AU2003252470A1 - Plasma processing apparatus - Google Patents

Plasma processing apparatus

Info

Publication number: AU2003252470A1
Authority: AU; Australia
Prior art keywords: processing apparatus; plasma processing; plasma; processing
Prior art date: 2002-07-03
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Abandoned

Application number

AU2003252470A

Inventor

Tsutomu Higashiura

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Tokyo Electron Ltd

Original Assignee

Tokyo Electron Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2002-07-03

Filing date

2003-07-03

Publication date

2004-01-23

2003-07-03 Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd

2004-01-23 Publication of AU2003252470A1 publication Critical patent/AU2003252470A1/en

Status Abandoned legal-status Critical Current

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge

Landscapes

Physics & Mathematics (AREA)
Engineering & Computer Science (AREA)
Plasma & Fusion (AREA)
Chemical & Material Sciences (AREA)
Analytical Chemistry (AREA)
Plasma Technology (AREA)
Physical Or Chemical Processes And Apparatus (AREA)
Chemical Vapour Deposition (AREA)

AU2003252470A 2002-07-03 2003-07-03 Plasma processing apparatus Abandoned AU2003252470A1 (en)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
JP2002-194431		2002-07-03
JP2002194431A JP4127488B2 (en)	2002-07-03	2002-07-03	Plasma processing equipment
PCT/JP2003/008494 WO2004006320A1 (en)	2002-07-03	2003-07-03	Plasma processing apparatus

Publications (1)

Publication Number	Publication Date
AU2003252470A1 true AU2003252470A1 (en)	2004-01-23

Family

ID=30112304

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
AU2003252470A Abandoned AU2003252470A1 (en)	2002-07-03	2003-07-03	Plasma processing apparatus

Country Status (3)

Country	Link
JP (1)	JP4127488B2 (en)
AU (1)	AU2003252470A1 (en)
WO (1)	WO2004006320A1 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP4904202B2 (en) *	2006-05-22	2012-03-28	ジーイーエヌカンパニーリミッテッド	Plasma reactor
TWI661746B (en) *	2011-10-05	2019-06-01	應用材料股份有限公司	Plasma processing equipment and its cover assembly (1)
CN105612602B (en)	2013-09-25	2019-04-16	Ev 集团 E·索尔纳有限责任公司	Apparatus and method for bonding substrates
JP5850581B2 (en)	2013-11-29	2016-02-03	株式会社京三製作所	Plasma non-ignition state discrimination device and plasma non-ignition discrimination method
JP6574547B2 (en) *	2013-12-12	2019-09-11	東京エレクトロン株式会社	Plasma processing apparatus and plasma processing method
KR102352739B1 (en) *	2014-04-09	2022-01-17	어플라이드 머티어리얼스, 인코포레이티드	Symmetric chamber body design architecture to address variable process volume with improved flow uniformity/gas conductance
JP6638031B2 (en) *	2018-07-30	2020-01-29	エーファウ・グループ・エー・タルナー・ゲーエムベーハー	Apparatus and method for bonding substrates
WO2020242799A1 (en) *	2019-05-24	2020-12-03	Applied Materials, Inc.	Substrate processing chamber
WO2021154492A1 (en) *	2020-01-30	2021-08-05	Lam Research Corporation	Impedance match with an elongated rf strap
FI130020B (en)	2021-05-10	2022-12-30	Picosun Oy	Substrate processing apparatus and method
CN115692263B (en)	2022-10-31	2023-06-16	北京北方华创微电子装备有限公司	Semiconductor process chamber and semiconductor process equipment

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2593282Y2 (en) *	1992-11-10	1999-04-05	株式会社島津製作所	Plasma CVD equipment
JP3425009B2 (en) *	1995-05-30	2003-07-07	アネルバ株式会社	Surface treatment equipment
JP3396399B2 (en) *	1997-06-26	2003-04-14	シャープ株式会社	Electronic device manufacturing equipment
JP3377773B2 (en) *	2000-03-24	2003-02-17	三菱重工業株式会社	Power supply method to discharge electrode, high-frequency plasma generation method, and semiconductor manufacturing method
JP2002110566A (en) *	2000-10-02	2002-04-12	Mitsubishi Heavy Ind Ltd	High frequency plasma generator
JP3847581B2 (en) *	2001-06-29	2006-11-22	アルプス電気株式会社	Plasma processing apparatus and plasma processing system

2002
- 2002-07-03 JP JP2002194431A patent/JP4127488B2/en not_active Expired - Fee Related
2003
- 2003-07-03 WO PCT/JP2003/008494 patent/WO2004006320A1/en not_active Ceased
- 2003-07-03 AU AU2003252470A patent/AU2003252470A1/en not_active Abandoned

Also Published As

Publication number	Publication date
JP2004039844A (en)	2004-02-05
WO2004006320A1 (en)	2004-01-15
JP4127488B2 (en)	2008-07-30

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Legal Events

Date	Code	Title	Description
2005-04-28	MK6	Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase