[go: up one dir, main page]

BR9800191A - Procedimento para fabricação contìnua de cartões portando microchips ou circuitos integrados, e cartões obtidos com o dito procedimento - Google Patents

Procedimento para fabricação contìnua de cartões portando microchips ou circuitos integrados, e cartões obtidos com o dito procedimento

Info

Publication number
BR9800191A
BR9800191A BR9800191A BR9800191A BR9800191A BR 9800191 A BR9800191 A BR 9800191A BR 9800191 A BR9800191 A BR 9800191A BR 9800191 A BR9800191 A BR 9800191A BR 9800191 A BR9800191 A BR 9800191A
Authority
BR
Brazil
Prior art keywords
procedure
cards
microchips
integrated circuits
continuous manufacture
Prior art date
Application number
BR9800191A
Other languages
English (en)
Inventor
Rodolfo Arturo Peluffo
Marcelo Adrian Martinez
Carlos Luis Bonfico
Original Assignee
Cedin S A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cedin S A filed Critical Cedin S A
Publication of BR9800191A publication Critical patent/BR9800191A/pt

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/20Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of continuous webs only
    • B32B37/203One or more of the layers being plastic
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00Condition, form or state of the layers or laminate
    • B32B2305/34Inserts
    • B32B2305/342Chips
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2425/00Cards, e.g. identity cards, credit cards

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Making Paper Articles (AREA)

Abstract

<B>"PROCEDIMENTO PARA FABRICAçãO CONTìNUA DE CARTõES PORTANDO MICROCHIPS OU CIRCUITOS INTEGRADOS, E CARTõES OBTIDOS COM O DITO PROCEDIMENTO"<D>. A presente invenção apresenta um procedimento para a fabricação contínua de cartões portando microchips que compreende a superposição em paralelo de pelo menos três peças laminares (100, 100, 300) realizadas em um material dielétrico, tal como plástico e/ou celulose, ou combinações dos mesmos, unidos entre sí formando uma única peça laminar multicamada (2), tendo pelo menos na peça intermediária (200) uma estampagem (201) que define um alojamento (3) para um microchip ou circuito integrado.
BR9800191A 1997-02-07 1998-02-06 Procedimento para fabricação contìnua de cartões portando microchips ou circuitos integrados, e cartões obtidos com o dito procedimento BR9800191A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
AR9700508 1997-02-07

Publications (1)

Publication Number Publication Date
BR9800191A true BR9800191A (pt) 2000-10-24

Family

ID=3460997

Family Applications (1)

Application Number Title Priority Date Filing Date
BR9800191A BR9800191A (pt) 1997-02-07 1998-02-06 Procedimento para fabricação contìnua de cartões portando microchips ou circuitos integrados, e cartões obtidos com o dito procedimento

Country Status (2)

Country Link
EP (1) EP0858050A3 (pt)
BR (1) BR9800191A (pt)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19921230B4 (de) * 1999-05-07 2009-04-02 Giesecke & Devrient Gmbh Verfahren zum Handhaben von gedünnten Chips zum Einbringen in Chipkarten
FR2809986B1 (fr) * 2000-06-13 2008-06-20 Gemplus Card Int Procede de fabrication de cartes a puce par extrusion
KR100742996B1 (ko) 2005-10-26 2007-07-26 주식회사 케이엠티 멀티미디어 카드 절단 시스템

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3122981A1 (de) * 1981-06-10 1983-01-05 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Verfahren zum einbau von ic-bausteinen in ausweiskarten
US4539472A (en) * 1984-01-06 1985-09-03 Horizon Technology, Inc. Data processing card system and method of forming same
NL8601404A (nl) * 1986-05-30 1987-12-16 Papier Plastic Coating Groning Gegevensdragende kaart, werkwijze voor het vervaardigen van een dergelijke kaart en inrichting voor het uitvoeren van deze werkwijze.
DE19509233A1 (de) * 1995-03-19 1996-09-26 Melzer Maschinenbau Gmbh Verfahren zum Herstellen von Elektronik-Komponenten enthaltenden Kunststoffkarten
WO1998002848A1 (de) * 1996-07-11 1998-01-22 David Finn Verfahren und vorrichtung zur herstellung einer chipkarte sowie chipkarte

Also Published As

Publication number Publication date
EP0858050A3 (en) 2001-03-28
EP0858050A2 (en) 1998-08-12

Similar Documents

Publication Publication Date Title
BR9909580B1 (pt) dispositivo de circuito integrado, processo para produzir um dispositivo eletrÈnico, e, dispositivo eletrÈnico.
BR9806147B1 (pt) disposição, sobretudo para o emprego em um equipamento de comando eletrÈnico, abrangendo uma placa de circuito impresso e um dissipador térmico e processo para a fabricação de uma disposição.
DE69613645D1 (de) Kostengünstiges hochleistungsgehäuse für mikrowellenschaltungen im 90 ghz-bereich mit bga ein/ausgangsformat und keramischer substrattechnologie
DE69823591D1 (de) Geschichtete Aperturantenne und mehrschichtige Leiterplatte damit
FI972423A7 (fi) Painetun piirilevyn valmistus
BR9808062A (pt) Módulo eletrônico para cartão de microplaqueta
DE60026331T8 (de) Leiterplatte, halbleiter und herstellung, test und gehäuse derselben und systemplatte und elektronikgerät
DE69936483D1 (de) Laminierte Leiterplatte und Herstellungsverfahren
DE69941937D1 (de) Mehrschichtige Leiterplatte und Herstellungsverfahren dafür
DE69936493D1 (de) Verbindungsstruktur für Leiterplatte, elektro-optische Vorrichtung, damit versehenes elektronisches Gerät und Herstellungsverfahren für elektro-optische Vorrichtung
DE69936225D1 (de) Gleichzeitige serielle verbindung zur integrierung von funktionellen blöcken in eine integrierte schaltungsvorrichtung
EP0679878A3 (de) Mikrosystem mit integrierter Schaltung und mikromechanischem Bauteil und Herstellverfahren.
DE69400904D1 (de) Gehäuse, Fassung und Verbinder für integrierte Schaltung
BR9913588A (pt) Microvia não circular
BR9005384A (pt) Placa de circuito impresso,processo para sua fabricacao e processo para a fixacao de pecas eletronicas a mesma
BR9610259A (pt) Artigo absorvente tendo secura aperfeiçoada na região de cintura e processo de fabricação
BR9603590A (pt) Chip para cartão eletrónico e cartão eletrónico
PT847595E (pt) Elemento de arrefecimento para componentes electronicos
DE69402049D1 (de) Leiterplatte mit elektrischem Adaptorstift und dessen Herstellungsverfahren.
BR9701324A (pt) Placa de circuito impresso e processo para montagem precisa e solda de componentes eletrónicos na superfície da placa de circuito impresso
BR9602566A (pt) Produto compreendendo um primeiro substrato um circuito de arranjo um circuito multiplexador e uma ou mais estruturas de circuitos integrado
BR9905740B1 (pt) processo para fabricação de um membro de folha para uso na fabricação de uma embalagem laminada ventilada para dispositivos médicos.
ATE191327T1 (de) Klemmanordnungen für orthopädischen fixateur und verwendungen derselben
DE69942467D1 (de) Leiterplatte und Herstellungsverfahren dafür
DE69300615D1 (de) Mehrschichtige Leiterplatte und Herstellungsverfahren.

Legal Events

Date Code Title Description
B08F Application fees: dismissal - article 86 of industrial property law

Free format text: REFERENTE A 9A E 10A ANUIDADES.

B08K Maintenance of archiving: application remains archived as no request for restauration (art. 87) has been received.

Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 1928 DE 18/12/2007.