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AU2001288081A1 - Photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board - Google Patents

Photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board

Info

Publication number
AU2001288081A1
AU2001288081A1 AU2001288081A AU8808101A AU2001288081A1 AU 2001288081 A1 AU2001288081 A1 AU 2001288081A1 AU 2001288081 A AU2001288081 A AU 2001288081A AU 8808101 A AU8808101 A AU 8808101A AU 2001288081 A1 AU2001288081 A1 AU 2001288081A1
Authority
AU
Australia
Prior art keywords
wiring board
printed wiring
resist pattern
photosensitive element
forming resist
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001288081A
Inventor
Tomoaki Aoki
Tatsuya Ichikawa
Taku Kawaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of AU2001288081A1 publication Critical patent/AU2001288081A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
AU2001288081A 2000-09-20 2001-09-20 Photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board Abandoned AU2001288081A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000285465 2000-09-20
JP2000-285465 2000-09-20
PCT/JP2001/008192 WO2002025377A1 (en) 2000-09-20 2001-09-20 Photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board

Publications (1)

Publication Number Publication Date
AU2001288081A1 true AU2001288081A1 (en) 2002-04-02

Family

ID=18769529

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001288081A Abandoned AU2001288081A1 (en) 2000-09-20 2001-09-20 Photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board

Country Status (8)

Country Link
US (1) US7078151B2 (en)
JP (1) JPWO2002025377A1 (en)
KR (1) KR100588991B1 (en)
CN (1) CN1265244C (en)
AU (1) AU2001288081A1 (en)
MY (1) MY130867A (en)
TW (1) TWI285296B (en)
WO (1) WO2002025377A1 (en)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7309559B2 (en) * 2000-09-27 2007-12-18 Hitachi Chemical Co., Ltd. Resist pattern, process for producing same, and utilization thereof
WO2002079878A1 (en) * 2001-03-29 2002-10-10 Hitachi Chemical Co., Ltd. Photosensitive film for circuit formation and process for producing printed wiring board
JP4716347B2 (en) * 2001-04-05 2011-07-06 旭化成イーマテリアルズ株式会社 Dry film resist
JP4314911B2 (en) * 2003-08-20 2009-08-19 スタンレー電気株式会社 Vehicle headlamp
JP4140042B2 (en) * 2003-09-17 2008-08-27 スタンレー電気株式会社 LED light source device using phosphor and vehicle headlamp using LED light source device
JP4402425B2 (en) * 2003-10-24 2010-01-20 スタンレー電気株式会社 Vehicle headlamp
JP2005173369A (en) * 2003-12-12 2005-06-30 Tokyo Ohka Kogyo Co Ltd Method for removing resist pattern
ATE553157T1 (en) * 2004-10-07 2012-04-15 Hitachi Chemical Co Ltd RESIN COMPOSITION FOR OPTICAL MATERIAL, RESIN FILM FOR OPTICAL MATERIAL AND OPTICAL MATERIAL THEREOF
TW200745755A (en) * 2006-05-26 2007-12-16 Dongwoo Fine Chem Co Ltd Colored negative photoresist composition, colored pattern comprising the same, and method for producing the colored pattern
JP2008083683A (en) * 2006-08-30 2008-04-10 Nitto Denko Corp Photosensitive resin composition for flexible printed circuit board and flexible printed circuit board obtained using the same
JP2008083684A (en) * 2006-08-30 2008-04-10 Nitto Denko Corp Photosensitive resin composition for flexible printed circuit board and flexible printed circuit board obtained using the same
CN101512437B (en) 2006-09-13 2011-12-14 日立化成工业株式会社 Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board
JP2008243957A (en) * 2007-03-26 2008-10-09 Nitto Denko Corp Manufacturing method of printed circuit board
CN102067037B (en) * 2008-06-18 2013-07-24 日立化成株式会社 Photosensitive resin composition, photosensitive element using same, method for forming resist pattern, and method for manufacturing printed circuit board
WO2010021030A1 (en) * 2008-08-20 2010-02-25 富士通株式会社 Material for resist sensitization film formation, process for producing semiconductor device, semiconductor device, and magnetic head
KR20150061016A (en) 2008-08-22 2015-06-03 히타치가세이가부시끼가이샤 Photosensitive conductive film, method for forming conductive film, method for forming conductive pattern, and conductive film substrate
KR101016361B1 (en) * 2010-10-28 2011-02-21 주식회사 한반도건축 Door opening and closing door to prevent flooding
CN103076719B (en) * 2011-10-26 2019-08-09 日立化成株式会社 Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board
JP6267602B2 (en) * 2014-08-19 2018-01-24 新光電気工業株式会社 Resist pattern forming method and wiring board manufacturing method
JP6582628B2 (en) * 2015-07-02 2019-10-02 富士通株式会社 Process allocation method, process allocation apparatus, and process allocation program
KR102275737B1 (en) * 2015-09-25 2021-07-08 코오롱인더스트리 주식회사 Photosensitive resin composition for Dry Film Photoresist
JP6421161B2 (en) * 2015-11-27 2018-11-07 株式会社タムラ製作所 Photosensitive resin composition
JP7246615B2 (en) * 2017-12-20 2023-03-28 住友電気工業株式会社 Printed wiring board manufacturing method and laminate
CN114901454A (en) * 2020-01-28 2022-08-12 昭和电工材料株式会社 Photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board
CN114355728A (en) * 2021-12-03 2022-04-15 杭州福斯特电子材料有限公司 A dry film resist laminate and its preparation method and application
JP2024038567A (en) * 2022-09-08 2024-03-21 三菱製紙株式会社 Photosensitive resin composition for etching and etching method

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4629680A (en) * 1984-01-30 1986-12-16 Fuji Photo Film Co., Ltd. Photopolymerizable materials capable of being developed by a weak alkaline aqueous solution
JPH0740133B2 (en) * 1987-02-17 1995-05-01 富士写真フイルム株式会社 No dampening water required Photosensitive lithographic printing plate
JP2982311B2 (en) 1991-01-09 1999-11-22 東レ株式会社 Antistatic polyester film
JPH06287288A (en) 1993-03-31 1994-10-11 Toray Ind Inc Modified polyester and film
JPH0887106A (en) * 1994-09-20 1996-04-02 Asahi Chem Ind Co Ltd Photosensitive structural body for flexographic printing plate
JPH09211851A (en) 1996-02-05 1997-08-15 Toyo Ink Mfg Co Ltd Image forming material and image forming method thereof
JP2000214583A (en) 1999-01-22 2000-08-04 Hitachi Chem Co Ltd Photosensitive resin composition, and photosensitive element using same and manufacture of resist pattern and printed circuit board
JP2001005178A (en) 1999-06-18 2001-01-12 Fuji Photo Film Co Ltd Image forming method, multilayer circuit board, and multilayer film used for the same

Also Published As

Publication number Publication date
US7078151B2 (en) 2006-07-18
WO2002025377A1 (en) 2002-03-28
KR20040004378A (en) 2004-01-13
TWI285296B (en) 2007-08-11
CN1265244C (en) 2006-07-19
KR100588991B1 (en) 2006-06-14
MY130867A (en) 2007-07-31
CN1460200A (en) 2003-12-03
JPWO2002025377A1 (en) 2004-01-29
US20040018446A1 (en) 2004-01-29

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