[go: up one dir, main page]

AU7315000A - Photosensitive resin compositions, photosensitive element containing the same, process for producing resist pattern, and process for producing printed circuit board - Google Patents

Photosensitive resin compositions, photosensitive element containing the same, process for producing resist pattern, and process for producing printed circuit board

Info

Publication number
AU7315000A
AU7315000A AU73150/00A AU7315000A AU7315000A AU 7315000 A AU7315000 A AU 7315000A AU 73150/00 A AU73150/00 A AU 73150/00A AU 7315000 A AU7315000 A AU 7315000A AU 7315000 A AU7315000 A AU 7315000A
Authority
AU
Australia
Prior art keywords
producing
circuit board
printed circuit
resist pattern
same
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU73150/00A
Inventor
Takahiro Hidaka
Yasuharu Murakami
Yukiko Muramatsu
Michiko Natori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of AU7315000A publication Critical patent/AU7315000A/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
AU73150/00A 1999-09-17 2000-09-18 Photosensitive resin compositions, photosensitive element containing the same, process for producing resist pattern, and process for producing printed circuit board Abandoned AU7315000A (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP11/263863 1999-09-17
JP26386399 1999-09-17
JP11/313180 1999-11-04
JP31318099 1999-11-04
PCT/JP2000/006353 WO2001022165A1 (en) 1999-09-17 2000-09-18 Photosensitive resin compositions, photosensitive element containing the same, process for producing resist pattern, and process for producing printed circuit board

Publications (1)

Publication Number Publication Date
AU7315000A true AU7315000A (en) 2001-04-24

Family

ID=26546229

Family Applications (1)

Application Number Title Priority Date Filing Date
AU73150/00A Abandoned AU7315000A (en) 1999-09-17 2000-09-18 Photosensitive resin compositions, photosensitive element containing the same, process for producing resist pattern, and process for producing printed circuit board

Country Status (4)

Country Link
JP (1) JP3765272B2 (en)
AU (1) AU7315000A (en)
TW (1) TWI251123B (en)
WO (1) WO2001022165A1 (en)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002341537A (en) * 2001-05-21 2002-11-27 Jsr Corp Negative-type radiation-sensitive resin composition for producing plated objects and method for producing plated objects
JP4315892B2 (en) * 2004-11-25 2009-08-19 東京応化工業株式会社 Photosensitive resin composition and photosensitive dry film using the same
JP5007668B2 (en) * 2005-04-12 2012-08-22 コニカミノルタエムジー株式会社 Actinic ray curable composition, actinic ray curable inkjet ink, image forming method, and inkjet recording apparatus
JP4763390B2 (en) * 2005-09-05 2011-08-31 東京応化工業株式会社 Photosensitive resin composition
JP5280615B2 (en) * 2006-06-16 2013-09-04 シーメット株式会社 Optical three-dimensional resin composition
JP2008045035A (en) * 2006-08-16 2008-02-28 Az Electronic Materials Kk Curable resin composition for printing and pattern forming method using the same
JP5383196B2 (en) * 2006-09-19 2014-01-08 新日鉄住金化学株式会社 Thermally polymerizable resin composition
JP2009134255A (en) * 2007-10-31 2009-06-18 Sekisui Chem Co Ltd Micropattern forming material, micropattern composite material, manufacturing method thereof, and manufacturing method of micro three-dimensional structure substrate
JP5667336B2 (en) * 2008-03-17 2015-02-12 積水化学工業株式会社 CURABLE COMPOSITION FOR FORMING MICRO PATTERN, MICRO PATTERN COMPOSITE MATERIAL, AND METHOD FOR PRODUCING FINE 3D STRUCTURE
JP6993766B2 (en) * 2016-03-30 2022-01-14 株式会社Adeka Curable composition, method for producing cured product, and cured product thereof
JP7216470B2 (en) * 2016-03-30 2023-02-01 株式会社Adeka Curable composition, method for producing cured product, and cured product thereof
JP6883021B2 (en) * 2016-03-30 2021-06-02 株式会社Adeka Curable composition, method for producing cured product, and cured product thereof
WO2017170881A1 (en) * 2016-03-30 2017-10-05 株式会社Adeka Curable composition, cured product production method, and cured product therefrom
KR102265025B1 (en) * 2016-03-31 2021-06-14 가부시키가이샤 아데카 Curable composition, manufacturing method of cured product, and cured product thereof
CN107619399B (en) * 2016-07-13 2021-04-27 常州强力先端电子材料有限公司 Polyfunctional oxetane compound and preparation method thereof
WO2020243898A1 (en) * 2019-06-04 2020-12-10 Showa Denko Materials Co. Ltd Method for forming cured film
CN114509914B (en) * 2020-11-16 2025-06-27 常州强力先端电子材料有限公司 Photocurable composition, optical film, preparation method thereof and optical product

