AU2002359950A1 - Plasma treatment method - Google Patents

Plasma treatment method

Info

Publication number: AU2002359950A1
Authority: AU; Australia
Prior art keywords: treatment method; plasma treatment; plasma; treatment
Prior art date: 2002-01-07
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Abandoned

Application number

AU2002359950A

Inventor

Kiwamu Fujimoto

Takashi Fuse

Jeong Jy

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Tokyo Electron Ltd

Original Assignee

Tokyo Electron Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2002-01-07

Filing date

2002-12-27

Publication date

2003-07-24

2002-12-27 Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd

2003-07-24 Publication of AU2002359950A1 publication Critical patent/AU2002359950A1/en

Status Abandoned legal-status Critical Current

Classifications

- H10P50/287—
- H10P50/73—

AU2002359950A 2002-01-07 2002-12-27 Plasma treatment method Abandoned AU2002359950A1 (en)

Applications Claiming Priority (5)

Application Number	Priority Date	Filing Date	Title
JP2002-933		2002-01-07
JP2002000933		2002-01-07
JP2002-104160		2002-04-05
JP2002104160A JP4326746B2 (en)	2002-01-07	2002-04-05	Plasma processing method
PCT/JP2002/013861 WO2003058700A1 (en)	2002-01-07	2002-12-27	Plasma treatment method

Publications (1)

Publication Number	Publication Date
AU2002359950A1 true AU2002359950A1 (en)	2003-07-24

Family

ID=26625442

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
AU2002359950A Abandoned AU2002359950A1 (en)	2002-01-07	2002-12-27	Plasma treatment method

Country Status (4)

Country	Link
JP (1)	JP4326746B2 (en)
AU (1)	AU2002359950A1 (en)
TW (1)	TWI270137B (en)
WO (1)	WO2003058700A1 (en)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP4889199B2 (en) *	2003-11-05	2012-03-07	株式会社アルバック	Dry etching method for low dielectric constant interlayer insulating film
US20050101135A1 (en) *	2003-11-12	2005-05-12	Lam Research Corporation	Minimizing the loss of barrier materials during photoresist stripping
JP4749683B2 (en) *	2004-06-08	2011-08-17	東京エレクトロン株式会社	Etching method
US7951262B2 (en)	2004-06-21	2011-05-31	Tokyo Electron Limited	Plasma processing apparatus and method
JP5036143B2 (en) *	2004-06-21	2012-09-26	東京エレクトロン株式会社	Plasma processing apparatus, plasma processing method, and computer-readable storage medium
KR101247833B1 (en) *	2004-06-21	2013-03-26	도쿄엘렉트론가부시키가이샤	Plasma processing method
US7988816B2 (en)	2004-06-21	2011-08-02	Tokyo Electron Limited	Plasma processing apparatus and method
JP4672455B2 (en) *	2004-06-21	2011-04-20	東京エレクトロン株式会社	Plasma etching apparatus, plasma etching method, and computer-readable storage medium
US7740737B2 (en)	2004-06-21	2010-06-22	Tokyo Electron Limited	Plasma processing apparatus and method
JP4523351B2 (en) *	2004-07-14	2010-08-11	ルネサスエレクトロニクス株式会社	Manufacturing method of semiconductor device
JP4616605B2 (en) *	2004-09-27	2011-01-19	東京エレクトロン株式会社	Plasma processing method, plasma processing apparatus, and storage medium
US8193096B2 (en)	2004-12-13	2012-06-05	Novellus Systems, Inc.	High dose implantation strip (HDIS) in H2 base chemistry
US8129281B1 (en)	2005-05-12	2012-03-06	Novellus Systems, Inc.	Plasma based photoresist removal system for cleaning post ash residue
US7244313B1 (en) *	2006-03-24	2007-07-17	Applied Materials, Inc.	Plasma etch and photoresist strip process with intervening chamber de-fluorination and wafer de-fluorination steps
US8435895B2 (en)	2007-04-04	2013-05-07	Novellus Systems, Inc.	Methods for stripping photoresist and/or cleaning metal regions
KR101770008B1 (en)	2009-12-11	2017-08-21	노벨러스 시스템즈, 인코포레이티드	Enhanced passivation process to protect silicon prior to high dose implant strip
US20110143548A1 (en)	2009-12-11	2011-06-16	David Cheung	Ultra low silicon loss high dose implant strip
US9613825B2 (en)	2011-08-26	2017-04-04	Novellus Systems, Inc.	Photoresist strip processes for improved device integrity
US9514954B2 (en)	2014-06-10	2016-12-06	Lam Research Corporation	Peroxide-vapor treatment for enhancing photoresist-strip performance and modifying organic films
KR20230029686A (en)	2020-06-30	2023-03-03	램 리써치 코포레이션	Intralevel Capacitance Reduction in Semiconductor Devices
EP4636811A1 (en) *	2022-12-28	2025-10-22	Tokyo Electron Limited	Substrate processing method and substrate processing device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH11214356A (en) *	1998-01-29	1999-08-06	Sony Corp	Dry etching method for silicon substrate
JP2000195830A (en) *	1998-12-28	2000-07-14	Mitsubishi Electric Corp	Semiconductor manufacturing apparatus, semiconductor manufacturing apparatus cleaning method, semiconductor device manufacturing method, and semiconductor device
US6492186B1 (en) *	1999-08-05	2002-12-10	Eaton Corporation	Method for detecting an endpoint for an oxygen free plasma process
JP2001135630A (en) *	1999-11-10	2001-05-18	Matsushita Electronics Industry Corp	Method for manufacturing semiconductor device

2002
- 2002-04-05 JP JP2002104160A patent/JP4326746B2/en not_active Expired - Fee Related
- 2002-12-26 TW TW091137526A patent/TWI270137B/en not_active IP Right Cessation
- 2002-12-27 WO PCT/JP2002/013861 patent/WO2003058700A1/en not_active Ceased
- 2002-12-27 AU AU2002359950A patent/AU2002359950A1/en not_active Abandoned

Also Published As

Publication number	Publication date
JP2003264170A (en)	2003-09-19
TWI270137B (en)	2007-01-01
WO2003058700A1 (en)	2003-07-17
TW200306625A (en)	2003-11-16
JP4326746B2 (en)	2009-09-09

Publication	Publication Date	Title
AU2003244166A1 (en)	2004-01-19	Plasma processing method
AU2003236309A1 (en)	2003-10-20	Plasma etching method
AU2002232187A1 (en)	2003-09-04	Authenticating method
AU2003280004A1 (en)	2004-06-03	Hair treatment method
AU2002359950A1 (en)	2003-07-24	Plasma treatment method
AU2002359947A1 (en)	2003-11-10	Substrate treatment apparatus
AU2003277596A1 (en)	2004-07-29	Method of deuterization
AU2003222492A1 (en)	2003-11-10	Plasma sterilizer apparatus
AUPS160602A0 (en)	2002-05-16	Therapeutic method
AU2003258070A1 (en)	2004-02-23	Electrodionization method
AU2003221340A1 (en)	2003-09-22	Plasma processing apparatus
AU2003278355A1 (en)	2004-05-25	Process
AU2003205849A1 (en)	2003-09-04	Plasma processing apparatus
AU2003252470A1 (en)	2004-01-23	Plasma processing apparatus
AUPS334902A0 (en)	2002-07-25	Purification method
AU2002951913A0 (en)	2002-10-24	Method of treatment
AU2003253813A1 (en)	2004-01-23	Method for colpoplasty
AU2003236232A1 (en)	2003-11-17	Method for treatment of textile
AU2003263197A1 (en)	2004-02-25	Process
AU2003278535A1 (en)	2004-01-06	Histoscreen method
AU2003213109A1 (en)	2003-09-09	Method for treating cellulite
AU2003210099A1 (en)	2003-09-16	New method
AUPS230702A0 (en)	2002-06-13	A method of treatment
AUPS164502A0 (en)	2002-05-16	Treatment methods
AU2002953042A0 (en)	2002-12-19	Method of treatment

Legal Events

Date	Code	Title	Description
2004-09-23	MK6	Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase