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BR9902291A - Processo e instalação para a aplicação e complementação de um eletrólito em uma instalação de tratamento eletroquìmico - Google Patents

Processo e instalação para a aplicação e complementação de um eletrólito em uma instalação de tratamento eletroquìmico

Info

Publication number
BR9902291A
BR9902291A BR9902291-5A BR9902291A BR9902291A BR 9902291 A BR9902291 A BR 9902291A BR 9902291 A BR9902291 A BR 9902291A BR 9902291 A BR9902291 A BR 9902291A
Authority
BR
Brazil
Prior art keywords
installation
electrolyte
application
electrochemical treatment
supplementation
Prior art date
Application number
BR9902291-5A
Other languages
English (en)
Inventor
Gerald Maresch
Herbert Track
Lutz Wieser
Original Assignee
Andritz Patentverwaltung
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Andritz Patentverwaltung filed Critical Andritz Patentverwaltung
Publication of BR9902291A publication Critical patent/BR9902291A/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/12—Electroforming by electrophoresis
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F25/00—Flow mixers; Mixers for falling materials, e.g. solid particles
    • B01F25/30—Injector mixers
    • B01F25/31—Injector mixers in conduits or tubes through which the main component flows
    • B01F25/312—Injector mixers in conduits or tubes through which the main component flows with Venturi elements; Details thereof

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Molecular Biology (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Agricultural Chemicals And Associated Chemicals (AREA)
  • Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)

Abstract

Patente de Invenção: <B>"PROCESSO E INSTALAçãO PARA A APLICAçãO E COMPLEMENTAçãO DE UM ELETRóLITO EM UMA INSTALAçãO DE TRATAMENTO ELETROQUìMICO"<D>. A invenção refere-se a um processo e a uma instalação para a aplicação, assim como para a complementação, de um eletrólito em uma instalação de tratamento eletroquímico. Ela caracateriza-se principalmente pelo fato de que os necessários sais eletrolíticos e/ou substâncias químicas são fornecidos ao eletrólito através do vácuo gerado em uma máquina de borrifar 12.
BR9902291-5A 1998-06-19 1999-06-17 Processo e instalação para a aplicação e complementação de um eletrólito em uma instalação de tratamento eletroquìmico BR9902291A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
AT0105798A AT408353B (de) 1998-06-19 1998-06-19 Verfahren und anlage zum ansetzen sowie zum ergänzen eines elektrolyts

Publications (1)

Publication Number Publication Date
BR9902291A true BR9902291A (pt) 2000-02-29

Family

ID=3505656

Family Applications (1)

Application Number Title Priority Date Filing Date
BR9902291-5A BR9902291A (pt) 1998-06-19 1999-06-17 Processo e instalação para a aplicação e complementação de um eletrólito em uma instalação de tratamento eletroquìmico

Country Status (10)

Country Link
US (2) US6231729B1 (pt)
JP (1) JP2000034595A (pt)
KR (1) KR100476102B1 (pt)
CN (1) CN1196815C (pt)
AT (1) AT408353B (pt)
BE (1) BE1012406A3 (pt)
BR (1) BR9902291A (pt)
DE (1) DE19923944A1 (pt)
FR (1) FR2780071B1 (pt)
TW (1) TW460628B (pt)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100522873C (zh) * 2005-12-30 2009-08-05 中国科学院上海硅酸盐研究所 一种铋层状结构弛豫铁电陶瓷材料及其制备方法
CN1986485B (zh) * 2006-12-25 2012-08-08 中国科学院上海硅酸盐研究所 一种高体电阻率铋层状结构压电陶瓷材料及其制备方法
DE102009023124A1 (de) * 2008-05-28 2009-12-03 Ipt International Plating Technologies Gmbh Verfahren zur galvanischen Kupferbeschichtung und Vorrichtung zur Durchführung eines solchen Verfahrens
EP2194165A1 (en) * 2008-10-21 2010-06-09 Rohm and Haas Electronic Materials LLC Method for replenishing tin and its alloying metals in electrolyte solutions
DE102008058086B4 (de) * 2008-11-18 2013-05-23 Atotech Deutschland Gmbh Verfahren und Vorrichtung zur Reinigung von galvanischen Bädern zur Abscheidung von Metallen
JP5458604B2 (ja) * 2009-03-04 2014-04-02 三菱マテリアル株式会社 Ｓｎ合金めっき装置及びそのＳｎ成分補給方法
CN103361709B (zh) * 2012-03-27 2016-04-06 上海梅山钢铁股份有限公司 电镀金属陶瓷镀液均匀性及稳定性控制装置
WO2014033890A1 (ja) * 2012-08-31 2014-03-06 株式会社日立製作所 非水系電気めっき方法および非水系電気めっき装置
US9462359B2 (en) * 2014-04-25 2016-10-04 Huawei Technologies Co., Ltd. System and method for photonic switching
CN105442024A (zh) * 2015-12-30 2016-03-30 桂林斯壮微电子有限责任公司 药液自动添加系统
JP6416435B1 (ja) * 2018-08-22 2018-10-31 株式会社荏原製作所 基板のめっきに使用される酸化銅固形物、該酸化銅固形物を製造する方法、およびめっき液をめっき槽まで供給するための装置
CN112111768A (zh) * 2020-10-19 2020-12-22 新疆众和股份有限公司 阳极氧化补充装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3194540A (en) 1961-07-28 1965-07-13 Liberty Nat Bank And Trust Com Homogenizing apparatus
US4599363A (en) * 1979-07-13 1986-07-08 Lever Brothers Company Method for wetting and dispersing powders
JPS57171700A (en) * 1981-04-15 1982-10-22 Sumitomo Metal Ind Ltd Electroplating method
JPS62199800A (ja) * 1986-02-27 1987-09-03 Kawasaki Steel Corp 電気めつきにおけるめつき用金属粒供給方法およびその装置
JP2681813B2 (ja) * 1988-11-09 1997-11-26 クニミネ工業株式会社 分散液調製装置
DE9000771U1 (de) * 1990-01-24 1990-03-29 Degussa Ag, 6000 Frankfurt Vorrichtung zum Dosieren in galvanischen Bädern
DE4118870A1 (de) 1991-06-07 1992-12-17 Ystral Gmbh Maschinenbau Und P Vorrichtung zum benetzen und dispergieren von pulvern in fluessigkeiten
US5882502A (en) * 1992-04-01 1999-03-16 Rmg Services Pty Ltd. Electrochemical system and method
KR100241575B1 (ko) * 1994-02-28 2000-03-02 에모또 간지 도금용 금속분말의 연속용해장치 및 그 장치에 의한 금속 Ni 의 용해방법
US5609747A (en) * 1995-08-17 1997-03-11 Kawasaki Steel Corporation Method of dissolving zinc oxide

Also Published As

Publication number Publication date
DE19923944A1 (de) 1999-12-23
KR20000006292A (ko) 2000-01-25
ATA105798A (de) 2001-03-15
US6231729B1 (en) 2001-05-15
JP2000034595A (ja) 2000-02-02
FR2780071A1 (fr) 1999-12-24
FR2780071B1 (fr) 2002-04-05
AT408353B (de) 2001-11-26
CN1196815C (zh) 2005-04-13
CN1240241A (zh) 2000-01-05
US20010017266A1 (en) 2001-08-30
KR100476102B1 (ko) 2005-03-10
TW460628B (en) 2001-10-21
US6451194B2 (en) 2002-09-17
BE1012406A3 (fr) 2000-10-03

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Legal Events

Date Code Title Description
B06A Patent application procedure suspended [chapter 6.1 patent gazette]
B11B Dismissal acc. art. 36, par 1 of ipl - no reply within 90 days to fullfil the necessary requirements