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59180543A (en) * 1983-03-31 1984-10-13 Konishiroku Photo Ind Co Ltd Photosensitive composition
JP3630483B2 (en) * 1995-12-04 2005-03-16 富士通株式会社 Photosensitive resin composition for pattern formation and pattern forming method
JP3852880B2 (en) * 1997-08-25 2006-12-06 Ｊｓｒ株式会社 Radiation-sensitive resin composition for forming an insulating layer constituting a multilayer wiring board
JP3993691B2 (en) * 1997-09-24 2007-10-17 関西ペイント株式会社 Resist pattern forming method
JP3913350B2 (en) * 1998-01-13 2007-05-09 ナブテスコ株式会社 Optical molding resin composition

Also Published As

Publication number Publication date
JP3765272B2 (en) 2006-04-12
WO2001022165A1 (en) 2001-03-29
TWI251123B (en) 2006-03-11

Similar Documents

Publication Publication Date Title
EP0733683A4 (en) Photosolder resist ink, printed circuit board, and process for producing the same
AU2001244548A1 (en) Photosensitive resin composition, photosensitive element comprising the same, method for producing resist pattern, and method for producing printed wiring board
AU2001284499A1 (en) Photosensitive composition, cured article thereof, and printed circuit board using the same
AU2824900A (en) Photosensitive resin composition, photosensitive element comprising the same, process for producing resist pattern, and process for producing printed circuit board
AU4316700A (en) Sheet for printed wiring board, method of forming via, resin sheet having filledvia, printed wiring board and method of manufacturing the same
AU7315000A (en) Photosensitive resin compositions, photosensitive element containing the same, process for producing resist pattern, and process for producing printed circuit board
AU2002224832A1 (en) Positive type photosensitive epoxy resin composition and printed circuit board using the same
AU2001266324A1 (en) Photosensitive resin composition, photosensitive element comprising the same, process for producing resist pattern, and process for producing printed circuit board
AU2001288081A1 (en) Photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board
AU6483199A (en) Electronic circuit board
EP0763562A3 (en) Prepreg for printed circuit board
EP0614331A3 (en) Printed circuit board.
GB9615001D0 (en) Printed circuit board
AU2002215211A1 (en) Liquid thermosetting resin composition, printed wiring boards and process for their production
AU7954400A (en) Photosensitive resin composition, photosensitive element using the same, method for producing resist pattern, resist pattern and substrate having the resist pattern laminated thereon
AU2001240090A1 (en) Process for the manufacture of printed circuit boards with plated resistors
AU2001271381A1 (en) Vialess printed circuit board
AU6063901A (en) Photosensitive resin composition, photosensitive element, production method for resist pattern and production method for printed circuit board
GB0024401D0 (en) Printed circuit board
AU2001229588A1 (en) Printed circuit board assembly
AU2003271131A1 (en) Photosensitive resin composition, and, photosensitive element, method for forming resist pattern and printed wiring board using the composition
EP1205802A4 (en) Photosensitive element, photosensitive element roll, process for producing resist pattern with the same, resist pattern, substrate with overlying resist pattern, process for producing wiring pattern, and wiring pattern
AU9450298A (en) Printed circuit boards
AU2003211797A1 (en) Photosensitive resin composition, process for forming photosensitive elements or resist patterns with the same, and process for production of printed wiring boards
EP0624054A3 (en) Printed circuit boards.

Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase