CN203276154U

CN203276154U - Efficient heat dissipation device of computer CPU

Info

Publication number: CN203276154U
Application number: CN201320314510.7U
Authority: CN
Inventors: 汪凤兰
Original assignee: Individual
Current assignee: Individual
Priority date: 2013-05-27
Filing date: 2013-05-27
Publication date: 2013-11-06
Anticipated expiration: 2023-05-27

Abstract

A high-efficiency heat dissipation device for a computer CPU effectively solves the problems of slow heat dissipation and poor heat dissipation effect of the existing computer CPU heat dissipation device. It includes a heat conduction block in contact with the CPU, at least two chip heat sinks, and a first heat dissipation fan. At least two heat pipes arranged in parallel, at least two heat dissipation ribs arranged in parallel with each other, a second heat dissipation fan, and at least two pipe grooves corresponding to each heat pipe respectively in the transverse direction are arranged on the upper part of the heat conduction block, and the evaporation of each heat pipe The ends of the heat pipes are fixedly arranged in each pipe groove, and the cooling ends of each heat pipe pass through each heat dissipation fin in turn, and are fixedly connected with each heat dissipation fin, and each heat pipe is equipped with a heat transfer medium; at least two chip heat sinks are mutually Parallel and vertically arranged on each pipe groove, a first heat dissipation fan is installed horizontally above each chip heat sink, and a second heat dissipation fan is vertically arranged between the outside of the outermost heat dissipation fin and the inside of the heat dissipation air outlet of the chassis .

Description

A kind of efficient radiating apparatus of computer CPU

Technical field

The utility model relates to a kind of efficient radiating apparatus that dispels the heat for CPU in computer cabinet.

Background technology

CPU is the central processing unit of computing machine, is also the core parts of computing machine, and in the calculating process of computing machine, CPU can produce a large amount of heats, in order to make in time cooling, normal operation of CPU, heat abstractor is installed on CPU is usually dispelled the heat.Yet along with the fast development of infotech, the arithmetic speed of CPU improves constantly, and the heat that produces during computing also increases thereupon, if dispel the heat the problem such as insufficiently can cause that computing power is limited, deadlock, comfort are low.

The CPU heat abstractor that present industry is used is to adopt heat-conducting block, heat radiator, radiator fan mostly, heat-conducting block transfers heat to heat radiator, by radiator fan, heat radiator being absorbed heat dispels, but the radiating efficiency of this heat abstractor still is restricted, and has the problem that radiating rate is slow, heat radiation is insufficient, radiating effect is relatively poor.

The utility model content

The purpose of this utility model is to provide a kind of efficient radiating apparatus of computer CPU, effectively solves the problem that the heat abstractor radiating rate is slow, radiating effect is poor of the CPU of active computer.

the technical solution adopted in the utility model is: comprise the contacted heat-conducting block with CPU, at least two chip heat radiator, the first radiator fan, also comprise at least two heat pipes that are arranged in parallel, at least two radiated ribs that are arranged parallel to each other, the second radiator fan, be provided with on heat-conducting block top with each heat pipe is corresponding respectively and laterally be parallel to each other, at least two tube seats, the evaporation ends correspondence of each heat pipe is fixedly installed in each tube seat, the colling end of each heat pipe all passes each radiated rib successively, and be fixedly connected with each radiated rib, heat transfer medium all is housed in each heat pipe, at least two chip heat radiator are parallel to each other and vertically are arranged in each above tube seat, in each chip cooling sheet upper horizontal, the first radiator fan is installed, vertically is provided with the second radiator fan between the outside of outermost radiated rib and case radiation air outlet inboard.

For guaranteeing fixed effect preferably, and be conducive to heat radiation, the evaporation ends of each heat pipe is bonded in each tube seat by the heat conductive silica gel correspondence.

For guaranteeing fixed effect preferably, and be conducive to heat radiation, pass through heat conductive silica gel between the colling end of each heat pipe and each radiated rib bonding.

Stable for ensureing, efficient radiating efficiency, heat pipe adopt constant temperature controllable type heat pipe.

Has the coefficient of heat conductivity that obviously is better than common fluid because of nano-fluid, for ensureing higher heat transfer efficiency, the fluid media (medium) that heat transfer medium is comprised of water and ferroferric oxide nano granules.

Good effect of the present utility model is: adopt " heat pipe " element, namely fill with heat transfer medium and utilize the decalescence of heat transfer medium and the high efficient heat exchanging element that heat interchange is carried out in heat release in the shell of sealing, hot pipe technique takes full advantage of the Rapid Thermal hereditary property of heat-conduction principle and heat transfer medium, be delivered to rapidly outside thermal source through the heat of heat pipe with thermal objects, play the rapidly and efficiently effect of refrigeration.The utility model one-piece construction is simple, reasonable in design, on the one hand by chip cooling sheet, radiator fan heat radiation, rely on the other hand the phase transformation of inside heat pipe heat transfer medium to realize conducting heat, heat-transfer capability is strong, reliable, noiselessness, the more heats of large conduction of can trying one's best in limited room and time, have that radiating efficiency is high, rapid heat dissipation, characteristics that environmental suitability is strong, can satisfy the heat radiation requirement of high-performance computer CPU, make CPU can stablize, work.

Description of drawings

Fig. 1 is one-piece construction schematic diagram of the present utility model (heat pipe is longer, omissive representation);

Fig. 2 is the vertical view (vertical view after dismounting the first radiator fan) of Fig. 1.

Embodiment

As shown in Figure 1 and Figure 2, the utility model comprises and the contacted heat-conducting block 4 of CPU6, two chip heat radiator 2, the first radiator fan 1 at least, at least two heat pipes that are arranged in parallel 5, at least two radiated ribs that are arranged parallel to each other 7, the second radiator fan 8.

As shown in Figure 1, 2, heat-conducting block 4 lower surfaces closely are connected to above CPU6, be provided with in heat-conducting block 4 upper surfaces with each heat pipe 5 respectively corresponding, horizontally set and be parallel to each other, at least two tube seats 3, the corresponding heat conductive silica gel fixed bonding that passes through of the evaporation ends of each heat pipe 5 is in each tube seat 3, the colling end of each heat pipe 5 all passes each radiated rib 7 successively, and bonding or adopt other modes to be fixedly connected with by heat conductive silica gel between each colling end and each radiated rib 7, the interior heat transfer medium 10 that all is equipped with of each heat pipe 5; At least two chip heat radiator 2 are parallel to each other and vertically are arranged in each above tube seat 3, and be fixedly connected with heat-conducting block 4 upper surfaces, in each chip cooling sheet 2 upper horizontal, the first radiator fan 1 is installed, between the outside of outermost radiated rib 7 and case radiation air outlet 9 inboards, the second radiator fan 8 is installed vertically.Each heat pipe 5 all adopts constant temperature controllable type heat pipe, heat transfer medium 10 is preferably the nano-fluid medium that is comprised of water and ferroferric oxide nano granules, namely take water as base fluid, add ferroferric oxide nano granules, the volume of this fluid media (medium) accounts for the 15-25% of heating pipe cavity volume.

as Fig. 1, shown in 2, radiating principle of the present utility model is: when computing machine normally moves, the heat that CPU6 produces passes to heat-conducting block 4, a part of heat of heat-conducting block 4 passes to the evaporator section of the heat pipe 5 that is positioned at each heat pipe 5 left parts fast, make the heat transfer medium 10 heat absorption vaporizations in heat pipe 5 evaporator sections, under the effect of pressure reduction, the steam Rapid Flow is to the condensation segment of heat pipe 5 right parts, by each radiated rib 7 and the second radiator fan 8, that heat is quick through case radiation air outlet 9, efficiently be discharged in the computing machine external environment condition and go, under the liquid-sucking core capillary suction force effect of heat pipe 5 inner walls, the evaporator section that heat transfer medium 10 in heat pipe 5 condensation segments flows back to heat pipe 5 continues to absorb heat, carburation by evaporation again after being heated, so circulation, heat constantly is transported to the low temperature place from high temperature, another part heat of heat-conducting block 4 passes to each chip cooling sheet 2 of heat-conducting block 4 tops, is dispelled the heat of chip cooling sheet 2 by the first radiator fan 1.

Claims

1. A high-efficiency cooling device for a computer CPU, comprising a thermal block (4) in contact with the CPU (6), at least two chip cooling fins (2), the first cooling fan (1), characterized in that: also includes At least two heat pipes (5) arranged in parallel, at least two heat dissipation fins (7) arranged in parallel to each other, a second heat dissipation fan (8), and the upper part of the heat conduction block (4) are provided with corresponding heat pipes (5) respectively. At least two pipe grooves (3) parallel to each other in the transverse direction, the evaporation ends of each heat pipe (5) are correspondingly fixed in each pipe groove (3), and the cooling ends of each heat pipe (5) pass through each heat dissipation rib in turn fins (7), and are fixedly connected with each cooling rib (7), each heat pipe (5) is equipped with a heat transfer medium (10); at least two chip cooling fins (2) are parallel to each other and vertically arranged on each Above the pipe groove (3), a first heat dissipation fan (1) is installed horizontally above each chip heat sink (2), between the outside of the outermost heat dissipation fin (7) and the inside of the chassis heat dissipation air outlet (9). A second cooling fan (8) is vertically arranged.

2. A high-efficiency cooling device for a computer CPU according to claim 1, characterized in that: the evaporation ends of each heat pipe (5) are correspondingly bonded in each pipe groove (3) through heat-conducting silica gel.

3. A high-efficiency heat dissipation device for a computer CPU according to claim 1, characterized in that: the cooling end of each heat pipe (5) and each heat dissipation fin (7) are bonded by heat-conducting silica gel.

4. A high-efficiency cooling device for a computer CPU according to claim 1, characterized in that: the heat pipe (5) adopts a constant temperature controllable heat pipe.

5. A high-efficiency cooling device for a computer CPU according to claim 1, characterized in that: the heat transfer medium (10) is a fluid medium composed of water and ferroferric oxide nanoparticles.