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AU2001284962A1 - Methods and apparatus for making integrated circuit package including opening exposing portion of the ic - Google Patents

Methods and apparatus for making integrated circuit package including opening exposing portion of the ic

Info

Publication number
AU2001284962A1
AU2001284962A1 AU2001284962A AU8496201A AU2001284962A1 AU 2001284962 A1 AU2001284962 A1 AU 2001284962A1 AU 2001284962 A AU2001284962 A AU 2001284962A AU 8496201 A AU8496201 A AU 8496201A AU 2001284962 A1 AU2001284962 A1 AU 2001284962A1
Authority
AU
Australia
Prior art keywords
methods
integrated circuit
circuit package
package including
opening exposing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001284962A
Inventor
Matthew M. Salatino
Patrick O. Weber
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Authentec Inc
Original Assignee
Authentec Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Authentec Inc filed Critical Authentec Inc
Publication of AU2001284962A1 publication Critical patent/AU2001284962A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
    • H10W74/016—
    • H10W74/111—
    • H10W72/075—
    • H10W72/551—
    • H10W72/951—
    • H10W74/00—

Landscapes

  • Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Multimedia (AREA)
  • Theoretical Computer Science (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
AU2001284962A 2000-08-17 2001-08-16 Methods and apparatus for making integrated circuit package including opening exposing portion of the ic Abandoned AU2001284962A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US22597200P 2000-08-17 2000-08-17
US60/225,972 2000-08-17
US09/931,587 2001-08-16
PCT/US2001/025614 WO2002015209A2 (en) 2000-08-17 2001-08-16 Methods and apparatus for making integrated circuit package including opening exposing portion of the ic
US09/931,587 US7049166B2 (en) 2000-08-17 2001-08-16 Methods and apparatus for making integrated circuit package including opening exposing portion of the IC

Publications (1)

Publication Number Publication Date
AU2001284962A1 true AU2001284962A1 (en) 2002-02-25

Family

ID=26920104

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001284962A Abandoned AU2001284962A1 (en) 2000-08-17 2001-08-16 Methods and apparatus for making integrated circuit package including opening exposing portion of the ic

Country Status (4)

Country Link
US (1) US7049166B2 (en)
EP (1) EP1352426A2 (en)
AU (1) AU2001284962A1 (en)
WO (1) WO2002015209A2 (en)

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US6653723B2 (en) * 2002-03-09 2003-11-25 Fujitsu Limited System for providing an open-cavity low profile encapsulated semiconductor package
US6924496B2 (en) * 2002-05-31 2005-08-02 Fujitsu Limited Fingerprint sensor and interconnect
US6906403B2 (en) * 2002-06-04 2005-06-14 Micron Technology, Inc. Sealed electronic device packages with transparent coverings
US7146029B2 (en) * 2003-02-28 2006-12-05 Fujitsu Limited Chip carrier for fingerprint sensor
US7474772B2 (en) 2003-06-25 2009-01-06 Atrua Technologies, Inc. System and method for a miniature user input device
US7587072B2 (en) 2003-08-22 2009-09-08 Authentec, Inc. System for and method of generating rotational inputs
US7697729B2 (en) 2004-01-29 2010-04-13 Authentec, Inc. System for and method of finger initiated actions
US7364684B2 (en) * 2004-08-16 2008-04-29 Delphi Technologies, Inc. Method of making an encapsulated microelectronic package having fluid carrying encapsulant channels
US7831070B1 (en) 2005-02-18 2010-11-09 Authentec, Inc. Dynamic finger detection mechanism for a fingerprint sensor
US8231056B2 (en) 2005-04-08 2012-07-31 Authentec, Inc. System for and method of protecting an integrated circuit from over currents
US7495325B2 (en) * 2005-05-05 2009-02-24 Stats Chippac, Ltd. Optical die-down quad flat non-leaded package
US8358816B2 (en) 2005-10-18 2013-01-22 Authentec, Inc. Thinned finger sensor and associated methods
KR101011572B1 (en) * 2005-10-18 2011-01-27 오쎈테크, 인코포레이티드 Finger sensor including flexible circuit and related method
US8252615B2 (en) 2006-12-22 2012-08-28 Stats Chippac Ltd. Integrated circuit package system employing mold flash prevention technology
US8852986B2 (en) * 2007-05-16 2014-10-07 Stats Chippac Ltd. Integrated circuit package system employing resilient member mold system technology
US7691682B2 (en) 2007-06-26 2010-04-06 Micron Technology, Inc. Build-up-package for integrated circuit devices, and methods of making same
US8138027B2 (en) 2008-03-07 2012-03-20 Stats Chippac, Ltd. Optical semiconductor device having pre-molded leadframe with window and method therefor
US8421890B2 (en) 2010-01-15 2013-04-16 Picofield Technologies, Inc. Electronic imager using an impedance sensor grid array and method of making
US8866347B2 (en) 2010-01-15 2014-10-21 Idex Asa Biometric image sensing
US20120090757A1 (en) 2010-10-18 2012-04-19 Qualcomm Mems Technologies, Inc. Fabrication of touch, handwriting and fingerprint sensor
KR101160681B1 (en) 2011-10-19 2012-06-28 배경덕 Method, mobile communication terminal and computer-readable recording medium for operating specific function when activaing of mobile communication terminal
US20130279769A1 (en) 2012-04-10 2013-10-24 Picofield Technologies Inc. Biometric Sensing
US9024910B2 (en) 2012-04-23 2015-05-05 Qualcomm Mems Technologies, Inc. Touchscreen with bridged force-sensitive resistors
US8616451B1 (en) 2012-06-21 2013-12-31 Authentec, Inc. Finger sensing device including finger sensing integrated circuit die within a recess in a mounting substrate and related methods
CN104051367A (en) * 2014-07-01 2014-09-17 苏州晶方半导体科技股份有限公司 Packaging structure and packaging method for fingerprint recognition chip
KR20170082358A (en) * 2016-01-06 2017-07-14 하나 마이크론(주) Device for track pad semiconductor package of smart phone and method for manufacturing the same
US9792516B2 (en) 2016-01-26 2017-10-17 Next Biometrics Group Asa Flexible card with fingerprint sensor
TWI644601B (en) * 2017-03-03 2018-12-11 致伸科技股份有限公司 Jig of fingerprint recognition module and method for fabricating fingerprint recognition module

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Also Published As

Publication number Publication date
US20020081780A1 (en) 2002-06-27
WO2002015209A3 (en) 2003-07-24
US7049166B2 (en) 2006-05-23
WO2002015209A2 (en) 2002-02-21
EP1352426A2 (en) 2003-10-15

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