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BRPI0819387A2 - Composição termofixa, produto termofixo, uso do produto termofixo e método para confeccionar um produto termofixo - Google Patents

Composição termofixa, produto termofixo, uso do produto termofixo e método para confeccionar um produto termofixo

Info

Publication number
BRPI0819387A2
BRPI0819387A2 BRPI0819387A BRPI0819387A2 BR PI0819387 A2 BRPI0819387 A2 BR PI0819387A2 BR PI0819387 A BRPI0819387 A BR PI0819387A BR PI0819387 A2 BRPI0819387 A2 BR PI0819387A2
Authority
BR
Brazil
Prior art keywords
thermosetting
product
thermosetting product
making
composition
Prior art date
Application number
Other languages
English (en)
Inventor
Ludovic Valette
Bernd Hoevel
Patricia L Roberts
Original Assignee
Dow Global Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Global Technologies Inc filed Critical Dow Global Technologies Inc
Publication of BRPI0819387A2 publication Critical patent/BRPI0819387A2/pt
Publication of BRPI0819387B1 publication Critical patent/BRPI0819387B1/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4215—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof cycloaliphatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/10—Block- or graft-copolymers containing polysiloxane sequences
    • C08L83/12—Block- or graft-copolymers containing polysiloxane sequences containing polyether sequences
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
    • Y10T428/24994—Fiber embedded in or on the surface of a polymeric matrix

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
BRPI0819387A 2007-12-18 2008-12-03 composição termofixa, produto termofixo, uso do produto termofixo e método para confeccionar um produto termofixo BRPI0819387B1 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US1456007P 2007-12-18 2007-12-18
PCT/US2008/085325 WO2009079205A1 (en) 2007-12-18 2008-12-03 Thermosetting compositions comprising silicone polyethers, their manufacture, and uses

Publications (2)

Publication Number Publication Date
BRPI0819387A2 true BRPI0819387A2 (pt) 2015-05-05
BRPI0819387B1 BRPI0819387B1 (pt) 2018-11-13

Family

ID=40343480

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0819387A BRPI0819387B1 (pt) 2007-12-18 2008-12-03 composição termofixa, produto termofixo, uso do produto termofixo e método para confeccionar um produto termofixo

Country Status (8)

Country Link
US (1) US8535793B2 (pt)
EP (1) EP2225311B1 (pt)
JP (1) JP5571568B2 (pt)
KR (1) KR101513005B1 (pt)
CN (1) CN101903440B (pt)
BR (1) BRPI0819387B1 (pt)
TW (1) TW200936700A (pt)
WO (1) WO2009079205A1 (pt)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102007167A (zh) * 2008-02-15 2011-04-06 陶氏环球技术公司 包含有机硅聚醚的热固性组合物，及其制备和用途
US8722798B2 (en) 2009-03-09 2014-05-13 Leiming Ji Thermosettable composition containing a combination of an amphiphilic block copolymer and a polyol and a thermoset product therefrom
BR112012024852A2 (pt) * 2010-03-31 2016-06-14 Dow Global Technologies Llc composição curável e processo para preparar uma composição curável
JP6403988B2 (ja) * 2014-05-16 2018-10-10 積水化学工業株式会社 硬化性樹脂組成物、及び、樹脂硬化物
KR102146996B1 (ko) * 2017-12-29 2020-08-21 삼성에스디아이 주식회사 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 사용하여 밀봉된 반도체 소자
KR102905579B1 (ko) * 2022-04-22 2025-12-31 엘레 코포레이션 아크릴레이트 관능기를 갖는 선형 블록 공중합체 강인화제
JP2025105144A (ja) * 2023-12-28 2025-07-10 味の素株式会社 樹脂組成物

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4052495A (en) * 1975-05-19 1977-10-04 Dow Corning Corporation Method of obtaining release of polyurethane polymers and compositions therefor
US4546154A (en) * 1983-05-23 1985-10-08 Ici Americas Inc. Process for forming mold releasable polyurethane, polyurea and polyureaurethane resins using isocyanate reactive polysiloxanes as internal mold release agents
KR900006033B1 (ko) * 1987-05-30 1990-08-20 고려화학 주식회사 저응력화 변성제 제조방법 및 본 변성제를 함유한 반도체 봉지용 에폭시수지 조성물
JPH01108255A (ja) 1987-10-20 1989-04-25 Shin Etsu Chem Co Ltd 硬化性エポキシ樹脂組成物
JPH0623236B2 (ja) 1988-05-26 1994-03-30 松下電工株式会社 エポキシ樹脂組成物
US5064881A (en) * 1989-01-18 1991-11-12 Mitsui Petrochemical Industries, Ltd. Epoxy resin composition and semiconductor sealing material comprising same based on spherical silica
JP3341168B2 (ja) * 1992-10-09 2002-11-05 大原パラヂウム化学株式会社 接着剤組成物
US5389140A (en) * 1992-10-30 1995-02-14 Kansai Paint Co., Ltd. Electrodeposition paint composition
CA2131048C (en) * 1993-09-17 2006-01-31 Michael F. Hurley Process for the preparation of filled urethane-based reinforced moldings and the resultant products
US5684074A (en) * 1994-10-25 1997-11-04 Central Glass Company, Limited Fluorine-containing coating composition
JPH09249809A (ja) * 1996-03-19 1997-09-22 Yoshikazu Yugaki 埋没物の保存用樹脂組成物および保存方法
JP3320609B2 (ja) 1996-04-23 2002-09-03 住友ベークライト株式会社 半導体封止用エポキシ樹脂組成物
JPH1045872A (ja) * 1996-05-31 1998-02-17 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物
JP3964481B2 (ja) * 1996-10-01 2007-08-22 関西ペイント株式会社 陽極アルミニウム材用艶消しアニオン型電着塗料
JPH10158473A (ja) * 1996-12-03 1998-06-16 Hitachi Chem Co Ltd 光半導体素子封止用エポキシ樹脂組成物、及び該エポキシ樹脂組成物を用いて封止された光半導体装置
JP3731960B2 (ja) * 1996-12-26 2006-01-05 住友ベークライト株式会社 エポキシ樹脂組成物
JP3475792B2 (ja) 1998-06-25 2003-12-08 松下電工株式会社 多重モールド半導体装置の内層封止用エポキシ樹脂組成物及び多重モールド半導体装置
EP1195083B1 (en) * 1999-07-08 2006-01-11 Sunstar Giken Kabushiki Kaisha Underfilling material for semiconductor package
DE10002726A1 (de) 2000-01-22 2001-08-02 Goldschmidt Ag Th Verwendung von Polyoxyalkylen-modifizierten Polyhydrogenmethylorganosiloxanen
US6498260B2 (en) * 2000-03-29 2002-12-24 Georgia Tech Research Corp. Thermally degradable epoxy underfills for flip-chip applications
WO2003029353A1 (en) 2001-09-25 2003-04-10 Hitachi Chemical Co., Ltd. Thermosetting resin composition with low thermal expansion and resin film
JP2003336207A (ja) 2002-05-22 2003-11-28 Yoshikazu Yugaki 透水性構造体及びその製造法
JP3912515B2 (ja) 2002-07-18 2007-05-09 信越化学工業株式会社 液状エポキシ樹脂組成物及び半導体装置
US8216673B2 (en) * 2005-08-03 2012-07-10 Nissin Chemical Industry Co., Ltd. Glass fiber-treating agent and glass fiber-treating composition
CN102007167A (zh) * 2008-02-15 2011-04-06 陶氏环球技术公司 包含有机硅聚醚的热固性组合物，及其制备和用途

Also Published As

Publication number Publication date
KR101513005B1 (ko) 2015-04-17
BRPI0819387B1 (pt) 2018-11-13
US20100311891A1 (en) 2010-12-09
CN101903440A (zh) 2010-12-01
JP2011506750A (ja) 2011-03-03
EP2225311A1 (en) 2010-09-08
KR20100113489A (ko) 2010-10-21
TW200936700A (en) 2009-09-01
US8535793B2 (en) 2013-09-17
WO2009079205A1 (en) 2009-06-25
JP5571568B2 (ja) 2014-08-13
EP2225311B1 (en) 2015-07-15
CN101903440B (zh) 2014-09-03

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Legal Events

Date Code Title Description
B07A Application suspended after technical examination (opinion) [chapter 7.1 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 03/12/2008, OBSERVADAS AS CONDICOES LEGAIS.

B21F Lapse acc. art. 78, item iv - on non-payment of the annual fees in time

Free format text: REFERENTE A 12A ANUIDADE.

B24J Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12)

Free format text: EM VIRTUDE DA EXTINCAO PUBLICADA NA RPI 2606 DE 15-12-2020 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDA A EXTINCAO DA PATENTE E SEUS CERTIFICADOS, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.