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AU2000265772A1 - Method for making an integrated circuit capable of being surface-mounted and resulting circuit - Google Patents

Method for making an integrated circuit capable of being surface-mounted and resulting circuit

Info

Publication number
AU2000265772A1
AU2000265772A1 AU2000265772A AU6577200A AU2000265772A1 AU 2000265772 A1 AU2000265772 A1 AU 2000265772A1 AU 2000265772 A AU2000265772 A AU 2000265772A AU 6577200 A AU6577200 A AU 6577200A AU 2000265772 A1 AU2000265772 A1 AU 2000265772A1
Authority
AU
Australia
Prior art keywords
making
integrated circuit
resulting
circuit capable
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2000265772A
Inventor
Eric Pilat
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Teledyne e2v Semiconductors SAS
Original Assignee
Atmel Grenoble SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atmel Grenoble SA filed Critical Atmel Grenoble SA
Publication of AU2000265772A1 publication Critical patent/AU2000265772A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H10W70/60—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H10W70/093—
    • H10W70/68—
    • H10W90/701—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0249—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for simultaneous welding or soldering of a plurality of wires to contact elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10704—Pin grid array [PGA]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
    • H10W72/01215—
    • H10W72/222—
    • H10W72/223—
    • H10W72/252—
    • H10W72/255—
    • H10W72/90—
    • H10W90/724—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Lead Frames For Integrated Circuits (AREA)
AU2000265772A 2000-07-18 2000-07-18 Method for making an integrated circuit capable of being surface-mounted and resulting circuit Abandoned AU2000265772A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/FR2000/002063 WO2002007208A1 (en) 2000-07-18 2000-07-18 Method for making an integrated circuit capable of being surface-mounted and resulting circuit

Publications (1)

Publication Number Publication Date
AU2000265772A1 true AU2000265772A1 (en) 2002-01-30

Family

ID=8847160

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2000265772A Abandoned AU2000265772A1 (en) 2000-07-18 2000-07-18 Method for making an integrated circuit capable of being surface-mounted and resulting circuit

Country Status (8)

Country Link
US (1) US6989591B1 (en)
EP (1) EP1314196A1 (en)
JP (1) JP2004504722A (en)
KR (1) KR20030059078A (en)
AU (1) AU2000265772A1 (en)
CA (1) CA2416502A1 (en)
IL (1) IL154002A0 (en)
WO (1) WO2002007208A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2000265772A1 (en) * 2000-07-18 2002-01-30 Atmel Grenoble S.A. Method for making an integrated circuit capable of being surface-mounted and resulting circuit
JP4744689B2 (en) * 2000-12-11 2011-08-10 パナソニック株式会社 Viscous fluid transfer device and electronic component mounting device

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4396140A (en) * 1981-01-27 1983-08-02 Bell Telephone Laboratories, Incorporated Method of bonding electronic components
US4722470A (en) * 1986-12-01 1988-02-02 International Business Machines Corporation Method and transfer plate for applying solder to component leads
US4759491A (en) * 1987-05-18 1988-07-26 American Telephone And Telegraph Company Method and apparatus for applying bonding material to component leads
JPH01270391A (en) * 1988-04-22 1989-10-27 Nec Corp Pre-soldering method
JPH01278967A (en) * 1988-05-06 1989-11-09 Senju Metal Ind Co Ltd Presoldering method for lead of electronic parts
JP2810101B2 (en) * 1989-04-17 1998-10-15 日本エー・エム・ピー株式会社 Electric pin and method of manufacturing the same
JPH06132439A (en) * 1992-10-21 1994-05-13 Ngk Insulators Ltd Plating method for ceramic package
JPH08167772A (en) * 1994-12-14 1996-06-25 Hitachi Ltd Pre-soldering method for surface mount electronic components
US6007348A (en) 1996-05-07 1999-12-28 Advanced Intercommunications Corporation Solder ball terminal
US5847458A (en) * 1996-05-21 1998-12-08 Shinko Electric Industries Co., Ltd. Semiconductor package and device having heads coupled with insulating material
US5839191A (en) * 1997-01-24 1998-11-24 Unisys Corporation Vibrating template method of placing solder balls on the I/O pads of an integrated circuit package
US6002172A (en) * 1997-03-12 1999-12-14 International Business Machines Corporation Substrate structure and method for improving attachment reliability of semiconductor chips and modules
DE19807279C2 (en) 1998-02-23 2000-02-17 Dieter Friedrich Method for manufacturing an electronic component
FR2789225B1 (en) 1999-02-02 2004-09-03 Thomson Csf SURFACE MOUNTED INTEGRATED CIRCUIT
AU2000265772A1 (en) * 2000-07-18 2002-01-30 Atmel Grenoble S.A. Method for making an integrated circuit capable of being surface-mounted and resulting circuit

Also Published As

Publication number Publication date
WO2002007208A1 (en) 2002-01-24
EP1314196A1 (en) 2003-05-28
JP2004504722A (en) 2004-02-12
IL154002A0 (en) 2003-07-31
US6989591B1 (en) 2006-01-24
CA2416502A1 (en) 2002-01-24
KR20030059078A (en) 2003-07-07

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