AU2003286421A1 - Polishing method - Google Patents

Polishing method

Info

Publication number: AU2003286421A1
Authority: AU; Australia
Prior art keywords: polishing method; polishing
Prior art date: 2002-12-10
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Abandoned

Application number

AU2003286421A

Inventor

Hiroshi Biwata

Mikihiko Masaki

Nobuyuki Takahashi

Hiroomi Torii

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Ebara Corp

Original Assignee

Ebara Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2002-12-10

Filing date

2003-12-03

Publication date

2004-06-30

2003-12-03 Application filed by Ebara Corp filed Critical Ebara Corp

2004-06-30 Publication of AU2003286421A1 publication Critical patent/AU2003286421A1/en

Status Abandoned legal-status Critical Current

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor

Landscapes

Engineering & Computer Science (AREA)
Mechanical Engineering (AREA)
Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Mechanical Treatment Of Semiconductor (AREA)

AU2003286421A 2002-12-10 2003-12-03 Polishing method Abandoned AU2003286421A1 (en)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
JP2002-358771		2002-12-10
JP2002358771A JP2004193289A (en)	2002-12-10	2002-12-10	Polishing method
PCT/JP2003/015460 WO2004053966A1 (en)	2002-12-10	2003-12-03	Polishing method

Publications (1)

Publication Number	Publication Date
AU2003286421A1 true AU2003286421A1 (en)	2004-06-30

Family

ID=32500909

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
AU2003286421A Abandoned AU2003286421A1 (en)	2002-12-10	2003-12-03	Polishing method

Country Status (8)

Country	Link
US (1)	US20050054272A1 (en)
EP (1)	EP1595281A1 (en)
JP (1)	JP2004193289A (en)
KR (1)	KR20050084767A (en)
CN (1)	CN1685482A (en)
AU (1)	AU2003286421A1 (en)
TW (1)	TW200420380A (en)
WO (1)	WO2004053966A1 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2005268566A (en) *	2004-03-19	2005-09-29	Ebara Corp	Head structure of substrate holding mechanism of chemical mechanical polishing device
JP4787063B2 (en) *	2005-12-09	2011-10-05	株式会社荏原製作所	Polishing apparatus and polishing method
JP5248127B2 (en) *	2008-01-30	2013-07-31	株式会社荏原製作所	Polishing method and polishing apparatus
JP5336799B2 (en) *	2008-09-24	2013-11-06	東京エレクトロン株式会社	Chemical mechanical polishing apparatus, chemical mechanical polishing method and control program
US8939815B2 (en) *	2011-02-21	2015-01-27	Taiwan Semiconductor Manufacturing Company, Ltd.	Systems providing an air zone for a chucking stage
JP5697207B2 (en) *	2011-04-19	2015-04-08	浜井産業株式会社	Double-side polishing apparatus and polishing method
TWI613037B (en)	2011-07-19	2018-02-01	荏原製作所股份有限公司	Honing method
US9308622B2 (en) *	2013-10-18	2016-04-12	Seagate Technology Llc	Lapping head with a sensor device on the rotating lapping head
US9744642B2 (en)	2013-10-29	2017-08-29	Taiwan Semiconductor Manufacturing Co., Ltd.	Slurry feed system and method of providing slurry to chemical mechanical planarization station
JP6882017B2 (en) *	2017-03-06	2021-06-02	株式会社荏原製作所	Polishing method, polishing equipment, and substrate processing system
US10593603B2 (en) *	2018-03-16	2020-03-17	Sandisk Technologies Llc	Chemical mechanical polishing apparatus containing hydraulic multi-chamber bladder and method of using thereof
CN112792735B (en) *	2021-01-20	2022-04-05	北京科技大学	Clamp for inhibiting generation and expansion of grinding and polishing cracks of diamond film and using method
JP2023086404A (en) *	2021-12-10	2023-06-22	株式会社荏原製作所	Substrate cleaning equipment and substrate polishing equipment
CN117549211A (en) *	2023-12-26	2024-02-13	山东有研艾斯半导体材料有限公司	Edge polishing method for improving edge liquid marks of silicon wafer

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH07201786A (en) *	1994-01-05	1995-08-04	Sumitomo Electric Ind Ltd	Polishing method and polishing apparatus for compound semiconductor substrate
JPH08267357A (en) *	1995-03-31	1996-10-15	Nec Corp	Abrasive device of substrate and abrasive method thereof
JP3705670B2 (en) *	1997-02-19	2005-10-12	株式会社荏原製作所	Polishing apparatus and method
US5957751A (en) *	1997-05-23	1999-09-28	Applied Materials, Inc.	Carrier head with a substrate detection mechanism for a chemical mechanical polishing system
US6398621B1 (en) *	1997-05-23	2002-06-04	Applied Materials, Inc.	Carrier head with a substrate sensor
JPH11254311A (en) *	1998-03-09	1999-09-21	Super Silicon Kenkyusho:Kk	Method of preventing breakage of thin work during polishing
US6132294A (en) *	1998-09-28	2000-10-17	Siemens Aktiengesellschaft	Method of enhancing semiconductor wafer release
JP2001023939A (en) *	1999-07-07	2001-01-26	Seiko Epson Corp	Polishing method and method for manufacturing semiconductor device
US6663466B2 (en) *	1999-11-17	2003-12-16	Applied Materials, Inc.	Carrier head with a substrate detector
JP2001334458A (en) *	2000-05-26	2001-12-04	Ebara Corp	Polishing method
JP2002252190A (en) *	2001-02-22	2002-09-06	Toshiba Corp	Semiconductor substrate polishing method and semiconductor substrate polishing apparatus
US6905392B2 (en) *	2003-06-30	2005-06-14	Freescale Semiconductor, Inc.	Polishing system having a carrier head with substrate presence sensing

2002
- 2002-12-10 JP JP2002358771A patent/JP2004193289A/en active Pending
2003
- 2003-12-03 US US10/495,562 patent/US20050054272A1/en not_active Abandoned
- 2003-12-03 EP EP03777192A patent/EP1595281A1/en not_active Withdrawn
- 2003-12-03 CN CNA2003801001285A patent/CN1685482A/en active Pending
- 2003-12-03 AU AU2003286421A patent/AU2003286421A1/en not_active Abandoned
- 2003-12-03 KR KR1020047011803A patent/KR20050084767A/en not_active Withdrawn
- 2003-12-03 WO PCT/JP2003/015460 patent/WO2004053966A1/en not_active Ceased
- 2003-12-08 TW TW092134526A patent/TW200420380A/en unknown

Also Published As

Publication number	Publication date
KR20050084767A (en)	2005-08-29
WO2004053966A1 (en)	2004-06-24
JP2004193289A (en)	2004-07-08
US20050054272A1 (en)	2005-03-10
CN1685482A (en)	2005-10-19
TW200420380A (en)	2004-10-16
EP1595281A1 (en)	2005-11-16

Publication	Publication Date	Title
AU2003237608A1 (en)	2003-12-22	Cleaning method
AU2003217521A1 (en)	2003-10-08	Polishing machine
AU2002368501A1 (en)	2004-07-22	Ekoskeleton interface apparatus
AU2003215261A1 (en)	2003-09-09	Polishing composition
AU2003206898A1 (en)	2003-09-04	Method for rate matching
AU2003278606A1 (en)	2004-06-07	Polishing apparatus
AUPS236102A0 (en)	2002-06-13	Grinder
AU2003233357A1 (en)	2003-09-16	Dressing aid
AU2003258070A1 (en)	2004-02-23	Electrodionization method
AU2003286421A1 (en)	2004-06-30	Polishing method
AU2003278355A1 (en)	2004-05-25	Process
AU2003227414A1 (en)	2003-10-27	Polishing method
AU2003275653A1 (en)	2004-06-03	Polishing apparatus
AU2003902613A0 (en)	2003-06-12	Self-surveying method
AU2003246435A1 (en)	2004-02-02	Crossflow-filtration method for beverages
AU2003242400A1 (en)	2003-12-31	Polisher
AU2003229646A1 (en)	2003-10-27	Authentication method
AUPS334902A0 (en)	2002-07-25	Purification method
AU2003264722A1 (en)	2004-03-11	Methods
AU2003253813A1 (en)	2004-01-23	Method for colpoplasty
AU2003252687A1 (en)	2004-02-16	Polishing device
AU2003208685A1 (en)	2003-09-16	Podologic aid
AU2003286197A1 (en)	2004-06-23	Surface-polishing block
AU2003278535A1 (en)	2004-01-06	Histoscreen method
AU2003263197A1 (en)	2004-02-25	Process

Legal Events

Date	Code	Title	Description
2005-08-25	MK6	Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase