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DE60026331T8 - Leiterplatte, halbleiter und herstellung, test und gehäuse derselben und systemplatte und elektronikgerät - Google Patents

Leiterplatte, halbleiter und herstellung, test und gehäuse derselben und systemplatte und elektronikgerät Download PDF

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Publication number
DE60026331T8
DE60026331T8 DE60026331T DE60026331T DE60026331T8 DE 60026331 T8 DE60026331 T8 DE 60026331T8 DE 60026331 T DE60026331 T DE 60026331T DE 60026331 T DE60026331 T DE 60026331T DE 60026331 T8 DE60026331 T8 DE 60026331T8
Authority
DE
Germany
Prior art keywords
pcb
semiconductor
test
housing
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE60026331T
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English (en)
Other versions
DE60026331T2 (de
DE60026331D1 (de
Inventor
Nobuaki Seiko Epson Corporation Suwa-shi Hashimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of DE60026331D1 publication Critical patent/DE60026331D1/de
Publication of DE60026331T2 publication Critical patent/DE60026331T2/de
Application granted granted Critical
Publication of DE60026331T8 publication Critical patent/DE60026331T8/de
Active legal-status Critical Current

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Classifications

    • H10W90/701—
    • H10W70/60—
    • H10W46/00—
    • H10W70/611—
    • H10W70/688—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H10W46/601—
    • H10W72/877—
    • H10W72/90—
    • H10W72/9415—
    • H10W74/15—
    • H10W90/724—
    • H10W90/732—
    • H10W90/734—
DE60026331T 1999-10-01 2000-09-29 Leiterplatte, halbleiter und herstellung, test und gehäuse derselben und systemplatte und elektronikgerät Active DE60026331T8 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP28142499 1999-10-01
JP28142499 1999-10-01
PCT/JP2000/006824 WO2001026432A1 (fr) 1999-10-01 2000-09-29 Plaquette imprimee, dispositif a semi-conducteur et son procede de fabrication, ses essais et sa mise en boitier, et circuit integre et equipement electronique

Publications (3)

Publication Number Publication Date
DE60026331D1 DE60026331D1 (de) 2006-04-27
DE60026331T2 DE60026331T2 (de) 2006-10-12
DE60026331T8 true DE60026331T8 (de) 2007-02-01

Family

ID=17638979

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60026331T Active DE60026331T8 (de) 1999-10-01 2000-09-29 Leiterplatte, halbleiter und herstellung, test und gehäuse derselben und systemplatte und elektronikgerät

Country Status (7)

Country Link
US (2) US6867496B1 (de)
EP (1) EP1156705B1 (de)
KR (2) KR100530911B1 (de)
CN (1) CN1230046C (de)
DE (1) DE60026331T8 (de)
TW (1) TW494503B (de)
WO (1) WO2001026432A1 (de)

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US9007520B2 (en) 2012-08-10 2015-04-14 Nanchang O-Film Optoelectronics Technology Ltd Camera module with EMI shield
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JP6318556B2 (ja) * 2013-11-11 2018-05-09 セイコーエプソン株式会社 パッケージの製造方法および電子デバイスの製造方法
CN104981102B (zh) * 2014-04-10 2018-09-18 广东丹邦科技有限公司 一种多芯片嵌入式的柔性电路板及其制造方法
US9831281B2 (en) 2015-05-01 2017-11-28 Sensors Unlimited, Inc. Electrical interconnects for photodiode arrays and readout interface circuits in focal plane array assemblies
CN105578717B (zh) * 2015-12-29 2018-07-06 广东欧珀移动通信有限公司 柔性电路板及终端
EP4024483B1 (de) * 2019-08-27 2024-11-06 Kyocera Corporation Elektronische vorrichtung
JP7265974B2 (ja) * 2019-11-14 2023-04-27 新光電気工業株式会社 電子機器
CN115707169A (zh) * 2021-08-06 2023-02-17 奥特斯(中国)有限公司 部件承载件及其制造方法和用途以及布置结构
CN116525547A (zh) * 2022-01-20 2023-08-01 瑞昱半导体股份有限公司 晶粒封装结构及其制作方法
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Also Published As

Publication number Publication date
TW494503B (en) 2002-07-11
US7009293B2 (en) 2006-03-07
DE60026331T2 (de) 2006-10-12
CN1230046C (zh) 2005-11-30
CN1339243A (zh) 2002-03-06
US6867496B1 (en) 2005-03-15
EP1156705A4 (de) 2003-04-23
EP1156705B1 (de) 2006-03-01
WO2001026432A1 (fr) 2001-04-12
DE60026331D1 (de) 2006-04-27
KR20010101099A (ko) 2001-11-14
KR100472334B1 (ko) 2005-03-14
EP1156705A1 (de) 2001-11-21
KR100530911B1 (ko) 2005-11-23
KR20040017354A (ko) 2004-02-26
US20050040510A1 (en) 2005-02-24

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