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AU2002215939A1 - Copper bath and method of depositing a matt copper coating - Google Patents

Copper bath and method of depositing a matt copper coating

Info

Publication number
AU2002215939A1
AU2002215939A1 AU2002215939A AU1593902A AU2002215939A1 AU 2002215939 A1 AU2002215939 A1 AU 2002215939A1 AU 2002215939 A AU2002215939 A AU 2002215939A AU 1593902 A AU1593902 A AU 1593902A AU 2002215939 A1 AU2002215939 A1 AU 2002215939A1
Authority
AU
Australia
Prior art keywords
copper
matt
bath
layers
poly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002215939A
Other languages
English (en)
Inventor
Stefan Kretschmer
Torsten Kussner
Thorsten Ross
Gerd Senge
Gonzalo Urrutia Desmaison
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Atotech Deutschland GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE10058896A external-priority patent/DE10058896C1/de
Application filed by Atotech Deutschland GmbH and Co KG filed Critical Atotech Deutschland GmbH and Co KG
Publication of AU2002215939A1 publication Critical patent/AU2002215939A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
AU2002215939A 2000-10-19 2001-10-10 Copper bath and method of depositing a matt copper coating Abandoned AU2002215939A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
DE10052987 2000-10-19
DE10052987.9 2000-10-19
DE10058896A DE10058896C1 (de) 2000-10-19 2000-11-22 Elektrolytisches Kupferbad, dessen Verwendung und Verfahren zur Abscheidung einer matten Kupferschicht
DE10058896.4 2000-11-22
PCT/EP2001/011734 WO2002033153A2 (fr) 2000-10-19 2001-10-10 Bain de cuivre et procede de depot d'un revetement de cuivre mat

Publications (1)

Publication Number Publication Date
AU2002215939A1 true AU2002215939A1 (en) 2002-04-29

Family

ID=26007494

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002215939A Abandoned AU2002215939A1 (en) 2000-10-19 2001-10-10 Copper bath and method of depositing a matt copper coating

Country Status (12)

Country Link
US (1) US7074315B2 (fr)
EP (1) EP1341951B1 (fr)
JP (1) JP3899313B2 (fr)
KR (1) KR100801908B1 (fr)
CN (1) CN1314839C (fr)
AT (1) ATE267278T1 (fr)
AU (1) AU2002215939A1 (fr)
BR (1) BR0114600B1 (fr)
CA (1) CA2419595A1 (fr)
MX (1) MX230531B (fr)
TW (1) TW526293B (fr)
WO (1) WO2002033153A2 (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7079246B2 (en) * 2003-04-15 2006-07-18 Lucent Technologies Inc. Method and apparatus for measuring polarization
CN100362141C (zh) * 2005-09-01 2008-01-16 山东建筑工程学院材料科学研究所 丙三醇无氰光亮镀铜液
WO2007076898A1 (fr) * 2006-01-06 2007-07-12 Enthone Inc Électrolyte et procédé de séparation d’une couche métallique mate
JP4954686B2 (ja) * 2006-11-29 2012-06-20 福田金属箔粉工業株式会社 電解銅箔とその製造方法
KR101752018B1 (ko) * 2009-07-30 2017-06-28 바스프 에스이 무보이드 서브마이크론 피쳐 충전을 위한 억제제를 포함하는 도금용 조성물
EP2620529B1 (fr) 2012-01-25 2014-04-30 Atotech Deutschland GmbH Procédé de production de dépôts de cuivre mate
US9243339B2 (en) 2012-05-25 2016-01-26 Trevor Pearson Additives for producing copper electrodeposits having low oxygen content
US11384446B2 (en) * 2020-08-28 2022-07-12 Macdermid Enthone Inc. Compositions and methods for the electrodeposition of nanotwinned copper
CN117795135A (zh) * 2021-08-05 2024-03-29 麦克德米德乐思公司 用于电沉积纳米孪晶铜的组合物和方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4928571B1 (fr) * 1969-11-05 1974-07-27
US3682788A (en) 1970-07-28 1972-08-08 M & T Chemicals Inc Copper electroplating
JPS4928571A (fr) 1972-07-11 1974-03-14
US3945894A (en) 1975-04-11 1976-03-23 Oxy Metal Industries Corporation Bath composition and method of electrodepositing utilizing the same
US4134803A (en) 1977-12-21 1979-01-16 R. O. Hull & Company, Inc. Nitrogen and sulfur compositions and acid copper plating baths
US4336114A (en) 1981-03-26 1982-06-22 Hooker Chemicals & Plastics Corp. Electrodeposition of bright copper
US4376685A (en) 1981-06-24 1983-03-15 M&T Chemicals Inc. Acid copper electroplating baths containing brightening and leveling additives
US4385967A (en) 1981-10-07 1983-05-31 Chemcut Corporation Electroplating apparatus and method
SU1158621A1 (ru) * 1981-12-30 1985-05-30 Dn Khim T I Im F E Dzerzhinsko "элektpoлиt циhkobahия"
DE3483078D1 (de) * 1983-09-28 1990-10-04 Blasberg Oberflaechentech Saures galvanisches kupferbad und verfahren zu seiner herstellung.
US4555315A (en) 1984-05-29 1985-11-26 Omi International Corporation High speed copper electroplating process and bath therefor
DE3624481A1 (de) 1986-07-19 1988-01-28 Schering Ag Anordnung zur elektrolytischen behandlung von plattenfoermigen gegenstaenden
US4755271A (en) 1986-07-28 1988-07-05 Siemens Aktiengesellschaft Electroplating apparatus for plate-shaped workpieces, particularly printed circuit boards
US4781801A (en) 1987-02-03 1988-11-01 Mcgean-Rohco, Inc. Method of copper plating gravure rolls
DE3836521C2 (de) 1988-10-24 1995-04-13 Atotech Deutschland Gmbh Wäßriges saures Bad zur galvanischen Abscheidung von glänzenden und rißfreien Kupferüberzügen und Verwendung des Bades
DE4126502C1 (fr) 1991-08-07 1993-02-11 Schering Ag Berlin Und Bergkamen, 1000 Berlin, De
US5328589A (en) * 1992-12-23 1994-07-12 Enthone-Omi, Inc. Functional fluid additives for acid copper electroplating baths
JP3718790B2 (ja) * 1998-12-24 2005-11-24 石原薬品株式会社 銀及び銀合金メッキ浴

Also Published As

Publication number Publication date
JP3899313B2 (ja) 2007-03-28
TW526293B (en) 2003-04-01
CN1636083A (zh) 2005-07-06
MX230531B (es) 2005-09-12
WO2002033153A2 (fr) 2002-04-25
US20040020783A1 (en) 2004-02-05
US7074315B2 (en) 2006-07-11
JP2004511663A (ja) 2004-04-15
EP1341951A2 (fr) 2003-09-10
CN1314839C (zh) 2007-05-09
KR100801908B1 (ko) 2008-02-12
MXPA03002739A (es) 2003-07-28
KR20030045101A (ko) 2003-06-09
BR0114600B1 (pt) 2011-04-05
CA2419595A1 (fr) 2002-04-25
EP1341951B1 (fr) 2004-05-19
ATE267278T1 (de) 2004-06-15
BR0114600A (pt) 2004-01-20
HK1054766A1 (en) 2003-12-12
WO2002033153A3 (fr) 2003-06-19

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