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BR9911572A - Composições de resina de termofixação fotopolimerizáveis - Google Patents

Composições de resina de termofixação fotopolimerizáveis

Info

Publication number
BR9911572A
BR9911572A BR9911572-7A BR9911572A BR9911572A BR 9911572 A BR9911572 A BR 9911572A BR 9911572 A BR9911572 A BR 9911572A BR 9911572 A BR9911572 A BR 9911572A
Authority
BR
Brazil
Prior art keywords
light
c12alkyl
benzoyl
unsubstituted
phenyl
Prior art date
Application number
BR9911572-7A
Other languages
English (en)
Inventor
Hidetaka Oka
Masaki Ohwa
Akira Matsumoto
Hisatoshi Kura
Original Assignee
Ciba Sc Holding Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ciba Sc Holding Ag filed Critical Ciba Sc Holding Ag
Publication of BR9911572A publication Critical patent/BR9911572A/pt

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C251/00—Compounds containing nitrogen atoms doubly-bound to a carbon skeleton
    • C07C251/32—Oximes
    • C07C251/62—Oximes having oxygen atoms of oxyimino groups esterified
    • C07C251/64—Oximes having oxygen atoms of oxyimino groups esterified by carboxylic acids
    • C07C251/66—Oximes having oxygen atoms of oxyimino groups esterified by carboxylic acids with the esterifying carboxyl groups bound to hydrogen atoms, to acyclic carbon atoms or to carbon atoms of rings other than six-membered aromatic rings
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D207/00—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom
    • C07D207/02—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom with only hydrogen or carbon atoms directly attached to the ring nitrogen atom
    • C07D207/30—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom with only hydrogen or carbon atoms directly attached to the ring nitrogen atom having two double bonds between ring members or between ring members and non-ring members
    • C07D207/32—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom with only hydrogen or carbon atoms directly attached to the ring nitrogen atom having two double bonds between ring members or between ring members and non-ring members with only hydrogen atoms, hydrocarbon or substituted hydrocarbon radicals, directly attached to ring carbon atoms
    • C07D207/33—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom with only hydrogen or carbon atoms directly attached to the ring nitrogen atom having two double bonds between ring members or between ring members and non-ring members with only hydrogen atoms, hydrocarbon or substituted hydrocarbon radicals, directly attached to ring carbon atoms with substituted hydrocarbon radicals, directly attached to ring carbon atoms
    • C07D207/335—Radicals substituted by nitrogen atoms not forming part of a nitro radical
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D209/00—Heterocyclic compounds containing five-membered rings, condensed with other rings, with one nitrogen atom as the only ring hetero atom
    • C07D209/56—Ring systems containing three or more rings
    • C07D209/80—[b, c]- or [b, d]-condensed
    • C07D209/82—Carbazoles; Hydrogenated carbazoles
    • C07D209/86—Carbazoles; Hydrogenated carbazoles with only hydrogen atoms, hydrocarbon or substituted hydrocarbon radicals, directly attached to carbon atoms of the ring system
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D401/00—Heterocyclic compounds containing two or more hetero rings, having nitrogen atoms as the only ring hetero atoms, at least one ring being a six-membered ring with only one nitrogen atom
    • C07D401/02—Heterocyclic compounds containing two or more hetero rings, having nitrogen atoms as the only ring hetero atoms, at least one ring being a six-membered ring with only one nitrogen atom containing two hetero rings
    • C07D401/04—Heterocyclic compounds containing two or more hetero rings, having nitrogen atoms as the only ring hetero atoms, at least one ring being a six-membered ring with only one nitrogen atom containing two hetero rings directly linked by a ring-member-to-ring-member bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K9/00—Tenebrescent materials, i.e. materials for which the range of wavelengths for energy absorption is changed as a result of excitation by some form of energy
    • C09K9/02—Organic tenebrescent materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Materials For Photolithography (AREA)
  • Epoxy Resins (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Polymerisation Methods In General (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

Patente de Invenção: <B>"COMPOSIçõES DE RESINA DE TERMOFIXAçãO FOTOPOLIMERIZáVEIS"<D>. A invenção refere-se a composições que compreendem <B>(A)<D> um oligómero ou polímero que contém pelo menos um grupo ácido carboxílico na molécula; <B>(B)<D> pelo menos um composto de fórmula I, II, III, IV, V ou VI R~ 1~ entre outros é fenila ou alquila; R~ 2~ é por exemplo C~ 2~-C~ 12~alcanoíla que é não-substituída ou substituída ou é benzila; <B>R~ 3~, R~ 4~, R~ 5~, R~ 6~<D> e <B>R~ 7~<D>, independentemente um do outro, são por exemplo hidrogênio, C~ 1~-C~ 12~alquila, cicloexila ou fenila que é não-substituída ou substituída, ou são benzila, benzoíla, C~ 1~-C~ 12~alcanoíla ou fenoxicarbonila; <B>R~ 8~<D> é por exemplo hidrogênio ou C~ 1~-C~ 12~alquila ou um grupo<B>[<D>é por exemplo C~ 2~-C~ 12~alquileno, cicloexileno ou fenileno; <B>M~ 1~<D> entre outros é uma ligação direta ou C~ 1~-C~ 12~alquilenóxi; e <B>Ar<D> é um anel heterocíclico aromático de 5 ou 6 membros; <B>(C)<D> um diluente reativo ou não-reativo fotopolimerizável; e <B>(D)<D> como componente de termofixação um composto de epóxi que contém pelo menos dois grupos epóxi em uma molécula; sendo altamente adequadas como revestimentos que são reveláveis em meio alcalino.
BR9911572-7A 1998-06-26 1999-06-18 Composições de resina de termofixação fotopolimerizáveis BR9911572A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP98810596 1998-06-26
PCT/EP1999/004234 WO2000000869A1 (en) 1998-06-26 1999-06-18 Photopolymerizable thermosetting resin compositions

Publications (1)

Publication Number Publication Date
BR9911572A true BR9911572A (pt) 2001-03-20

Family

ID=8236164

Family Applications (1)

Application Number Title Priority Date Filing Date
BR9911572-7A BR9911572A (pt) 1998-06-26 1999-06-18 Composições de resina de termofixação fotopolimerizáveis

Country Status (13)

Country Link
US (1) US6485885B1 (pt)
EP (1) EP1095313B1 (pt)
JP (1) JP2002519732A (pt)
KR (1) KR100563019B1 (pt)
CN (1) CN1203374C (pt)
AT (1) ATE388426T1 (pt)
AU (1) AU751966B2 (pt)
BR (1) BR9911572A (pt)
CA (1) CA2333365A1 (pt)
DE (1) DE69938305T2 (pt)
MY (1) MY121423A (pt)
TW (1) TW484034B (pt)
WO (1) WO2000000869A1 (pt)

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WO2002100903A1 (en) * 2001-06-11 2002-12-19 Ciba Specialty Chemicals Holding Inc. Oxime ester photoinitiators having a combined structure
SG100761A1 (en) * 2001-09-28 2003-12-26 Nanya Plastics Corp Photosensitive thermosetting resin composition
KR101032582B1 (ko) * 2002-12-03 2011-05-06 시바 홀딩 인크 헤테로방향족 그룹을 갖는 옥심 에스테르 광개시제
JP4595374B2 (ja) * 2003-04-24 2010-12-08 住友化学株式会社 黒色感光性樹脂組成物
JP4437651B2 (ja) 2003-08-28 2010-03-24 新日鐵化学株式会社 感光性樹脂組成物及びそれを用いたカラーフィルター
DE10349394A1 (de) * 2003-10-21 2005-05-25 Marabuwerke Gmbh & Co. Kg UV-härtendes Bindemittel für Farben oder Lacke zur Bedruckung von Glas und Verfahren zur Bedruckung von Glassubstraten
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TWI346111B (en) * 2004-02-09 2011-08-01 Nippon Kayaku Kk Photosensitive resin composition and products of cured product thereof
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JP4584164B2 (ja) * 2006-03-08 2010-11-17 富士フイルム株式会社 感光性組成物、感光性フィルム、永久パターン形成方法、及びプリント基板
JP2007286487A (ja) * 2006-04-19 2007-11-01 Fujifilm Corp 感光性組成物、感光性フィルム、永久パターン形成方法、及びプリント基板
JP4711886B2 (ja) * 2006-05-26 2011-06-29 富士フイルム株式会社 感光性組成物、感光性フィルム及びプリント基板
KR100781690B1 (ko) 2006-08-24 2007-12-03 한국화학연구원 다가의 옥심 에스테르 기를 갖는 광 개시제 및 이의 제조방법
JP5513711B2 (ja) * 2007-10-01 2014-06-04 太陽ホールディングス株式会社 感光性樹脂組成物及びその硬化物
TWI408150B (zh) 2008-10-17 2013-09-11 Taiyo Ink Mfg Co Ltd A solder resist composition and a printed circuit board using the same
JP5669386B2 (ja) * 2009-01-15 2015-02-12 富士フイルム株式会社 新規化合物、重合性組成物、カラーフィルタ、及びその製造方法、固体撮像素子、並びに、平版印刷版原版
JP4833324B2 (ja) * 2009-08-03 2011-12-07 新日鐵化学株式会社 感光性樹脂組成物及びそれを用いたカラーフィルター
CA2780036C (en) 2009-12-07 2017-08-22 Agfa-Gevaert Photoinitiators for uv-led curable compositions and inks
AU2010330040B2 (en) 2009-12-07 2013-12-19 Agfa Nv UV-LED curable compositions and inks
JP2013539072A (ja) * 2010-09-16 2013-10-17 エルジー・ケム・リミテッド 感光性樹脂組成物、ドライフィルムソルダーレジスト及び回路基板
ES2622330T3 (es) 2012-06-01 2017-07-06 Basf Se Mezcla de colorante negro
JP5809182B2 (ja) * 2013-03-26 2015-11-10 株式会社タムラ製作所 感光性樹脂組成物
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US20210277251A1 (en) 2018-06-25 2021-09-09 Basf Se Red pigment composition for color filter
CN110196531B (zh) * 2019-06-03 2020-12-11 珠海市能动科技光学产业有限公司 一种干膜光阻剂

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Also Published As

Publication number Publication date
CN1307693A (zh) 2001-08-08
CN1203374C (zh) 2005-05-25
DE69938305D1 (de) 2008-04-17
AU4773999A (en) 2000-01-17
EP1095313B1 (en) 2008-03-05
TW484034B (en) 2002-04-21
EP1095313A1 (en) 2001-05-02
JP2002519732A (ja) 2002-07-02
ATE388426T1 (de) 2008-03-15
WO2000000869A1 (en) 2000-01-06
CA2333365A1 (en) 2000-01-06
KR100563019B1 (ko) 2006-03-22
DE69938305T2 (de) 2009-03-19
AU751966B2 (en) 2002-09-05
US6485885B1 (en) 2002-11-26
KR20010053101A (ko) 2001-06-25
MY121423A (en) 2006-01-28

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Legal Events

Date Code Title Description
B06A Patent application procedure suspended [chapter 6.1 patent gazette]
B11B Dismissal acc. art. 36, par 1 of ipl - no reply within 90 days to fullfil the necessary requirements