AU2003274829A1 - Lithography system - Google Patents
Lithography systemInfo
- Publication number
- AU2003274829A1 AU2003274829A1 AU2003274829A AU2003274829A AU2003274829A1 AU 2003274829 A1 AU2003274829 A1 AU 2003274829A1 AU 2003274829 A AU2003274829 A AU 2003274829A AU 2003274829 A AU2003274829 A AU 2003274829A AU 2003274829 A1 AU2003274829 A1 AU 2003274829A1
- Authority
- AU
- Australia
- Prior art keywords
- modulation means
- pattern data
- converting
- control unit
- digital computer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2008—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the reflectors, diffusers, light or heat filtering means or anti-reflective means used
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B27/00—Photographic printing apparatus
- G03B27/32—Projection printing apparatus, e.g. enlarger, copying camera
- G03B27/52—Details
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70283—Mask effects on the imaging process
- G03F7/70291—Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/70508—Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70991—Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus; Shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate; Utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids or vacuum
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
- H01J37/045—Beam blanking or chopping, i.e. arrangements for momentarily interrupting exposure to the discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
- H01J37/3174—Particle-beam lithography, e.g. electron beam lithography
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
- H01J37/3174—Particle-beam lithography, e.g. electron beam lithography
- H01J37/3177—Multi-beam, e.g. fly's eye, comb probe
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/01—Manufacture or treatment
- H10D86/021—Manufacture or treatment of multiple TFTs
- H10D86/0221—Manufacture or treatment of multiple TFTs comprising manufacture, treatment or patterning of TFT semiconductor bodies
-
- H10P76/2042—
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/04—Means for controlling the discharge
- H01J2237/043—Beam blanking
- H01J2237/0432—High speed and short duration
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/04—Means for controlling the discharge
- H01J2237/043—Beam blanking
- H01J2237/0435—Multi-aperture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/04—Means for controlling the discharge
- H01J2237/043—Beam blanking
- H01J2237/0435—Multi-aperture
- H01J2237/0437—Semiconductor substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/248—Components associated with the control of the tube
- H01J2237/2482—Optical means
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Analytical Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Public Health (AREA)
- Health & Medical Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Computer Networks & Wireless Communication (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Mathematical Physics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Electron Beam Exposure (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Microscoopes, Condenser (AREA)
- Vehicle Body Suspensions (AREA)
- Fluid-Damping Devices (AREA)
- Optical Communication System (AREA)
Abstract
The invention relates to a maskless electron beam lithography system for transferring a pattern onto the surface of a target by a plurality of beamlets. The system includes a modulation means and a control unit. The modulation means includes an aperture plate comprising electrostatic deflectors for deflecting beamlets passing through the apertures in the aperture plate in dependence on received pattern data and light sensitive elements for converting an incoming light signal into an electric signal. The control unit is arranged for delivering pattern data in the form of digital computer data to the modulation means, and includes elements for converting the digital computer data into pattern data carrying light beams, and means to transfer the pattern data carrying light beams via free space optical interconnects towards the light sensitive elements of the modulation means.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US42146402P | 2002-10-25 | 2002-10-25 | |
| US60/421,464 | 2002-10-25 | ||
| PCT/NL2003/000725 WO2004038509A2 (en) | 2002-10-25 | 2003-10-24 | Lithography system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2003274829A1 true AU2003274829A1 (en) | 2004-05-13 |
Family
ID=32176717
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2003274829A Abandoned AU2003274829A1 (en) | 2002-10-25 | 2003-10-24 | Lithography system |
Country Status (9)
| Country | Link |
|---|---|
| US (8) | US6958804B2 (en) |
| EP (6) | EP2336830B1 (en) |
| JP (6) | JP5112617B2 (en) |
| KR (3) | KR101060567B1 (en) |
| CN (1) | CN100524026C (en) |
| AT (1) | ATE538412T1 (en) |
| AU (1) | AU2003274829A1 (en) |
| TW (1) | TWI300308B (en) |
| WO (1) | WO2004038509A2 (en) |
Families Citing this family (101)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003079116A1 (en) * | 2002-03-19 | 2003-09-25 | Mapper Lithography Ip B.V. | Direct write lithography system |
| TWI300308B (en) * | 2002-10-25 | 2008-08-21 | Mapper Lithography Ip Bv | Lithography system |
| DE10319154B4 (en) * | 2003-04-29 | 2012-12-27 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Maskless lithography system |
| US7372547B2 (en) * | 2004-04-27 | 2008-05-13 | Lsi Corporation | Process and apparatus for achieving single exposure pattern transfer using maskless optical direct write lithography |
| KR101099487B1 (en) * | 2004-05-17 | 2011-12-28 | 마퍼 리쏘그라피 아이피 비.브이. | Charged particle beam exposure system |
| US7145636B2 (en) * | 2004-12-28 | 2006-12-05 | Asml Netherlands Bv | System and method for determining maximum operational parameters used in maskless applications |
| EP1842103A2 (en) * | 2005-01-14 | 2007-10-10 | Arradiance, Inc. | Synchronous raster scanning lithographic system |
| JP4652829B2 (en) * | 2005-01-26 | 2011-03-16 | キヤノン株式会社 | Electron beam exposure apparatus and device manufacturing method |
| US7542013B2 (en) * | 2005-01-31 | 2009-06-02 | Asml Holding N.V. | System and method for imaging enhancement via calculation of a customized optimal pupil field and illumination mode |
| WO2006084298A1 (en) | 2005-02-11 | 2006-08-17 | Ims Nanofabrication Ag | Charged-particle exposure apparatus with electrostatic zone plate |
| EP1865538A4 (en) * | 2005-03-29 | 2012-03-07 | Advantest Corp | Multi-column electron beam exposure device |
| US8890095B2 (en) * | 2005-07-25 | 2014-11-18 | Mapper Lithography Ip B.V. | Reliability in a maskless lithography system |
| KR101367499B1 (en) * | 2005-09-16 | 2014-02-25 | 마퍼 리쏘그라피 아이피 비.브이. | Lithography system and projection method |
| US7709815B2 (en) * | 2005-09-16 | 2010-05-04 | Mapper Lithography Ip B.V. | Lithography system and projection method |
| TW200715075A (en) * | 2005-09-16 | 2007-04-16 | Mapper Lithography Ip Bv | Lithography system and projection method |
| US8026495B2 (en) * | 2005-10-28 | 2011-09-27 | Carl Zeiss Sms Gmbh | Charged particle beam exposure system |
| KR100655165B1 (en) * | 2005-11-28 | 2007-02-28 | 서만승 | Occupancy-based pattern generation method for maskless lithography |
| TWI432908B (en) | 2006-03-10 | 2014-04-01 | 瑪波微影Ip公司 | Lithography system and projection method |
| US7551359B2 (en) * | 2006-09-14 | 2009-06-23 | 3M Innovative Properties Company | Beam splitter apparatus and system |
| US20080083886A1 (en) * | 2006-09-14 | 2008-04-10 | 3M Innovative Properties Company | Optical system suitable for processing multiphoton curable photoreactive compositions |
| KR100868242B1 (en) * | 2007-05-14 | 2008-11-12 | 아엠텐 주식회사 | Inline Virtual Masking Method for Maskless Lithography |
| KR100875900B1 (en) * | 2007-06-08 | 2008-12-26 | 재단법인서울대학교산학협력재단 | Photolithographic lithography system without mask |
| TWI514090B (en) | 2007-07-13 | 2015-12-21 | 瑪波微影Ip公司 | Photolithography system and wafer table for supporting wafers |
| EP2017833A1 (en) | 2007-07-16 | 2009-01-21 | Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO | Scanned writing of an exposure pattern on a substrate |
| US8890094B2 (en) | 2008-02-26 | 2014-11-18 | Mapper Lithography Ip B.V. | Projection lens arrangement |
| US8445869B2 (en) | 2008-04-15 | 2013-05-21 | Mapper Lithography Ip B.V. | Projection lens arrangement |
| KR101678823B1 (en) | 2008-04-15 | 2016-11-23 | 마퍼 리쏘그라피 아이피 비.브이. | Projection lens arrangement |
| US7851774B2 (en) * | 2008-04-25 | 2010-12-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | System and method for direct writing to a wafer |
| US8390781B2 (en) | 2008-09-23 | 2013-03-05 | Pinebrook Imaging Technology, Ltd. | Optical imaging writer system |
| US8670106B2 (en) | 2008-09-23 | 2014-03-11 | Pinebrook Imaging, Inc. | Optical imaging writer system |
| US8253923B1 (en) | 2008-09-23 | 2012-08-28 | Pinebrook Imaging Technology, Ltd. | Optical imaging writer system |
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| US8395752B2 (en) | 2008-09-23 | 2013-03-12 | Pinebrook Imaging Technology, Ltd. | Optical imaging writer system |
| WO2010094724A1 (en) | 2009-02-22 | 2010-08-26 | Mapper Lithography Ip B.V. | Charged particle lithography apparatus and method of generating vacuum in a vacuum chamber |
| JP5653941B2 (en) | 2009-02-22 | 2015-01-14 | マッパー・リソグラフィー・アイピー・ビー.ブイ. | Method and equipment for realizing a vacuum in a vacuum chamber |
| CN102414776A (en) | 2009-02-22 | 2012-04-11 | 迈普尔平版印刷Ip有限公司 | Lithography machine and substrate handling arrangement |
| EP2399270B1 (en) | 2009-02-22 | 2013-06-12 | Mapper Lithography IP B.V. | Charged particle lithography apparatus |
| CN102460633B (en) | 2009-05-20 | 2014-12-17 | 迈普尔平版印刷Ip有限公司 | Pattern Data Converter for Lithography Systems |
| WO2010134017A1 (en) * | 2009-05-20 | 2010-11-25 | Mapper Lithography Ip B.V. | Method of generating a two-level pattern for lithographic processing and pattern generator using the same |
| CN104795303B (en) * | 2009-05-20 | 2017-12-05 | 迈普尔平版印刷Ip有限公司 | Method for pattern Processing data |
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| US9224580B2 (en) | 2011-09-28 | 2015-12-29 | Mapper Litohgraphy Ip B.V. | Plasma generator |
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