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AU2002330718A1 - Integrated circuit structure and a method of making an integrated circuit structure - Google Patents

Integrated circuit structure and a method of making an integrated circuit structure

Info

Publication number
AU2002330718A1
AU2002330718A1 AU2002330718A AU2002330718A AU2002330718A1 AU 2002330718 A1 AU2002330718 A1 AU 2002330718A1 AU 2002330718 A AU2002330718 A AU 2002330718A AU 2002330718 A AU2002330718 A AU 2002330718A AU 2002330718 A1 AU2002330718 A1 AU 2002330718A1
Authority
AU
Australia
Prior art keywords
integrated circuit
circuit structure
making
integrated
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002330718A
Inventor
John Alderman
Julie Donnelly
Alan Mathewson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NATIONAL MICROELECTRONIC RESEARCH CENTRE UNIVERSITY COLLEGE CORK - NATIONAL UNIVERSITY OF IRELAND CO
Original Assignee
NAT MICROELECTRONIC RES CT UNI
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NAT MICROELECTRONIC RES CT UNI filed Critical NAT MICROELECTRONIC RES CT UNI
Publication of AU2002330718A1 publication Critical patent/AU2002330718A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H10W70/69—
    • H10W70/611—
    • H10W70/688—
    • H10W90/00—
AU2002330718A 2001-09-03 2002-08-30 Integrated circuit structure and a method of making an integrated circuit structure Abandoned AU2002330718A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
IE20010802 2001-09-03
IES010802 2001-09-03
PCT/IE2002/000128 WO2003021679A2 (en) 2001-09-03 2002-08-30 Integrated circuit structure and a method of making an integrated circuit structure

Publications (1)

Publication Number Publication Date
AU2002330718A1 true AU2002330718A1 (en) 2003-03-18

Family

ID=11042836

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002330718A Abandoned AU2002330718A1 (en) 2001-09-03 2002-08-30 Integrated circuit structure and a method of making an integrated circuit structure

Country Status (2)

Country Link
AU (1) AU2002330718A1 (en)
WO (1) WO2003021679A2 (en)

Families Citing this family (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2396252A (en) * 2002-10-01 2004-06-16 Steven Leftly Textile light system
WO2005001422A2 (en) * 2003-06-06 2005-01-06 The Board Of Trustees Of The University Of Illinois Sensor chip and apparatus for tactile and/or flow
US7644624B2 (en) 2004-06-04 2010-01-12 The Board Of Trustees Of The University Of Illinois Artificial lateral line
US7413802B2 (en) 2005-08-16 2008-08-19 Textronics, Inc. Energy active composite yarn, methods for making the same, and articles incorporating the same
ATE471572T1 (en) * 2006-04-07 2010-07-15 Koninkl Philips Electronics Nv ELASTIC DEFORMABLE INTEGRATED CIRCUIT
WO2007143123A2 (en) 2006-06-02 2007-12-13 The Board Of Trustees Of The University Of Illinois Micromachined artificial haircell
AU2007293476B2 (en) 2006-06-02 2011-07-07 The Board Of Trustees Of The University Of Illinois Soft mems
US20100218805A1 (en) * 2007-02-15 2010-09-02 The Australian National University Substrate, an assembly process, and an assembly apparatus
EP2154945B1 (en) 2007-05-14 2017-07-12 Philips Lighting Holding B.V. Shading device
FR2917895B1 (en) * 2007-06-21 2010-04-09 Commissariat Energie Atomique METHOD FOR MANUFACTURING AN ASSEMBLY OF MECHANICALLY CONNECTED CHIPS USING A FLEXIBLE CONNECTION
TWI370714B (en) 2008-01-09 2012-08-11 Ind Tech Res Inst Circuit structure and menufacturing method thereof
US8389862B2 (en) 2008-10-07 2013-03-05 Mc10, Inc. Extremely stretchable electronics
US8097926B2 (en) 2008-10-07 2012-01-17 Mc10, Inc. Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy
JP5646492B2 (en) 2008-10-07 2014-12-24 エムシー１０ インコーポレイテッドＭｃ１０，Ｉｎｃ． Stretchable integrated circuit and device with sensor array
US8886334B2 (en) 2008-10-07 2014-11-11 Mc10, Inc. Systems, methods, and devices using stretchable or flexible electronics for medical applications
US9123614B2 (en) 2008-10-07 2015-09-01 Mc10, Inc. Methods and applications of non-planar imaging arrays
EP2902294B1 (en) * 2008-11-12 2020-03-04 Mc10, Inc. Extremely stretchable electronics
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JP2012515436A (en) * 2009-01-12 2012-07-05 エムシー１０ インコーポレイテッド Non-planar imaging array methods and applications
US9723122B2 (en) 2009-10-01 2017-08-01 Mc10, Inc. Protective cases with integrated electronics
EP2355144A1 (en) 2010-02-09 2011-08-10 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Component placement on flexible and/or stretchable substrates
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EP2461658A1 (en) 2010-12-03 2012-06-06 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Method and apparatus for assembling electric components on a flexible substrate as well as assembly of an electric component with a flexible substrate
JP2014523633A (en) 2011-05-27 2014-09-11 エムシー１０ インコーポレイテッド Electronic, optical and / or mechanical devices and systems and methods of manufacturing these devices and systems
US9226402B2 (en) 2012-06-11 2015-12-29 Mc10, Inc. Strain isolation structures for stretchable electronics
JP2015521894A (en) 2012-07-05 2015-08-03 エムシー１０ インコーポレイテッドＭｃ１０，Ｉｎｃ． Catheter device including flow sensing
US9295842B2 (en) 2012-07-05 2016-03-29 Mc10, Inc. Catheter or guidewire device including flow sensing and use thereof
US9171794B2 (en) 2012-10-09 2015-10-27 Mc10, Inc. Embedding thin chips in polymer
JP2016500869A (en) 2012-10-09 2016-01-14 エムシー１０ インコーポレイテッドＭｃ１０，Ｉｎｃ． Conformal electronic circuit integrated with clothing
US9706647B2 (en) 2013-05-14 2017-07-11 Mc10, Inc. Conformal electronics including nested serpentine interconnects
CN105723197A (en) 2013-08-05 2016-06-29 Mc10股份有限公司 Flexible temperature sensor including conformable electronics
JP2016532468A (en) 2013-10-07 2016-10-20 エムシー１０ インコーポレイテッドＭｃ１０，Ｉｎｃ． Conformal sensor system for detection and analysis
EP3071096A4 (en) 2013-11-22 2017-08-09 Mc10, Inc. Conformal sensor systems for sensing and analysis of cardiac activity
WO2015100414A1 (en) 2013-12-27 2015-07-02 Arizona Board Of Regents On Behalf Of Arizona State University Deformable origami batteries
WO2015103580A2 (en) 2014-01-06 2015-07-09 Mc10, Inc. Encapsulated conformal electronic systems and devices, and methods of making and using the same
CA2940539C (en) 2014-03-04 2022-10-04 Mc10, Inc. Multi-part flexible encapsulation housing for electronic devices
WO2016049444A1 (en) 2014-09-26 2016-03-31 Arizona Board Of Regents On Behalf Of Arizona State University Stretchable batteries
US9899330B2 (en) 2014-10-03 2018-02-20 Mc10, Inc. Flexible electronic circuits with embedded integrated circuit die
US10297572B2 (en) 2014-10-06 2019-05-21 Mc10, Inc. Discrete flexible interconnects for modules of integrated circuits
USD781270S1 (en) 2014-10-15 2017-03-14 Mc10, Inc. Electronic device having antenna
CN107113960A (en) * 2014-12-08 2017-08-29 株式会社藤仓 Retractility substrate
WO2016109652A1 (en) * 2015-01-02 2016-07-07 Arizona Board Of Regents On Behalf Of Arizona State University Archimedean spiral design for deformable electronics
US10502991B2 (en) 2015-02-05 2019-12-10 The Arizona Board Of Regents On Behalf Of Arizona State University Origami displays and methods for their manufacture
WO2016134306A1 (en) 2015-02-20 2016-08-25 Mc10, Inc. Automated detection and configuration of wearable devices based on on-body status, location, and/or orientation
WO2016140961A1 (en) 2015-03-02 2016-09-09 Mc10, Inc. Perspiration sensor
US10653332B2 (en) 2015-07-17 2020-05-19 Mc10, Inc. Conductive stiffener, method of making a conductive stiffener, and conductive adhesive and encapsulation layers
US10709384B2 (en) 2015-08-19 2020-07-14 Mc10, Inc. Wearable heat flux devices and methods of use
WO2017059215A1 (en) 2015-10-01 2017-04-06 Mc10, Inc. Method and system for interacting with a virtual environment
CN108289630A (en) 2015-10-05 2018-07-17 Mc10股份有限公司 Method and system for nerve modulation and stimulation
CN108781313B (en) 2016-02-22 2022-04-08 美谛达解决方案公司 Systems, devices, and methods for coupled hubs and sensor nodes for on-body acquisition of sensor information
EP3420732B8 (en) 2016-02-22 2020-12-30 Medidata Solutions, Inc. System, devices, and method for on-body data and power transmission
CN109310340A (en) 2016-04-19 2019-02-05 Mc10股份有限公司 Method and system for measuring sweat
US10390698B2 (en) 2016-06-16 2019-08-27 Arizona Board Of Regents On Behalf Of Arizona State University Conductive and stretchable polymer composite
US10447347B2 (en) 2016-08-12 2019-10-15 Mc10, Inc. Wireless charger and high speed data off-loader

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE59609022D1 (en) * 1995-06-15 2002-05-08 Dyconex Patente Ag Zug CONNECTION SUBSTRATE
EP1050078B1 (en) * 1998-01-22 2002-04-17 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Microsystem and method for the production thereof
NO311317B1 (en) * 1999-04-30 2001-11-12 Thin Film Electronics Asa Apparatus comprising electronic and / or optoelectronic circuits and method of realizing and / or integrating circuits of this kind in the apparatus

Also Published As

Publication number Publication date
WO2003021679A3 (en) 2003-11-27
WO2003021679A2 (en) 2003-03-13

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase