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AU2003248101A1 - Polishing fluid and polishing method - Google Patents

Polishing fluid and polishing method

Info

Publication number
AU2003248101A1
AU2003248101A1 AU2003248101A AU2003248101A AU2003248101A1 AU 2003248101 A1 AU2003248101 A1 AU 2003248101A1 AU 2003248101 A AU2003248101 A AU 2003248101A AU 2003248101 A AU2003248101 A AU 2003248101A AU 2003248101 A1 AU2003248101 A1 AU 2003248101A1
Authority
AU
Australia
Prior art keywords
polishing
fluid
polishing method
polishing fluid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003248101A
Inventor
Masato Fukasawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of AU2003248101A1 publication Critical patent/AU2003248101A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/04—Aqueous dispersions
    • H10P52/403—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Weting (AREA)
AU2003248101A 2002-07-25 2003-07-24 Polishing fluid and polishing method Abandoned AU2003248101A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2002216428 2002-07-25
JP2002-216428 2002-07-25
JP2002-216423 2002-07-25
JP2002216423 2002-07-25
PCT/JP2003/009389 WO2004012248A1 (en) 2002-07-25 2003-07-24 Polishing fluid and polishing method

Publications (1)

Publication Number Publication Date
AU2003248101A1 true AU2003248101A1 (en) 2004-02-16

Family

ID=31190292

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003248101A Abandoned AU2003248101A1 (en) 2002-07-25 2003-07-24 Polishing fluid and polishing method

Country Status (4)

Country Link
JP (1) JPWO2004012248A1 (en)
AU (1) AU2003248101A1 (en)
TW (1) TWI257126B (en)
WO (1) WO2004012248A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004010379A1 (en) * 2004-03-03 2005-09-22 Schott Ag Process for the production of wafers with low-defect surfaces, the use of such wafers and electronic components obtained therefrom
JP4316406B2 (en) * 2004-03-22 2009-08-19 株式会社フジミインコーポレーテッド Polishing composition
JP4644434B2 (en) * 2004-03-24 2011-03-02 株式会社フジミインコーポレーテッド Polishing composition
JP5648567B2 (en) * 2010-05-07 2015-01-07 日立化成株式会社 Polishing liquid for CMP and polishing method using the same
JP5953766B2 (en) * 2012-01-24 2016-07-20 日立化成株式会社 Polishing liquid and substrate polishing method
JP6589361B2 (en) * 2015-05-01 2019-10-16 日立化成株式会社 Abrasive, abrasive set, and substrate polishing method
CN113874377A (en) * 2019-05-13 2021-12-31 埃科莱布美国股份有限公司 1,2, 4-triazolo [1,5-a ] pyrimidine derivatives as copper corrosion inhibitors

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6217416B1 (en) * 1998-06-26 2001-04-17 Cabot Microelectronics Corporation Chemical mechanical polishing slurry useful for copper/tantalum substrates
JP2000252243A (en) * 1998-12-28 2000-09-14 Hitachi Chem Co Ltd Polishing liquid for metal and polishing method using the same
JP4538109B2 (en) * 1999-02-18 2010-09-08 株式会社トッパンＴｄｋレーベル Chemical mechanical polishing composition
JP3902897B2 (en) * 1999-11-15 2007-04-11 日立化成工業株式会社 Substrate polishing method using metal polishing liquid
JP2001185514A (en) * 1999-12-27 2001-07-06 Hitachi Chem Co Ltd Cmp abrasive and method for polishing substrate
JP3841995B2 (en) * 1999-12-28 2006-11-08 Ｎｅｃエレクトロニクス株式会社 Chemical mechanical polishing slurry
JP4001219B2 (en) * 2000-10-12 2007-10-31 Ｊｓｒ株式会社 Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method
US7375066B2 (en) * 2000-03-21 2008-05-20 Wako Pure Chemical Industries, Ltd. Semiconductor wafer cleaning agent and cleaning method
JP3768401B2 (en) * 2000-11-24 2006-04-19 Ｎｅｃエレクトロニクス株式会社 Chemical mechanical polishing slurry
JP3768402B2 (en) * 2000-11-24 2006-04-19 Ｎｅｃエレクトロニクス株式会社 Chemical mechanical polishing slurry
JP2003188120A (en) * 2001-12-17 2003-07-04 Hitachi Chem Co Ltd Polishing liquid and polishing method for metal
CN100336179C (en) * 2002-04-30 2007-09-05 日立化成工业株式会社 Grinding liquid and grinding method
JP2004031442A (en) * 2002-06-21 2004-01-29 Hitachi Chem Co Ltd Polishing solution and polishing method
JP2004031446A (en) * 2002-06-21 2004-01-29 Hitachi Chem Co Ltd Polishing solution and polishing method

Also Published As

Publication number Publication date
JPWO2004012248A1 (en) 2005-11-24
TWI257126B (en) 2006-06-21
WO2004012248A1 (en) 2004-02-05
TW200405453A (en) 2004-04-01

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase