[go: up one dir, main page]

AU2002215939A1 - Copper bath and method of depositing a matt copper coating - Google Patents

Copper bath and method of depositing a matt copper coating

Info

Publication number
AU2002215939A1
AU2002215939A1 AU2002215939A AU1593902A AU2002215939A1 AU 2002215939 A1 AU2002215939 A1 AU 2002215939A1 AU 2002215939 A AU2002215939 A AU 2002215939A AU 1593902 A AU1593902 A AU 1593902A AU 2002215939 A1 AU2002215939 A1 AU 2002215939A1
Authority
AU
Australia
Prior art keywords
copper
matt
bath
layers
poly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002215939A
Inventor
Stefan Kretschmer
Torsten Kussner
Thorsten Ross
Gerd Senge
Gonzalo Urrutia Desmaison
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Atotech Deutschland GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE10058896A external-priority patent/DE10058896C1/en
Application filed by Atotech Deutschland GmbH and Co KG filed Critical Atotech Deutschland GmbH and Co KG
Publication of AU2002215939A1 publication Critical patent/AU2002215939A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

In the production of printed circuit boards it is required that organic protective coatings adhere tightly on the copper surfaces. Accordingly, matt layers of copper are to be preferred over lustrous coatings. The bath in accordance with the invention serves to deposit matt layers of copper and has the additional advantageous property that the layers may also be deposited with sufficient coating thickness in very narrow bore holes at average cathode current density. For this purpose the bath contains at least one polyglycerin compound selected from the group comprising poly(1,2,3-propantriol), poly(2,3-epoxy-1-propanol) and derivatives thereof.
AU2002215939A 2000-10-19 2001-10-10 Copper bath and method of depositing a matt copper coating Abandoned AU2002215939A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
DE10052987 2000-10-19
DE10052987.9 2000-10-19
DE10058896A DE10058896C1 (en) 2000-10-19 2000-11-22 Electrolytic copper bath, its use and method for depositing a matt copper layer
DE10058896.4 2000-11-22
PCT/EP2001/011734 WO2002033153A2 (en) 2000-10-19 2001-10-10 Copper bath and method of depositing a matt copper coating

Publications (1)

Publication Number Publication Date
AU2002215939A1 true AU2002215939A1 (en) 2002-04-29

Family

ID=26007494

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002215939A Abandoned AU2002215939A1 (en) 2000-10-19 2001-10-10 Copper bath and method of depositing a matt copper coating

Country Status (12)

Country Link
US (1) US7074315B2 (en)
EP (1) EP1341951B1 (en)
JP (1) JP3899313B2 (en)
KR (1) KR100801908B1 (en)
CN (1) CN1314839C (en)
AT (1) ATE267278T1 (en)
AU (1) AU2002215939A1 (en)
BR (1) BR0114600B1 (en)
CA (1) CA2419595A1 (en)
MX (1) MX230531B (en)
TW (1) TW526293B (en)
WO (1) WO2002033153A2 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7079246B2 (en) * 2003-04-15 2006-07-18 Lucent Technologies Inc. Method and apparatus for measuring polarization
CN100362141C (en) * 2005-09-01 2008-01-16 山东建筑工程学院材料科学研究所 Propanetriol non-cyanide bright copper plating liquid
WO2007076898A1 (en) * 2006-01-06 2007-07-12 Enthone Inc Electrolyte and process for depositing a matt metal layer
JP4954686B2 (en) * 2006-11-29 2012-06-20 福田金属箔粉工業株式会社 Electrolytic copper foil and manufacturing method thereof
KR101752018B1 (en) * 2009-07-30 2017-06-28 바스프 에스이 Composition for metal plating comprising suppressing agent for void free submicron feature filling
EP2620529B1 (en) 2012-01-25 2014-04-30 Atotech Deutschland GmbH Method for producing matt copper deposits
US9243339B2 (en) 2012-05-25 2016-01-26 Trevor Pearson Additives for producing copper electrodeposits having low oxygen content
US11384446B2 (en) * 2020-08-28 2022-07-12 Macdermid Enthone Inc. Compositions and methods for the electrodeposition of nanotwinned copper
CN117795135A (en) * 2021-08-05 2024-03-29 麦克德米德乐思公司 Compositions and methods for electrodepositing nanotwinned copper

