And Cooling Therapy Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
本发明提供一种散热膜材，属于散热材料技术领域，其可解决现有的散热膜材散热方式较单一，在高热量或有火源的情况下散热效果不好的问题。本发明的散热膜材至少包括第一散热片和吸热反应模块；其中，所述第一散热片的一面与发热物体接触，另一面与所述吸热反应模块连接，所述吸热反应模块用于将所述发热物体产生的热量吸收。本发明可用于提高散热膜材的散热效果。
The invention provides a heat-dissipating membrane material, which belongs to the technical field of heat-dissipating materials, and can solve the problem that the existing heat-dissipating membrane material has a single heat dissipation method and poor heat dissipation effect under the condition of high heat or fire source. The heat dissipation film material of the present invention at least includes a first heat dissipation fin and an endothermic reaction module; wherein, one side of the first heat dissipation fin is in contact with a heat-generating object, and the other side is connected to the endothermic reaction module, and the endothermic reaction module It is used to absorb the heat generated by the heating object. The invention can be used to improve the heat dissipation effect of the heat dissipation film material.
Description
Technical Field
The invention belongs to the technical field of heat dissipation materials, and particularly relates to a heat dissipation film material.
Background
In many fields such as machinery, electronics, electric power, communication, chemical industry, in the course of processing, production and use of products, there are many situations that produce high temperature and high heat, and for some of them, if the produced heat can not be effectively dissipated through a certain heat dissipation mode (such as using a heat dissipation film), the production, processing and use of products and the life and health of people will be adversely affected, and even the life safety of people will be endangered.
At present, the heat dissipation materials widely used for heat dissipation film materials are generally metal materials, such as copper, aluminum, silver, etc., and the metal materials have good heat conductivity, and the heat conductivity is about 200-500W/m.k. Compared with the metal material, the graphite film and the graphene material prepared by using the carbon component have higher heat dissipation capacity, for example, the heat conductivity of the graphite film can reach 1500-1750W/m.K, and the heat conductivity of the graphene can reach 5000W/m.K.
In order to improve the heat dissipation effect of the heat dissipation film, in the prior art, the heat conductivity is generally improved by changing the material of the heat dissipation film (for example, replacing a material with poor heat dissipation capability with a material with better heat dissipation capability) or adjusting the components of the heat dissipation film (for example, replacing a metal with a single component with an alloy), so as to achieve the effect of improving the heat dissipation.
The inventor finds that at least the following problems exist in the prior art: the current heat dissipation film material generally achieves the effect of improving heat dissipation by improving the heat conductivity of the heat dissipation material. However, the heat dissipation film material is used for heat dissipation, the heat dissipation mode is single, and the heat dissipation effect is poor under the condition of high heat or fire sources.
Disclosure of Invention
The invention aims to solve the technical problems that the existing heat dissipation film material has a single heat dissipation mode and has poor heat dissipation effect under the condition of high heat or fire source, and provides a heat dissipation film material with various heat dissipation modes and good heat dissipation effect.
The technical scheme adopted for solving the technical problem of the invention is that the heat dissipation film material at least comprises a first heat dissipation sheet and an endothermic reaction module; one surface of the first radiating fin is in contact with a heating object, the other surface of the first radiating fin is connected with the endothermic reaction module, and the endothermic reaction module is used for absorbing heat generated by the heating object.
In the heat dissipation film material, one surface of the first heat dissipation sheet is in contact with a heating object, and the other surface of the first heat dissipation sheet is connected with the endothermic reaction module, and the endothermic reaction module is used for absorbing heat generated by the heating object. Therefore, when the heat dissipation film material is used for heat dissipation, the first heat dissipation film sheet dissipates heat in a heat conduction mode, and the endothermic reaction module absorbs heat to react, so that the heat dissipation effect can be achieved. Therefore, the heat dissipation film material has various heat dissipation modes and good heat dissipation effect, and is particularly suitable for the situation of generating high heat or having a fire source.
Preferably, the first heat sink and the endothermic reaction module are connected by a thermally conductive adhesive.
Preferably, the heat dissipation film further comprises a second heat dissipation fin arranged opposite to the first heat dissipation fin at an interval, wherein,
the endothermic reaction module is arranged between the first radiating fin and the second radiating fin and is connected with the second radiating fin through heat conducting glue.
Preferably, the endothermic reaction module includes at least one receiving chamber, and the receiving chamber contains an endothermic reaction material therein.
It is further preferred that the endothermic reaction material is an endothermic chemical reaction reversible material including: sodium bicarbonate or copper sulfate pentahydrate.
Further preferably, the endothermic reaction module includes one of the accommodation chambers,
and the accommodating cavity discharges reactants generated in the reaction of the endothermic reaction material out of the heat dissipation film material through the drainage conduit.
It is further preferred that the endothermic reaction module comprises a plurality of the accommodation chambers,
any two adjacent containing chambers are communicated through a heat-resistant conduit, and one containing chamber in the containing chambers is also connected with a drainage conduit and used for discharging reactants generated in the reaction of the endothermic reaction materials out of the heat dissipation film material.
It is further preferred that the material of the heat resistant conduit is metal.
Still further preferably, the metal is any one or more of copper, aluminum, and silver.
It is still further preferred that the material of the drain conduit is a metallic material.
Still further preferably, the metal is any one or more of copper, aluminum, and silver.
More preferably, the material of the first heat sink, the second heat sink and the accommodating chamber is any one of metal, graphite film and graphene.
Still more preferably, the metal is any one or more of copper, aluminum and silver.
Drawings
Fig. 1 is a schematic structural view of a heat dissipation film according to embodiment 1 of the present invention;
fig. 2 is an AA-direction cross-sectional view of a heat-dissipating film according to example 1 of the present invention.
Wherein the reference numerals are: 1. a first heat sink; 2. a second heat sink; 3. an accommodating chamber; 4. a heat resistant conduit; 5. a drainage conduit.
Detailed Description
In order to make the technical solutions of the present invention better understood, the present invention will be described in further detail with reference to the accompanying drawings and specific embodiments. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the invention without any inventive step, are within the scope of protection of the invention.
Example 1:
the embodiment provides a heat dissipation membrane material, is applicable to and dispels the heat to product or components and parts etc.. As shown in fig. 1 and 2, the heat dissipation film of the present embodiment includes a first heat sink 1 and an endothermic reaction module; one surface of the first heat sink 1 is in contact with a heat generating object, and the other surface is in contact with an endothermic reaction module, which is used for absorbing heat generated by the heat generating object.
It should be noted that, the material of the first heat sink 1 is generally a material with high thermal conductivity, and when the heat generating object is in contact with the first heat sink 1, the heat generated by the heat generating object can be well dissipated through the first heat sink 1.
The heat dissipation film material of the present embodiment not only has the first heat dissipation sheet 1, but also has the endothermic reaction module on the first heat dissipation sheet structure, and the two cooperate to effectively dissipate the heat generated by the heating object. Specifically, when the heat generating body generates a certain amount of heat, the first heat sink 1 has good thermal conductivity, so that the heat generated by the heat generating body can be transferred to the endothermic reaction module through the first heat sink 1, and the endothermic reaction module absorbs the heat well, thereby achieving the purpose of dissipating heat from the heat generating body.
The first radiating fin 1 and the endothermic reaction module are preferably connected through heat conducting glue, the heat conducting glue can be used for fixedly connecting the first radiating fin 1 and the endothermic reaction module, and meanwhile, the heat conducting glue also has good heat conducting performance, so that heat generated by a heating object can be well transferred to the endothermic reaction module through the first radiating fin 1, and the purpose of radiating heat is achieved. Of course, the first heat sink 1 and the endothermic reaction module may be formed as a single body, that is, the endothermic reaction module is formed at the same time as the first heat sink 1 is formed during the manufacturing process, and the first heat sink 1 and the endothermic reaction module are in complete contact with each other.
Preferably, the heat dissipation film material of the present embodiment further includes a second heat sink 2, wherein the first heat sink 1 and the second heat sink 2 are arranged at an interval; the endothermic reaction module is arranged between the first radiating fin 1 and the second radiating fin 2 and is connected with the second radiating fin 2 through heat conducting glue. Because the endothermic reaction module is arranged between the first radiating fin 1 and the second radiating fin 2, after the endothermic reaction module absorbs heat generated by a certain heating object, the redundant heat can be further dissipated through the second radiating fin 2, and the radiating effect can be further improved by the radiating film material with the structure.
In the present embodiment, the first heat sink 1 and the second heat sink 2 may be made of a material having high thermal conductivity, for example, a graphene material or a graphite film material having excellent thermal conductivity may be preferably used, or a metal material such as copper, aluminum, or silver may be preferably used. Wherein the first and second heat sinks 1 and 2 may be connected to form an integral structure by using a heat conductive adhesive having high temperature resistance in an adhesive manner or by a hot pressing manner.
The endothermic reaction module in the heat dissipation film material of the present embodiment includes at least one accommodating chamber 3, and endothermic reaction materials are contained in the accommodating chamber 3. The endothermic reaction material is a material whose endothermic chemical reaction is reversible, and the material whose endothermic chemical reaction is reversible includes: sodium bicarbonate or copper sulfate pentahydrate.
Specifically, when the endothermic reaction material is sodium bicarbonate, sodium bicarbonate (NaHCO)3) Upon heating, the following reactions occur: 2NaHCO3→Na2CO3+H2O+CO2The reaction, while absorbing heat, produces water and carbon dioxide gasThe water and the carbon dioxide gas which are generated have the same effects of absorbing heat or extinguishing the fire source to the heat or the fire source generating the heat, so that the heat dissipation effect of the heat dissipation film material is improved. Accordingly, it is further preferable that an opening (not shown in the drawings) is further formed on a side surface of the accommodating chamber 3 to release a reactant generated when the endothermic reaction material reacts, thereby further improving a heat dissipation effect.
The endothermic reaction material contained in the containing chamber 3 may also preferably be copper sulfate pentahydrate. The copper sulfate pentahydrate reacts upon heating as follows: CuSO4·5H2O＝CuSO4+5H20, the reaction absorbs heat and generates water, and the generated water has the same heat absorption effect or fire source extinguishing effect on heat or a fire source generating heat, so that the heat dissipation effect of the heat dissipation film material is improved; and another product CuSO produced by the reaction4The heat dissipation film material can absorb moisture to generate copper sulfate pentahydrate at normal temperature, so that the heat dissipation film material achieves the effect of recycling, and the applicability of the heat dissipation film material is improved.
It should be noted that, in this embodiment, only sodium bicarbonate and copper sulfate pentahydrate are taken as examples for illustration, but the material with reversible endothermic chemical reaction is not limited to these two materials, and other materials with reversible endothermic chemical reaction are also possible, which are not described in detail herein.
As a case of this embodiment, the endothermic reaction module includes an accommodating chamber 3, and the accommodating chamber 3 discharges a reactant generated when the endothermic reaction material reacts out of the heat dissipation film material through a drainage conduit 5. Through the above chemical reaction, it can be understood that the reactant generated during the reaction of the endothermic reaction material includes moisture (liquid) and gas, and the moisture (liquid) and the gas will have a certain influence on the heat dissipation film material itself, and at this time, the reactant generated during the reaction of the endothermic reaction material can be discharged from the heat dissipation film material through the drainage conduit 5, so as to affect the performance of the heat dissipation film material itself.
As another situation of this embodiment, since the sizes of the heat dissipation film materials are different, the number of the accommodating chambers 3 may be set according to the sizes of the heat dissipation film materials, when the size of the heat dissipation film material is larger, the endothermic reaction module includes a plurality of the accommodating chambers 3, at this time, any two adjacent accommodating chambers 3 are communicated through the heat-resistant conduit 4, and one accommodating chamber 3 of the plurality of accommodating chambers 3 is further connected with the drainage conduit 5, for discharging the reactant generated during the reaction of the endothermic reaction material out of the heat dissipation film material. The heat dissipation principle of this kind of structure is similar with the above-mentioned principle that has an accommodation chamber 3, just for simple structure, with each accommodation chamber 3 through heat-resisting pipe intercommunication, the produced reactant of taking place the chemical reaction in each accommodation chamber 3 at this moment joins together through the heat-resisting pipe 4 that is used for each accommodation chamber 3 intercommunication, and the reactant after the rethread drains all endothermic reaction material chemical reaction through a drain pipe 5.
More preferably, the heat-resistant conduit 4 and the drain conduit 5 are both made of a metal material, and still more preferably a metal material such as copper, aluminum, or silver. And the heat-resistant conduit 4 and the drain conduit 5 are both connected with the accommodating chamber 3 by welding or chemical means.
The shape of the accommodating chamber 3 may be a rectangular parallelepiped shape, an ellipsoidal shape, or any other shape, and the shape of the accommodating chamber 3 is not particularly limited in this embodiment. The accommodating chamber 3 may be made of a material having a good heat conduction performance, and preferably, the accommodating chamber 3 is made of any one of metal, a graphite film, and graphene. In order to simplify the production process and reduce the production cost, the material of the accommodating chamber 3 is preferably any one or more of copper, aluminum and silver, and more preferably, the accommodating chamber 3 is made of metallic copper.
When the not unidimensional heat dissipation membrane material of needs, can splice the multi-disc heat dissipation membrane material, link together the two through the mode of hot pressing in the edge of each adjacent two heat dissipation membrane materials promptly to obtain the not unidimensional heat dissipation membrane material.
The heat dissipation film material of the embodiment includes the first heat sink 1 and may further include the second heat sink 2, and the endothermic reaction module is disposed on the first heat sink 1 or between the first heat sink 1 and the second heat sink 2, so that when the heat dissipation film material of the embodiment is used for heat dissipation, the endothermic reaction module absorbs heat to perform a reaction while the first heat dissipation film and the second heat sink 2 perform heat dissipation in a heat conduction manner, and may also perform a heat dissipation function. Therefore, the heat dissipation film material has various heat dissipation modes and good heat dissipation effect, and is particularly suitable for the situation of generating high heat or having a fire source.
It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
Claims (13)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410205651.4A CN104036828A (en) | 2014-05-15 | 2014-05-15 | Heat-radiation membrane material |
| US14/568,659 US20150330698A1 (en) | 2014-05-15 | 2014-12-12 | Heat-dissipation film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410205651.4A CN104036828A (en) | 2014-05-15 | 2014-05-15 | Heat-radiation membrane material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104036828A true CN104036828A (en) | 2014-09-10 |
Family
ID=51467567
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410205651.4A Pending CN104036828A (en) | 2014-05-15 | 2014-05-15 | Heat-radiation membrane material |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20150330698A1 (en) |
| CN (1) | CN104036828A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109411428A (en) * | 2018-10-10 | 2019-03-01 | 李汝和 | A kind of high efficiency and heat radiation package metals shell of chip |
| CN114129905A (en) * | 2021-12-08 | 2022-03-04 | 固安翌光科技有限公司 | Thermoelectric power generation heat dissipation module, phototherapy device comprising thermoelectric power generation heat dissipation module and phototherapy method |
| CN115281928A (en) * | 2022-08-15 | 2022-11-04 | 王雪峰 | Device for adjusting temperature of underpants |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109378554A (en) * | 2018-12-04 | 2019-02-22 | 无锡睿米信息技术有限公司 | A vacuum cleaner power supply device and a vacuum cleaner using the same |
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| US20030079861A1 (en) * | 2001-03-03 | 2003-05-01 | Zalman Tech Co., Ltd. | Heatsink and heatsink device using the heatsink |
| CN1484254A (en) * | 2002-09-19 | 2004-03-24 | ������������ʽ���� | electronic device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114129905A (en) * | 2021-12-08 | 2022-03-04 | 固安翌光科技有限公司 | Thermoelectric power generation heat dissipation module, phototherapy device comprising thermoelectric power generation heat dissipation module and phototherapy method |
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| CN115281928A (en) * | 2022-08-15 | 2022-11-04 | 王雪峰 | Device for adjusting temperature of underpants |
Also Published As
| Publication number | Publication date |
|---|---|
| US20150330698A1 (en) | 2015-11-19 |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20140910 |
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| RJ01 | Rejection of invention patent application after publication |