BR0010572A - Portador projetado para um ou diversos componentes eletrônicos, e, processo para fabricar um portador substancialmente condutor de calor para um componente eletrônico - Google Patents
Portador projetado para um ou diversos componentes eletrônicos, e, processo para fabricar um portador substancialmente condutor de calor para um componente eletrônicoInfo
- Publication number
- BR0010572A BR0010572A BR0010572-4A BR0010572A BR0010572A BR 0010572 A BR0010572 A BR 0010572A BR 0010572 A BR0010572 A BR 0010572A BR 0010572 A BR0010572 A BR 0010572A
- Authority
- BR
- Brazil
- Prior art keywords
- carrier
- components
- designed
- electronic components
- electronic component
- Prior art date
Links
Classifications
-
- H10W70/093—
-
- H10W40/251—
-
- H10W40/259—
-
- H10W70/09—
-
- H10W72/013—
-
- H10W99/00—
-
- H10W70/099—
-
- H10W70/682—
-
- H10W72/073—
-
- H10W72/241—
-
- H10W72/874—
-
- H10W90/00—
-
- H10W90/734—
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Details Of Resistors (AREA)
- Wire Bonding (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Laminated Bodies (AREA)
Abstract
"PORTADOR PROJETADO PARA UM OU DIVERSOS COMPONENTES ELETRôNICOS, E, PROCESSO PARA FABRICAR UM PORTADOR SUBSTANCIALMENTE CONDUTOR DE CALOR PARA UM COMPONENTE ELETRôNICO". A presente invenção é relativa a um portador ( 10 ) projetado para um ou diversos componentes eletrônicos ( 14, 15 ) e que compreende espaços ( 13 ) fornecidos para ditos componentes sobre no mínimo uma superfície ( 11 ). O portador ( 10 ) compreende no mínimo material parcialmente condutor LTCC ( Low Temperature Cofire Ceramic ) com boa capacidade de condução térmica de modo que o portador além de fornecer suporte mecânico para os componentes também conduz calor gerado pelos componentes.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SE9901831A SE515856C2 (sv) | 1999-05-19 | 1999-05-19 | Bärare för elektronikkomponenter |
| PCT/SE2000/001008 WO2000070679A1 (en) | 1999-05-19 | 2000-05-18 | Carrier for electronic components and a method for manufacturing a carrier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BR0010572A true BR0010572A (pt) | 2002-06-04 |
Family
ID=20415669
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BR0010572-4A BR0010572A (pt) | 1999-05-19 | 2000-05-18 | Portador projetado para um ou diversos componentes eletrônicos, e, processo para fabricar um portador substancialmente condutor de calor para um componente eletrônico |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US6690583B1 (pt) |
| EP (1) | EP1186033B1 (pt) |
| JP (1) | JP4758006B2 (pt) |
| AU (1) | AU4968500A (pt) |
| BR (1) | BR0010572A (pt) |
| DE (1) | DE60041916D1 (pt) |
| SE (1) | SE515856C2 (pt) |
| WO (1) | WO2000070679A1 (pt) |
Families Citing this family (53)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6862189B2 (en) * | 2000-09-26 | 2005-03-01 | Kabushiki Kaisha Toshiba | Electronic component, circuit device, method for manufacturing the circuit device, and semiconductor device |
| SE0004078L (sv) * | 2000-11-06 | 2002-05-07 | Imego Ab | Metod och anordning för att förse ett substrat med kaviteter |
| FI119583B (fi) * | 2003-02-26 | 2008-12-31 | Imbera Electronics Oy | Menetelmä elektroniikkamoduulin valmistamiseksi |
| US7429596B2 (en) * | 2003-06-20 | 2008-09-30 | The Regents Of The University Of California | 1H-pyrrolo [2,3-D] pyrimidine derivatives and methods of use thereof |
| US7321098B2 (en) * | 2004-04-21 | 2008-01-22 | Delphi Technologies, Inc. | Laminate ceramic circuit board and process therefor |
| FI20041680L (fi) * | 2004-04-27 | 2005-10-28 | Imbera Electronics Oy | Elektroniikkamoduuli ja menetelmä sen valmistamiseksi |
| EP1831225A2 (en) | 2004-11-19 | 2007-09-12 | The Regents of the University of California | Anti-inflammatory pyrazolopyrimidines |
| US7365273B2 (en) * | 2004-12-03 | 2008-04-29 | Delphi Technologies, Inc. | Thermal management of surface-mount circuit devices |
| FR2879819B1 (fr) * | 2004-12-21 | 2007-02-23 | Ulis Soc Par Actions Simplifie | Composant de detection de rayonnements electromagnetiques notamment infrarouges |
| US7335986B1 (en) | 2005-09-14 | 2008-02-26 | Amkor Technology, Inc. | Wafer level chip scale package |
| EP2004654B1 (en) | 2006-04-04 | 2013-05-22 | The Regents of the University of California | Pyrazolopyrimidine derivatives for use as kinase antagonists |
| KR100825766B1 (ko) * | 2007-04-26 | 2008-04-29 | 한국전자통신연구원 | Ltcc 패키지 및 그 제조방법 |
| DE102007037538A1 (de) | 2007-08-09 | 2009-02-12 | Robert Bosch Gmbh | Baugruppe sowie Herstellung einer Baugruppe |
| WO2009046448A1 (en) | 2007-10-04 | 2009-04-09 | Intellikine, Inc. | Chemical entities and therapeutic uses thereof |
| MX2010007419A (es) | 2008-01-04 | 2010-11-12 | Intellikine Inc | Ciertas entidades quimicas, composiciones y metodos. |
| US8193182B2 (en) | 2008-01-04 | 2012-06-05 | Intellikine, Inc. | Substituted isoquinolin-1(2H)-ones, and methods of use thereof |
| JP5547099B2 (ja) | 2008-03-14 | 2014-07-09 | インテリカイン, エルエルシー | キナーゼ阻害剤および使用方法 |
| WO2009114874A2 (en) | 2008-03-14 | 2009-09-17 | Intellikine, Inc. | Benzothiazole kinase inhibitors and methods of use |
| KR100962369B1 (ko) * | 2008-06-26 | 2010-06-10 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조방법 |
| US20110224223A1 (en) * | 2008-07-08 | 2011-09-15 | The Regents Of The University Of California, A California Corporation | MTOR Modulators and Uses Thereof |
| US9096611B2 (en) | 2008-07-08 | 2015-08-04 | Intellikine Llc | Kinase inhibitors and methods of use |
| JP5731978B2 (ja) | 2008-09-26 | 2015-06-10 | インテリカイン, エルエルシー | 複素環キナーゼ阻害剤 |
| WO2010040398A1 (en) * | 2008-10-08 | 2010-04-15 | Telefonaktiebolaget L M Ericsson (Publ) | Chip interconnection |
| AU2009305669A1 (en) | 2008-10-16 | 2010-04-22 | The Regents Of The University Of California | Fused ring heteroaryl kinase inhibitors |
| US8476431B2 (en) * | 2008-11-03 | 2013-07-02 | Itellikine LLC | Benzoxazole kinase inhibitors and methods of use |
| CA2760791C (en) | 2009-05-07 | 2017-06-20 | Intellikine, Inc. | Heterocyclic compounds and uses thereof |
| WO2011047384A2 (en) | 2009-10-16 | 2011-04-21 | The Regents Of The University Of California | Methods of inhibiting ire1 |
| CN103002738A (zh) | 2010-05-21 | 2013-03-27 | 英特利凯恩有限责任公司 | 用于激酶调节的化学化合物、组合物和方法 |
| US8847376B2 (en) | 2010-07-23 | 2014-09-30 | Tessera, Inc. | Microelectronic elements with post-assembly planarization |
| JP2013545749A (ja) | 2010-11-10 | 2013-12-26 | インフィニティー ファーマシューティカルズ, インコーポレイテッド | 複素環化合物及びその使用 |
| US8809349B2 (en) | 2011-01-10 | 2014-08-19 | Infinity Pharmaceuticals, Inc. | Processes for preparing isoquinolinones and solid forms of isoquinolinones |
| CN103491962B (zh) | 2011-02-23 | 2016-10-12 | 因特利凯有限责任公司 | 激酶抑制剂的组合及其用途 |
| TWI565709B (zh) | 2011-07-19 | 2017-01-11 | 英菲尼提製藥股份有限公司 | 雜環化合物及其用途 |
| US8969363B2 (en) | 2011-07-19 | 2015-03-03 | Infinity Pharmaceuticals, Inc. | Heterocyclic compounds and uses thereof |
| SG11201400310WA (en) | 2011-08-29 | 2014-06-27 | Infinity Pharmaceuticals Inc | Heterocyclic compounds and uses thereof |
| EP2751112B1 (en) | 2011-09-02 | 2019-10-09 | The Regents of The University of California | Substituted pyrazolo[3,4-d]pyrimidines and uses thereof |
| US8940742B2 (en) | 2012-04-10 | 2015-01-27 | Infinity Pharmaceuticals, Inc. | Heterocyclic compounds and uses thereof |
| US8828998B2 (en) | 2012-06-25 | 2014-09-09 | Infinity Pharmaceuticals, Inc. | Treatment of lupus, fibrotic conditions, and inflammatory myopathies and other disorders using PI3 kinase inhibitors |
| CA2886240A1 (en) | 2012-09-26 | 2014-04-03 | The Regents Of The University Of California | Modulation of ire1 |
| US9385075B2 (en) * | 2012-10-26 | 2016-07-05 | Infineon Technologies Ag | Glass carrier with embedded semiconductor device and metal layers on the top surface |
| MX386085B (es) | 2012-11-01 | 2025-03-18 | Infinity Pharmaceuticals Inc | Tratamiento de canceres utilizando moduladores de las isoformas de pi3 cinasa |
| US9481667B2 (en) | 2013-03-15 | 2016-11-01 | Infinity Pharmaceuticals, Inc. | Salts and solid forms of isoquinolinones and composition comprising and methods of using the same |
| WO2015051241A1 (en) | 2013-10-04 | 2015-04-09 | Infinity Pharmaceuticals, Inc. | Heterocyclic compounds and uses thereof |
| CN105793255B (zh) | 2013-10-04 | 2018-11-16 | 无限药品股份有限公司 | 杂环化合物及其用途 |
| MX382033B (es) | 2014-03-19 | 2025-03-13 | Infinity Pharmaceuticals Inc | Compuestos heterocíclicos para utilizarlos en el tratamiento de trastornos mediados por pi3k-gamma. |
| US20150320755A1 (en) | 2014-04-16 | 2015-11-12 | Infinity Pharmaceuticals, Inc. | Combination therapies |
| WO2016054491A1 (en) | 2014-10-03 | 2016-04-07 | Infinity Pharmaceuticals, Inc. | Heterocyclic compounds and uses thereof |
| US10160761B2 (en) | 2015-09-14 | 2018-12-25 | Infinity Pharmaceuticals, Inc. | Solid forms of isoquinolinones, and process of making, composition comprising, and methods of using the same |
| US10759806B2 (en) | 2016-03-17 | 2020-09-01 | Infinity Pharmaceuticals, Inc. | Isotopologues of isoquinolinone and quinazolinone compounds and uses thereof as PI3K kinase inhibitors |
| US10919914B2 (en) | 2016-06-08 | 2021-02-16 | Infinity Pharmaceuticals, Inc. | Heterocyclic compounds and uses thereof |
| RU2754507C2 (ru) | 2016-06-24 | 2021-09-02 | Инфинити Фармасьютикалз, Инк. | Комбинированная терапия |
| US10636690B2 (en) * | 2016-07-20 | 2020-04-28 | Applied Materials, Inc. | Laminated top plate of a workpiece carrier in micromechanical and semiconductor processing |
| US20250079243A1 (en) * | 2023-08-30 | 2025-03-06 | Absolics Inc. | Packaging substrate and method of manufacturing the same |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6265991A (ja) * | 1985-09-13 | 1987-03-25 | 株式会社東芝 | 高熱伝導性セラミツクス基板 |
| JPS62224646A (ja) * | 1986-03-12 | 1987-10-02 | オリン コ−ポレ−シヨン | 複合材料とその製造方法 |
| EP0341246A4 (en) * | 1986-10-30 | 1990-09-26 | Olin Corporation | Ceramic-glass-metal composite |
| US4899118A (en) * | 1988-12-27 | 1990-02-06 | Hughes Aircraft Company | Low temperature cofired ceramic packages for microwave and millimeter wave gallium arsenide integrated circuits |
| JP3280394B2 (ja) * | 1990-04-05 | 2002-05-13 | ロックヒード マーティン コーポレーション | 電子装置 |
| JPH0541471A (ja) * | 1991-08-07 | 1993-02-19 | Hitachi Ltd | 半導体集積回路装置 |
| US5343363A (en) * | 1992-12-21 | 1994-08-30 | Delco Electronics Corporation | Split backed pressure sensitive die carrier tape |
| US5831828A (en) * | 1993-06-03 | 1998-11-03 | International Business Machines Corporation | Flexible circuit board and common heat spreader assembly |
| US5386339A (en) * | 1993-07-29 | 1995-01-31 | Hughes Aircraft Company | Monolithic microelectronic circuit package including low-temperature-cofired-ceramic (LTCC) tape dielectric structure and in-situ heat sink |
| US5532513A (en) * | 1994-07-08 | 1996-07-02 | Johnson Matthey Electronics, Inc. | Metal-ceramic composite lid |
| US5798909A (en) * | 1995-02-15 | 1998-08-25 | International Business Machines Corporation | Single-tiered organic chip carriers for wire bond-type chips |
| US5661647A (en) * | 1995-06-07 | 1997-08-26 | Hughes Electronics | Low temperature co-fired ceramic UHF/VHF power converters |
| US5708570A (en) * | 1995-10-11 | 1998-01-13 | Hughes Aircraft Company | Shrinkage-matched circuit package utilizing low temperature co-fired ceramic structures |
| JPH09266265A (ja) * | 1996-03-28 | 1997-10-07 | Toshiba Corp | 半導体パッケージ |
| EP0934515B1 (en) * | 1996-10-09 | 2006-03-08 | Symyx Technologies, Inc. | Infrared spectroscopy and imaging of libraries |
| US5855803A (en) * | 1996-11-20 | 1999-01-05 | Northrop Grumman Corporation | Template type cavity-formation device for low temperature cofired ceramic (LTCC) sheets |
| EP0960448B1 (de) * | 1997-02-11 | 2002-04-10 | Fucellco, Incorporated | Brennstoffzellenstapel mit festen elektrolyten und deren anordnung |
| JPH10256429A (ja) * | 1997-03-07 | 1998-09-25 | Toshiba Corp | 半導体パッケージ |
| JPH1154665A (ja) * | 1997-07-31 | 1999-02-26 | Toshiba Corp | 複合パッケージ |
| SE514529C2 (sv) | 1998-09-21 | 2001-03-05 | Ericsson Telefon Ab L M | Metod och anordning för begravda elektronik-komponenter |
| US6288905B1 (en) * | 1999-04-15 | 2001-09-11 | Amerasia International Technology Inc. | Contact module, as for a smart card, and method for making same |
-
1999
- 1999-05-19 SE SE9901831A patent/SE515856C2/sv not_active IP Right Cessation
-
2000
- 2000-05-18 EP EP00931872A patent/EP1186033B1/en not_active Expired - Lifetime
- 2000-05-18 WO PCT/SE2000/001008 patent/WO2000070679A1/en not_active Ceased
- 2000-05-18 BR BR0010572-4A patent/BR0010572A/pt not_active Application Discontinuation
- 2000-05-18 AU AU49685/00A patent/AU4968500A/en not_active Abandoned
- 2000-05-18 DE DE60041916T patent/DE60041916D1/de not_active Expired - Lifetime
- 2000-05-18 JP JP2000619030A patent/JP4758006B2/ja not_active Expired - Lifetime
- 2000-05-19 US US09/574,243 patent/US6690583B1/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| SE515856C2 (sv) | 2001-10-22 |
| JP2003500834A (ja) | 2003-01-07 |
| EP1186033A1 (en) | 2002-03-13 |
| WO2000070679B1 (en) | 2001-02-08 |
| US6690583B1 (en) | 2004-02-10 |
| JP4758006B2 (ja) | 2011-08-24 |
| SE9901831L (sv) | 2000-11-20 |
| SE9901831D0 (sv) | 1999-05-19 |
| AU4968500A (en) | 2000-12-05 |
| DE60041916D1 (de) | 2009-05-14 |
| EP1186033B1 (en) | 2009-04-01 |
| WO2000070679A1 (en) | 2000-11-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FA10 | Dismissal: dismissal - article 33 of industrial property law | ||
| B11Y | Definitive dismissal - extension of time limit for request of examination expired [chapter 11.1.1 patent gazette] |