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4928571B1 (en) * 1969-11-05 1974-07-27
US3682788A (en) 1970-07-28 1972-08-08 M & T Chemicals Inc Copper electroplating
JPS4928571A (en) 1972-07-11 1974-03-14
US3945894A (en) 1975-04-11 1976-03-23 Oxy Metal Industries Corporation Bath composition and method of electrodepositing utilizing the same
US4134803A (en) 1977-12-21 1979-01-16 R. O. Hull & Company, Inc. Nitrogen and sulfur compositions and acid copper plating baths
US4336114A (en) 1981-03-26 1982-06-22 Hooker Chemicals & Plastics Corp. Electrodeposition of bright copper
US4376685A (en) 1981-06-24 1983-03-15 M&T Chemicals Inc. Acid copper electroplating baths containing brightening and leveling additives
US4385967A (en) 1981-10-07 1983-05-31 Chemcut Corporation Electroplating apparatus and method
SU1158621A1 (en) * 1981-12-30 1985-05-30 Dn Khim T I Im F E Dzerzhinsko Zinc-plating electrolyte
DE3483078D1 (en) * 1983-09-28 1990-10-04 Blasberg Oberflaechentech ACID GALVANIC COPPER BATH AND METHOD FOR THE PRODUCTION THEREOF.
US4555315A (en) 1984-05-29 1985-11-26 Omi International Corporation High speed copper electroplating process and bath therefor
DE3624481A1 (en) 1986-07-19 1988-01-28 Schering Ag ARRANGEMENT FOR THE ELECTROLYTIC TREATMENT OF PLATE-SHAPED OBJECTS
US4755271A (en) 1986-07-28 1988-07-05 Siemens Aktiengesellschaft Electroplating apparatus for plate-shaped workpieces, particularly printed circuit boards
US4781801A (en) 1987-02-03 1988-11-01 Mcgean-Rohco, Inc. Method of copper plating gravure rolls
DE3836521C2 (en) 1988-10-24 1995-04-13 Atotech Deutschland Gmbh Aqueous acidic bath for the galvanic deposition of shiny and crack-free copper coatings and use of the bath
DE4126502C1 (en) 1991-08-07 1993-02-11 Schering Ag Berlin Und Bergkamen, 1000 Berlin, De
US5328589A (en) * 1992-12-23 1994-07-12 Enthone-Omi, Inc. Functional fluid additives for acid copper electroplating baths
JP3718790B2 (en) * 1998-12-24 2005-11-24 石原薬品株式会社 Silver and silver alloy plating bath

Also Published As

Publication number Publication date
JP3899313B2 (en) 2007-03-28
TW526293B (en) 2003-04-01
CN1636083A (en) 2005-07-06
MX230531B (en) 2005-09-12
WO2002033153A2 (en) 2002-04-25
US20040020783A1 (en) 2004-02-05
US7074315B2 (en) 2006-07-11
JP2004511663A (en) 2004-04-15
EP1341951A2 (en) 2003-09-10
CN1314839C (en) 2007-05-09
KR100801908B1 (en) 2008-02-12
MXPA03002739A (en) 2003-07-28
KR20030045101A (en) 2003-06-09
BR0114600B1 (en) 2011-04-05
CA2419595A1 (en) 2002-04-25
EP1341951B1 (en) 2004-05-19
ATE267278T1 (en) 2004-06-15
BR0114600A (en) 2004-01-20
HK1054766A1 (en) 2003-12-12
WO2002033153A3 (en) 2003-06-19

Similar Documents

Publication Publication Date Title
US5733466A (en) Electrolytic method of depositing gold connectors on a printed circuit board
MY128333A (en) Printed wiring board and its manufacturing method
EP1744609A3 (en) Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board
EP1260607A3 (en) Plating method
CA2275214A1 (en) Process to electrolytically deposit copper layers
TW200513549A (en) Electroplating composite substrates
MY120628A (en) Electronic component having external electrodes and method for the manufacture thereof
EP1201786A3 (en) Seed layer deposition
WO2000005747A3 (en) Metallization structures for microelectronic applications and process for forming the structures
MY139405A (en) Printed circuit board and method for its production
WO2002055762A3 (en) Electrochemical co-deposition of metals for electronic device manufacture
AU2002215939A1 (en) Copper bath and method of depositing a matt copper coating
TW200741037A (en) Plating apparatus and plating method
EP1185151A4 (en) SURFACE TREATED COPPER SHEET AND PROCESS FOR PREPARING SAME AND COPPER COATING LAMINATE USING SAME
ATE282248T1 (en) METHOD FOR GALVANICALLY FORMING CONDUCTOR STRUCTURES FROM HIGH PURITY COPPER IN THE PRODUCTION OF INTEGRATED CIRCUITS
WO2002004704A3 (en) Method and apparatus for patching electrochemically deposited layers using electroless deposited materials
EP1017068A3 (en) Process for forming device comprising metallized magnetic substrates
WO2001090446A3 (en) Method and apparatus to overcome anomalies in copper seed layers and to tune for feature size and aspect ratio
DE59805020D1 (en) METHOD FOR METALLIZING A SUBSTRATE HAVING ELECTRICALLY NON-CONDUCTIVE SURFACE AREAS
MY124505A (en) Copper bath and method of depositing a matt copper coating
EP1199384A3 (en) Plating Bath
ATE162923T1 (en) METHOD FOR PRODUCING A CIRCUIT BOARD.
AU2003290633A1 (en) Multi-layer circuit assembly and process for preparing the same
SE0101868D0 (en) Method of applying copper to substrate
WO1998020523A3 (en) Method for selectively plating an organic substrate